阅读说明：本技术 一种陶瓷电容器全连线生产工艺 (Full-connection production process of ceramic capacitor ) 是由 罗世勇 赵俊斌 姚映和 刘恒武 赵丽兴 于 2020-12-29 设计创作，主要内容包括：本发明公开一种陶瓷电容器全连线生产工艺,包括以下步骤：对引线进行切断编带后,再对引线进行打线成形,通过热风对电容器芯片与引线进行焊接,焊接完成后进行第一次CCD检测并将不良品剔除；焊接后的引线芯片随料带传动通过多次粘粉使包封料附着到芯片表面；将涂装料带进入固化炉对附着到芯片表面的包封料进行固化,完成固化后进行第二次CCD检测及不良品剔除；将完成固化的产品由料带传动通过双面激光打标机对产品的上下表面进行打标,完成打标后进行第三次CCD检测及不良品剔除；对打标料带上的产品进行电容量、损耗、耐电压、绝缘电阻等测试。实现从引线成形、引线芯片装配焊接、涂封固化、标志、电性能检测、外观检查、编带一次性完成。(The invention discloses a full-connection production process of a ceramic capacitor, which comprises the following steps: cutting off and taping the lead, then routing and forming the lead, welding the capacitor chip and the lead by hot air, carrying out primary CCD detection after welding is finished, and removing defective products; the welded lead chip is driven by the material belt to adhere the packaging material to the surface of the chip through multiple times of powder adhesion; the coating material belt enters a curing furnace to cure the packaging material attached to the surface of the chip, and secondary CCD detection and defective product elimination are carried out after curing is finished; marking the upper and lower surfaces of the product subjected to solidification by a material belt transmission through a double-sided laser marking machine, and performing CCD detection and defective product elimination for the third time after marking is completed; and testing the products on the marking material belt for capacitance, loss, voltage resistance, insulation resistance and the like. The method realizes one-time completion of lead forming, lead chip assembly welding, coating and curing, marking, electrical property detection, appearance inspection and taping.)

1. The full-connection production process of the ceramic capacitor is characterized by comprising the following steps of:

1) chip welding: after the leads are braided, the leads are subjected to routing forming, then chip assembly is carried out, the chip is clamped between the two crossed leads, the capacitor chip and the leads are welded through hot air, and after welding is finished, CCD detection and defective product elimination are carried out for the first time, so that a chip material belt is obtained;

2) chip coating and sealing: the method comprises the following steps that a chip material belt enters an encapsulating material coating machine under the driving of traction equipment, the encapsulating material is attached to the surface of a chip through multiple times of powder adhesion, and product coating is achieved through leveling to obtain a coating material belt;

3) coating and curing: the coating material belt enters a curing oven under the driving of traction equipment to cure the coating material attached to the surface of the chip, and secondary CCD detection and defective product elimination are carried out after the curing is finished to obtain a cured material belt;

4) marking a product: enabling the solidified material belt to enter a double-sided laser marking machine under the driving of traction equipment, marking the upper surface and the lower surface of a product, carrying out third CCD detection and defective product elimination after marking is finished, obtaining a marked material belt, and enabling the marked material belt to enter a pre-test cache frame under the driving of the traction equipment;

5) and (3) testing electrical properties: and testing the electric capacity, loss, voltage resistance and insulation resistance of the product on the marking material belt, and automatically rejecting each section of tested defective products to obtain the electric testing good product belt.

2. The full-wiring production process of the ceramic capacitor as claimed in claim 1, wherein before the chip tape passes through the encapsulant coating machine, the chip tape is driven by a traction device to enter a pre-coating buffer rack; before the coating material belt passes through a curing furnace, the coating material belt enters a pre-curing buffer storage rack under the driving of traction equipment; before the solidified material belt enters the double-sided laser marking machine, the solidified material belt is driven by traction equipment to carry out marking on a pre-cache frame; before the marking material belt is subjected to electrical performance test, the marking material belt enters a pre-test cache frame under the driving of traction equipment.

3. The full-wiring production process of the ceramic capacitor according to claim 1, further comprising the step 6) of secondary braiding: and taking out the products on the electrically tested good material belt, re-braiding the products, and finally folding and packaging the re-braided material belt according to the set packaging quantity to finish the production of finished products.

4. The process according to claim 1, wherein the causes of defective products in the first CCD detection are classified and counted, and data are stored.

5. The process of claim 4, wherein the first CCD detects defects including lead-to-chip pad displacement, chip breakage or cold solder joint.

6. The full-line production process of the ceramic capacitor as claimed in claim 1, wherein the causes of defective products in the second CCD detection are classified and counted, and data are stored; and defective products such as impurities on the front surface of the product, impurities on the back surface of the product or surface defects of the product are detected by the CCD for the second time.

7. The process according to claim 1, wherein the causes of defective products in the third CCD detection are classified and counted, and data are stored.

