阅读说明：本技术 显示模组和显示面板 (Display module and display panel ) 是由 陈曦 于 2021-02-05 设计创作，主要内容包括：本发明实施例公开了一种显示模组和显示面板,通过设置显示模组包括阵列基板和绝缘层,绝缘层位于阵列基板的平坦化层远离驱动电路层的一侧,绝缘层覆盖平坦化层的至少部分设定侧面,所述邦定端子至少部分裸露,在第一方向上,绝缘层在设定侧面覆盖平坦化层的位置至少与邦定端子对应；其中,设定侧面为沿第一方向平坦化层最外侧的表面,第一方向为显示区指向邦定区的方向；可以使得即使邦定区平坦化层的设定侧面的位置处电极层材料有残留,第一方向上设定侧面与邦定端子的对应位置处,残留电极层也会被绝缘层所覆盖,进而减少显示模组的邦定端子与柔性线路板邦定时不同邦定端子之间的短路现象的发生,保证显示面板良好的显示效果。(The embodiment of the invention discloses a display module and a display panel, wherein the display module comprises an array substrate and an insulating layer, the insulating layer is positioned on one side, away from a driving circuit layer, of a planarization layer of the array substrate, the insulating layer covers at least part of a set side face of the planarization layer, at least part of a bonding terminal is exposed, and in a first direction, the position, covered by the planarization layer, of the set side face of the insulating layer at least corresponds to the bonding terminal; setting a side surface as the surface of the outermost side of the planarization layer along a first direction, wherein the first direction is a direction in which the display area points to the bonding area; even can be so that position department electrode layer material of the settlement side of bonding district planarization layer has the residue, the corresponding position department of settlement side and bonding terminal on the first direction, it also can be covered by the insulating layer to remain the electrode layer, and then reduces the emergence of the short circuit phenomenon between the different bonding terminals of display module's bonding terminal and flexible line way board bonding, guarantees the good display effect of display panel.)

1. A display module is characterized by comprising a display area and a bonding area positioned on one side of the display area; the display module further comprises an array substrate and an insulating layer;

the array substrate comprises a driving circuit layer, a planarization layer and an electrode layer which are arranged in a stacked mode, and the bonding area comprises a plurality of bonding terminals connected with the driving circuit layer;

the insulating layer is positioned on one side of the planarization layer far away from the driving circuit layer, the insulating layer covers at least part of set side face of the planarization layer, the bonding terminals are at least partially exposed, and in the first direction, at least part of the insulating layer corresponds to the bonding terminals at the position where the set side face covers the planarization layer;

the set side is the surface of the outermost side of the planarization layer along the first direction, and the first direction is the direction in which the display area points to the bonding area.

2. The display module of claim 1, wherein the insulating layer comprises a first insulating portion corresponding to the bonding terminals in the first direction, the first insulating portion being at least partially located at a set side of the planarization layer;

preferably, in the second direction, a size of the first insulating portion is larger than a size of the corresponding bonding terminal; wherein the second direction is perpendicular to the first direction.

3. The display module according to claim 2, wherein at least two adjacent first insulating portions are separated from each other.

4. The display module according to claim 2 or 3, further comprising a second insulating portion, wherein at least two adjacent first insulating portions are connected by the second insulating portion;

preferably, each adjacent first insulating portion is connected by the second insulating portion.

5. The display module according to claim 2, wherein a dimension of a vertical projection of the first insulating portion on the driving circuit layer in the first direction is greater than or equal to a dimension of a vertical projection of the set side of the planarization layer on the driving circuit layer in the first direction.

6. The display module according to claim 2, wherein the first insulating portion comprises a first sub-insulating portion and a second sub-insulating portion connected to the first sub-insulating portion, the first sub-insulating portion is located on a predetermined side of the planarization layer, the second sub-insulating portion is located on the same side of the driving circuit layer as the planarization layer, and the second sub-insulating portion is located on a side of the predetermined side away from the display region.

7. The display module according to claim 6, wherein the first insulating portion further comprises a third sub-insulating portion, and the third sub-insulating portion is connected to the second sub-insulating portion through the first sub-insulating portion.

8. The display module according to claim 6, wherein a dimension of a vertical projection of the first sub-insulating portion on the driving circuit layer in the first direction is equal to a dimension of a vertical projection of the set side of the planarization layer on the driving circuit layer in the first direction.

9. The display module according to claim 1, wherein a pixel defining layer and a support pillar layer are sequentially stacked on the array substrate in a direction from the driving circuit layer to the planarization layer, and the pixel defining layer and/or the support pillar layer at the bonding region serve as the insulating layer.

10. A display panel comprising the display module of any one of claims 1-9, further comprising a flexible wiring board comprising connection terminals, the connection terminals being bonded to the bonding terminals in a one-to-one correspondence.

