阅读说明：本技术 电路板拆卸结构 (Circuit board dismounting structure ) 是由 孙党飞 叶波 王时文 翟理想 刘伟 郑金松 于 2020-05-08 设计创作，主要内容包括：一种电路板拆卸结构,用于将一锁板上的双层电路板进行拆解,所述电路板拆卸结构包括拆解模组及翻转模组,所述拆解模组用于从所述锁板中拆解出一第一电路板,并将所述第一电路板放置于所述翻转模组；所述翻转模组用于对所述第一电路板进行翻转,并将翻转后的所述第一电路板固定至所述锁板的一收容部。所述电路板拆卸结构可以从锁板上拆解出所述第一电路板,并自动将所述第一电路板翻转后固定在所述锁板的收容部处。使得双层电路板之间的电子元件裸露出来,以便实现对所述电子元件的修理。所述电路板拆卸结构成本低、生产效率高。(A circuit board disassembly structure is used for disassembling a double-layer circuit board on a lock plate and comprises a disassembling module and a turning module, wherein the disassembling module is used for disassembling a first circuit board from the lock plate and placing the first circuit board in the turning module; the turnover module is used for turning over the first circuit board and fixing the turned first circuit board to a containing part of the locking plate. The circuit board dismounting structure can disassemble the first circuit board from the locking plate and automatically turn over the first circuit board and then fix the first circuit board at the accommodating part of the locking plate. So that the electronic elements between the double-layer circuit boards are exposed, and the repair of the electronic elements is realized. The circuit board dismounting structure is low in cost and high in production efficiency.)

1. The utility model provides a structure is dismantled to circuit board for disassemble the double-deck circuit board on the jam plate, its characterized in that: the circuit board disassembling structure comprises a disassembling module and a turning module, wherein the disassembling module is used for disassembling a first circuit board from the locking plate and placing the first circuit board on the turning module; the turnover module is used for turning over the first circuit board and fixing the turned first circuit board to a containing part of the locking plate.

2. The circuit board disassembly structure of claim 1, wherein: the circuit board disassembly structure further comprises a sliding rail, the disassembling module is arranged above the sliding rail, the overturning module is connected to the sliding rail, the locking plate slides in from one end of the sliding rail, the first circuit board is disassembled through the disassembling module, the overturning module overturns the first circuit board and fixes the overturned first circuit board to the locking plate, and therefore the locking plate slides out from the other end of the sliding rail.

3. The circuit board disassembly structure of claim 2, wherein: the circuit board disassembly structure further comprises a shell, a supporting plate is installed inside the shell, the shell is disassembled into a first shell and a second shell, the sliding rail is fixedly installed on the supporting plate, and the disassembly module spans across the sliding rail and is fixedly installed on the supporting plate.

4. The circuit board disassembly structure of claim 3, wherein: the inlet and the outlet are formed in the two sides of the first shell, the sliding rail is fixedly installed in the first shell, and the two ends of the sliding rail extend out of the inlet and the outlet.

5. The circuit board disassembly structure of claim 3, wherein: the slide rail includes two guide rails and a supporting part, two the guide rail interval sets up, the one end of supporting part set up perpendicularly in the backup pad, the other end of supporting part is connected to the guide rail, in order to support the guide rail.

6. The circuit board disassembly structure of claim 3, wherein: the disassembling module comprises an installation part, a screw rod, an air cylinder and a disassembling structure, wherein the installation part is used for fixedly installing the disassembling module on the supporting plate, the screw rod is arranged on the installation part, the air cylinder is fixedly connected with the screw rod, the disassembling structure is connected with the air cylinder, and the disassembling structure is used for disassembling the first circuit board from the locking plate.

7. The circuit board disassembly structure of claim 6, wherein: installation department one end stride across the slide rail and with backup pad fixed connection, one side of installation department install in the lead screw, the lead screw can for the installation department slides, one side fixed connection of cylinder in the lead screw is kept away from one side of installation department, disassemble structure fixed connection in the opposite side of cylinder.

8. The circuit board disassembly structure of claim 7, wherein: the screw rod is connected with a motor, the screw rod is driven by the motor to move along a first direction relative to the mounting part, and the cylinder drives the disassembling structure to move along a second direction.

