阅读说明：本技术 存储阵列块及半导体存储器 (Memory array block and semiconductor memory ) 是由 刘毅华 肖韩 王宗巍 蔡一茂 于 2019-09-12 设计创作，主要内容包括：本申请提供一种存储阵列块及半导体存储器,该存储阵列块包括：阵列分布的多个存储电路,每个所述存储电路包括：第一晶体管,该第一晶体管的漏极分别通过第一存储单元连接至第一位线,通过第二存储单元连接至第二位线；第二晶体管,该第二晶体管的漏极分别通过第三存储单元连接至第一位线,通过第四存储单元连接至第二位线；第一晶体管的源极和第二晶体管的源极连接至地线；其中,当第一位线导通时,第二位线断开；当第二位线导通时,第一位线断开。本申请中,一个晶体管对应两个存储单元,与现有的1T1R技术相比,本申请提供的1T2R存储器件降低了有效存储器面积,可以节约各种芯片的制造成本。(The application provides a memory array block and a semiconductor memory, wherein the memory array block comprises a plurality of memory circuits distributed in an array, each memory circuit comprises a th transistor, a drain of a th transistor is respectively connected to a th bit line through a th memory cell and is connected to a second bit line through a second memory cell, a drain of a second transistor is respectively connected to a th bit line through a third memory cell and is connected to a second bit line through a fourth memory cell, a source of a transistor and a source of the second transistor are connected to a ground line, wherein when the th bit line is conducted, the second bit line is disconnected, when the second bit line is conducted, the th bit line is disconnected, transistors correspond to two memory cells in the application, and compared with the existing 1T1R technology, the 1T2R memory device provided by the application reduces the effective memory area and can save the manufacturing cost of various chips.)

A memory array block of , comprising:

a plurality of memory circuits distributed in an array, wherein each of the memory circuits comprises:

an th transistor, the th transistor having a drain connected to a th bit line through a th memory cell and to a second bit line through a second memory cell, respectively;

a second transistor, wherein the drain of the second transistor is respectively connected to the bit line through a third memory cell and the second bit line through a fourth memory cell;

when the th bit line is turned on, the second bit line is turned off, and when the second bit line is turned on, the th bit line is turned off.

2. The memory array block of claim 1, wherein the gate of the th transistor is connected to a th word line to control the th transistor to turn on or off.

3. The memory array block of claim 1, wherein the gate of the second transistor is connected to a second word line to control the second transistor to turn on or off.

4. The memory array block of claim 1, wherein the th, second, third, and fourth memory cells are memristor devices.

5. The memory array block of claim 4, wherein the fabrication material of the memristor device is tantalum oxide.

Semiconductor memory of , comprising a memory array block according to any of claims 1-5 to .

Technical Field

The application relates to the technical field of semiconductors, in particular to memory array blocks and a semiconductor memory.

Background

RRAM (Resistive Random Access Memory) is kinds of novel memories, and has a very broad application prospect in the fields of embedding, artificial intelligence, edge calculation and the like.

The key to putting RRAM into practical use is to shrink the memory cell size, which not only determines the cost of the memory, but also limits the maximum storage capacity that can be produced in a given area, and many embedded designs have limited chip area available for on-chip memory. Ideally the effective memory cell area of the RRAM should be 4F or less²(F is lithographic feature size).

For the purposes of avoiding crosstalk and simplifying the process, the currently mass-produced RRAM memory is in the form of selection transistors matched with memory cells (1T1R), such as the 1T1R device shown in fig. 1, wherein the selection transistors include gates, drains and sources, the drains are sequentially connected with memory cells and bit lines BL, the gates are connected with word lines, and the sources are connected with ground lines²The manufacturing cost increases. Therefore, how to reduce the effective memory cell area is an urgent technical problem to be solved in the art.

Disclosure of Invention

The purpose of this application is to provide kinds of memory array blocks, kinds of semiconductor memories, in order to reduce the effective memory cell area and save the manufacturing cost of various chips.

The aspect of the present application provides a memory array block comprising:

a plurality of memory circuits distributed in an array, wherein each of the memory circuits comprises:

an th transistor, the th transistor having a drain connected to a th bit line through a th memory cell and to a second bit line through a second memory cell, respectively;

a second transistor, wherein the drain of the second transistor is respectively connected to the bit line through a third memory cell and the second bit line through a fourth memory cell;

when the th bit line is turned on, the second bit line is turned off, and when the second bit line is turned on, the th bit line is turned off.

In embodiments of the present application, the gate of the transistor is connected to the word line to control the transistor to turn on or off.

In the embodiments of the present application, the gate of the second transistor is connected to a second word line to control the second transistor to turn on or off.

In the embodiments of the present application, the th, second, third and fourth memory cells are memristor devices.

In embodiments of the present application, the memristor device is made of tantalum oxide.

A second aspect of the present application provides kinds of semiconductor memories including the memory array block in the above-described aspect.

Compared with the prior art, the memory array block and the semiconductor memory provided by the application comprise a plurality of memory circuits distributed in an array, wherein each memory circuit comprises th transistors, the drains of the th transistors are respectively connected to a th bit line through th memory cells and connected to a second bit line through second memory cells, the drains of the second transistors are respectively connected to the th bit line through third memory cells and connected to the second bit line through fourth memory cells, the sources of the th transistors and the sources of the second transistors are connected to the ground, the second bit line is disconnected when the th bit line is conducted, the th bit line is disconnected when the second bit line is conducted, the transistors correspond to two memory cells in the application, and compared with the prior art 1T1R, the 1T2R memory device provided by the application has the advantages of reducing the effective memory area and saving the manufacturing cost of various chips.

