阅读说明：本技术 一种镀层均匀的化学镀铜工艺 (Electroless copper plating process with uniform plating ) 是由 鄢妙 于 2021-08-03 设计创作，主要内容包括：本发明公开了一种镀层均匀的化学镀铜工艺,包括混凝炉,所述混凝炉内部开有混凝腔,所述混凝腔开口朝上,所述混凝炉上端面固定连接有一个固定架,所述固定架上端面固定连接有一个动力箱；本发明通过将密集度较高的待镀工件放置在分离盘上,利用离心力以及分离臂上的磁铁将镀铜层较厚的工件与镀铜层较薄的工件分离开来,使得镀铜层较薄的工件重新接触加入了催化剂的镀铜液,保证了同一批次的镀铜工件的镀铜层厚度均匀,还利用了活塞板与密封板,将固体催化剂与镀铜液实现了在保证随时反应基础上的固液分离,避免催化剂的浪费以及控制反应速率。(The invention discloses a chemical copper plating process with uniform plating, which comprises a coagulation furnace, wherein a coagulation cavity is formed in the coagulation furnace, the opening of the coagulation cavity is upward, the upper end surface of the coagulation furnace is fixedly connected with a fixing frame, and the upper end surface of the fixing frame is fixedly connected with a power box; according to the invention, the workpieces to be plated with higher density are placed on the separating disc, the workpieces with thicker copper plating layers are separated from the workpieces with thinner copper plating layers by using centrifugal force and the magnets on the separating arms, so that the workpieces with thinner copper plating layers are contacted with the copper plating solution added with the catalyst again, the uniform thickness of the copper plating layers of the workpieces with the same batch of copper plating is ensured, the solid-liquid separation of the solid catalyst and the copper plating solution on the basis of ensuring the reaction at any time is realized by using the piston plate and the sealing plate, the waste of the catalyst is avoided, and the reaction rate is controlled.)

1. The chemical copper plating process with uniform plating layers comprises a coagulation furnace and is characterized in that: the concrete mixer is characterized in that a concrete cavity is formed in the concrete mixer, the opening of the concrete cavity faces upwards, a fixing frame is fixedly connected to the upper end face of the concrete mixer, a power box is fixedly connected to the upper end face of the fixing frame, a power cavity is formed in the power box, the opening of the power cavity faces downwards, a liquid mixing box is fixedly connected to the lower end of the concrete mixer, a liquid mixing cavity is formed in the liquid mixing box, the opening of the liquid mixing cavity faces upwards, a power motor is fixedly arranged on the inner wall of the upper side of the power cavity, the power motor is controlled by an electric telescopic rod, a separating mechanism for screening workpieces with thick copper coatings and workpieces with thin copper coatings is fixedly arranged on the lower end face of the electric telescopic rod, a limiting cylinder penetrates through the inner wall of the lower side of the concrete cavity and the liquid mixing cavity, a gas cavity is formed in the limiting cylinder, a piston plate slides on the inner wall of the gas cavity, and a solid catalyst is fixedly connected to the lower side of the piston plate, the lower end face of the solid catalyst is fixedly connected with a sealing plate, and an infiltration mechanism for controlling the copper plating chemical reaction rate and saving the catalyst is arranged in the coagulation chamber.

2. The electroless copper plating process of claim 1, wherein: the separating mechanism comprises a sleeve fixedly connected to the lower end face of the electric telescopic rod, a sleeve cavity with a downward opening is formed in the sleeve, a separating disc is fixedly connected to the sleeve, five hole grooves are formed in the lower surface of the separating disc, each hole groove is close to a supporting block fixedly connected to the inner wall of one side of the electric telescopic rod, a separating arm is hinged to the supporting block and fixed to the separating arm, an electromagnet is fixed to the separating arm, a steel wire rope is fixedly connected to one side of the separating arm and penetrates through a movable clamp and the fixed clamp to be fixedly connected to the fixed block, a pressure spring is fixedly connected to the lower end face of the fixed block, and the other end of the pressure spring is fixedly connected to the upper surface of the limiting cylinder.