9. The circuit board disassembly structure of claim 7, wherein: the turnover module comprises a sliding part, a connecting part, a first adjusting cylinder, a rotating cylinder and a transposition carrier, wherein one side of the sliding part is fixedly connected to the sliding rail, the connecting part is arranged on the other side of the sliding part and slides relative to the sliding part, the first adjusting cylinder is connected to the connecting part, the rotating cylinder is arranged on the first adjusting cylinder and rotates relative to the first adjusting cylinder, the transposition carrier is arranged on the rotating cylinder and rotates relative to the rotating cylinder, the transposition carrier is used for placing the first circuit board, and the rotating cylinder is used for overturning the first circuit board.

10. The circuit board disassembly structure of claim 9, wherein: the turnover module further comprises a second adjusting cylinder, the second adjusting cylinder is arranged on the slide rail and is further far away from one side of the first adjusting cylinder through the connecting portion, the second adjusting cylinder is used for driving the turnover module to move relative to the sliding portion, so that the turnover module moves to the position right opposite to the disassembling structure to place the first circuit board.

11. The circuit board disassembly structure of claim 9, wherein: the transposition carrier comprises a rotating support, a placing plate and a pushing module, one end of the rotating support is connected to the rotating cylinder and rotates relative to the rotating cylinder, the other end of the rotating support is connected to the placing plate, the placing plate is used for placing the first circuit board, the pushing module is arranged in the rotating support, and the pushing module is used for pushing the turned first circuit board to be fixed to the accommodating part after the first circuit board is turned.

Technical Field

The invention relates to a circuit board dismounting structure.

Background

At present, the double-layer circuit board is widely applied, for example, the circuit board used in the smart phone is the double-layer circuit board. An electronic element is arranged between the double-layer circuit boards. When the electronic components between the double-layer circuit boards are damaged and need to be repaired, the electronic components cannot be directly repaired. In addition, the conventional maintenance method is to manually disassemble and then maintain the electronic element. Thus, the cost is high and the production efficiency is low.

Disclosure of Invention

In view of the above, it is desirable to provide a circuit board dismounting structure with low cost and high production efficiency, which is used to automatically expose the electronic components between the two layers of circuit boards after being dismounted and turned over, so as to facilitate maintenance.

A circuit board disassembly structure is used for disassembling a double-layer circuit board on a lock plate and comprises a disassembling module and a turning module, wherein the disassembling module is used for disassembling a first circuit board from the lock plate and placing the first circuit board in the turning module; the turnover module is used for turning over the first circuit board and fixing the turned first circuit board to a containing part of the locking plate.

Preferably, the circuit board disassembly structure further comprises a slide rail, the disassembling module is arranged above the slide rail, the overturning module is connected to the slide rail, the locking plate slides in from one end of the slide rail, the first circuit board is disassembled through the disassembling module, the overturning module overturns the first circuit board and fixes the overturned first circuit board to the locking plate, and the locking plate slides out from the other end of the slide rail.

Preferably, the circuit board disassembly structure further comprises a housing, a support plate is installed inside the housing to disassemble the housing into a first housing and a second housing, the slide rail is fixedly installed on the support plate, and the disassembly module spans across the slide rail and is fixedly installed on the support plate.

Preferably, an inlet and an outlet are formed in two sides of the first housing, the slide rail is fixedly mounted in the first housing, and two ends of the slide rail extend out of the inlet and the outlet.

Preferably, the slide rail includes two guide rails and a supporting portion, two the guide rail interval sets up, the one end of supporting portion set up perpendicularly in the backup pad, the other end of supporting portion is connected to the guide rail, in order to support the guide rail.

Preferably, disassemble the module and include installation department, lead screw, cylinder and disassemble the structure, the installation department be used for with disassemble module fixed mounting in the backup pad, the lead screw set up in the installation department, cylinder fixed connection in the lead screw, disassemble the structure connect in the cylinder, disassemble the structure be used for following disassemble first circuit board in the jam plate.

Preferably, installation department one end stride across the slide rail and with backup pad fixed connection, one side of installation department install in the lead screw, the lead screw can for the installation department slides, one side fixed connection of cylinder in the lead screw is kept away from one side of installation department, disassemble structure fixed connection in the opposite side of cylinder.

