阅读说明：本技术 一种电容器用金属化薄膜及其制作方法 (Metallized film for capacitor and manufacturing method thereof ) 是由 杨仁波 于 2021-08-18 设计创作，主要内容包括：本发明公开了一种电容器用金属化薄膜及其制作方法,电容器用金属化薄膜包括基膜层、覆盖于所述基膜层上的锡层、覆盖于所述锡层上的锌及覆盖于所述锌层上的AL-(2)O-(3)保护层,锡和锌复合作为电容器的极板,有效地解决了电容器在使用过程中发生的电腐蚀问题,AL-(2)O-(3)保护层可以阻止内部的金属层发生氧化反应,从而保证电容器用金属化薄膜的使用性能。本发明的的电容器用金属化薄膜成本低、附着性强；解决了目前国内普遍使用的锌铝复合金属化薄膜的电腐蚀和大气氧化问题。(The invention discloses a metallized film for a capacitor and a manufacturing method thereof 2 O 3 The protective layer, tin and zinc are compounded to be used as a polar plate of the capacitor, the problem of electric corrosion of the capacitor in the using process is effectively solved, and AL is 2 O 3 The protective layer can prevent the internal metal layer from oxidation reaction, thereby ensuring the service performance of the metallized film for the capacitor. The metallized film for the capacitor has low cost and strong adhesiveness; solves the problems of electric corrosion and atmospheric oxidation of the zinc-aluminum composite metallized film which is generally used at home at present.)

1. A metallized film for a capacitor, comprising a base film layer, characterized in that: further comprises a tin layer covering the base film layer, a zinc layer covering the tin layer, and an AL covering the zinc layer₂O₃And a protective layer.

2. The metallized film for capacitors as claimed in claim 1, wherein: the weight of the tin layer is the tin layer, the zinc layer and the AL₂O₃1-2% of the total weight of the layer.

3. The metallized film for capacitors as claimed in claim 1, wherein: the weight of the zinc layer is that of the tin layer, the zinc layer and AL₂O₃90-95% of the total weight of the layer.

4. The metallized film for capacitors as claimed in claim 1, wherein: the AL₂O₃The weight of the layer is the tin layer, the zinc layer and the AL₂O₃4 to 8 percent of the total weight of the layer.

5. A method for manufacturing a metallized film for a capacitor is characterized by comprising the following steps: under the vacuum condition, firstly evaporating a layer of tin as a base metal on the base film layer to form a tin layer; then, evaporating a layer of zinc on the tin layer to form a zinc layer; finally atEvaporating a layer of Al on the zinc layer₂O₃And a protective layer.

6. The method of manufacturing a metallized film for capacitors as claimed in claim 5, wherein: the tin layer is evaporated by using a tin evaporation source, the tin evaporation source adopts molybdenum sheet boat heating, metal tin is put on the molybdenum sheet boat for melting, the temperature is heated to 1000-1200 ℃ under the vacuum condition, and tin steam is plated on the base film.

7. The method of manufacturing a metallized film for capacitors as claimed in claim 5, wherein: the evaporation of the zinc layer uses a zinc evaporation source, the zinc material of the zinc evaporation source is placed in an iron bath, a zinc furnace is used for heating to 600-700 ℃, and zinc vapor is plated on the tin layer through a zinc nozzle.

8. The method of manufacturing a metallized film for capacitors as claimed in claim 5, wherein: the AL₂O₃The protective layer is evaporated by using an aluminum evaporation source, the aluminum evaporation source adopts a boron nitride evaporation boat, 8 or 10 aluminum wires are conveyed to the boron nitride evaporation boat through a wire feeding mechanism to be melted, the aluminum wires are heated to 1000-1200 ℃ under the vacuum condition, an oxygen spraying mechanism is arranged above the evaporation source, and the aluminum steam reacts with the sprayed oxygen to form AL₂O₃Vapor plating onto the zinc layer.

Technical Field

The invention relates to the field of metalized films, in particular to a metalized film for a capacitor and a manufacturing method thereof.

Background

The metallized film capacitor is made up by using organic plastic film (common film material includes polyethylene, polypropylene and polycarbonate) as medium, using metallized film (i.e. one or several layers of metal film are evaporated on the surface of organic plastic film instead of traditional metal foil) as electrode and adopting winding mode.

