阅读说明：本技术 一种电子封装用高纯度球形硅微粉 (High-purity spherical silicon micropowder for electronic packaging ) 是由 何书辉 于 2019-01-10 设计创作，主要内容包括：本发明公开了一种电子封装用高纯度球形硅微粉,该产品属于石英精加工领域；生产该产品使用的原料有：优质石英石、浓度为10%-15%的稀盐酸、水,使用的设备有：水洗机、破碎机、酸池、高温烧结炉、研磨机、磁选机、燃气炉、分级机,该生产方法的优点是：设备投资少、生产成本低、无污水废气排放、可批量生产出高质量的电子封装用高纯度球形硅微粉,产品具有耐高温、低热膨胀、硬度较高、耐磨性好、透光折射性能、压电性能优异等一系列优点,是电子封装使用的首选材料。(The invention discloses high-purity spherical silicon micro powder for electronic packaging, which belongs to the field of quartz finish machining; the raw materials for producing the product are as follows: high-quality quartz stone, dilute hydrochloric acid with the concentration of 10% -15% and water, and the used equipment comprises: the production method comprises the following steps of washing machine, crusher, acid tank, high-temperature sintering furnace, grinder, magnetic separator, gas furnace and classifier, and has the advantages that: the spherical silicon micro powder has the advantages of low equipment investment, low production cost, no sewage and waste gas emission, capability of producing high-quality high-purity spherical silicon micro powder for electronic packaging in batches, high temperature resistance, low thermal expansion, higher hardness, good wear resistance, excellent light transmission and refraction properties, excellent piezoelectric property and the like, and is a preferred material for electronic packaging.)

1. The high-purity spherical silicon powder for electronic packaging is prepared from the following raw materials: high-quality quartz stone, dilute hydrochloric acid with the concentration of 10% -15% and water, and the used equipment comprises: rinsing machine, breaker, acid chest, high temperature sintering furnace, grinding machine, magnet separator, gas furnace, grader, its characterized in that:

(1) Feeding quantitative high-quality blocky quartz stone into a washing machine, washing with high-pressure water, and feeding into a crusher to be crushed into quartz blocks smaller than 15mm after cleaning;

(2) Sending the crushed quartz blocks into an acid tank, soaking the quartz blocks for 20 to 30 hours by using dilute hydrochloric acid with the concentration of 10 to 15 percent, then fishing out the soaked quartz blocks from the tank, immediately sending the quartz blocks into a water washer for washing, airing the cleaned quartz blocks, sending the quartz blocks into a high-temperature sintering furnace, adjusting the temperature in the furnace to be 1840 to 1860 ℃, and melting for 13 to 14 hours to enable the quartz in the furnace to be in a molten state;

(3) Stopping heating, cooling to normal temperature to obtain massive solid fused quartz, mechanically crushing the quartz particles to obtain quartz particles of 5-6mm, grinding the quartz particles in a grinding machine for 4-5 hours to obtain angle-shaped silicon micro powder with different particle sizes, removing iron-containing particles from the angle-shaped silicon micro powder with different particle sizes by a magnetic separator, and collecting the angle-shaped silicon micro powder without iron by a material collector;

(4) Regulating the temperature in the gas furnace to be above 1800 ℃, vertically setting a channel in the gas furnace, slowly feeding the collected angular silicon micropowder from the top of the channel in the gas furnace, rapidly melting under the action of high temperature, rapidly cooling and solidifying the micropowder out of the gas furnace into a spherical shape after the micropowder falls down, and packaging the micropowder by a classifier according to the granularity after the micropowder is cooled to normal temperature.

2. The spherical high-purity fine silica powder for electronic packaging according to claim 1, wherein: the quartz block is a product of real estate red-skin large quartz stone after peeling.

3. The spherical high-purity fine silica powder for electronic packaging according to claim 1, wherein: the 10-15% dilute hydrochloric acid is waste acid used in factories.

4. The spherical high-purity fine silica powder for electronic packaging according to claim 1, wherein: the high-temperature sintering furnace is 5 tons in grade.

Technical Field

The invention belongs to the field of quartz finish machining, and particularly relates to a method for industrially producing high-purity spherical silicon micropowder for electronic packaging by taking high-quality quartz stone as a raw material.