Technical Field

The embodiment of the invention relates to the technical field of display, in particular to a display module and a display panel.

Background

With the development of display technology, the requirements for display reliability of display panels are also higher and higher.

Among the current display module assembly, including bonding terminal usually in the lower frame position, bond with flexible line way board through bonding terminal, and then realize the signal transmission among the driver chip line display module assembly.

Among the current display panel, there is flexible line way board and display module's bonding terminal bonding back, the phenomenon of two adjacent bonding terminal short circuits, influences display panel's normal demonstration.

Disclosure of Invention

The invention provides a display module and a display panel, which are used for reducing the short circuit phenomenon between a bonding terminal of the display module and an adjacent bonding terminal of a flexible circuit board in a bonding process and ensuring the normal display of the display panel.

In a first aspect, an embodiment of the present invention provides a display module, where the display module includes a display area and a bonding area located on one side of the display area; the display module further comprises an array substrate and an insulating layer;

the array substrate comprises a driving circuit layer, a planarization layer and an electrode layer which are arranged in a stacked mode, and a bonding area comprises a plurality of bonding terminals connected with the driving circuit layer;

the insulating layer is positioned on one side, far away from the driving circuit layer, of the planarization layer, the insulating layer covers at least part of the set side face of the planarization layer, the bonding terminals are at least partially exposed, and in the first direction, at least part of the insulating layer corresponds to the bonding terminals at the positions, covered by the planarization layer, of the set side face;

the side face is set to be the surface of the outermost side of the planarization layer along the first direction, and the first direction is the direction in which the display area points to the bonding area.

Optionally, the insulating layer includes first insulating portions corresponding to the bonding terminals in the first direction, and the first insulating portions are at least partially located on the set side of the planarization layer;

optionally, in the second direction, the size of the first insulating portion is larger than the size of the corresponding bonding terminal; wherein the second direction is perpendicular to the first direction.

Optionally, at least two adjacent first insulating portions are separated from each other.

Optionally, the display module further includes a second insulating portion, and at least two adjacent first insulating portions are connected by the second insulating portion;

optionally, each adjacent first insulating portion is connected by a second insulating portion.

Optionally, a size of a vertical projection of the first insulating portion on the driving circuit layer in the first direction is greater than or equal to a size of a vertical projection of the set side of the planarization layer on the driving circuit layer in the first direction.

Optionally, the first insulating portion includes a first sub insulating portion and a second sub insulating portion connected to the first sub insulating portion, the first sub insulating portion is located on the setting side of the planarization layer, the second sub insulating portion and the planarization layer are located on the same side of the driving circuit layer, and the second sub insulating portion is located on a side of the setting side far away from the display area.

Optionally, the first insulating portion further includes a third sub-insulating portion, and the third sub-insulating portion is connected to the second sub-insulating portion through the first sub-insulating portion.

Optionally, a dimension of a vertical projection of the first sub-insulating portion on the driving circuit layer in the first direction is equal to a dimension of a vertical projection of the set side of the planarization layer on the driving circuit layer in the first direction.

Optionally, in a direction in which the driving circuit layer points to the planarization layer, a pixel defining layer and a support column layer are sequentially stacked on the array substrate, and the pixel defining layer and/or the support column layer located in the bonding region serve as insulating layers.

In a second aspect, an embodiment of the present invention further provides a display panel, including the display module in the first aspect, and further including a flexible printed circuit board, where the flexible printed circuit board includes a connection terminal, and the connection terminal is connected to the bonding terminals in a one-to-one corresponding bonding manner.

According to the display module and the display panel provided by the embodiment of the invention, the display module comprises the array substrate and the insulating layer, the insulating layer is positioned on one side, away from the driving circuit layer, of the planarization layer of the array substrate, the insulating layer covers at least part of the set side face of the planarization layer, and the position, covered by the planarization layer, of the set side face of the insulating layer at least corresponds to the bonding terminal in the first direction; setting a side surface as the surface of the outermost side of the planarization layer along a first direction, wherein the first direction is a direction in which the display area points to the bonding area; even can be so that position department electrode layer material of settlement side of bonding district planarization layer has the residue, set for the corresponding position department of side and bonding terminal in the first direction, it also can be covered by the insulating layer to remain the electrode layer, and then make flexible line way board and display module group bind when, the probability that connecting terminal and the settlement side position department of planarization layer remained the electrode layer and take place the contact among the flexible line way board reduces, then the probability that remaining electrode layer and bonding terminal take place to be connected reduces, and then reduce the emergence of the short circuit phenomenon between the different bonding terminals of bonding terminal of display module group and flexible line way board bonding, guarantee the good display effect of display panel.

