阅读说明：本技术 一种精准加热无损害拆解薄膜电容器的工艺方法 (Process method for accurately heating and disassembling thin-film capacitor without damage ) 是由 不公告发明人 于 2019-02-20 设计创作，主要内容包括：本发明实施例涉及一种精准加热无损害拆解薄膜电容器的工艺方法,工具包括,电烙铁,热风枪,锡炉和酒精灯,通过使用电烙铁,锡炉,热风枪、酒精灯等方式,对薄膜电容引脚进行精准加热,从而避免长时间高温对薄膜电容造成的损坏,目前的工艺拆解出来的薄膜电容会导致薄膜电容受损或损坏,极难通过检测方式进行筛选,导致拆机出来的薄膜电容几乎百分之百进行报废出来,本发明可以避免以上问题,无损坏拆解薄膜电容,并可以将薄膜电容进行二次翻新使用,在电路板回收分解领域,有着巨大的经济价值和环保价值,对国家提倡的节能减排工作有着重要的意义。(The invention embodiment relates to a process method for accurately heating and disassembling a film capacitor without damage, which comprises a tool, an electric iron, a hot air gun, a tin furnace and an alcohol lamp, wherein pins of the film capacitor are accurately heated by using the electric iron, the tin furnace, the hot air gun, the alcohol lamp and the like, so that the damage to the film capacitor caused by long-time high temperature is avoided, the film capacitor disassembled by the conventional process can cause the film capacitor to be damaged or destroyed, the film capacitor disassembled by the conventional process is extremely difficult to screen by a detection mode, and almost one hundred percent of the film capacitor disassembled is scrapped.)

1. A process method for accurately heating and disassembling a thin film capacitor without damage comprises

An electric iron; the electric soldering iron directly melts off soldering tin of the capacitor pin to be disassembled, and then the thin film capacitor is taken out.

And the hot air gun directly melts the soldering tin of the capacitor pin to be disassembled, and then the film capacitor is taken out.

And the capacitor pin with the tin soldering surface of the circuit board to be disassembled is placed in the small tin furnace, the small tin furnace melts the tin soldering, and the capacitor is taken out.

2. The process according to any one of claim 1, wherein the field belongs to the field of waste circuit board disassembly.

The technical field is as follows:

the invention belongs to the field of circuit board disassembly and recovery, and particularly relates to a method for accurately heating soldering tin of a pin of a disassembled thin film capacitor by using tools such as an electric soldering iron, a tin furnace, a hot air gun and the like, so that the thin film capacitor is prevented from being damaged by high temperature, and the thin film capacitor can be recycled.

Background art:

this section is intended to introduce the reader to various aspects of art that may be related to various embodiments of the present invention and is believed to provide the reader with useful background information to facilitate a better understanding of the various aspects of embodiments of the present invention. Accordingly, it should be understood that the description in this section is for purposes of illustration and is not an admission of prior art.

An induction cooker is a common household appliance used for cooking and heating. Electromagnetic ovens are more and more common in daily life due to the advantages of energy conservation, cleanness, high heating speed and the like of products; when the induction cooker works, high-frequency alternating current passes through the coil panel to generate a magnetic field with high-frequency change, so that eddy current is generated at the bottom of an iron pan placed on the induction cooker to heat food in the iron pan. The electromagnetic oven directly generates heat at the bottom of the pan without open fire or conduction heating, so that the heat efficiency is greatly improved, the electromagnetic oven is a high-efficiency energy-saving kitchen ware, is completely different from all traditional kitchen ware with fire or without fire conduction heating, does not have open fire in the heating process, and is safe and sanitary. As an electric heating appliance, various electronic components inside the induction cooker cannot dissipate heat, heat of a heating panel cannot be conducted to the inside, and in order to solve the heat dissipation problem of the components, a heat dissipation fan is often arranged inside the induction cooker.

China produces more than 1 million heating appliances every year as a large country of heating appliances, the service life of the electromagnetic heating appliances is about 5-10 years, the conservative estimation of China is that at least about 5 million electromagnetic heating appliances are scrapped by 3-5 million appliances every year, each electromagnetic heating appliance averagely has 3 film capacitors, 9 million-1.5 million film capacitors are scrapped every year, the total weight is about 25000 tons, and great pollution and waste are caused.