3. The process of claim 2, wherein the electroless copper plating process comprises the following steps: mix the liquid chamber and pass through sealed tube and external intercommunication, it has the seal membrane to add the stifled seal in the sealed tube.

4. The electroless copper plating process of claim 1, wherein: the infiltrating mechanism comprises a copper plate fixed on the sleeve, thirty-two holes are formed in the copper plate, a sealing gasket is fixed on one side, away from the sleeve, of the copper plate, four guide rails are formed in the surface of the sleeve, and an annular slide rail is further formed in the surface of the sleeve.

5. The electroless copper plating process of claim 1, wherein: the lower side of the coagulation furnace is symmetrically communicated with two liquid conveying pipes in the left and right positions of the sleeve, a pneumatic valve is arranged in each liquid conveying pipe, two air pipes are symmetrically arranged in the left and right positions of the coagulation furnace in the left and right positions of the sleeve, one end of each air pipe is communicated to the pneumatic valve, a sealing block is added to the other end of each air pipe, two limiting cavities are symmetrically arranged in the left and right positions of the sleeve in the coagulation furnace in the spring, each limiting cavity is far away from a reset spring fixedly connected to the inner wall of one side of the sleeve, and a trigger block is fixedly connected to the other end of the reset spring.

6. The process of claim 5, wherein the electroless copper plating process comprises the following steps: and a certain amount of compressed nitrogen is filled in the air pipe and the sleeve cavity.

7. The electroless copper plating process of claim 1, wherein: and the upper end surface of the limiting cylinder is provided with a ventilating through hole.

Technical Field

The invention relates to the technical field of chemical copper plating, in particular to a chemical copper plating process with uniform plating.

Background

Electroless copper plating is a process in circuit board manufacturing, and is also commonly referred to as copper deposition or voiding as an autocatalytic redox reaction. The first treatment with activator makes the surface of insulating base material adsorb one layer of active particles, usually metal palladium particles, copper ions are first reduced on these active metal palladium particles, and these reduced metal copper crystal nucleuses themselves become catalytic layers of copper ions, so that the reduction reaction of copper is continued on the surface of these new copper crystal nucleuses.

In the case of some workpieces with high concentration, due to insufficient contact, the thickness of the generated coating is different, the subsequent processing application is influenced, and the reaction rate and the use of a catalyst are difficult to control.

Disclosure of Invention

The invention aims to provide an electroless copper plating process with uniform plating, which is used for overcoming the defects in the prior art.

The electroless copper plating process with uniform plating layers comprises a coagulation furnace, wherein a coagulation cavity is formed in the coagulation furnace, the opening of the coagulation cavity faces upwards, a fixing frame is fixedly connected to the upper end face of the coagulation furnace, a power box is fixedly connected to the upper end face of the fixing frame, a power cavity is formed in the power box, the opening of the power cavity faces downwards, a liquid mixing box is fixedly connected to the lower end of the coagulation furnace, a liquid mixing cavity is formed in the liquid mixing box, the opening of the liquid mixing cavity faces upwards, a power motor is fixedly arranged on the inner wall of the upper side of the power cavity, the power motor controls an electric telescopic rod, a separating mechanism for screening workpieces with thick copper plating layers and workpieces with thin copper plating layers is fixedly arranged on the lower end face of the electric telescopic rod, a limiting cylinder penetrates through the space between the inner wall of the lower side of the coagulation cavity and the liquid mixing cavity, and a gas cavity is formed in the limiting cylinder, the gas chamber is characterized in that a piston plate slides on the inner wall of the gas chamber, a solid catalyst is fixedly connected to the lower side of the piston plate, a sealing plate is fixedly connected to the lower end face of the solid catalyst, and an infiltration mechanism for controlling the copper plating chemical reaction rate and saving the catalyst is arranged in the coagulation chamber.