8. The full-wiring production process of the ceramic capacitor as claimed in claim 1, wherein when chip coating is performed, the chips on the chip tape are sequentially subjected to primary preheating, primary powder adhesion, secondary preheating, secondary powder adhesion, tertiary preheating, tertiary powder adhesion, tertiary preheating and quaternary powder adhesion, and are subjected to leveling to complete coating and sealing storage; the temperature of each preheating is 180-220 ℃, and the temperature of each heating is 300-340 ℃.

Technical Field

The invention relates to the technical field of ceramic capacitors, in particular to a full-connection production process of a ceramic capacitor.

Background

The capacitor is a common electronic component in modern electronic products, and is widely applied to circuits, and the performance of the capacitor affects each electronic product. Ceramic capacitors (ceramic capacitors) are produced by using ceramic as a dielectric, coating silver or copper layers on both sides of a ceramic substrate, and firing the silver or copper layers to form electrodes. The shape of the utility model is more than that of a sheet, and also has the shapes of a circle, a square, a tube and the like. The production process of the existing ceramic capacitor mainly comprises the following steps: lead taping, pin forming, chip assembly, chip welding, product coating, product curing, product marking, electrical property detection, taping and the like; in the existing production process, the ceramic capacitor is produced by mainly adopting a segmented production line, materials need to be frequently transferred among production lines, the production efficiency is low, the quality problem of products of the production lines is difficult to track, and the product quality management and control are not facilitated.

Disclosure of Invention

The invention provides a full-wiring production process of a ceramic capacitor aiming at the defects of the existing production process, and aims to solve the problems in the background.

In order to solve the problems, the technical scheme adopted by the invention is as follows:

a full-wiring production process of a ceramic capacitor comprises the following steps:

1) chip welding: after the leads are braided, the leads are subjected to routing forming, then chip assembly is carried out, the chip is clamped between the two crossed leads, the capacitor chip and the leads are welded through hot air, and after welding is finished, CCD detection and defective product elimination are carried out for the first time, so that a chip material belt is obtained;

2) chip coating and sealing: the chip material belt enters an encapsulating material coating machine under the driving of traction equipment, the coating encapsulating material is attached to the surface of a chip through multiple times of powder adhesion, and the coating encapsulating material belt is cooled after vulcanization to obtain the coating encapsulating material belt;

3) coating and curing: the coating material belt enters a curing oven under the driving of traction equipment to cure the coating material attached to the surface of the chip, and secondary CCD detection and defective product elimination are carried out after the curing is finished to obtain a cured material belt;

4) marking a product: enabling the solidified material belt to enter a double-sided laser marking machine under the driving of traction equipment, marking the upper surface and the lower surface of a product through the double-sided laser marking machine, carrying out third CCD detection and defective product elimination after marking is finished to obtain a marked material belt, and enabling the marked material belt to enter a pre-test cache frame under the driving of the traction equipment;

5) and (3) testing electrical properties: and testing the products on the marking material belt for electric capacity, loss, voltage resistance, insulation resistance and the like, and automatically rejecting each section of tested defective products to obtain the electric testing good product material belt.

As a preferred scheme, before the chip material belt passes through an encapsulating material coating machine, the chip material belt enters a buffer storage rack before coating under the driving of traction equipment; before the coating material belt passes through a curing furnace, the coating material belt enters a pre-curing buffer storage rack under the driving of traction equipment; the solidified material belt enters between the double-sided laser marking machines, and the solidified material belt is driven by traction equipment to carry out marking on the pre-cache frame; before the marking material belt is subjected to electrical performance test, the marking material belt enters a pre-test cache frame under the driving of traction equipment.

As a preferable scheme, the method further comprises the step 6) of secondary braiding: and taking out the products on the electrically tested good material belt, re-braiding the products, and finally folding and packaging the re-braided material belt according to the set packaging quantity to finish the production of finished products.

As a preferable scheme, the reason for generating the defective products in the first CCD detection is classified and counted, and the data is stored.

Preferably, the first CCD detects defective products including pad deviation between the lead and the chip, chip substrate damage or cold joint.

As a preferred scheme, the reasons for generating defective products in the second CCD detection are classified and counted, and data are stored; and detecting defective products such as impurities on the front surface of the product, impurities on the back surface of the product or surface defects of the product by the secondary CCD.

As a preferred scheme, defective products such as unclear marking and skew marking positions are detected by the third CCD, classified statistics is carried out according to reasons for generating the defective products, and data are stored.

As a preferred scheme, when chip coating is carried out, chips on a chip material belt are sequentially subjected to primary preheating, primary powder adhesion, secondary preheating, secondary powder adhesion, tertiary preheating, tertiary powder adhesion, quaternary preheating and quaternary powder adhesion, and coating is finished through leveling; the temperature of each preheating is 180-220 ℃, and the temperature of each heating is 300-340 ℃.

