阅读说明：本技术 阵列基板和显示装置 (Array substrate and display device ) 是由 赵云 于 2021-08-03 设计创作，主要内容包括：本申请公开了一种阵列基板和显示装置,阵列基板包括显示区和绑定区,绑定区设置于显示区的一侧,阵列基板包括衬底层、绑定脚电极和保护层,绑定脚电极设置于绑定区的衬底层上,保护层设置于绑定脚电极上。通过在绑定脚电极上设置保护层,避免后续采用异方性导电胶进行绑定时,异方性导电胶中的导电粒子损坏绑定脚电极,进而保证阵列基板的性能。(The application discloses array substrate and display device, array substrate include the display area and bind the district, bind the district and set up in one side of display area, and array substrate includes the substrate layer, binds foot electrode and protective layer, binds foot electrode and sets up on the substrate layer of binding the district, and the protective layer sets up on binding foot electrode. Through set up the protective layer on binding the foot electrode, when avoiding follow-up adoption anisotropic conducting resin to bind, conductive particle among the anisotropic conducting resin damages and binds the foot electrode, and then guarantees array substrate's performance.)

1. The array substrate is characterized by comprising a display area and a binding area, wherein the binding area is arranged on one side of the display area and comprises:

a substrate layer;

the binding pin electrode is arranged on the substrate layer of the binding area; and

the protective layer is arranged on the binding pin electrode and is electrically connected with the binding pin electrode.

2. The array substrate of claim 1, wherein the protection layer comprises a buffer layer and an additional electrode, the buffer layer is disposed on the binding pin electrode, the additional electrode covers the buffer layer, and the additional electrode is connected to the binding pin electrode.

3. The array substrate of claim 2, wherein the material of the bonding pin electrode and the material of the additional electrode are selected from one or more of a conductive metal and a conductive metal oxide.

4. The array substrate of claim 3, wherein the material of the binding pin electrode and the additional electrode is selected from one or more of silver, titanium, aluminum, zinc oxide, indium tin oxide, molybdenum trioxide and titanium dioxide.

5. The array substrate of claim 2, wherein the thickness of the bond foot electrode and the additional electrode is 500 angstroms to 3000 angstroms.

6. The array substrate of claim 2, wherein the material of the buffer layer comprises one or a combination of organic and inorganic materials.

7. The array substrate of claim 6, wherein the material of the buffer layer comprises one or more of epoxy resin, phenolic resin, silicon oxynitride, silicon nitride, and silicon oxide.

8. The array substrate of claim 1, wherein the protection layer comprises a protection electrode disposed on the bound pin electrode.

9. A display device comprising the array substrate according to any one of claims 1 to 8 and an anisotropic conductive paste disposed on a protective layer in the array substrate, wherein conductive particles are disposed in the anisotropic conductive paste.

10. The display device according to claim 9, wherein a thickness of a vertical cross section of the guard electrode is larger than a thickness of a vertical cross section of the conductive particle.

Technical Field

The application relates to the technical field of display, in particular to an array substrate and a display device.

Background

Flexible display screen, owing to have the characteristic of can buckling, very big reinforcing flat panel display's application space, at present, array substrate among the flexible display screen adopts the plastic material to form, when carrying out driver chip or flexible circuit board binding on this array substrate, driver chip or flexible circuit board's electrode port is connected with the foot electrode of binding on the array substrate through the anisotropic conductive adhesive, there is conductive particle anisotropic conductive adhesive inside, because it is softer to bind foot electrode substrate hardness, the inside conductive particle of anisotropic conductive adhesive can generally crush the foot electrode of binding on the array substrate, cause driver chip or flexible circuit board and the difference contact resistance who binds between the foot electrode different, and then lead to showing inhomogeneously.

Disclosure of Invention

The embodiment of the application provides an array substrate and a display device, and aims to solve the problem that a binding pin electrode is damaged due to extrusion of conductive particles in the prior art.

The application provides an array substrate, array substrate includes the display area and binds the district, bind the district set up in one side of display area includes:

a substrate layer;

the binding pin electrode is arranged on the substrate layer of the binding area; and

a protective layer disposed on the bond pin electrode.

Optionally, in some embodiments of the present application, the protection layer includes a buffer layer and an additional electrode, the buffer layer is disposed on the pin-bonding electrode, the additional electrode covers the buffer layer, and the additional electrode is connected to the pin-bonding electrode.

Optionally, in some embodiments of the present application, the materials of the bound foot electrode and the additional electrode are selected from one or more of a conductive metal and a conductive metal oxide.

