阅读说明：本技术 色谱系统温度控制系统 (Temperature control system of chromatographic system ) 是由 S.D.斯蒂尔恩斯 蔡华民 C.毕晓普 R.辛普森 C.S.考尔斯 D.阿什沃尔思 D. 于 2018-02-26 设计创作，主要内容包括：一种温度控制器,用于同时控制色谱分析中使用的包括柱、检测器、阀、输送管线和其他部件的多个加热元件的温度。(A temperature controller for simultaneously controlling the temperature of a plurality of heating elements including columns, detectors, valves, transfer lines and other components used in chromatography.)

1. A chromatography system, comprising:

A first chromatographic component selected from the group consisting of transfer lines, valves, sample loops, columns, and detectors;

a second chromatographic component selected from the group consisting of transfer lines, valves, sample loops, columns, and detectors;

a first electrically controlled heating element associated with the first chromatographic component;

a second electrically controlled heating element associated with the second chromatographic member;

a first temperature sensor associated with the first chromatographic component, the first temperature sensor generating a first temperature sensor signal;

A second temperature sensor associated with the second chromatographic component, the second temperature sensor producing a second temperature sensor signal;

A power source;

A temperature controller having a processor, a first electrically controlled heating element output, a second electrically controlled heating element output, a first temperature sensor input, a second temperature sensor input;

The processor is adapted to receive the first temperature sensor signal at the first temperature sensor input to construct a first actual time-temperature profile;

the processor is adapted to receive the second temperature sensor signal at the second temperature sensor input to construct a second actual time-temperature profile;

The processor is adapted to receive a first time-temperature profile of the first chromatographic component;

The processor is adapted to receive a second time-temperature profile of the second chromatographic component, the second time-temperature profile being selected from the group of the first time-temperature profile and a first actual time-temperature profile of the first chromatographic component;

The processor having a first power control for controlling a first output from the power supply to the first electrically controlled heating element output;

the processor has a second power control for controlling a second output from the power supply to the first electrically controlled heating element output;

The processor is adapted to vary the first output from the power supply such that the first actual time-temperature curve approximates the first time-temperature curve;

the processor is adapted to vary the second output from the power supply such that the second actual time-temperature curve approximates the second time-temperature curve.

2. The chromatography system of claim 1, wherein one of the first and second electrically controlled heating elements is a wire comprised of nickel.

3. The chromatography system of claim 1, wherein one of the first and second electrically controlled heating elements is a wire composed of a nickel alloy.

4. The chromatography system of claim 1, further comprising a fan for inducing an air flow around one of said first and second components, wherein said processor has a third power control for controlling a third output from said power supply to said fan.

5. A temperature controller, comprising:

The system comprises a processor, a first electric control heating element output, a second electric control heating element output, a first temperature sensor input and a second temperature sensor input;

The processor is adapted to receive the first temperature sensor signal at the first temperature sensor input to construct a first actual time-temperature profile;

The processor is adapted to receive the second temperature sensor signal at the second temperature sensor input to construct a second actual time-temperature profile;

The processor is adapted to receive a first time-temperature profile of the first chromatographic component;

The processor is adapted to receive a second time-temperature profile of the second chromatographic component, the second time-temperature profile being selected from the group of the first time-temperature profile and a first actual time-temperature profile of the first chromatographic component;

the processor having a first power control for controlling a first output from the power supply to the first electrically controlled heating element output;

the processor has a second power control for controlling a second output from the power supply to the first electrically controlled heating element output;

The processor is adapted to vary the first output from the power supply such that the first actual time-temperature curve approximates the first actual time-temperature curve;

the processor is adapted to vary the second output from the power supply such that the second actual time-temperature curve approximates the second time-temperature curve.

6. A method for controlling at least two chromatography components in a chromatography system, comprising:

Determining a power/temperature relationship for the first component;

Determining a power/temperature relationship for the second component;

Receiving a time/temperature profile of the first component;

Receiving an input as to whether the time/temperature profile of the second component will track the actual time/temperature profile of the first component;

Applying power to the first component to change a temperature of the first component according to the power-temperature relationship of the first component;

obtaining a temperature measurement of the first component;

constructing an actual time-temperature profile of the first component;

Adjusting power supplied to the first component to change a temperature of the first component based on the power-temperature relationship of the first component determined from the temperature measurement of the first component;

applying power to the second component to change a temperature of the second component in accordance with one of the power-temperature relationship of the first component and the actual time-temperature profile of the first component;

Obtaining a temperature measurement of the second component;

adjusting power supplied to the first component to change a temperature of the second component based on one of the power-temperature relationship of the first component and the actual time-temperature profile of the first component as determined from the temperature measurement of the second component.

Technical Field

The present invention relates to a temperature controller for simultaneously controlling the temperature of a plurality of heating elements including columns, detectors, valves, transfer lines and other components used in chromatography. In particular, the device controls the temperature of the heating element associated with each component, monitors the temperature of each component, and replicates the temperature profile of the first component at the remaining components. The apparatus is therefore directed to controlling the temperature of a plurality of heating elements including columns, detectors, valves, transfer lines and other components used in chromatographic analysis, although it may be used in any system requiring precise heating over a range of temperatures.