Compared with the prior art, the invention has obvious advantages and beneficial effects, in particular: 1. by sequentially carrying out chip welding, chip coating and curing, product marking and electrical property testing on the lead after the lead is braided, the product can be formed, assembled and welded, coated and sealed, cured, marked, electrical property detection and braid one-time completion, the intermediate material transfer process is reduced, the production efficiency of the ceramic capacitor is greatly improved, the product consistency is ensured, and the production cost of enterprises is reduced; 2. the reason for generating the defective products in the CCD detection is classified and counted, and the related data is stored, so that the reason for generating the defective products in each process is tracked, the key problem of causing the defective products is analyzed, the continuous improvement of subsequent products is facilitated, the production quality of the ceramic capacitor is improved, and the production cost caused by the defective products is reduced.

In order to more clearly illustrate the structural features and technical means of the present invention and the specific objects and functions achieved thereby, the present invention will be further described in detail with reference to the following specific embodiments:

Detailed Description

In the description of the present invention, it should be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "connected," and "connected" are to be construed broadly, e.g., as meaning either a fixed connection, a removable connection, or an integral connection; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meaning of the above terms in the present invention can be understood as appropriate by those of ordinary skill in the art.

A full-wiring production process of a ceramic capacitor comprises the following steps:

1) chip welding: after the leads are braided, the leads are subjected to routing forming, then chip assembly is carried out, the chip is clamped between the two crossed leads, the capacitor chip and the leads are welded through hot air, after welding is finished, first CCD detection and defective product elimination are carried out, a chip material belt is obtained, and the chip material belt enters a pre-coating cache frame under the driving of traction equipment; when the first CCD detection is carried out, the reasons for generating defective products in the first CCD detection are classified and counted, and data are stored; the first CCD detects defective products including welding point deviation of a lead and a chip, chip matrix damage or insufficient welding and the like.

2) Chip coating and sealing: the chip material belt is driven by traction equipment to enter an encapsulating material coating machine from a coating pre-buffer frame, the coating encapsulating material is attached to the surface of a chip through multiple times of powder adhesion, cooling is carried out after vulcanization to obtain the coating material belt, and the coating material belt enters a curing pre-buffer frame under the drive of the traction equipment;

3) coating and curing: the coating material belt enters a curing furnace from a pre-curing cache frame under the drive of traction equipment to cure the coating material attached to the surface of the chip, secondary CCD detection and defective product elimination are carried out after curing is finished, so that a cured material belt is obtained, and the cured material belt is driven by the traction equipment to carry out the pre-marking cache frame; when the second CCD detection is carried out, the reasons for generating defective products in the second CCD detection are classified and counted, and data are stored; the reasons for generating defective products in the second CCD detection comprise that impurities exist on the front side of the product, impurities exist on the back side of the product or the surface defects of the product;

4) marking a product: enabling the solidified material belt to enter a double-sided laser marking machine under the driving of traction equipment, marking the upper surface and the lower surface of a product through the double-sided laser marking machine, carrying out third CCD detection and defective product elimination after marking is finished to obtain a marked material belt, and enabling the marked material belt to enter a pre-test cache frame under the driving of the traction equipment; classifying and counting the reasons for generating defective products in the third CCD detection, and storing data; the reasons for generating defective products in the third CCD detection comprise that the marking is not clear, the marking position is inclined and the like;

5) and (3) testing electrical properties: the product on the material area is beaten to the mark carries out tests such as electric capacity, loss, withstand voltage, insulation resistance to reject every section test defective products automatically, obtain the electricity and survey the good product material area, save measuring result simultaneously in the testing process, so that the quantity of producing the defective products under the different tests of statistics.

6) Secondary braiding: and taking out the products on the electrically tested good material belt, re-braiding the products, and finally folding and packaging the re-braided material belt according to the set packaging quantity to finish the production of finished products.

In the invention, when chip coating is carried out, chips on a chip material belt are sequentially subjected to primary preheating for first powder adhesion, secondary preheating for second powder adhesion, tertiary preheating, tertiary powder adhesion, quaternary preheating and quaternary powder adhesion, and are subjected to leveling to finish coating; the temperature of each preheating is 180-220 ℃, and the temperature of each heating is 300-340 ℃.

In conclusion, the invention realizes that the product is formed, assembled and welded, coated and sealed, solidified, marked and electrically tested at one time from the lead by sequentially carrying out chip welding, chip coating and curing, product marking and electrical property testing on the lead after the lead is braided, reduces the intermediate material transfer process, greatly improves the production efficiency of the ceramic capacitor, ensures the product consistency and reduces the production cost of enterprises; the reasons for generating the defective products in the CCD detection are classified and counted, and relevant data are stored, so that the main reasons for the defective products can be analyzed in the subsequent tracking process through counting the reasons, the improvement on the process causing the reasons is facilitated, the product quality is improved, the yield of the products is effectively improved, and the production cost of enterprises is reduced.

The above description is only for the preferred embodiment of the present invention and is not intended to limit the present invention, so that any modifications, equivalents, improvements, etc. made to the above embodiment according to the present invention are within the scope of the present invention.