阅读说明：本技术 一种多层膜劳埃透镜的离线表征方法 (Offline characterization method of multilayer film Laue lens ) 是由 岳帅鹏 周亮 常广才 冀斌 于 2021-07-28 设计创作，主要内容包括：本发明公开了一种多层膜劳埃透镜的离线表征方法,其步骤包括：1)在基底上镀制多层膜,其中每隔一设定间隔插入一个标志层；2)将多层膜的端面做抛光处理；3)使用扫描电子显微镜拍摄每两个相邻标志层之间的图像；4)将每一副所述图像进行处理,得到每一层膜的厚度值：5)根据各相邻两层膜的厚度生成一个周期性局部光栅,使用CWT方法计算光栅出射面的电场分布作为多层膜劳埃透镜出射面的电场分布；6)利用菲涅耳-基尔霍夫衍射积分,计算电场从出射面传播到焦平面的强度分布。本发明基于测量膜层的实际厚度计算其对多层膜劳埃透镜聚焦性能的影响。(The invention discloses an off-line characterization method of a multilayer film Laue lens, which comprises the following steps: 1) plating a multilayer film on a substrate, wherein a marker layer is inserted at every set interval; 2) polishing the end face of the multilayer film; 3) using a scanning electron microscope to take images between each two adjacent marking layers; 4) processing each image to obtain a thickness value of each layer: 5) generating a periodic local grating according to the thickness of each two adjacent layers of films, and calculating the electric field distribution of the exit surface of the grating as the electric field distribution of the exit surface of the multilayer film Laue lens by using a CWT method; 6) the intensity distribution of the electric field propagating from the exit face to the focal plane is calculated using fresnel-kirchhoff diffraction integration. The present invention calculates its effect on the focusing performance of a multilayer film laeo lens based on measuring the actual thickness of the film layer.)

1. A method for off-line characterization of a multilayer film laey lens, comprising the steps of:

1) plating a multilayer film on a substrate, wherein a marker layer is inserted at every set interval;

2) polishing the end face of the multilayer film;

3) using a scanning electron microscope to take images between each two adjacent marking layers;

4) subjecting each of the images to the processes of steps (a) to (d) to obtain a film thickness value for each film:

(a) calculating the width of each pixel in the image by using the pixel number represented by the length of the image scale of the scanning electron microscope;

(b) performing smoothing processing on the image;

(c) setting an average intensity of a plurality of points centered on each pixel in the multilayer film growth direction as a threshold value of the corresponding pixel; if the intensity of the pixel is larger than the corresponding threshold value of the pixel, setting the intensity of the pixel to be I1, otherwise, setting the intensity of the pixel to be I2;

(d) selecting a plurality of pixels in each layer of film, multiplying the pixel intensity value of the selected pixel by the width of a single pixel, and taking the average value of the multiplication results as the thickness value of the corresponding layer of film;

5) respectively generating a periodic local grating according to the thickness of each two adjacent layers of films, and calculating the electric field distribution of the grating emergent surface by using a CWT (continuous wave transmit) method to be used as the electric field distribution of the emergent surface of the multilayer film Laue lens;

6) the intensity distribution of the electric field propagating from the exit face to the focal plane is calculated using fresnel-kirchhoff diffraction integration.

2. The method of claim 1, wherein smoothing the image comprises: the intensity of each pixel is replaced by the average of several pixel intensities around the pixel.

3. The method of claim 1, wherein I1 is 255 and I2 is 0.

4. The method of claim 1, wherein the polishing of the cross-section of the multilayer film is performed using focused ion beam polishing.

5. The method of claim 1, wherein 200 pixels are selected in each layer, the pixel intensity values of the selected pixels are multiplied by the width of a single pixel, and the average of the multiplication results is used as the thickness value of the corresponding layer.

6. The method of claim 1, wherein the multilayer film is deposited on the substrate using a magnetron sputtering process.

Technical Field

The invention relates to an off-line characterization method applied to a hard X-ray nano focusing optical element, namely a multilayer film Laue lens, and belongs to the fields of diffraction dynamics theory, synchrotron radiation optics, micro-nano processing measurement and the like.

Background

The high-energy synchrotron radiation source has the characteristics of low emissivity, high brightness, high coherence and the like, and has wide application prospect in a plurality of scientific research fields of material structure dynamics, geophysics, environmental science, biophysics, protein crystallography and the like. Hard X-rays with high penetration can study the internal structure of a material on a three-dimensional spatial scale, while a smaller focused beam represents higher spatial resolution and greater ability to characterize the microstructure of the material. The size of hard X-ray probes is increased from the commonly used micrometer scale to the nanometer scale, and the energy of the probes is also expanded from soft X-rays to hard X-rays. The advent of high-energy synchrotron radiation sources and high-performance X-ray focusing elements made hard X-ray nano-focusing possible.