Background

an adaptive temperature controller for any electrically conductive material is disclosed. In chromatographic analysis, the chromatographic column is heated according to a temperature profile, which may depict a plurality of temperature settings at different times during operation. Temperatures are known to significantly alter the efficiency of the column, affecting the efficiency and repeatability of the separation. The column is associated with necessary associated equipment such as sample injectors, valves, transfer lines and detectors. Since it is important to maintain the temperature of the sample and the resulting separation, it is known in the art to position the column in an oven and the remaining components in the oven or adjacent to the outer wall thereof. However, these pillar ovens tend to be bulky, consume considerable space, and are heavy and inconvenient to transport. Alternatively, the rest of the components may be positioned in a static air bath, enclosed in their own air bath, resulting in a large amount of laboratory space being consumed. Thus, it is often desirable to maintain portions of the test equipment or other items above ambient temperature. This has been achieved in the prior art by various temperature controllers and heating devices. It is well known to provide a heat source that is easy to control. Most commonly heat is transferred from a conductive element. In the prior art, the temperature of such conductive elements is monitored by a separate device, typically a Resistance Temperature Detector (RTD). However, this requires multiple parts, further increasing the space consumed by such devices, as well as increasing the weight and cost of such devices. Furthermore, such systems typically do not produce rapid temperature changes and do not replicate the temperature changes applied to the column between associated chromatographic components. In addition, heating and cooling of a particular device is not uniform and often not fast enough, requiring a delay in testing until the device reaches the desired temperature through heating or cooling. This disadvantage has been demonstrated in gas chromatograph oven based systems, where the chromatographic column is maintained at the temperature within the oven. Although the oven provides a bath of air heated to a certain temperature, the sample typically enters the column from a transfer line at room temperature, creating a cold spot.

Accordingly, an improvement would be a temperature controller having fewer components that would reduce weight, space, and cost, provide and ensure near uniform heating of associated components, and enable rapid heating and cooling.

Disclosure of Invention

an adaptive temperature controller disclosed herein includes a means for measuring resistance, a conductive material, and a power source. In operation, the controller determines the resistance of the conductive material at one or more predetermined temperatures and is able to determine the corresponding resistance of the conductive material at other temperatures within the temperature range and apply the voltage or current required to achieve such resistance. The predetermined (calibrated) temperature of the conductive material may be determined by using a temperature sensor or an approximation based on the ambient air temperature. Thus, the voltage or power can be varied immediately to produce near infinite control over the material temperature.

The foregoing and other objects, features and advantages of the present disclosure will be more readily understood upon consideration of the following detailed description of the present disclosure taken in conjunction with the accompanying drawings.

Drawings

So that the manner in which the above recited features, advantages and objects of the present disclosure, as well as others which will become apparent, are attained and can be understood in detail, a more particular description of the disclosure briefly summarized above may be had by reference to the embodiments thereof which are illustrated in the appended drawings, which drawings form a part of this specification. It is to be noted, however, that the appended drawings illustrate only typical preferred embodiments of this disclosure and are therefore not to be considered limiting of its scope, for the disclosure may admit to other equally effective embodiments.

FIG. 1a depicts a cross-sectional view of one embodiment of the prior art.

FIG. 1b depicts a cross-sectional view of another embodiment of the prior art.

Fig. 2 illustrates one embodiment of the present disclosure.

fig. 3A illustrates a first portion of one embodiment of a workflow of the present disclosure, which continues to fig. 3B and 3C.

Fig. 3B illustrates a second portion of one embodiment of a workflow of the present disclosure, which follows fig. 3A and continues to fig. 3C.

Fig. 3C illustrates a third portion of one embodiment of a workflow of the present disclosure, which immediately follows fig. 3A and 3B.

Detailed Description

as depicted in fig. 1a and 1b, temperature controllers are known in which a conductive element 102 and a sensor 101 are placed near or around one component 201 of a system 200 to heat and monitor the temperature of the single component 201, respectively. It is well known to provide a heat source that is easy to control. Most commonly, heat is transferred from the conductive element 102 to be subsequently distributed to the component 201. The conductive element 102 may be placed adjacent (fig. 1a) or around (fig. 1b) the element 301.

referring to fig. 2, a chromatography system 200 may include a plurality of components 201a, 201b, 201c, 201d, 201e, such as a transfer line 204, an injection valve 206, a sample loop 208, a column 210, and a detector 212. In some cases, valve 206 may be connected to an output of sample loop 208 and an input of column 210. The post 210 may be a coiled bundle. In other chromatography systems 200, a valve 206 may be connected to the input and output of the sample loop 208 and column 210 and the input of the detector 212. In other chromatography systems 200, a valve may also be connected to the output of the detector 212. In the chromatography system 200, a plurality of valves 206 may be positioned between the components 204, 206, 208, 210, and 212. In each chromatography system 200, it may be necessary to change the temperature of each of these components 204, 206, 208, 210, and 212 by heating or allowing cooling to maintain a common temperature profile for the duration of the test. This requires the chromatography system 200 to control the heating of each or all of the components 204, 206, 208, 210, and 212, potentially increasing the space consumed by such equipment, the weight of such equipment, and its cost. The present disclosure provides for common control of heating of various components by a single temperature controller 250.

referring to FIG. 2, the heating elements 202a, 202b, 202c, 202d, and 202e may be electrically conductive materials for directly or indirectly changing the temperature of each of the components 204, 206, 208, 210, and 212 of the spectroscopy system 200 by heating or allowing cooling.