The existing metallized film capacitor industry generally adopts a zinc and aluminum composite metallized film coating process, wherein zinc is used as a main electrode plateFor the metal layer, because of its poor adhesion, it is difficult to directly evaporate the coating on the base film, and a layer of metal must be plated first to make the bottom layer. At present, the metallized film capacitor industry in China generally adopts a zinc-aluminum composite metallized film technology, namely, a layer of metal aluminum is plated on a base film for priming under the vacuum condition, and then a layer of metal zinc is plated, so that an aluminum-zinc composite coating is formed on the surface of the base film and is used as an electrode plate for manufacturing a capacitor. The biggest defects of the zinc-aluminum composite metallized film technology are as follows: firstly, the galvanic reaction of aluminum and zinc in the use process of the capacitor, namely the electric corrosion phenomenon, and secondly, the oxidation reaction of the outmost metal zinc and the oxygen in the air is easy to occur, thereby reducing the performance of the capacitor product. A silver, zinc and aluminum composite metallized film is provided internationally, namely a base film is firstly coated with a layer of silver (belonging to noble metal), then coated with a layer of zinc and finally coated with a layer of aluminum, and the aluminum layer is oxidized by contacting with air to form AL₂O₃Protective layer of the AL₂O₃The protective layer can prevent the metal layer inside from continuously generating oxidation reaction, thereby ensuring the service performance of the metallized film. The silver, zinc and aluminum composite metallized film technology is also introduced in a small amount in China, but the technology adopts noble metal silver as a primer, so the cost is high, and simultaneously, the technology is to plate an aluminum layer on the surface of a metal layer, and the aluminum layer naturally forms AL by contacting with the atmosphere₂O₃The protective layer is thin and has poor protective effect, so the technology is not widely adopted in China. Therefore, there is a need for improvements in the prior art to avoid the disadvantages of the prior art.

Disclosure of Invention

The invention aims to overcome the defects in the prior art and provide a metallized film for a capacitor, which has low cost, strong adhesiveness and stable electrical property.

Another object of the present invention is to provide a method for manufacturing a metallized film for capacitors.

The invention is realized by the following technical scheme:

the metallized film for capacitor includes base film layer and covering the baseTin layer on the film, zinc layer covering the tin layer, AL covering the zinc layer₂O₃And a protective layer.

Further, the weight of the tin layer is the tin layer, the zinc layer and the AL₂O₃1-2% of the total weight of the layer.

Further, the weight of the zinc layer is the tin layer, the zinc layer and the AL₂O₃90-95% of the total weight of the layer.

Further, the AL₂O₃The weight of the layer is the tin layer, the zinc layer and the AL₂O₃4 to 8 percent of the total weight of the layer.

A method for preparing metallized film for capacitor, under vacuum condition, a layer of tin is evaporated on a base film layer to form a tin layer; then, evaporating a layer of zinc on the tin layer to form a zinc layer; finally, evaporating a layer of AL on the zinc layer₂O₃And a protective layer.

Furthermore, the tin layer is evaporated by using a tin evaporation source, the tin evaporation source adopts a molybdenum sheet boat for heating, metal tin is put on the molybdenum sheet boat for melting, the temperature is heated to 1000-1200 ℃ under the vacuum condition, and tin steam is plated on the base film.

Furthermore, the evaporation of the zinc layer uses a zinc evaporation source, zinc material of the zinc evaporation source is placed in an iron bath, the zinc bath is heated to 600-700 ℃ by a zinc furnace, and zinc vapor is plated on the tin layer through a zinc nozzle.

Further, the AL₂O₃The protective layer is evaporated by using an aluminum evaporation source, the aluminum evaporation source adopts a boron nitride evaporation boat, 8 or 10 aluminum wires are conveyed to the boron nitride evaporation boat through a wire feeding mechanism to be melted, the aluminum wires are heated to 1000-1200 ℃ under the vacuum condition, an oxygen spraying mechanism is arranged above the evaporation source, and the aluminum steam reacts with the sprayed oxygen to form AL₂O₃Vapor plating onto the zinc layer.

Compared with the prior art, the invention effectively solves the problem of poor adhesion of zinc by using a layer of tin as the priming metal on the base film, and greatly improves the problems of high cost and difficult popularization of the silver, zinc and aluminum composite metallized film manufacturing technologyAnd the outer layer AL, while improving the electric corrosion resistance of the capacitor₂O₃The protective layer can prevent the oxidation reaction of the metal layer inside, and solve the oxidation problem of the zinc-aluminum composite metallized film commonly used in China at present.