Optionally, in some embodiments of the present application, the material of each of the binding pin electrode and the additional electrode is selected from one or more of silver, titanium, aluminum, zinc oxide, indium tin oxide, molybdenum trioxide, and titanium dioxide.

Optionally, in some embodiments of the present application, the thickness of the bond foot electrode and the additional electrode are both 500 angstroms to 3000 angstroms.

Optionally, in some embodiments of the present application, the material of the buffer layer includes one or a combination of organic material and inorganic material.

Optionally, in some embodiments of the present application, the material of the buffer layer includes one or a combination of epoxy resin, phenolic resin, silicon oxynitride, silicon nitride, or silicon oxide.

Optionally, in some embodiments of the present application, the protection layer includes a protection electrode disposed on the bound pin electrode.

Correspondingly, the application also provides a display device, which comprises the array substrate and anisotropic conductive adhesive arranged on the protective layer in the array substrate, wherein conductive particles are arranged in the anisotropic conductive adhesive.

Optionally, in some embodiments of the present application, a thickness of a vertical cross section of the guard electrode is greater than a thickness of a vertical cross section of the conductive particle.

The application discloses array substrate and display device, array substrate include the display area and bind the district, bind the district and set up in one side of display area, and array substrate includes the substrate layer, binds foot electrode and protective layer, binds foot electrode and sets up on the substrate layer of binding the district, and the protective layer sets up on binding foot electrode. Through setting up the protective layer between binding foot electrode and anisotropic conductive adhesive, when avoiding subsequent binding the component to bind in binding the foot electrode through anisotropic conductive adhesive, avoid soft because of the hardness of binding the foot electrode, and easily be broken by the conductive particle pressure, make conductive particle the same with the area of contact who binds the foot electrode, and then avoid different binding foot electrodes and bind the contact resistance difference between the component, and then avoid when using it at display device, lead to the problem that bright line or dark line appear in display device, make display device show inequality, and then improved display device's performance.

Drawings

In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings needed to be used in the description of the embodiments are briefly introduced below, and it is obvious that the drawings in the following description are only some embodiments of the present application, and it is obvious for those skilled in the art to obtain other drawings based on these drawings without creative efforts.

Fig. 1 is a schematic view of a first structure of an array substrate according to an embodiment of the present disclosure.

Fig. 2 is a schematic view of a second structure of an array substrate according to an embodiment of the present disclosure.

Fig. 3 is a schematic view of a first structure of a display device according to an embodiment of the present application.

Fig. 4 is a schematic diagram of a second structure of a display device according to an embodiment of the present application.

Detailed Description

The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application, and it is obvious that the described embodiments are only a part of the embodiments of the present application, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application. Furthermore, it should be understood that the detailed description and specific examples, while indicating exemplary embodiments of the invention, are given by way of illustration and explanation only, and are not intended to limit the scope of the invention. In the present application, unless indicated to the contrary, the use of the directional terms "upper" and "lower" generally refer to the upper and lower positions of the device in actual use or operation, and more particularly to the orientation of the figures of the drawings; while "inner" and "outer" are with respect to the outline of the device. In the present application, the "reaction" may be a chemical reaction or a physical reaction.

The embodiment of the application provides an array substrate and a display device. The following are detailed below.

Referring to fig. 1, fig. 1 is a schematic view illustrating a first structure of an array substrate according to an embodiment of the present disclosure. The present application provides an array substrate 10. The array substrate 10 includes a substrate layer 100, a binding pin electrode 200, and a protective layer 300. The array substrate 10 includes a display region 11 and a bonding region 12, and the bonding region 12 is disposed on one side of the display region 11. The specific description is as follows:

the material of the substrate layer 100 is a plastic material. The material of the substrate layer 100 is selected from one or more of Polyimide (PI), polyethylene naphthalate (PEN), polyethylene terephthalate (PET), Polyarylate (PAR), Polycarbonate (PC), Polyetherimide (PEI) and Polyethersulfone (PES).

In one embodiment, the substrate layer 100 includes a first polyimide layer, a first barrier layer, a second polyimide layer, and a second barrier layer, which are sequentially stacked. The materials of the first barrier layer and the second barrier layer are selected from inorganic materials such as silicon dioxide, silicon oxynitride or silicon nitride. Through constituting substrate layer 100 by first polyimide layer, first barrier layer, second polyimide layer and second barrier layer, improved the separation water oxygen ability of substrate layer 100, avoid other structures in the array substrate 10 to receive the erosion of water oxygen, and then guaranteed the performance of array substrate 10.