In direct heating, the heating element is the component 201a, 201b, 201c, 201d, 201e itself, which is at least partially composed of or coated by the electrically conductive material 114. Thus, direct heating may be most effective for components 201a, 201b, 201c, 201d, 201e, such as transfer line 204 or column 210. In indirect heating, the components 201a, 201b, 201c, 201d, 201e are contacted by separate heating elements 202a, 202b, 202c, 202d and 202 e. Thus, indirect heating may be most effective for components 201a, 201b, 201c, 201d, 201e where the component body does not have sufficient electrical conductivity, such as the valve 206, or where electrical interference is undesirable, such as in the detector 212. For example, the bundled column 210 may include one or more nickel wires within the bundle. Regardless of the type of heating used, the temperature, heating rate, and duration of heating at any temperature of the components 201a, 201b, 201c, 201d, 201e are controlled by the temperature controller 250. As shown in fig. 2, the system 200 may include a combination of direct and indirect heating.

In direct heating, the heating elements 202a, 202b, 202c, 202d, and 202e used in conjunction with the temperature controller 250 have a known resistance as a function of temperature. The temperature controller 250 is in electrically conductive communication with the heating elements 202a, 202b, 202c, 202d, and 202 e. The relationship between the resistance and the temperature of the heating elements 202a, 202b, 202c, 202d, and 202e may be obtained by the temperature controller 250 by applying an equation or by interpolating from such a data table. Thus, such heating elements 202a, 202b, 202c, 202d, and 202e are in close contact with the components 201a, 201b, 201c, 201d, 201 e. Since the resistance of the heating elements 202a, 202b, 202c, 202d, and 202e is known as a function of temperature, the temperature of the heating elements 202a, 202b, 202c, 202d, and 202e can be determined by dynamic measurement of the resistance of the heating elements 202a, 202b, 202c, 202d, and 202 e. Thus, the temperature of the components 204, 206, 208, 210, and 212 may be controlled by the current (or voltage or both) applied to the heating elements 202a, 202b, 202c, 202d, and 202 e. In a preferred embodiment, the heating elements 202a, 202b, 202c, 202d, and 202e are nickel or a nickel alloy. Thus, temperature controller 250 may use the resistance of the nickel as derived by the resistance determination circuit. Notably, such a column 210 has a reduced mass.

As another example where the heating elements 202a, 202b, 202c, 202d, and 202e are columns 210 for chromatographic separations, the columns 210 may be constructed of commercial fused silica columns coated with nickel using an electroplating process to provide for direct heating. For indirect heating, the heating elements 202a, 202b, 202c, 202d, and 202e may be nickel or nickel-containing wires, such as a nickel-iron alloy, positioned and held in contact with the post 210. In this indirect heating, because the heating elements 202a, 202b, 202c, 202d, and 202e are whole filaments, the filaments heat to a consistent temperature and uniformly heat the column 210. This configuration or contact can be applied to various other components, eliminating the need for an air bath that surrounds the various components, consumes valuable space, and tethers the test device in a fixed position.

In operation, the temperature of the components 204, 206, 208, 210, and 212 may be calculated based on resistance, may be adjusted based on a signal from a temperature measurement device, such as a thermocouple, or may be controlled based on a combination of calculations and sensor readings. Such a device may be selected to further achieve the goals of a small portable chromatograph. For example, the selection of small type K thermocouples allows for rapid temperature changes. Indirect heating using nickel wire can reduce weight.

Controlling the temperature of the heating elements 202a, 202b, 202c, 202d, and 202e associated with the components 204, 206, 208, 210, and 212 by determining the resistance and applying power, current, or voltage by the resistance sensing circuit 248 may provide several advantages, particularly in reducing the quality of the chromatography system 200, because components such as a separate heater cartridge intermediate the heating elements and the temperature controller may be omitted. Furthermore, localized areas of increased or decreased temperature may be avoided because the heat flux is distributed over a large area, rather than emanating from a particular location associated with the heater cartridge. Furthermore, as the indirectly heated surface area or the directly heated surface area increases, the temperature may be more evenly distributed to provide an even distribution along its length, rather than starting from a point associated with the cartridge heater.