Drawings

Various other advantages and benefits will become apparent to those of ordinary skill in the art upon reading the following detailed description of the preferred embodiments. The drawings are only for purposes of illustrating the preferred embodiments and are not to be construed as limiting the application. Also, like reference numerals are used to refer to like parts throughout the drawings.

FIG. 1 shows a schematic diagram of a prior art 1T1R memory cell;

FIG. 2 shows a schematic diagram of memory array blocks provided by embodiments of the present application;

FIG. 3 illustrates a schematic diagram of a 1T2R memory cell provided herein;

fig. 4 shows a schematic diagram of semiconductor memories provided by embodiments of the present application.

Reference numerals:

100 a memory circuit;

110, th transistor;

111 a drain of the th transistor;

112, source of th transistor;

113 gate of a th transistor;

120 a second transistor;

121 a drain of the second transistor;

122 a source of the second transistor;

123 a gate of the second transistor;

130, bit line, 140 second bit line;

131, , 132, 133, a third, 134, and a fourth storage unit;

150, , word line, 160, second word line;

170 ground.

Detailed Description

Exemplary embodiments of the present disclosure will be described in more detail below with reference to the accompanying drawings. While exemplary embodiments of the present disclosure are shown in the drawings, it should be understood that the present disclosure may be embodied in various forms and should not be limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the scope of the disclosure to those skilled in the art.

It is to be noted that, unless otherwise specified, technical or scientific terms used herein shall have the ordinary meaning as understood by those skilled in the art to which this application belongs.

Additionally, the terms "," "second," and the like, are used to distinguish one object from another, and not to describe a particular order.

In this application, unless otherwise expressly stated or limited, the terms "mounted," "connected," "secured," and the like shall be construed , as meaning either fixed or removable, or , mechanically, electrically, or communicatively, directly or indirectly through an intermediary, or through an interconnection between two elements or through an interaction between two elements.

The following disclosure provides many different embodiments or examples for implementing different features of the application. In order to simplify the disclosure of the present application, specific example components and arrangements are described below. Of course, they are merely examples and are not intended to limit the present application. Moreover, the present application may repeat reference numerals and/or letters in the various examples, such repetition is for the purpose of simplicity and clarity and does not in itself dictate a relationship between the various embodiments and/or configurations discussed. In addition, examples of various specific processes and materials are provided herein, but one of ordinary skill in the art may recognize applications of other processes and/or use of other materials.

The embodiment of the present application provides kinds of memory array blocks, kinds of semiconductor memories, which are described below with reference to the accompanying drawings.

Referring to FIG. 2, a schematic diagram of memory array blocks provided by embodiments of the present application is shown.

As shown in fig. 2, the memory array block 10 includes: a plurality of memory circuits 100 distributed in an array.

As shown in fig. 2, each of the memory circuits 100 includes:

an th transistor 110, the th transistor 110 having a drain 111 connected to the th bit line 130 through a th memory cell 131 and to the second bit line 140 through a second memory cell 132, respectively;

a second transistor 120, a drain 121 of the second transistor 120 is connected to the th bitline 130 through a third memory cell 133 and to the second bitline 140 through a fourth memory cell 134, respectively, a source 112 of the th transistor 110 and a source 122 of the second transistor 120 are connected to a ground 170.

Wherein the second bit line 140 is turned off when the th bit line 130 is turned on, and vice versa the th bit line 130 is turned off when the second bit line 140 is turned on.

In some embodiments of the present application, the gate 113 of the transistor 110 is connected to the word line 150 to control the transistor to turn on or off, and the gate 123 of the second transistor 120 is connected to the second word line 160 to control the second transistor to turn on or off.

Specifically, as shown in fig. 3, transistors are used in the present application for a single memory device corresponding to two memory cells (1T2R), drains of transistors in the present application connect two bit lines and two memory cells, and another transistors are turned off when bit lines are turned on.

The memory array block comprises a plurality of memory circuits distributed in an array, wherein each memory circuit comprises th transistors, the drains of the th transistors are respectively connected to a th bit line through th memory cells and connected to a second bit line through second memory cells, the drains of the second transistors are respectively connected to a th bit line through third memory cells and connected to the second bit line through fourth memory cells, the sources of the th transistors and the sources of the second transistors are connected to a ground line, the second bit line is disconnected when the th bit line is conducted, the bit line is disconnected when the second bit line is conducted, transistors correspond to two memory cells in the memory array block, and compared with the conventional 1T1R technology, the 1T2R memory device provided by the application reduces the effective memory area and can save the manufacturing cost of various chips.

In the above embodiment, kinds of memory array blocks are provided, and correspondingly, kinds of semiconductor memories using the above memory array block 10 are also provided in the present application, please refer to fig. 4, which shows a schematic diagram of kinds of semiconductor memories provided in embodiments of the present application.

The semiconductor memory provided by the above embodiments of the present application and the memory array block provided by the embodiments of the present application have the same beneficial effects due to the same inventive concept.

Finally, it should be noted that in the description of the present specification, reference to the description of the terms " embodiments," " embodiments," "examples," "specific examples," or " examples," etc., means that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least embodiments or examples of the application, and that the particular feature, structure, material, or characteristic described may be combined in any suitable manner in any or more embodiments or examples.

The above embodiments are only used for illustrating the technical solutions of the present application, and not for limiting the same; although the present application has been described in detail with reference to the foregoing embodiments, it should be understood by those of ordinary skill in the art that: the technical solutions described in the foregoing embodiments may still be modified, or some or all of the technical features may be equivalently replaced; such modifications and substitutions do not depart from the spirit and scope of the present disclosure, and the present disclosure should be construed as being covered by the claims and the specification.