The binding foot electrode 200 is disposed on the substrate layer 100 in the binding region 12. The material of the binding pin electrode 200 includes one or a combination of several of conductive metal and conductive metal oxide.

In one embodiment, the material of the bonding pin electrode 200 includes one or more of silver, titanium, aluminum, zinc oxide, indium tin oxide, molybdenum trioxide, and titanium dioxide. In the present embodiment, the material of the bonding pin electrode 200 is silver.

In one embodiment, the thickness H of the pinned electrode 200 is 500-3000 angstroms. Specifically, the thickness H of the pinned electrode 200 may be 500 angstroms, 1000 angstroms, 1500 angstroms, 2000 angstroms, 2500 angstroms, 3000 angstroms, or the like. In the present embodiment, the thickness H of the pinning electrode 200 is 1500 angstroms.

In the present application, the thickness H of the pinning electrode 200 is set to 500 to 3000 angstroms, which improves the performance of the array substrate 10. If the thickness H of the binding pin electrode 200 is set to be less than 500 angstroms, the resistance of the binding pin electrode 200 is too large, which may result in performance degradation of the array substrate 10; if the thickness H of the bonding pin electrode 200 is set to be greater than 3000 angstroms, the stress of the substrate layer 100 may be too large, so that the substrate layer 100 may be broken during use or transportation, and the performance of the array substrate 10 may be reduced, and the cost may be increased.

In one embodiment, the array substrate 10 further includes a pixel electrode trace 400. The pixel electrode trace 400 is disposed on the substrate layer 100 of the display region 11. The pixel electrode trace 400 and the binding pin electrode 200 are disposed on the same layer. In the present application, the pixel electrode trace 400 is disposed on the same layer as the binding pin electrode 200, which simplifies the manufacturing process of the array substrate 10, shortens the production cycle of the array substrate 10, and further reduces the cost.

In another embodiment, the pixel electrode trace 400 is disposed in a different layer from the binding foot electrode 200. The pixel electrode routing 400 is not arranged on the same layer as the binding pin electrode 200, so that the occupied space of the binding pin electrode 200 is reduced, the frame is reduced, and a narrow-frame device is realized.

The protection layer 300 is disposed on the bonding pin electrode 200. The protective layer 300 includes a buffer layer 310 and an additional electrode 320. The buffer layer 310 is disposed on the pinned electrode 200. The additional electrode 320 encapsulates the buffer layer 310. The additional electrode 320 is connected to the binding pin electrode 200.

In one embodiment, the material of the buffer layer 310 includes one or more of an organic material and an inorganic material.

In one embodiment, the material of the buffer layer 310 includes one or more of epoxy resin, phenolic resin, silicon oxynitride, silicon nitride, or silicon oxide. In this embodiment, the material of the buffer layer 310 is epoxy resin.

In one embodiment, the thickness W of the buffer layer 310 is 500 angstroms to 20000 angstroms. Specifically, the thickness W of the buffer layer 310 may be 500 angstroms, 1000 angstroms, 3000 angstroms, 5000 angstroms, 10000 angstroms, 15000 angstroms, 18000 angstroms, 20000 angstroms, or the like. In the present embodiment, the thickness W of the buffer layer 310 is 1000 angstroms.

In the present application, the thickness W of the buffer layer 310 is set to 500 angstroms to 20000 angstroms, so that when the conductive particles 510 crush the additional electrode 320, the buffering effect is achieved, and then the subsequent conductive particles 510 are prevented from crushing the binding pin electrode 200 on the surface of the flexible array substrate, and further the contact area between the conductive particles 510 and the binding pin electrode 200 is prevented from being different, and further the contact resistance between the different binding pin electrodes 200 and the subsequent driving chip or the flexible circuit board is prevented from being different, and further the application thereof to the display device is prevented, which causes the problem of bright lines or dark lines appearing on the display device, so that the display device displays unevenly, and further the performance of the display device is improved. If the thickness W of the buffer layer 310 is set to be less than 500 angstroms, the buffer layer 310 is too thin and is easily crushed by the conductive particles 510, so that the bonding pin electrode 200 may be crushed by the conductive particles 510, and a bright line or a dark line may appear on the display device, so that the display device displays non-uniformly; if the thickness W of the buffer layer 310 is set to be greater than 20000 angstroms, the buffer layer 310 is too thick, which results in a thicker array substrate 10, and is not favorable for realizing a thinner and lighter device when the array substrate is applied to a display device; if the thickness W of the buffer layer 310 is set to be greater than 20000 angstroms, the buffer layer 310 is too thick, which may cause the additional electrode 320 on the side of the buffer layer 310 to be too thin and even broken, thereby causing the additional electrode 320 to be in poor contact with the bonding pin electrode 200, and further reducing the performance of the array substrate 10.