When the temperature of components 204, 206, 208, 210, and 212 is calculated based on the resistance, temperature controller 250 may calibrate for the resistance. When the resistance of the heating elements 202a, 202b, 202c, 202d, and 202e is not immediately known, but its normalized resistance characteristics are known, such as where the length or diameter of the nickel wire is unknown, the temperature controller 250 may be calibrated for use with the heating elements 202a, 202b, 202c, 202d, and 202e by measuring the resistance of the heating elements 202a, 202b, 202c, 202d, and 202e at one or more known temperatures by the resistance sensing circuit 248. By heating the heating elements 202a, 202b, 202c, 202d, and 202e in an oven, a uniform temperature in the heating elements 202a, 202b, 202c, 202d, and 202e can be achieved. Then, a scaling factor obtained by dividing the measured resistance values of the heating elements 202a, 202b, 202c, 202d, and 202e by the normalized resistance values of the materials comprising the heating elements 202a, 202b, 202c, 202d, and 202e at the reference temperature may be applied to the normalized resistance characteristics to determine the resistance of the heating elements 202a, 202b, 202c, 202d, and 202e at any particular temperature.

It may be desirable to include a learning step with the temperature controller 250 to determine the resistance and thus the responsiveness of the temperature to changes in current, voltage or power of the heating elements 202a, 202b, 202c, 202d and 202 e. The determination of responsiveness is important to reduce or eliminate overshoot and/or undershoot of the temperature by temperature controller 250. Having determined the resistance of the heating elements 202a, 202b, 202c, 202d, and 202e at a known temperature, the temperature controller 250 can then determine the rate of temperature increase relative to the voltage, current, or power increase by various methods known in the art, including by analyzing data relating to the temperature increase per unit time of the heating elements 202a, 202b, 202c, 202d, and 202e in the oven as compared to the temperature increase in the oven. Heating elements 202a, 202b, 202c, 202d, and 202e having a large mass will exhibit a lower rate of temperature rise in proportion to an increase in current, voltage, or power. Likewise, heating elements 202a, 202b, 202c, 202d, and 202e having a small mass will exhibit a higher rate of temperature rise in proportion to an increase in current, voltage, or power. In each case, the change in temperature is also related to the known thermal coefficient of resistance of the materials comprising the heating elements 202a, 202b, 202c, 202d, and 202 e. For the operating range, the thermal coefficient of resistance as a function of temperature may be assumed to be known. The temperature controller 250 thereby avoids overshoot or undershoot of the desired temperature by predetermining the responsiveness of the heating elements 202a, 202b, 202c, 202d, and 202e to current, voltage, or power changes. In an alternative embodiment, the temperature controller 250 may include a look-up table of known materials for the heating elements 202a, 202b, 202c, 202d, and 202e at various temperatures, and include appropriate thermal coefficients of resistance at the temperatures of the heating elements 202a, 202b, 202c, 202d, and 202e to determine the relevant temperatures. Once the thermal coefficient of resistance of the conductive material is known, the temperature of the components 201a, 201b, 201c, 201d, 201e may be controlled such that the temperature may be increased at a stepped or fixed rate to provide increased separation between compounds having similar boiling points. In another embodiment, temperature controller 250 may record the change in resistance as a function of the change in applied power throughout operation, thereby mapping the function throughout.

Further, the temperature controller 250 may control the heating elements 202a, 202b, 202c, 202d, and 202e to provide varying temperatures, such as stepped or ramped temperature increases, to a particular device or over corresponding time periods. Thus, the heating element 202a is a first electrically controlled heating element 202a associated with the first chromatographic part 201a, and the heating element 202b is a second electrically controlled heating element 202b associated with the second chromatographic part 201 b.

When the components 204, 206, 208, 210 and 212 are constructed of an electrically conductive material so that they can be directly heated, power for generating the heating is supplied from the power source 258 through the temperature controller 250. Any number of control systems may be used to accomplish this. The current supplied to the conductive material of the components 204, 206, 208, 210, and 212 may be determined by the resistance sensing circuit 248 by detecting the voltage drop across a current sensing resistor (typically 0.1 ohms) placed between the current source and the components 204, 206, 208, 210, and 212. Also, the voltage is detected. An amplifier may be used to appropriately scale the detected voltage before the representative signal is passed to the analog-to-digital converter. The digitized signal thus obtained, for example 1000 times per second, can be passed to a microcontroller in which the relative resistance value is obtained by applying ohm's law, i.e. by dividing the converted voltage value by the converted current value. The relative resistance value may be compared to a reference resistance value for temperature control using conventional Proportional Integral Derivative (PID) or another control algorithm. The temperature of the components 204, 206, 208, 210, and 212 may also be determined for display or recording by solving equations relating temperature to resistance or interpolating from tables as is known in the art.