The invention content is as follows:

a process method for disassembling a thin film capacitor on an electromagnetic heating mainboard without damage through precise heating aims at solving the technical problem of the background

Traditionally disassemble the circuit board and generally adopt the tin stove, melt the tin of tin stove the inside, then place the circuit board that will disassemble in big tin stove, melt the soldering tin on the circuit board through tin stove high temperature, then with circuit board component through knocking with knocking, shake electronic component down, however, because scrap the circuit board not of uniform size, it is also not necessarily level and smooth, the tin stove is also bigger, generally can place polylith circuit board in proper order and carry out the grass best, the circuit board heats for a long time in big high temperature tin stove, the heat can be conducted in thin film capacitor by the pin welding machine through the pin, lead to leading to in

1. The thin film capacitor plastic package shell and the epoxy resin are arranged in a deformed manner;

2. scalding the plastic package shell of the thin-film capacitor;

3. the metal layers and the pin welding layers at two ends of the film in the film capacitor are damaged;

and the metal level and the pin welded layer at the film both ends of film capacitor inside receive to destroy and hardly detect out with conventional detection mode, if recycle, have very big proportion damage even the electric capacity generates heat and fires to domestic appliance fires, so decades, the film capacitor who disassembles the trade of scrapping the circuit board basically does and abandons the processing.

Aiming at the defects in the prior art, the invention implements a process method for accurately heating and disassembling the thin film capacitor on the electromagnetic heating mainboard without damage, solves the problem of damage and damage of the thin film capacitor caused by the traditional disassembling process, realizes secondary utilization of the thin film capacitor, reduces the treatment of electronic waste, responds to national energy conservation and emission reduction, and contributes to building a beautiful home.

The invention is realized in such a way

In a first aspect, the present invention is implemented to heat a thin film capacitor on a scrapped circuit board by precise heating, including:

the circuit board is scrapped, and a thin film capacitor is arranged on the scrapped circuit board;

the electric soldering iron heats the soldering tin of the thin film capacitor pin on the scrapped circuit board;

optionally, the method further comprises:

the hot air gun is used for heating the soldering tin of the thin film capacitor pin on the scrapped circuit board;

optionally, the method further comprises:

the tin furnace is not too large and can heat the disassembled capacitor pins, and the tin soldering of the thin film capacitor pins on the scrapped circuit board is heated;

optionally, the method further comprises:

the exhaust fan effectively extracts the smoke generated by heating

Optionally, the scrapped circuit boards comprise scrapped induction cooker circuit boards, IH electric cooker circuit boards and scrapped circuit boards of other devices with thin-film capacitors.

According to the technical scheme, in the scrapped circuit board disassembling industry, the thin film capacitor disassembling machine is accurately heated and disassembled without damage, the thin film capacitor is taken out, the thin film capacitor can be recycled, electronic wastes are greatly reduced, resources are saved, and the method and the device have important significance for building green home.

Drawings

In order to make the objects, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are some, but not all, embodiments of the present invention. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.

The first embodiment is as follows:

fig. 1 is a front view of a disassembled object circuit board in one embodiment of the present invention;

fig. 2 is a reverse view of a circuit board to be disassembled according to an embodiment of the present invention;

FIG. 3 is a side view of a circuit of a disassembled object according to an embodiment of the present invention;

FIG. 4 is a photograph of a disassembled capacitor according to an embodiment of the present invention;

FIG. 5 is a diagram of a plastic case at one end of a thin film capacitor with a metal vapor deposited layer being polished away, a lead pin being welded and plastic being sealed and a temperature sensing probe being attached with glue according to an embodiment of the present invention;

FIG. 6 shows an electric soldering iron used in this experiment according to an embodiment of the present invention;

FIG. 7 shows the actual power of the electric soldering iron in the present experiment according to an embodiment of the present invention;

FIG. 8 is a schematic diagram illustrating an embodiment of the present invention;

FIG. 9 is a diagram of an embodiment of the present invention;

FIG. 10 is a diagram of a capacitor metal deposition layer and pin temperature and time counter reset preparation start timing before heating in accordance with an exemplary embodiment of the present invention;

FIG. 11 is a photograph showing the temperature of the metal deposition layer and the lead of the capacitor approaching the maximum safe temperature threshold during the thin film capacitor disassembly process according to an embodiment of the present invention;

FIG. 12 is a photograph showing that the temperature of the metal deposition layer and the lead pins of the capacitor has exceeded the maximum safe temperature during the disassembly process of the thin film capacitor according to an embodiment of the present invention;

fig. 13 is a photograph showing a gap crack pattern when the temperature of the metal deposition layer and the pins of the capacitor is higher than the maximum safe temperature and the probe glue adhered thereon is melted and the capacitor film, the epoxy resin and the plastic package housing are separated by high temperature in the process of disassembling the film capacitor according to an embodiment of the present invention;