The X-ray nano focusing elements that are currently in common use are mainly reflective optics (Kirkpatrick-Baez mirrors, capillaries), refractive optics (compound refractive lenses, Kinoform lenses) and diffractive optics (fresnel zone plates, multilayer laue lenses), which already enable two-dimensional focusing of 10-50 nm. Since the spatial resolution (Δ) of the X-ray nanoprobe depends on the Numerical Aperture (NA) of the focusing optical element and the wavelength (λ) of the incident light, the spatial resolution can be expressed as: and delta is 0.61 lambda/NA. The complex refractive index of a substance can be expressed as: n-1- δ -i β, with δ typically being 10 in the hard X-ray band^-5-10^-6On the left and right sides, the refraction angle and the critical angle are extremely small, so that it is difficult to achieve the resolution of nanometer scale in both the transmission type and the reflection type. In order to increase the Numerical Aperture (NA) of the focusing element, diffractive focusing elements are widely studied, such as Multilayer Laue Lenses (MLLs). Theoretically, MLLs with ideal structures can focus hard X-rays to less than 1nm by alternating layers of high and low density materials on a flat substrate. The position of each film is also determined by the formula of the zone plate.

Xn²＝nλf+n²λ²/4

Where Xn is the position of the nth layer interface, λ is the wavelength, and f is the focal length. Due to the large aspect ratio, the MLL can also be viewed as a series of partial volume gratings. Geometric theory is no longer applicable and diffraction kinetic theory will be used to describe the diffraction characteristics of MLLs, including mainly Coupled Wave Theory (CWT) and Takagi-Taupin description (TTD). The MLL focusing performance is influenced by many factors, mainly including position error of the film layer, penetration depth precision, interface roughness and the like. The penetration depth accuracy affects diffraction efficiency, thereby reducing light flux. Film position errors can cause phase errors and distort the shape of the intensity curve in the focal plane, thereby enlarging the spot size. Therefore, to achieve diffraction limited focusing, it is important to analyze the effect of layer placement errors on MLL focusing performance and to reduce film layer placement errors.

A new CWT-based kinetic modeling method has been demonstrated to have the same focusing results as TTD. However, the TTD method can only characterize the influence of the film position error on the focusing performance by fitting the overall variation trend with a quadratic polynomial of the MLL structure, and neglects high frequency information.

Disclosure of Invention

The invention aims to provide a novel off-line characterization method of a multilayer film Laue lens to solve the problem of influence of actual film thickness on the focusing performance of the lens, in the invention, a cross section is measured through a scanning electron microscope, and the thickness of each layer is calculated through image smoothing, binary conversion and splicing processes; the focusing performance of the actual MLL versus the actual film thickness is calculated by a new kinetic model. Compared with the traditional method, the high-frequency film errors can be processed by using diffraction dynamics, the influence of the film position errors on the MLL can be analyzed systematically and comprehensively, and the calculation model is relatively simplified.

The invention can be realized by the following technical scheme:

a multilayer film Laue lens is characterized in that the multilayer film is composed of a substrate 1 and a multilayer film 2.

The effect of the multilayer film 2 is to focus the incident hard X-rays to a spot size of the order of nanometers by diffraction dynamics. The multilayer film material is generally formed by alternately plating high and low refractive index materials (for example: WSi)₂And Si), the thickness d of each layer satisfiesWherein λ is the wavelength of incident light, f is the focal length of the lens, n is the number of layers, and the multilayer film 2 is formed by plating on a silicon substrate 1 by magnetron sputteringIn (1). The present invention calculates its effect on the focusing performance of a multilayer film laeo lens based on measuring the actual thickness d.

A method for off-line characterization of a multilayer film laey lens, the method comprising:

(1) the multilayer film 2 is plated on the substrate 1 by a magnetron sputtering method, wherein a mark layer is inserted at regular intervals (such as 1 micron) so as to realize image splicing of the large-caliber multilayer film.

(2) The end face of the multilayer film 2 is subjected to polishing treatment using focused ion beam polishing (FIB).

(3) Images between each two adjacent marker layers were taken using a Scanning Electron Microscope (SEM).

(4) Processing each image by the following steps:

(a) the width of each pixel is calculated from the number of pixels represented by the length of the SEM image scale.

(b) The intensity of each pixel is replaced by the average of the intensities of several surrounding pixels (e.g., 25 or 50) to smooth the image.