Preferably, the screw rod is connected with a motor, the screw rod moves along a first direction relative to the mounting portion under the driving of the motor, and the cylinder drives the disassembling structure to move along a second direction.

Preferably, the flipping module includes a sliding portion, a connecting portion, a first adjusting cylinder, a rotating cylinder and a transposing carrier, one side of the sliding portion is fixedly connected to the slide rail, the connecting portion is disposed on the other side of the sliding portion and slides relative to the sliding portion, the first adjusting cylinder is connected to the connecting portion, the rotating cylinder is disposed on the first adjusting cylinder and rotates relative to the first adjusting cylinder, the transposing carrier is disposed on the rotating cylinder and rotates relative to the rotating cylinder, the transposing carrier is used for placing the first circuit board, and the rotating cylinder is used for flipping the first circuit board.

Preferably, the turnover module further comprises a second adjusting cylinder, the second adjusting cylinder is arranged on the slide rail, the second adjusting cylinder is further connected with one side, away from the first adjusting cylinder, of the connecting portion, and is used for driving the turnover module to move relative to the sliding portion, so that the turnover module moves to the position right opposite to the disassembling structure to place the first circuit board.

Preferably, the transposing carrier includes a rotating bracket, a placing plate, and a pushing module, one end of the rotating bracket is connected to the rotating cylinder and rotates relative to the rotating cylinder, the other end of the rotating bracket is connected to the placing plate, the placing plate is used for placing the first circuit board, the pushing module is disposed in the rotating bracket, and the pushing module is used for pushing the first circuit board after being turned over to be fixed to the accommodating portion after the first circuit board is turned over.

The circuit board dismounting structure can disassemble the first circuit board from the locking plate and automatically turn over the first circuit board and then fix the first circuit board at the accommodating part of the locking plate. So that the electronic elements between the double-layer circuit boards are exposed, and the repair of the electronic elements is realized. The circuit board dismounting structure is low in cost and high in production efficiency.

Drawings

Fig. 1 is an overall assembly view of a circuit board disassembly structure in an embodiment of the present invention.

Fig. 2 is a partially assembled view of the circuit board disassembly structure shown in fig. 1.

Fig. 3 is a schematic structural view of a locking plate in the circuit board dismounting structure shown in fig. 2.

Fig. 4 is a schematic structural diagram of a slide rail in the circuit board dismounting structure shown in fig. 2.

Fig. 5 is a schematic structural diagram of a disassembled module in the circuit board disassembling structure shown in fig. 2.

Fig. 6 is a schematic structural view of a flip module in the circuit board dismounting structure shown in fig. 2.

Fig. 7 is a schematic structural view of the transpose carrier in the flipping module shown in fig. 5.

Fig. 8 is a schematic view of another perspective structure of the transpose carrier in the flip module shown in fig. 5.

Description of the main elements

Circuit board dismounting structure 100

Housing 10

Supporting plate 11

First housing 12

Split door 121

Inlet 122

Outlet 123

Second housing 13

Slide rail 20

Guide rail 21

Chute 211

Support part 22

Disassembling module 30

Mounting part 31

Screw 32

Cylinder 33

Disassembling structure 34

Inductor 35

Turnover module 40

Sliding part 41

Connecting part 42

First adjusting cylinder 43

Rotary cylinder 44

Transposition carrier 45

Rotating bracket 451

Vacuum interface 4511

Placing plate 452

Guide post 4521

Wedge-shaped push block 4522

Positioning pin 4523

Push module 453

Second adjusting cylinder 46

Lock plate 200

First circuit board 201

Housing 202

Sliding press block 210

The following detailed description will further illustrate the invention in conjunction with the above-described figures.

Detailed Description

The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.

It will be understood that when an element is referred to as being "electrically connected" to another element, it can be directly on the other element or intervening elements may also be present. When an element is referred to as being "electrically connected" to another element, it can be connected by contact, e.g., by wires, or by contactless connection, e.g., by contactless coupling.

Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. The terminology used in the description of the invention herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention.

Some embodiments of the invention are described in detail below with reference to the accompanying drawings. The embodiments described below and the features of the embodiments can be combined with each other without conflict.