Background

the silicon micro powder for electronic packaging is angular or spherical, the angular production process is simple, the price is relatively low, but the requirement for spheroidization is that the surface fluidity of a ball is good, the addition amount of resin is small, the fluidity is best, the filling amount of the powder can reach the highest, the weight ratio can reach 90.5%, therefore, the higher the filling rate of the silicon micro powder is, the smaller the thermal expansion coefficient is, the lower the thermal conductivity coefficient is, the better the service performance of the produced oversized electronic component is, the better the stress concentration of the spherically produced plastic packaging material is, the highest the strength is, when the stress concentration of the angularly produced plastic packaging material is 1, the stress of the spherical powder is only 0.6, when the spherical powder plastic packaging material is produced into an integrated circuit chip by a high-temperature silicon integrated circuit, the utilization rate of silicon micro powder is high, the yield is high, and mechanical damage is generated in the transportation and use process, the mechanical damage is generated, the ball-shaped silicon micro powder is 0.8.8, the silicon micro powder is produced into a silicon micro powder, the integrated circuit, the integrated circuit is produced by a silicon micro-silicon micro integrated circuit, the silicon micro powder is produced by a silicon micro powder, the silicon micro powder is produced by a silicon micro powder, the silicon chip, the silicon powder, the silicon micro powder, the silicon micro powder, the silicon chip.

Disclosure of Invention

The invention mainly solves the problem of providing a method for producing high-purity spherical silicon micropowder for electronic packaging, which comprises the following raw materials: high-quality quartz stone, dilute hydrochloric acid with the concentration of 10% -15% and water, and the used equipment comprises: a water washing machine, a crusher, an acid tank, a high-temperature sintering furnace, a grinding machine, a magnetic separator, a gas furnace and a classifier.

The technical scheme adopted by the invention is as follows:

(1) Feeding quantitative high-quality blocky quartz stone into a washing machine, washing with high-pressure water, and feeding into a crusher to be crushed into quartz blocks with the size less than 15mm after cleaning.

(2) Sending the crushed quartz blocks into an acid tank, soaking the quartz blocks for 20 to 30 hours by using dilute hydrochloric acid with the concentration of 10 to 15 percent, then fishing out the soaked quartz blocks from the tank, immediately sending the quartz blocks into a water washer for washing, airing the cleaned quartz blocks, sending the quartz blocks into a high-temperature sintering furnace, adjusting the temperature in the furnace to be 1840 to 1860 ℃, and melting for 13 to 14 hours to enable the quartz blocks in the furnace to be in a molten state.

(3) Stopping heating, cooling to normal temperature to obtain massive solid fused quartz, mechanically crushing to obtain quartz particles of 5-6mm, grinding the quartz particles in a grinding machine for 4-5 hours to obtain angle-shaped silicon micro powder with different particle sizes, removing iron-containing particles from the angle-shaped silicon micro powder with different particle sizes by a magnetic separator, and collecting the angle-shaped silicon micro powder without iron by a material collector.

(4) Regulating the temperature in the gas furnace to be above 1800 ℃, vertically setting a channel in the gas furnace, slowly feeding the collected angular silicon micropowder from the top of the channel in the gas furnace, rapidly melting under the action of high temperature, rapidly cooling and solidifying the micropowder out of the gas furnace into a spherical shape after the micropowder falls down, and packaging the micropowder by a classifier according to the granularity after the micropowder is cooled to normal temperature.

Preferably, the quartz block is a product obtained by removing the skin of real-estate red-skin large quartz stone.

Preferably, the 10-15% dilute hydrochloric acid is waste acid used in factories.

Preferably, the high-temperature sintering furnace is in a grade of 5 tons.

The invention has the beneficial effects that: the high-purity spherical silicon micropowder for electronic packaging and the production method thereof are provided, and the production method has the advantages that: the spherical silicon micro powder has the advantages of low equipment investment, low production cost, no sewage and waste gas emission, capability of producing high-quality high-purity spherical silicon micro powder for electronic packaging in batches, high temperature resistance, low thermal expansion, higher hardness, good wear resistance, excellent light transmission and refraction properties, excellent piezoelectric property and the like, and is a preferred material for electronic packaging.

Detailed Description

The present invention will be described in further detail with reference to specific examples.