阅读说明：本技术 电容器和半导体芯片 (Capacitor and semiconductor chip ) 是由 夏文彬 于 2019-04-15 设计创作，主要内容包括：一种电容器,被内置于半导体芯片中,包括两个极板,这两个极板分别分布于该半导体芯片中的两个金属层上。在这两个金属层之间还分布有多个金属层,每个金属层上分布有多个金属块。所述多个金属块包括多个第一金属块和多个第二金属块,所述多个第一金属块通过多个第一通孔耦合至一个极板,所述多个第二金属块通过多个第二通孔耦合至另一极板。每两个相邻的金属层被介质层所隔离。每个极板上可包括一个或多个槽隙。该电容器可以有效降低天线效应。(A capacitor is built in a semiconductor chip and comprises two polar plates which are respectively distributed on two metal layers in the semiconductor chip. A plurality of metal layers are distributed between the two metal layers, and a plurality of metal blocks are distributed on each metal layer. The plurality of metal blocks includes a plurality of first metal blocks coupled to one plate through a plurality of first vias and a plurality of second metal blocks coupled to another plate through a plurality of second vias. Every two adjacent metal layers are separated by a dielectric layer. Each plate may include one or more slots therein. The capacitor can effectively reduce the antenna effect.)