Referring to fig. 1 to 3, a circuit board dismounting structure 100 is provided in the present invention. The circuit board disassembly structure 100 is used for disassembling a multi-layer circuit board on a lock plate 200 (see fig. 3), and automatically overturning the disassembled circuit board and fixing the circuit board to other positions of the lock plate 200. In the present embodiment, only the circuit board disassembly structure 100 is taken as an example to disassemble the double-layer circuit board.

In the present embodiment, the dual-layer circuit board includes a first circuit board 201 (see fig. 7) and a second circuit board (not shown). The first circuit board 201 and the second circuit board are connected together by soldering. The lock plate 200 is further provided with a receiving portion 202 matching with the first circuit board 201 in size and shape. After the first circuit board 201 and the second circuit board are disassembled by the circuit board disassembling structure 100, the first circuit board 201 may be rotated by 180 degrees and fixed in the receiving portion 202. Thus, the electronic components between the first circuit board 201 and the second circuit board can be exposed, and further, the electronic components can be conveniently operated, for example, maintained.

In the present embodiment, the circuit board dismounting structure 100 includes a housing 10, a slide rail 20, a dismounting module 30 and a flip module 40.

The housing 10 is used for accommodating the slide rail 20, the disassembling module 30 and the overturning module 40. The disassembling module 30 is disposed above the slide rail 20. The slide rail 20 is connected with the turnover module 40. The locking plate 200 slides in from one end of the slide rail 20, and slides out from the other end of the slide rail 20 after passing through the disassembling module 30 and the overturning module 40. The disassembling module 30 is configured to disassemble the first circuit board 201 from the lock plate 200, and place the first circuit board 201 on the flipping module 40. The flipping module 40 is configured to flip the first circuit board 201, and fix the flipped first circuit board 201 in the receiving portion 202 of the lock plate 200.

The housing 10 is substantially a rectangular parallelepiped box structure. A support plate 11 (see fig. 2) is mounted inside the housing 10. The supporting plate 11 is connected to the inner wall of the housing 10 at the periphery thereof, so as to separate the housing 10 into a first housing 12 and a second housing 13. The first housing 12 is used for accommodating and mounting the slide rail 20, the disassembling module 30 and the overturning module 40. A side-by-side door 121 is provided to one side of the first housing 12. The disassembling module 30 and the overturning module 40 may be installed or repaired through the split doors 121.

In this embodiment, the first housing 12 is opened adjacent to both sides of the split door 121, i.e., an inlet 122 and an outlet 123. The slide rail 20 is fixedly installed in the first housing 12, and both ends thereof can extend from the inlet 122 and the outlet 123.

It can be understood that the locking plate 200 can slide in from the inlet 122 and slide to the disassembling module 30 through the slide rail 20, so that the disassembling module 30 disassembles the first circuit board 201 and adsorbs the first circuit board to be placed on the flipping module 40. Then, the lock plate 200 slides to a position corresponding to the flipping module 40, so that the flipping module 40 fixes the flipped first circuit board 201 into the receiving portion 202 of the lock plate 200, and finally the lock plate 200 flows out from the outlet 123.

It can be understood that in the present embodiment, the outer side of the first casing 12 can further be provided with control elements such as an emergency stop button, an operation indicator light, an automatic and manual switching knob, a reset button, a start button, and a power switch key, and the functions thereof are not described herein again.

In the present embodiment, a motor (not shown) and a heat sink are mounted in the second housing 13. The motor connects the slide rail 20 and the motor together via a motor, so as to drive the lock plate 200 to slide on the slide rail 20. The heat sink is a fan for dissipating heat from the circuit board detachment structure 100. It is understood that in the present embodiment, the motor is partially disposed in the slide rail 20, and another portion of the motor is connected to the motor. The locking plate 200 may be disposed on a surface of the motor. Under the driving of the motor, the motor in the slide rail 20 slides, and further drives the lock plate 200 thereon to slide.

Referring to fig. 4, in the present embodiment, the slide rail 20 includes two guide rails 21. The guide rail 21 is substantially elongated. The guide rail 21 is formed with a slide groove 211. The two guide rails 21 are oppositely arranged and respectively correspond to two ends of the locking plate 200, so that two sides of the locking plate 200 can be slidably connected to the sliding groove 211.