referring to fig. 2, the illustrated chromatography system 200 includes a temperature controller 250 in electrical communication with heating elements 202a, 202b, 202c, 202d, and 202e, the heating elements 202a, 202b, 202c, 202d, and 202e being associated with components 204, 206, 208, 210, and 212 (i.e., transfer line 204, injection valve 206, sample loop 208, column 210, and detector 212), respectively. In the illustrated embodiment, the delivery line 204 is surrounded by a conductive trace, and thus is indirectly heated, where the trace serves as the heating element 202 a. In the illustrated embodiment, on the other hand, the injection valve 206 includes an internal heating element 202b for heating and is in communication with the transfer line 204, the sample loop 208, and the column 210. In the illustrated embodiment, sample loop 208 is in communication with injection valve 206 and is constructed of an electrically conductive material, and thus is directly heated and serves as heating element 202 c. In the illustrated embodiment, the pillars 210 having the conductive material positioned adjacent to the body of the pillars 210 are indirectly heated such that the conductive material serves as the heating element 202 d. In the illustrated embodiment, the detector 212 in communication with the column 210 includes a heating element 202e for heating.

referring to fig. 2, the chromatography system 200 further comprises temperature sensors for performing calculations and/or signal reception on many, but not necessarily all, of the components 201a, 201b, 201c, 201d, 201 e. When delivery line 204 is directly heated and used as heating element 202a, its temperature may be controlled based on known resistance data, allowing only the voltage and current to be varied to achieve the desired temperature, and thus the function of temperature sensor 214a is performed by resistance sensing circuit 248 and temperature controller 250. Temperature control by the temperature controller 250 of the transfer line 204 can reduce the effect on the temperature of the column 210, particularly when a column in the form of a bundle (coiled with the heating element 202d) is used. Temperature control of the temperature controller 250 of the transfer line 204 also eliminates the cold spot problem known in the art. Such temperature control of the transfer line 204 may also result in higher efficiency of the fast ramp absorption/release tube. Since injection valve 206 includes internal heating element 202b, valve 206 is associated with temperature sensor 214 b. The sample loop 208, which is indirectly heated by the wires used as the heating element 202c, may be accompanied by a temperature sensor 114c, such as a thermocouple, and may include a current sensing resistor 116b to determine the temperature based on the power output. The temperature of the column 210, which is indirectly heated by conduction, can be determined by its temperature sensor 214d, here a resistance sensing circuit 248. The detector 212 with the heating element 202e may also be accompanied by a temperature sensor 214 e.

Referring to FIG. 2, the chromatography system 200 may also include a cooling device, such as a fan 218, to increase the heat transfer rate when cooling is needed. Such fans 218 may be variable speed, allowing control of the rate of heat transfer associated with particular components 201a, 201b, 201c, 201d, 201 e.

simultaneous control of the temperature of the various components 201a, 201b, 201c, 201d, 201e provides substantial advantages. The temperature controller 250 may provide a common temperature between the various components 201a, 201b, 201c, 201d, 201e, or may be configured to track the temperature of upstream devices. In the common temperature setting, the temperature controller 250 ensures that each component 201a, 201b, 201c, 201d, 201e is at the common temperature setting during operation, although the temperature of each component 201a, 201b, 201c, 201d, 201e may independently fluctuate according to its own heating characteristics. In the tracking setting, the temperature controller 250 ensures that each component 201a, 201b, 201c, 201d, 201e tracks the actual temperature of the upstream component being monitored, thereby ensuring that the sample remains at the actual temperature for the duration of the operation, although not necessarily the optimum temperature.

the temperature controller thus includes the processor 252, a first electrically controlled heating element output, a second electrically controlled heating element output, and a first temperature sensor input, a second temperature sensor input. The processor 252 is adapted to receive the first temperature sensor signal at the first temperature sensor input and construct a first actual time-temperature profile. The processor 252 is further adapted to receive a second temperature sensor signal at a second temperature sensor input and construct a second actual time-temperature profile. The processor 252 is adapted to receive a first time-temperature profile of the first chromatographic component 201 a. The processor 252 is adapted to receive a second time-temperature profile of the second chromatographic component 201b selected from the group of a first time-temperature profile and a first actual time-temperature profile of the first chromatographic component. The processor 252 has a first power control for controlling a first output from the power source 258 to the first electrically controlled heating element output. The processor 252 has a second power control for controlling a second output from the power supply to the first electrically controlled heating element output. The processor 252 is adapted to vary the first output from the power supply such that the first actual time-temperature curve approximates the first actual time-temperature curve. The processor 252 is adapted to vary the second output from the power supply such that the second actual time-temperature curve approximates the second time-temperature curve.

Referring to fig. 3A, 3B, and 3C, one embodiment of the workflow of the temperature controller 250 of the chromatography system 200 of the present disclosure is shown, starting with fig. 3A, continuing to fig. 3B, and then to fig. 3C.

Referring to fig. 3A, in step 302, temperature controller 250 determines the power/temperature relationship of first component 201a (e.g., valve 206), which may be accomplished using temperature sensor 214 b. Step 302 may be performed based on any system known in the art, such as an output from power supply 258 and a response from temperature sensor 214 or from temperature sensor 214 and resistance sensing circuit 248, or as a function of oven temperature and resistance sensing circuit 248. The first chromatographic component 201a may be selected from the group consisting of a transfer line 204, a valve 206, a sample loop 208, a column 210, and a detector 212.

at step 304, the temperature controller 250 may also determine the power/temperature relationship of the second component 201b (e.g., the column 210) by using the temperature sensor 114 d. Step 302 may be repeated for each remaining component 201c, 201d, 201e in the chromatography system 200. The second chromatographic component 201b can be selected from the group consisting of a transfer line 204, a valve 206, a sample loop 208, a column 210, and a detector 212.