According to the technical scheme, the separating mechanism comprises a sleeve fixedly connected to the lower end face of the electric telescopic rod, a sleeve cavity with a downward opening is formed in the sleeve, a separating disc is fixedly connected to the sleeve, five hole grooves are formed in the lower surface of the separating disc, each hole groove is close to a supporting block fixedly connected to the inner wall of one side of the electric telescopic rod, a separating arm is hinged to the supporting block and fixed with an electromagnet, a steel wire rope is fixedly connected to one side of the separating arm and penetrates through a movable clamp and the fixed clamp to be fixedly connected to the fixed block, a pressure spring is fixedly connected to the lower end face of the fixed block, and the other end of the pressure spring is fixedly connected to the upper surface of the limiting cylinder.

Further technical scheme, mix the liquid chamber and pass through sealed tube and external intercommunication, it has the seal membrane to add the stifled in the sealed tube, the seal membrane is used for the shutoff and prevents that the copper plating liquid from oozing.

According to a further technical scheme, the infiltration mechanism comprises a copper plate fixed on the sleeve, thirty-two holes are formed in the copper plate, a sealing gasket is fixed on one side, away from the sleeve, of the copper plate, four guide rails are formed in the surface of the sleeve, and an annular slide rail is further formed in the surface of the sleeve.

According to the technical scheme, the lower side of the coagulation furnace is symmetrically communicated with two liquid conveying pipes in the left and right positions of the sleeve, a pneumatic valve is arranged in each liquid conveying pipe, two air pipes are symmetrically arranged in the left and right positions of the sleeve of the coagulation furnace, one end of each air pipe is communicated to the pneumatic valve, the other end of each air pipe is plugged with a sealing block, the coagulation furnace is symmetrically opened with two limiting cavities in the left and right positions of the sleeve, each limiting cavity is far away from a reset spring fixedly connected to the inner wall of one side of the sleeve, and a trigger block is fixedly connected to the other end of each reset spring.

According to a further technical scheme, a certain amount of compressed nitrogen is filled in the air pipe and the sleeve cavity, and the pneumatic valve and the sealing plate are controlled by the compressed nitrogen.

According to a further technical scheme, the upper end face of the limiting cylinder is provided with a ventilating through hole.

The invention has the beneficial effects that:

according to the invention, the workpieces to be plated with higher density are placed on the separating disc, and the workpieces with thicker copper plating layers are separated from the workpieces with thinner copper plating layers by using centrifugal force and the magnets on the separating arms, so that the workpieces with thinner copper plating layers are contacted with the copper plating solution added with the catalyst again, and the uniform thickness of the copper plating layers of the workpieces with copper plating in the same batch is ensured;

the invention also utilizes the piston plate and the sealing plate to realize solid-liquid separation of the solid catalyst and the copper plating solution on the basis of ensuring the reaction at any time, thereby avoiding the waste of the catalyst and controlling the reaction rate.

Drawings

FIG. 1 is a schematic external view of the present invention;

FIG. 2 is a schematic diagram of the overall structure of an electroless copper plating process with uniform plating according to the present invention;

FIG. 3 is a block diagram of the trigger block of FIG. 2 in accordance with the present invention;

FIG. 4 is a block diagram of the seal tube of FIG. 2 according to the present invention;

fig. 5 is a partial external view of the limiting cylinder in fig. 2.

Detailed Description

For purposes of making the objects and advantages of the present invention more apparent, the following detailed description of the invention, taken in conjunction with the examples, should be understood that the following text is intended to describe only one uniform electroless copper plating process or several specific embodiments of the invention, and is not intended to define the scope of the invention as specifically claimed, and as used herein, the terms up, down, left and right are not limited to their exact geometric definitions, but include tolerances for machining or human error rationality and inconsistencies, the following detailed description of which is exhaustive:

referring to the attached drawings, the electroless copper plating process with uniform plating according to the embodiment of the invention comprises a coagulation furnace 11, wherein a coagulation cavity 12 is formed in the coagulation furnace 11, the opening of the coagulation cavity 12 faces upwards, a fixed frame 48 is fixedly connected to the upper end face of the coagulation furnace 11, a power box 41 is fixedly connected to the upper end face of the fixed frame 48, a power cavity 42 is formed in the power box 41, the opening of the power cavity 42 faces downwards, a liquid mixing box 13 is fixedly connected to the lower end of the coagulation furnace 11, a liquid mixing cavity 14 is formed in the liquid mixing box 13, the opening of the liquid mixing cavity 14 faces upwards, a power motor 15 is fixedly arranged on the inner wall of the upper side of the power cavity 42, an electric telescopic rod 16 is controlled by the power motor 15, a separating mechanism 72 for screening workpieces with thicker copper plating layers and workpieces with thinner copper plating layers is fixedly arranged on the lower end face of the electric telescopic rod 16, the utility model discloses a copper plating chemical reaction device, including coagulation chamber 12, piston plate 51, solid catalyst 43, the terminal surface fixedly connected with closing plate 37 under the solid catalyst 43, the coagulation intracavity portion is equipped with control copper plating chemical reaction rate and the infiltration mechanism 71 that practices thrift the catalyst and use, and it has a spacing section of thick bamboo 33 to run through between the cavity 14 to thoughtlessly congeal the inboard wall in chamber 12 with mix the liquid chamber, the inside gas chamber 34 that opens of spacing section of thick bamboo 33, it has piston plate 51 to slide on the inner wall of gas chamber 34, piston plate 51 downside fixedly connected with solid catalyst 43, the infiltration mechanism 71 that controls copper plating chemical reaction rate and practice thrift the catalyst and use is equipped with.

Advantageously or exemplarily, the separating mechanism 72 includes a sleeve 17 fixedly connected to the lower end surface of the electric telescopic rod 16, the sleeve 17 is internally provided with a sleeve cavity 24 with a downward opening, the sleeve 17 is fixedly connected with a separating disc 18, the lower surface of the separating disc 18 is provided with five hole slots 19, each hole slot 19 is fixedly connected to the inner wall of one side of the electric telescopic rod 16, a supporting block 49 is fixedly connected to each hole slot 19, a separating arm 20 is hinged to the supporting block 49, an electromagnet 54 is fixed to the separating arm 20, a steel wire rope 22 is fixedly connected to one side of the separating arm 20, the steel wire rope 22 passes through a movable clamp 21 and a fixed clamp 50 and is fixedly connected to a fixed block 32, a pressure spring 25 is fixedly connected to the lower end surface of the fixed block 32, the other end of the pressure spring 25 is fixedly connected to the upper surface of the limiting cylinder 33, when a workpiece needs to be screened, the electric telescopic rod 16 is started, the electric telescopic rod 16 drives the separating disc 18 and the sleeve 17 to move downwards, the sleeve 17 drives the copper plate 40 to move downwards together, meanwhile, the steel wire rope 22 is stretched, and the steel wire rope 22 drives the separating arm 20 and the magnet 54 on the separating arm 20 to gather and adsorb workpieces.

The liquid mixing chamber 14 is communicated with the outside through a sealing pipe 45, a sealing film 46 is added in the sealing pipe 45, and the sealing film 46 is used for blocking and preventing copper plating liquid from seeping out.

Advantageously or exemplarily, the wetting mechanism 71 includes a copper plate 40 fixed on the sleeve 17, the copper plate 40 is provided with thirty-two holes 39, a sealing gasket 31 is fixed on one side of the copper plate 40 away from the sleeve 17, the sleeve 17 is provided with four guide rails 53 on the surface, and the sleeve 17 is further provided with an annular slide rail 38 on the surface.

Beneficially or exemplarily, two liquid conveying pipes 35 are symmetrically communicated with the lower side of the coagulation furnace 11 in the left-right direction of the sleeve 17, one pneumatic valve 36 is arranged in each liquid conveying pipe 35, two air pipes 52 are symmetrically arranged on the lower side of the coagulation furnace 11 in the left-right direction of the sleeve 17, one end of each air pipe 52 is communicated with the pneumatic valve 36, the other end of each air pipe 52 is plugged with a sealing block 30, two limit cavities 26 are symmetrically arranged on the coagulation furnace 11 in the left-right direction of the sleeve 17 in relation to a spring 27, a return spring 27 is fixedly connected to the inner wall of one side of each limit cavity, which is far away from the sleeve 17, a trigger block 28 is fixedly connected to the other end of the return spring 27, when the reaction needs to be stopped or controlled, the electric telescopic rod 16 is restarted, the electric telescopic rod 16 retracts to drive the sleeve 18 to move upwards until the sealing block 31 compresses the trigger block 28 and the return spring 27, meanwhile, the auxiliary trigger block 29 on the trigger block 28 pushes the seal block 30, the seal block 30 compresses the compressed nitrogen in the air pipe 52, the air-operated valve 36 is started, and the copper plating solution in the coagulation furnace 11 descends into the solution mixing tank 13.