In this embodiment, the slide rail 20 further includes a support portion 22. One end of the support portion 22 is vertically disposed on the support plate 11, and the other end is connected to the guide rail 21 to support the guide rail 21.

Referring to fig. 5, the disassembling module 30 is disposed on the supporting plate 11 and above the sliding rail 20. The disassembling module 30 includes a mounting portion 31, a screw 32, a cylinder 33 and a disassembling structure 34. The mounting portion 31 is used for mounting the disassembling module 30 on the support plate 11. The lead screw 32 is provided to the mounting portion 31. The cylinder 33 is fixedly connected to the screw rod 32. The un-disassembling structure 34 is connected to the cylinder 33. The disassembling structure 34 is used for disassembling the first circuit board 201 from the locking plate 200.

The mounting portion 31 is vertically disposed. One end of the mounting portion 31 spans the slide rail 20 and is fixedly connected with the support plate 11. One side of the mounting portion 31 is mounted to the screw 32. It is understood that the locking plate 200 may pass through the lower portion of the mounting portion 31.

The screw 32 is substantially strip-shaped. The screw 32 is disposed at one side of the mounting portion 31 and is slidable relative to the mounting portion 31. The other side of the screw rod 32 is fixedly connected to the air cylinder 33. Specifically, the screw 32 is connected to a motor (not shown) for moving relative to the mounting portion 31 in a first direction, such as a Y-axis direction, under the driving of the motor.

The cylinder 33 is vertically disposed. One side of the cylinder 33 is fixedly connected to one side of the screw rod 32 far away from the mounting part 31. The other side of the cylinder 33 is fixedly connected with the disassembling structure 34. Specifically, in the present embodiment, the air cylinder 33 is used for driving the un-disassembling structure 34 to move along a second direction, such as a Z-axis direction.

It can be understood that, in the embodiment, the screw rod 32 and the cylinder 33 move to further drive the disassembling structure 34 to move, so as to adjust the position of the disassembling structure 34 to be close to the lock plate 200 or the turnover module 40.

The disassembled structure 34 is generally a "7" shaped tubular structure. In this embodiment, the disassembled structure 34 is a tuyere.

Further, the disassembling structure 34 is disposed near the locking plate 200, and the first circuit board 201 is disassembled by heating and melting tin between the first circuit board 201 and the second circuit board. The disassembling structure 34 is also used for adsorbing the first circuit board 201 and placing the first circuit board on the turnover module 40.

In this embodiment, the disassembling module 30 further includes an inductor 35. The inductor 35 is disposed at one side of the mounting part 31. The sensor 35 is used for sensing the position of the lock plate 200. When the locking plate 200 is sensed to be close to the disassembling module 30, the disassembling module 30 is ready to disassemble and absorb the first circuit board 201.

Referring to fig. 6, the flipping module 40 includes a sliding portion 41, a connecting portion 42, a first adjusting cylinder 43, a rotating cylinder 44, and a transposing carrier 45. The sliding part 41 is fixedly connected to the slide rail 20. The connecting portion 42 is provided to the sliding portion 41. The first adjustment cylinder 43 is fixedly connected to the connection portion 42. The first adjustment cylinder 43 is used to adjust the position of the transpose carrier 45. The rotary cylinder 44 is provided in the first adjustment cylinder 43. The transpose carrier 45 is disposed on the rotary cylinder 44, and the transpose carrier 45 is used for placing the first circuit board 201 absorbed by the disassembling structure 34. The rotating cylinder 44 is used for rotating the first circuit board 201 by 180 degrees. The disassembled first circuit board 201 is turned 180 degrees by the turning module 40 and then is fixedly placed in the receiving portion 202 of the locking plate 200. Therefore, the electronic elements between the double-layer circuit boards are exposed so as to carry out subsequent operation.

Specifically, the sliding portion 41 is substantially elongated. One side of the sliding part 41 is fixed to the slide rail 20. The other side of the sliding portion 41 is provided to the connecting portion 42. It can be understood that, in the present embodiment, the turning module 40 is connected to the slide rail 20 by fixing one side of the sliding portion 41 to the slide rail 20.