In step 306, the temperature controller 250 receives a user input for the time/temperature profile of the first component 201 a. The user input may be provided by a user interface 162, such as a keyboard, or selected from a library 164 storing time-temperature profiles.

In step 308, the temperature controller 250 receives a user input identifying whether the time/temperature profile of the second component 201b will be parallel to or mirror the expected time/temperature profile of the first component 201a, or will track the actual time/temperature profile of the first component 201 a. The user input may be provided by a user interface 162, such as a keyboard, or selected from a library 164 storing time-temperature profiles. Step 308 may be repeated for each of the remaining components 201c, 201d, 201e in the chromatography system 200 relative to the first component 201 a.

in step 310, if the temperature controller 250 receives a user input in step 308 to parallels the expected time/temperature profile of the first component 201a, the chromatography system 200 proceeds to 312. The user input may be provided by a user interface 162, such as a keyboard, or selected from a library 164 storing time-temperature profiles. Otherwise, the temperature controller 250 proceeds to step 330.

Parallel operation

In step 312, temperature controller 250 causes first component 201a to change temperature by heating or allowing cooling using at least one of the temperature sensor, the voltage output and the current output for one cycle based on the user input from step 306 using the power-temperature relationship determined in step 302. The temperature controller 250 may associate the first processor 252 with the first component 201a, or may associate a single processor with multiple components 201a, 201b, 201c, 201d, 201 e. Accordingly, temperature controller 250 applies power from power source 258 to first component 201a according to the time-temperature curve received at step 306 using the power/temperature relationship of first component 201a from step 302. Temperature controller 250 includes a first electrically controlled heating element output, wherein temperature controller 250, for example in first processor 252, has a first power control for controlling a first output from power supply 258 to the first electrically controlled heating element output. The temperature controller 250, and in particular the first processor 252, is adapted to vary the first output from the power supply 258 such that the first actual time-temperature curve approximates the first time-temperature curve of step 308.

Referring to fig. 3B, in step 314, the temperature controller 250 makes a temperature measurement of the first component 201 a. As provided previously, this temperature measurement may be made by a resistance measurement or temperature sensor 214a (e.g., a thermocouple) and provided to the temperature controller 250 and/or the first processor 252. Accordingly, the temperature controller 250 receives the temperature of the first component 201a from the first temperature sensor 214 a.

in step 316, temperature controller 250 compares the temperature measurement of step 314 to the time/temperature profile of first component 201a received in step 306. The comparison may be performed in the first processor 252. Temperature controller 250 therefore determines whether the temperature received in step 314 conforms to the time-temperature curve received in step 306. If the temperature measurement of step 316 matches the time/temperature profile of first component 201a received in step 306, temperature controller 250 proceeds to step 320. Otherwise, the temperature controller 250 proceeds to step 318.

In step 318, the temperature controller 250 adjusts the power output from the power source 258 to the first component 201a to match the time/temperature profile of the first component 201a received in step 306. If desired, a fan 218 or other cooling device is associated with the temperature controller, as the rate of heat transfer is not sufficient to sufficiently reduce the temperature of the first component 201 a. Preferably, the temperature of the first component 201a is maintained within 0.1 ℃ for isothermy, within 1.0 ℃ for a temperature program, or within 10% of an expected temperature from the actual temperature identified in the previous cycle. The adjustment may be controlled by the first processor 252. The temperature controller 250 then proceeds to step 320. Temperature controller 250 utilizes the power/temperature relationship of first component 201a from step 302 to apply power from power source 258 to first component 201a according to the time-temperature curve received in step 306.

in step 320, temperature controller 250 mirrors the time/temperature profile of first component 201a using the power-temperature relationship determined in step 304 based on the user input from step 306 using at least one of a temperature sensor, a voltage output for one cycle, and a current output to cause second component 201b to change temperature by heating or allowing cooling. Thus, temperature controller 250 applies power from power source 258 to second component 201b according to the time-temperature curve received in step 306 using the power/temperature relationship of second component 201b from step 304. The temperature controller 250 may associate a second processor 254 with the second component 201 a. Temperature controller 250 includes a second electrically controlled heating element output, wherein temperature controller 250 has a second power control, for example within first processor 252 or second processor 254, for controlling a second output from power supply 258 to the second electrically controlled heating element output. The temperature controller 250, and in particular the first processor 252 or the second processor 254, is adapted to vary the second output from the power supply 258 such that the second actual time-temperature curve approximates the first time-temperature curve of step 308.