Advantageously or exemplarily, the air tube 52 and the sleeve cavity 24 are filled with a certain amount of compressed nitrogen, and the pneumatic valve 36 and the sealing plate 51 are controlled by the compressed nitrogen.

Beneficially or exemplarily, the upper end surface of the limiting cylinder 33 is provided with a through hole for ventilation.

The invention relates to a chemical copper plating process with uniform plating, which comprises the following working procedures:

an operator places a workpiece to be plated with copper with high concentration on the copper plate 40, fills the copper plating solution into the solution mixing cavity 14, adds a small amount of copper plating solution at the bottom of the coagulation furnace 11, and keeps the pneumatic valve 36 in a normally closed state;

starting the electric telescopic rod 16, driving the separating disc 18 and the sleeve 17 to move downwards by the electric telescopic rod 16, driving the copper plate 40 to move downwards together by the sleeve 17, compressing the compressed nitrogen inside the sleeve cavity 24 by the sleeve 17, completely wrapping the sleeve 17 outside the limiting cylinder 33 at the moment, indirectly compressing the piston plate 51 by the compressed nitrogen, pushing the piston plate 51 to move downwards, not attaching the sealing plate 37 to the limiting cylinder 33 at the moment, fully contacting the fixed catalyst 43 with the copper plating solution, accelerating the reaction, and fully immersing the workpiece to be plated with copper on the copper plate 40 with higher concentration in the copper plating solution;

because the concentration of the workpieces is high, the stacking phenomenon can occur, in addition, the catalyst accelerates the reaction, the phenomenon of uneven thickness of the copper plating layer is easily caused, after the workpieces react with the copper plating solution for a period of time, the power motor 15 is started, the power motor 15 drives the electric telescopic rod 16 to rotate, the electric telescopic rod 16 drives the separating disc 18 to rotate together, because the separating arm 20 is in a folding state at the moment, the magnet 54 on the separating arm 20 adsorbs the workpieces with thick copper plating layers, and meanwhile, the workpieces with thin copper plating layers are thrown off under the action of centrifugal force and contact with the copper plating solution again;

after a period of time, restarting the electric telescopic rod 16, retracting the electric telescopic rod 16 to drive the sleeve 18 to move upwards until the sealing gasket 31 compresses the trigger block 28 and the reset spring 27, simultaneously pushing the sealing block 30 by the auxiliary trigger block 29 on the trigger block 28, compressing compressed nitrogen in the air pipe 52 by the sealing block 30, starting the pneumatic valve 36, and at the moment, lowering the copper plating solution in the coagulation furnace 11 into the liquid mixing box 13, simultaneously, stopping excessive reaction when the solid catalyst 51 is not in contact with the copper plating solution;

the above operations are repeated until the copper plating layer on the workpiece is nearly uniform.

The invention has the beneficial effects that:

according to the invention, the workpieces to be plated with higher density are placed on the separating disc, and the workpieces with thicker copper plating layers are separated from the workpieces with thinner copper plating layers by using centrifugal force and the magnets on the separating arms, so that the workpieces with thinner copper plating layers are contacted with the copper plating solution added with the catalyst again, and the uniform thickness of the copper plating layers of the workpieces with copper plating in the same batch is ensured;

the invention also utilizes the piston plate and the sealing plate to realize solid-liquid separation of the solid catalyst and the copper plating solution on the basis of ensuring the reaction at any time, thereby avoiding the waste of the catalyst and controlling the reaction rate.

It will be apparent to those skilled in the art that various modifications may be made to the above embodiments without departing from the general spirit and concept of the invention. All falling within the scope of protection of the present invention. The protection scheme of the invention is subject to the appended claims.