Drawings

In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to these drawings without creative efforts.

FIG. 1 is a schematic structural diagram of a metallized film for capacitors in accordance with the present invention.

In the figure: 1-a base film layer; 2-a tin layer; 3-a zinc layer; 4-AL₂O₃And a protective layer.

Detailed Description

The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.

As shown in figure 1, the metallized film for capacitor of the invention comprises a base film layer 1, a tin layer 2 covering the base film layer 1, a zinc layer 3 covering the tin layer 2 and an AL covering the zinc layer 3₂O₃And a protective layer 4. Through set up tin layer 2 between base film layer 1 and zinc layer 3, solved base film layer 1 and zinc layer 3 poor problem of adhesion force at the coating in-process, improved the resistant electrical corrosion ability of condenser simultaneously again, through set up AL on zinc layer 3 surface₂O₃The protective layer 4 solves the problem that air oxidation is very easy to occur in the manufacturing and using processes of the capacitor, and simultaneously, a layer of AL is uniformly covered on the zinc layer₂O₃A protective layer 4 for effective protectionThe metal layer prevents the metal layer from being oxidized, improves the compressive strength of the film, and greatly solves the problems of high cost and difficult popularization of the silver, zinc and aluminum composite metallized film manufacturing technology; and the oxidation problem of the zinc-aluminum composite metallized film which is generally used at home at present.

The weight of the tin layer 2 is the tin layer 2, the zinc layer 3 and the AL₂O₃1% -2% of the total weight of layer 4, is most favorable to save material and guarantee the adhesive property of tin layer, as a concrete implementation mode, the weight of tin layer 2 is tin layer 2, zinc layer 3 and AL₂O₃1.5% of the total weight of layer 4.

The zinc layer 3 comprises a tin layer 2, a zinc layer 3 and AL₂O₃90% -95% of the total weight of layer 4, is most favorable to save material and guarantee the performance of the capacitor, as a concrete implementation mode, the weight of zinc layer is tin layer 2, zinc layer 3 and AL₂O₃93% of the total weight of layer 4.

AL₂O₃The layer 4 comprising, by weight, a tin layer 2, a zinc layer 3 and AL₂O₃4-8% of the total weight of the layer 4, which is most beneficial for saving materials and ensuring the anti-oxidation performance of the coating, as a specific implementation mode, AL₂O₃The layer 4 comprising, by weight, a tin layer 2, a zinc layer 3 and AL₂O₃6% of the total weight of layer 4.

A method for preparing metallized film for capacitor, under the vacuum condition, a layer of tin is first vapor-plated on a base film layer 1 as a base metal to form a tin layer 2; then, evaporating a layer of zinc on the tin layer 2 to form a zinc layer 3; finally, a layer of Al is evaporated on the zinc layer 3₂O₃And a protective layer 4.

The tin layer 2 is evaporated by using a tin evaporation source, the tin evaporation source adopts a molybdenum sheet boat for heating, metal tin is put on the molybdenum sheet boat for melting, the temperature is heated to 1000-1200 ℃ under the vacuum condition, and tin steam is plated on the base film.

The zinc layer 3 is evaporated by using a zinc evaporation source, zinc material in the zinc evaporation source is put in an iron bath, the temperature is heated to 600-700 ℃ by a zinc furnace, and zinc vapor is plated on the tin layer 2 through a zinc nozzle.

AL₂O₃Protective layer4, an aluminum evaporation source is used for evaporation, a boron nitride evaporation boat is adopted as the aluminum evaporation source, 8 or 10 aluminum wires are conveyed to the boron nitride evaporation boat through a wire feeding mechanism to be melted, the aluminum wires are heated to 1000-1200 ℃ under the vacuum condition, an oxygen spraying mechanism is arranged above the evaporation source, and the aluminum steam reacts with the sprayed oxygen to form AL₂O₃Vapor plating onto the zinc layer 3.

The above description is only for the purpose of illustrating the preferred embodiments of the present invention and is not to be construed as limiting the invention, and any modifications, equivalents, improvements and the like that fall within the spirit and principle of the present invention are intended to be included therein.