Referring to fig. 3C, in step 322, the temperature controller 250 takes a temperature measurement of the second component 201 b. As provided previously, this temperature measurement may be made by a resistance measurement or temperature sensor 214b (e.g., a thermocouple) and provided to temperature controller 250 and/or second processor 254. The temperature controller 250 receives the temperature of the second component 201b from the second temperature sensor 214 b.

In step 324, temperature controller 250 compares the temperature measurement of step 322 to the time/temperature profile of first component 201a received in step 306. The comparison may be performed in the second processor 254. If the temperature measurement of step 322 matches the time/temperature profile of first component 201a received in step 306, temperature controller 250 proceeds to step 330. Otherwise, the temperature controller 250 proceeds to step 326.

in step 326, the temperature controller 250 adjusts the power output from the power supply 258 or the second power supply 160 to the second component 201b to match the time/temperature profile of the first component 201a received in step 306. Temperature controller 250 utilizes the power/temperature relationship of second component 201b from step 304 to apply power from power source 258 to second component 201b according to the time-temperature curve received in step 306. If desired, a fan 218 or other cooling device is associated with the temperature controller, as the heat transfer rate is not sufficient to sufficiently reduce the temperature of the second component 201 b. Preferably, the temperature of the second component 201b is maintained within 10% of the expected temperature from the actual temperature identified in the previous cycle. The adjustment may be controlled by the first processor 252. The temperature controller then proceeds to step 328. It will be appreciated that if additional components 201c, 201d, 201e are included, the temperature controller 250 performs the same steps as steps 320-326 for each of those components 201c, 201d, 201e before proceeding to step 328. Each additional component 201c, 201d, 201e may likewise have an independent processor associated therewith.

In step 328, temperature controller 250 determines whether the time of the time/temperature profile of first component 201a received in step 306 has elapsed or has been completed. If the duration has not elapsed or completed, temperature controller 250 returns to step 312. If the duration has elapsed, the temperature controller 250 terminates the operation.

Tracking operations

In step 330, temperature controller 250 causes first component 201a to change temperature by heating or allowing cooling using at least one of the temperature sensor, the voltage output and the current output for one cycle based on the user input from step 306 using the power-temperature relationship determined in step 302. Temperature controller 250 utilizes the power/temperature relationship of the first component from step 302 to apply power from power supply 258 to first component 201a according to the time-temperature curve received in step 306. The temperature controller 250 may associate the first processor 252 with the first component 201a, or may associate a single processor with multiple components 201a, 201b, 201c, 201d, 201 e. Temperature controller 250 includes a first electrically controlled heating element output, wherein temperature controller 250, for example in first processor 252, has a first power control for controlling a first output from power supply 258 to the first electrically controlled heating element output. The temperature controller 250, and in particular the first processor 252, is adapted to vary the first output from the power supply 258 such that the first actual time-temperature curve approximates the first time-temperature curve of step 308.

Referring to fig. 3B, in step 332, the temperature controller 250 makes a temperature measurement of the first component 201 a. The temperature controller 250 receives the temperature of the first component 201a from the first temperature sensor 214 a. As provided previously, this temperature measurement may be made by a resistance measurement or temperature sensor 214a (e.g., a thermocouple) and provided to the temperature controller 250 and/or the first processor 252. The temperature measurement of the first component 201a may be provided as a signal and may also be provided to the second processor 254.

in step 334, temperature controller 250 compares the temperature measurement of step 332 with the time/temperature profile of first component 201a received in step 306. Temperature sensor 250 evaluates whether the temperature received in step 332 conforms to the time-temperature curve received in step 306. The comparison may be performed in the first processor 252. If the temperature measurement of step 332 matches the time/temperature profile of the first component 201a received in step 306, the temperature controller 250 proceeds to step 338. Otherwise, the temperature controller proceeds to step 336. The temperature measurements of the assembly step 332 provide the actual time-temperature profile of the first component 201 a.

In step 336, temperature controller 250 adjusts the power output from power supply 258 to first component 201a to match the time/temperature profile of first component 201a received in step 306. Temperature controller 250 utilizes the power/temperature relationship of first component 201a from step 302 to apply power from power source 258 to first component 201a according to the time-temperature curve received in step 306. If desired, a fan 218 or other cooling device is associated with the temperature controller, as the rate of heat transfer is not sufficient to sufficiently reduce the temperature of the first component 201 a. Preferably, the temperature of the first component 201a is maintained within 10% of the expected temperature from the actual temperature identified in the previous cycle. The temperature controller then proceeds to step 338.