Drawings

FIG. 1 is a schematic diagram of a process for etching an electrode layer in the prior art;

FIG. 2 is a top view of a prior art display panel;

fig. 3 is a schematic structural diagram of a display module according to an embodiment of the present invention;

fig. 4 is a top view of a display module according to an embodiment of the invention;

FIG. 5 is a top view of another display module according to an embodiment of the present invention;

FIG. 6 is a top view of another display module according to an embodiment of the present invention;

FIG. 7 is a schematic structural diagram of another display module according to an embodiment of the present invention;

FIG. 8 is a schematic structural diagram of another display module according to an embodiment of the present invention;

FIG. 9 is a schematic structural diagram of another display module according to an embodiment of the present invention;

fig. 10 is a schematic structural diagram of a display panel according to an embodiment of the present invention.

Detailed Description

The present invention will be described in further detail with reference to the accompanying drawings and examples. It is to be understood that the specific embodiments described herein are merely illustrative of the invention and are not limiting of the invention. It should be further noted that, for the convenience of description, only some of the structures related to the present invention are shown in the drawings, not all of the structures.

Just as in the background art, among the current display module assembly, there is flexible line way board and display module assembly's bonding terminal bonding back, the phenomenon of two adjacent bonding terminal short circuits, influences the problem that display module assembly's normal demonstration. The inventors have found that the above problem occurs because the side of the planarization layer in the bonding region of the conventional display module is usually sloped, and the electrode layer material is easily remained at the slope. FIG. 1 is a schematic diagram illustrating a process of etching an electrode layer in the prior art, and FIG. 2 is a top view of a display module in the prior art; wherein fig. 1 and 2 only show a display module or a partial structure of a display module. Referring to fig. 1 and 2, after the electrode layer 130 of the display module is formed on the planarization layer 120, when patterning the electrode layer 130 after the planarization layer 120 is formed on the substrate 110 in the bonding region, the photoresist 140 on the electrode layer 130 at the slope L1 is insufficiently exposed compared to the photoresist 140 on the electrode layer 130 on the surface of the planarization layer 120 parallel to the light emitting surface of the display module, so that the photoresist 140 at the slope L1 remains. When the electrode layer 130 is etched, the photoresist 140 serves as a protective mask for the electrode layer 130, the electrode layer 130 at a position not covered by the photoresist 140 is etched, and the electrode layer 130 at a position covered by the photoresist 140 remains. Therefore, the photoresist 140 at the slope L1 remains, so that when the electrode layer 130 is etched, the material of the electrode layer 130 at the slope L1 also remains. When bonding is performed, when the connection terminal 150 of the flexible printed circuit board is connected to the bonding terminal 160 of the display module, the connection terminal 150 of the flexible printed circuit board and the bonding terminal 160 of the display module are conducted in a direction s (or the direction opposite to the direction in which the bonding terminal 160 points to the connection terminal 150) in which the bonding terminal 160 points to the connection terminal 150, and two adjacent connection terminals 150 are conducted in a direction g in which one of the two adjacent connection terminals 150 points to the other through the remaining electrode layer 130, so that a U-shaped loop is formed between the two adjacent bonding terminals 160, and the two adjacent bonding terminals 160 are short-circuited, thereby causing poor display.

Based on the above reasons, an embodiment of the invention provides a display module, fig. 3 is a schematic structural diagram of the display module provided in the embodiment of the invention, fig. 4 is a top view of the display module provided in the embodiment of the invention, where fig. 4 may correspond to the top view of the bonding area of fig. 3, and fig. 3 and fig. 4 only show a partial structure of the display module. Referring to fig. 3 and 4, the display module includes a display area AA and a bonding area NAA1 located at one side of the display area AA; the display module further includes an array substrate 210 and an insulating layer 230;

the array substrate 210 includes a driving circuit layer 211, a planarization layer 212, and an electrode layer 213, which are stacked, and the bonding area NAA1 includes a plurality of bonding terminals 220 connected to the driving circuit layer 211;

the insulating layer 230 is located on a side of the planarization layer 212 away from the driving circuit layer 211, the insulating layer 230 covers at least a portion of the set side 2121 of the planarization layer 212, and the bonding terminal 220 is at least partially exposed, and in the first direction x, at least a portion of the insulating layer 230 corresponds to the bonding terminal 220 at a position where the set side 2121 covers the planarization layer 212, that is, at least a portion of the insulating layer 230 is located on an extending path of the bonding terminal 220 in the first direction x;

here, the side 2121 is set as the outermost surface of the planarization layer 212 along the first direction x, which is a direction in which the display area AA points to the bonding area NAA 1.