The connecting portion 42 is substantially in the shape of an "L" plate. One side of the connecting portion 42 is disposed on the sliding portion 41 and slides relative to the sliding portion 41, and the other side of the connecting portion 42 is fixedly connected to the first adjusting cylinder 43. Specifically, the connecting portion 42 includes an X-axis connecting plate and a Y-axis connecting plate, the X-axis connecting plate is slidably disposed on the sliding portion 41, and the Y-axis connecting plate is fixedly connected to the first adjusting cylinder 43.

The first adjustment cylinder 43 is of a substantially plate-like configuration. The first adjusting cylinder 43 is vertically connected to the connecting portion 42. One side of the first adjustment cylinder 43 is connected to the transpose carrier 45 through the rotary cylinder 44. The other side of the first adjusting cylinder 43 is fixedly connected to the connecting portion 42.

Specifically, in the present embodiment, the first adjusting cylinder 43 is used to drive the rotating cylinder 44 and the transpose carrier 45 to move along a second direction, for example, a Z-axis direction. It can be understood that after the flipping module 40 flips the first circuit board 201 by 180 degrees and fixes the first circuit board to the lock plate 200, the first adjusting cylinder 43 moves in a second direction, for example, away from the slide rail 20, so that the lock plate 200 can pass through the flipping module 40 and slide out from the other end of the slide rail 20.

The rotary cylinder 44 has a substantially rectangular parallelepiped shape. The rotary cylinder 44 is disposed along the Y-axis. One side of the rotary cylinder 44 is connected to a side of the first adjusting cylinder 43 away from the connecting portion 42. The other side of the rotary cylinder 44 is connected to the transpose carrier 45. The rotary cylinder 44 rotates clockwise or counterclockwise, and then drives the transpose carrier 45 to turn over. In this embodiment, the rotary cylinder 44 drives the transpose carrier 45 to turn 180 degrees.

Referring to fig. 7, the transpose carrier 45 is substantially plate-shaped. The transpose carrier 45 is used for placing the first circuit board 201. Specifically, the transpose carrier 45 includes a rotating bracket 451, a placing plate 452, and a pushing module 453 (see fig. 8).

One end of the rotating bracket 451 is bent and extended, and the bent portion thereof is connected to the rotating cylinder 44 and can rotate relative to the rotating cylinder 44. The other end of the rotating bracket 451 is fixedly connected to the placing plate 452. The rotating bracket 451 is also formed with a notch.

The placing board 452 is substantially a plate, and a receiving cavity (not shown) matching with the shape and size of the first circuit board 201 is formed at a middle position thereof, and the receiving cavity is used for receiving and placing the first circuit board 201.

In this embodiment, at least one guide post 4521 is further disposed around the receiving cavity of the placing plate 452. The un-mating structure 34 can be accurately placed in the receiving cavity along the guide post 4521. In this embodiment, there are three guide posts 4521. In this embodiment, at least one wedge-shaped push block 4522 is further disposed around the accommodating cavity of the placing plate 452. In this embodiment, there are three wedge-shaped push blocks 4522.

In this embodiment, 3 guide posts 4521 ensure the matching accuracy of the first circuit board 201 and the transpose carrier 45. In this embodiment, the tolerance for the precision may be +/-0.05 millimeters.

The pushing module 453 is disposed in the gap of the rotating bracket 451. The pushing module 453 is used for pushing the first circuit board 201 to be limited and fixed in the receiving portion 202 of the locking plate 200 after the first circuit board 201 is turned over.

In this embodiment, at least one positioning pin 4523 is further disposed in the receiving cavity of the placing board 452, and the positioning pin 4523 is used to ensure accurate placement of the first circuit board 201. In the embodiment, the maximum allowable deviation of the first circuit board 201 is 1.0 mm, which ensures the matching precision between the first circuit board 201 and the transpose carrier 45 when the disassembling module 30 is placed on the first circuit board 201.