In step 338, the temperature controller 250 causes the second component 201b to change temperature by heating or allowing cooling to match the actual temperature profile of the first component 201a received in step 332 using at least one of the temperature sensor, the voltage output for one cycle, and the current output, using the power-temperature relationship determined in step 304, in parallel to the actual time/temperature profile of the first component 201 a. The temperature controller 250 applies power from the power source 258 to the second component 201b using the power/temperature relationship of the second component 201b from step 304 to change the temperature to the temperature of the first component 201a received in step 332 by heating or allowing cooling. The temperature measurement of the first component 201a may be obtained as a signal from the first processor 252. Thus, for a suitable cycle, the target for the temperature of the second component 201b is to match the actual temperature of the first component 201 a. Temperature controller 250 includes a second electrically controlled heating element output, wherein temperature controller 250 has a second power control, for example within first processor 252 or second processor 254, for controlling a second output from power supply 258 to the second electrically controlled heating element output. The temperature controller 250, and in particular the first processor 252 or the second processor 254, is adapted to vary the second output from the power supply 258 such that the second actual time-temperature curve approximates the first actual time-temperature curve of step 332.

Referring to fig. 3C, in step 340, the temperature controller 250 makes a temperature measurement of the second component 201 b. The temperature controller 250 receives the temperature of the second component 201b from the second temperature sensor 214 b. As provided previously, this temperature measurement may be made by a resistance measurement or temperature sensor 214b (e.g., a thermocouple) and provided to temperature controller 250 and/or second processor 254.

in step 342, the temperature controller 250 compares the temperature measurement of step 324 to the actual temperature of the first component 201a received in step 332. The temperature controller 250 evaluates whether the temperature received in step 340 corresponds to the temperature of the first component 201a received in step 332. The comparison may be performed in the second processor 254. If the temperature measurement of step 340 matches the actual temperature profile of the first component 201a received in step 332, the temperature controller 250 proceeds to step 330. Otherwise, the temperature controller proceeds to step 346.

in step 344, the temperature controller 250 adjusts the power output from the power supply 258 or the second power supply 160 to the second component 201b to match the temperature profile of the first component 201a received in step 332. The temperature controller 250 applies power from the power source 258 to the second component 201b using the power/temperature relationship of the second component 201b from step 304 to change the temperature of the second component 201b to match the temperature of the first component 201a received in step 332. If desired, a fan 218 or other cooling device is associated with the temperature controller when the rate of heat transfer from the components 201a, 201b, 201c, 201d, 201e is insufficient to sufficiently reduce the temperature of the second component 201 b. Preferably, the temperature of the second component 201b is maintained within 10% of the expected temperature from the actual temperature identified in the previous cycle. The temperature controller then proceeds to step 346. Preferably, the temperature of the second component 201b is maintained within 10% of the expected temperature from the actual temperature identified in the previous cycle. It will be appreciated that if additional components 201c, 201d, 201e are included, the temperature controller 250 performs the same steps as steps 338 and 344 for each of those components 201c, 201d, 201e before proceeding to step 328.

In step 346, the temperature controller 250 determines whether the time of the time/temperature profile of the first component 201a received in step 306 has elapsed or has been completed. If the duration has not elapsed or completed, temperature controller 250 returns to step 330. If the duration has elapsed, the temperature controller 250 terminates the operation.

Other temperature regimes are also possible. For example, each component 201a, 201b, 201c, 201d, 201e may have a unique time-temperature profile, effectively processed independently according to steps 302, 306, 312 and 318 and 328. Because each component 201a, 201b, 201c, 201d, 201e may have its own time-temperature profile, each component 201a, 201b, 201c, 201d, 201e or group of components 201a, 201b, 201c, 201d, 201e in a zone may be associated with a different temperature sensor 214a, 214b, 214c, 214d, 214e and may be programmed to start and stop temperature ramping simultaneously or independently according to the profile. Thus, a first temperature sensor 214a is associated with the first chromatographic part 201a, while a second temperature sensor 214b is associated with the second chromatographic part 201 b. The first temperature sensor 214a generates a first temperature sensor signal and the second temperature sensor 214b generates a second temperature sensor signal.

Thus, in operation, the temperature controller 250 of the present disclosure simultaneously controls multiple components 201a, 201b, 201c, 201d, 201e, wherein the components are arranged to mirror or track an expected or actual temperature profile of another component 201a, 201b, 201c, 201d, 201e in a fast and controlled manner. Advantageously, the temperature controller 250 provides a rapid ramping temperature and cooling, particularly when associated with the heating elements 202a, 202b, 202c, 202d, 202e made of electrically conductive material and integrated into the body of the components 201a, 201b, 201c, 201d, 201e, particularly when the body of the components 201a, 201b, 201c, 201d, 201e itself is partially constructed of or coated with electrically conductive material. In any case, the temperature controller 250 allows for a smaller size and reduced power consumption compared to the prior art due to the individual control of the individual components 201a, 201b, 201c, 201d, 201e and the elimination of unnecessary heating of the surrounding air volume. In association with components 201a, 201b, 201c, 201d, 201e or zones that are simultaneously and commonly controlled, the temperature controller 250 may perform chromatographic analysis more quickly, may allow for the use of smaller sized columns 210, may produce a more sensitive system, and may consume less power because heating is localized to the components 201a, 201b, 201c, 201d, 201 e.

The terms and expressions which have been employed in the foregoing specification are used therein as terms of description and not of limitation, and there is no intention in the use of such terms and expressions of excluding equivalents of the features shown and described or portions thereof.