(c) The average intensity of several points (such as 5 or 9) centered on each pixel in the multilayer film growth direction is set as a threshold value. However, as the thickness of the film layer becomes thinner in the direction of the growth of the multilayer film, the number of dots is slightly adjusted. The threshold may be different for different pixels.

(d) If the intensity of a pixel is greater than the threshold for that pixel, we set the intensity of that pixel to 255, otherwise to 0, different intensity values represent different materials.

(e) The thickness value of each layer of film is the product of the same pixel number and the width of a single pixel. The same layer will typically only have the same intensity value.

(f) The average thickness of each film is averaged over a range (e.g., 200 pixels).

(5) And simulating a periodic local grating according to the thickness of each two adjacent layers of films, and calculating the electric field distribution of the emergent surface of the grating as the electric field distribution of the emergent surface of the lens by using a CWT method. The invention makes two adjacent layers equal to a periodic grating, and takes one period of the grating as a periodic local grating because the grating is infinite. For example, if the 1 st and 2 nd film layers are gratings n1, the 3 rd and 4 th film layers are gratings n2, and the 2k-1 st and 2k th film layers are gratings nk, the corresponding periodic local gratings have the grating numbers n1, n2 …, nk in sequence.

(6) The intensity distribution of the electric field propagating from the exit face to the focal plane is calculated using fresnel-kirchhoff diffraction integration. The skilled person can adjust the multilayer film according to the intensity profile in order to optimize the multilayer film laey lens.

Compared with the prior art, the invention has the following advantages:

1. and calculating the influence of the actual film thickness on the focusing performance of the multilayer film Laue lens.

2. Compared with the existing method, the method can process the high-frequency film error by using diffraction dynamics, and is beneficial to systematically and comprehensively analyzing the influence of the film position error on the MLL.

3. The computational model is relatively simplified.

Drawings

FIG. 1 is a schematic focusing diagram of a multilayer film Laue lens.

FIG. 2 is an SEM test and processing image of a multilayer film;

(a) for the original images of two adjacent marker layers of the multilayer film tested in the SEM,

(b) for smooth images of two adjacent marker layers of the multilayer film under SEM testing,

(c) binary converted images of two adjacent marker layers for the multilayer film tested in the SEM,

(d) the film layer thickness values of two adjacent marker layers are tested by SEM of the multilayer film.

Fig. 3 shows the light intensity distribution of the lens at the focal point under the actual film thickness.

Detailed Description

The present invention will be described in detail below with reference to the accompanying drawings and examples.

Example (b):

firstly, a multilayer film 2 is plated on a substrate 1 by a magnetron sputtering method, and the material composition of the multilayer film is WSi₂And Si, each ofThe thickness d of the layer satisfiesWhere λ is the wavelength of incident light, f is the focal length of the lens, and n is the number of film layers. The incident wavelength is 0.124nm, the focal length is 2.5mm, the value of n is 60-1495 layers, and the value of d is 7.2-36.1 nm. In the coating process, a mark layer is inserted at intervals of 1 micron, so that the purpose of image splicing of the large-caliber multilayer film is realized. The cross section of the multilayer film 2 is subjected to polishing treatment using focused ion beam polishing (FIB). And images between each two adjacent marking layers are taken by a Scanning Electron Microscope (SEM), as shown in fig. 2 (a).

Then each image is processed by the following steps:

(a) the width of each pixel is calculated from the number of pixels represented by the length of the SEM image scale.

(b) The intensity of each pixel is replaced with the average of its surrounding 25 pixels for smoothing the image, as shown in fig. 2 (b).

(c) The average intensity of several points (such as 5 or 9) centered on each pixel in the film growth direction is set as a threshold value. However, as the film layer becomes thinner, the number of dots is slightly adjusted.

(d) If the intensity of the pixel is greater than the threshold, we set the new intensity to 255, otherwise to 0, with the result shown in FIG. 2 (c).

(e) The thickness value of each layer of film is the product of the same pixel number and the width of a single pixel.

(f) The average thickness of each film was the average of 200 pixels around it, as shown in fig. 2 (d).

And finally, combining every two adjacent layers into a periodic local grating, and calculating the electric field distribution of the lens emergent surface by using a CWT method. The intensity distribution of the electric field propagating from the exit face to the focal plane is calculated using fresnel-kirchhoff diffraction integration, as shown in fig. 3.

The present application is not limited to the detailed embodiments of the present invention, and those skilled in the art can make various modifications thereto, such as changing the combination of the multi-layer film materials, the value range of the single layer thickness, the incident wavelength, the focal length, etc., but they still fall within the protection scope of the present invention, as long as the modifications do not depart from the spirit and intent of the present invention.