Referring also to fig. 8, the rotating frame 451 is further provided with a vacuum port 4511. The vacuum interface 4511 is configured to fix the first circuit board 201 by suction after the first circuit board 201 is placed on the placing plate 452, and prevent the first circuit board 201 from being detached from the placing plate 452 when the first circuit board 201 is rotated. It can be understood that when the first circuit board 201 is rotated and then fixed in a limited manner, the vacuum port 4511 is opened, and the first circuit board 201 is no longer fixed by suction.

Referring to fig. 6 again, in the present embodiment, the flipping module 40 further includes a second adjusting cylinder 46. The second adjusting cylinder 46 is disposed on the slide rail 20, and the second adjusting cylinder 46 is further connected to a side of the connecting portion 42 away from the first adjusting cylinder 43. Specifically, the second adjusting cylinder 46 is configured to drive the connecting portion 42 to move in a third direction, for example, the X-axis direction, relative to the sliding portion 41.

The second adjustment cylinder 46 can drive the turnover module 40 to move relative to the second sliding portion 41.

Specifically, when the turnover module 40 is installed, a certain distance is formed between the turnover module 40 and the disassembling module 30. When the first circuit board 201 is disassembled from the disassembling structure 34 and the first circuit board 201 is adsorbed, the second adjusting cylinder 46 drives the flipping module 40 to slide along the sliding portion 41, so that the transposing carrier 45 moves to a position opposite to the disassembling structure where the first circuit board 201 is adsorbed. Therefore, the interference or bad influence of the disassembling module 30 on the overturning module 40 during operation is avoided.

Referring to fig. 3 again, in the present embodiment, at least one sliding pressing block 210 is disposed around the accommodating portion 202. The positions of the sliding pressing block 210 and the wedge-shaped pushing block 4522 on the placing plate 452 are matched. When the first circuit board 201 rotates 180 degrees, the vacuum port 4511 is opened, and the pushing module 453 pushes the first circuit board 201 to approach the receiving portion 202. When the wedge-shaped push block 4522 contacts the sliding press block 210 and continues to push the pushing module 453, the wedge-shaped push block 4522 pushes the sliding press block 210 to move away from the receiving portion 202 until the first circuit board 201 is fixed in the receiving portion 202. Then, the first adjusting cylinder 43 moves away from the locking plate 200 along the second direction, and the locking plate 200 with the first circuit board 201 fixed thereon passes through the flipping module 40 and slides out of the outlet 123 of the housing 10.

Specifically, in the present embodiment, the sliding pressing block 210 further has a holding function, and after the first circuit board 201 is fixed in the accommodating portion 202, the sliding pressing block 210 can abut against the first circuit board 201, so that the first circuit board 201 is prevented from being separated from the locking plate 200 in the sliding process.

It can be understood that when the locking plate 200 to be disassembled enters from the entrance 122 of the housing 10 and slides along the slide rail 20 to the disassembling module 30. First, the disassembling module 30 disassembles and adsorbs the first circuit board 201. The second adjustment cylinder 46 then actuates the flipping module 40 to move to be disposed at the opposite position of the un-mating structure 34. Next, the disassembling module 30 places the first circuit board 201 on the placing plate 452. The transpose carrier 45 rotates 180 degrees. Finally, the first circuit board 201 is fixed to the receiving portion 202 of the locking plate 200. At this time, the first adjustment cylinder 43 slides in the third direction, and the locking plate 200 passes through the turnover module 40 and slides out of the outlet 123 of the housing 10.

In this way, the electronic component between the first circuit board 201 and the second circuit board is exposed, and other steps can be performed on the electronic component.

In this embodiment, the first circuit board 201 can be disassembled from the lock plate 200 through the circuit board disassembling structure 100, and the first circuit board 201 is automatically turned over and then fixed to the receiving portion 202 of the lock plate 200. So that the electronic elements between the double-layer circuit boards are exposed, and the repair of the electronic elements is realized. The circuit board dismounting structure 100 is low in cost and high in production efficiency.

Although the present invention has been described in detail with reference to the preferred embodiments, it will be understood by those skilled in the art that various changes may be made and equivalents may be substituted without departing from the spirit and scope of the invention. Those skilled in the art can also make other changes and the like in the design of the present invention within the spirit of the present invention as long as they do not depart from the technical effects of the present invention. Such variations are intended to be included within the scope of the invention as claimed.