In one embodiment, the material of the additional electrodes 320 is selected from one or more of conductive metal and conductive metal oxide.

In one embodiment, the material of the additional electrode 320 is selected from one or more of silver, titanium, aluminum, zinc oxide, indium tin oxide, molybdenum trioxide, and titanium dioxide. In the present embodiment, the material of the additional electrode 320 is aluminum.

In one embodiment, the additional electrode 320 has a thickness D of 500-3000 angstroms. The thickness D of the additional electrode 320 may be 500 angstroms, 1000 angstroms, 1500 angstroms, 2000 angstroms, 2500 angstroms, 3000 angstroms, or the like. In the present embodiment, the thickness D of the additional electrode 320 is 2500 angstroms.

In the application, the thickness D of the additional electrode 320 is set to be 500 angstroms to 3000 angstroms, so that the additional electrode 320 is not easily punctured by the subsequent conductive particles 510, and further the risk that the binding pin electrode 200 is punctured by the conductive particles 510 is reduced, and further the contact resistance between the different binding pin electrodes 200 and the subsequent driving chip or the flexible circuit board is different, and further the problem that the display device appears bright lines or dark lines when the display device is applied to the display device is avoided, so that the display device displays unevenly, and further the performance of the display device is improved. If the thickness D of the additional electrode 320 is set to be less than 500 angstroms, the additional electrode 320 is too thin and is easily crushed by the conductive particles 510, so that the risk that the bonding pin electrode 200 is crushed by the subsequent conductive particles 510 is increased, and then bright lines or dark lines appear on the display device, so that the display device displays non-uniform; if the thickness D of the additional electrode 320 is set to be greater than 3000 angstroms, the additional electrode 320 is too thick, which results in a thicker array substrate 10, and therefore, it is not favorable for implementing a thinner device when the array substrate is applied to a display device.

Referring to fig. 2, fig. 2 is a schematic view illustrating a second structure of an array substrate according to an embodiment of the present disclosure. It should be noted that the second structure is different from the first structure in that:

the additional electrode 320 and the buffer layer 310 are not disposed on the binding foot electrode 200, but the guard electrode 330 is disposed on the binding foot electrode 200, and the thickness h of the vertical section of the guard electrode 330 is greater than the thickness of the vertical section of the conductive particle 510. Specifically, the thickness h of the vertical section of the guard electrode 330 is greater than 10% of the thickness of the vertical section of the conductive particle 510. The other structures are the same as those in fig. 1, and are not described again here.

In one embodiment, the material of guard electrode 330 is the same as the material of bundled pin electrode 200.

In another implementation, the material of guard electrode 330 is different from the material of bound foot electrode 200.

In this application, set up guard electrode 330 on binding foot electrode 200, guard electrode 330 vertical cross-section's thickness h is greater than the thickness of conductive particle vertical cross-section, when making and binding drive element through anisotropic conducting resin 500, even the conductive particle pierces guard electrode 330, the conductive particle is the same with guard electrode 330 and the area of contact who binds foot electrode 200, and then avoid the difference to bind the contact resistance between foot electrode 200 and subsequent driver chip or the flexible circuit board, and then avoid using it when display device, lead to the problem that display device appears bright line or dark line, make display device show unevenly, and then improved display device's performance. The thickness h of the vertical section of the protective electrode 330 is set to be greater than 10% of the thickness of the vertical section of the conductive particles, so that the protective electrode 330 is prevented from being completely punctured by subsequent conductive particles, the difference of contact resistance between different binding pin electrodes 200 and a driving chip or a flexible circuit board is further avoided, and the problem that bright lines or dark lines appear on a display device is further avoided when the protective electrode is applied to the display device, so that the display device is enabled to display unevenly, and the performance of the display device is improved.

In another embodiment, the buffer layer 310 and the additional electrode 320 are sequentially stacked on the guard electrode 330.

In the application, the buffer layer 310 and the additional electrode 320 are sequentially stacked on the protective electrode 330, so that the binding pin electrode 200 is further prevented from being punctured by subsequent conductive particles, the difference in contact resistance between the different binding pin electrodes 200 and the driving chip or the flexible circuit board is further avoided, and the problem of bright lines or dark lines of the display device is further avoided when the display device is applied to the display device, so that the display device is uneven in display, and the performance of the display device is further improved.

The application discloses array substrate 10, array substrate 10 include the display area 11 and bind district 12, and the district 12 that binds sets up in one side of display area 11, and array substrate 10 includes substrate layer 100, binds foot electrode 200 and protective layer 300, binds foot electrode 200 and sets up on the substrate layer 100 of binding district 12, and protective layer 300 sets up on binding foot electrode 200. Through setting up protective layer 300 on binding foot electrode 200, avoid follow-up driver chip or flexible circuit board to bind in binding foot electrode 200 through anisotropic conducting resin 500 when, because of the hardness of binding foot electrode 200 is soft, easily be broken by the conductive particle pressure, thereby make conductive particle the same with the area of contact who binds foot electrode 200, and then avoid different contact resistance between binding foot electrode 200 and driver chip or the flexible circuit board different, and then avoid using it when display device, lead to the problem of bright line or dark line to appear in display device, make display device show unevenly, and then improved display device's performance.

Referring to fig. 3, fig. 3 is a first structural schematic diagram of a display device according to an embodiment of the present disclosure. The present application further provides a display device 20, the display device 20 includes the array substrate 10 and an anisotropic conductive adhesive 500 disposed on the protective layer 300 in the array substrate 10, wherein the anisotropic conductive adhesive 500 is disposed with conductive particles 510 therein.

Specifically, the anisotropic conductive paste 500 is disposed on the additional electrode 320.

In the present application, the protection layer 300 is disposed between the anisotropic conductive adhesive 500 and the binding pin electrode 200, so that when the structure in the protection layer 300 is punctured, the contact area between the conductive particles 510 and the binding pin electrode 200 is still ensured, and the difference in contact resistance between the different binding pin electrodes 200 and the driving chip or the flexible circuit board is avoided, which leads to the occurrence of bright lines or dark lines in the display device 20, so that the display device 20 displays non-uniform, and further the performance of the display device 20 is improved.

In an embodiment, the display device 20 further includes a binding element 600 and a connection electrode 700. The binding member 600 is disposed on the anisotropic conductive paste 500. The connection electrode 700 is disposed between the binding member 600 and the anisotropic conductive adhesive 500. The binding member 600 is a driving chip or a flexible circuit board.

Referring to fig. 4, fig. 4 is a schematic view of a second structure of a display device according to an embodiment of the present disclosure. It should be noted that the second structure is different from the first structure in that: the anisotropic conductive paste 500 is disposed on the additional electrode 320, but on the guard electrode 330. The other structures are the same as those in fig. 4, and are not described again here.

In the present application, the array substrate 10 of the present application is applied to the display device 20, through setting the protective layer 300 between the binding pin electrode 200 and the anisotropic conductive adhesive 500, it is avoided that the driving chip or the flexible circuit board is bound to the binding pin electrode 200 through the anisotropic conductive adhesive 500, and the hardness of the binding pin electrode 200 is soft, and the conductive particles are easily crushed, so that the contact area of the conductive particles and the binding pin electrode 200 is the same, and further the contact resistance between the different binding pin electrodes 200 and the driving chip or the flexible circuit board is different, and further the application thereof to the display device 20 is avoided, which results in the problem that bright lines or dark lines appear on the display device 20, so that the display device 20 displays unevenly, and further the performance of the display device 20 is improved.

The application discloses array substrate 10 and display device 20, array substrate 10 include the display area 11 and bind district 12, and the district 12 that binds sets up in one side of display area 11, and array substrate 10 includes substrate layer 100, binds foot electrode 200 and protective layer 300, binds foot electrode 200 and sets up on the substrate layer 100 of binding district 12, and protective layer 300 sets up on binding foot electrode 200. Through setting up protective layer 300 between binding foot electrode 200 and anisotropic conductive adhesive 500, avoid driver chip or flexible circuit board to bind in binding foot electrode 200 through anisotropic conductive adhesive 500, because of the hardness that binds foot electrode 200 is soft, easily be broken by conductive particle, thereby make conductive particle the same with the area of contact who binds foot electrode 200, and then avoid different contact resistance that binds between foot electrode 200 and driver chip or the flexible circuit board different, and then avoid using it when display device 20, lead to display device 20 to appear the problem of bright line or dark line, make display device 20 show unevenly, and then improved display device 20's performance.

The array substrate and the display device provided by the embodiments of the present application are described in detail above, and the principles and embodiments of the present application are described herein by applying specific examples, and the description of the embodiments is only used to help understand the method and the core concept of the present application; meanwhile, for those skilled in the art, according to the idea of the present application, there may be variations in the specific embodiments and the application scope, and in summary, the content of the present specification should not be construed as a limitation to the present application.