Specifically, the driving circuit layer 211 of the array substrate 210 may include a pixel circuit for driving the display module, a scan driving circuit for generating a scan signal, and a light-emitting control driving circuit for generating a light-emitting control signal. The pixel circuit may be located in the display area AA, the scan driving circuit and the light emission control driving circuit may be located in the non-display area NAA, and the bonding area NAA1 may also be located in the non-display area NAA. The driving circuit layer 211 of the array substrate 210 may include at least two metal layers, and the bonding terminal 220 of the bonding area NAA1 may be at the same layer as the metal layer of the driving circuit layer 211, or the bonding terminal 220 may be made of the metal layer of the driving circuit layer 211. The planarization layer 212 of the driving circuit is located between the metal layer closest to the electrode layer 213 and the electrode layer 213, that is, the planarization layer 212 covers the metal layer of the driving circuit layer 211. Since the metal layer of the driving circuit layer 211 usually needs to be patterned to form structures such as circuit devices or signal lines, the patterned structure in the metal layer is likely to affect the formation of the electrode layer 213, so that the electrode layer 213 is uneven, and the planarization layer 212 is disposed to avoid the above-mentioned problems. The planarization layer 212 has a larger thickness, so that after the planarization layer 212 covers the metal layer, the surface of the planarization layer 212 close to the electrode layer 213 is still flat, and the surface of the formed electrode layer 213 is also flat. The display module of the present embodiment may be an organic light emitting display module or an inorganic light emitting display module, and the present embodiment is not limited herein. The display module includes a plurality of light emitting devices, and in the display area AA, the electrode layer 213 may include a plurality of first electrodes 2131, which may be anodes of the light emitting devices. The surface of the first electrode is flat, so that emergent light of the light-emitting device is uniform, and a good display effect is ensured. With continued reference to fig. 3, the light emitting device may further include a light emitting layer 240 and a second electrode 250, and the second electrode 250 may be a cathode of the light emitting device. Since the set side 2121 of the planarization layer 212 is a slope, the bonding area NAA1 further includes a residual electrode layer 2132.

In this embodiment, the display module further includes an insulating layer 230, and the insulating layer 230 is located on a side of the planarization layer 212 far away from the driving circuit layer 211. The insulating layer 230 includes an insulating portion located in the display area AA (the insulating portion located in the display area AA is simply referred to as a display area insulating portion 231) and an insulating portion located in the bonding area NAA1 (the insulating portion located in the bonding area NAA1 is simply referred to as a bonding area insulating portion 232). Referring to fig. 3 and 4, the insulating layer 230 covers at least a portion of a set side 2121 of the planarization layer 212, where the set side 2121 is an outermost surface of the planarization layer 212 along a first direction x, and the first direction x is a direction in which the display area AA points to the bonding area NAA 1. Wherein the set side 2121 is the slope position of the planarization layer 212 indicated in the background art, as explained for the reason of the problem in the background art, the material of the electrode layer 213 is easy to remain at the slope position (i.e. the set side 2121), and when the display module is bonded to the flexible printed circuit board, the bonding terminal 220 of the display module and the connection terminal 310 of the flexible printed circuit board may be connected by a conductive adhesive, wherein the conductive adhesive may be an anisotropic conductive adhesive. The conductive paste includes conductive metal balls 410 (the material of the conductive metal balls 410 is gold), and due to the fluidity of the conductive paste, a part of the conductive paste may flow to the position of the set side 2121 of the planarization layer 212, so that when the connection terminal 310 of the flexible printed circuit board is bonded to the bonding terminal 220 of the display module, the connection terminal 310 makes a short circuit between two adjacent bonding terminals 220 by flowing the conductive paste at the position of the set side 2121 or directly contacting the residual electrode layer 2132 material of the bonding area NAA 1.

In this embodiment, the insulating layer 230 is located on the side of the planarization layer 212 away from the driving circuit layer 211, and the insulating layer 230 may be prepared after the preparation of the electrode layer 213 is completed, but when the insulating layer 230 is prepared, it is ensured that at least a portion of the bonding terminal 220 is exposed, and it is further ensured that the bonding terminal 220 can be bonded to the connection terminal 310 of the flexible circuit board. By providing the insulating layer 230 to cover at least a portion of the setting side 2121 of the planarization layer 212, and at least a portion of the insulating layer 230 in the first direction x corresponding to the bonding terminal 220 at the position where the setting side 2121 of the planarization layer 212 is covered by the setting side 2121 of the bonding area NAA1, even if the material of the electrode layer 213 remains at the position where the setting side 2121 of the planarization layer 212 is covered by the bonding terminal 220, the remaining electrode layer 2132 is covered by the insulating layer 230 at the position where the setting side 2121 of the planarization layer 212 is located in the first direction x, so that when the flexible printed circuit board is bonded to the display module, the probability that the connecting terminal 310 in the flexible printed circuit board is in direct contact or indirect contact (contact is made by the conductive paste at the time of indirect contact) with the remaining electrode layer 2132 at the position of the setting side 2121 of the planarization layer 212 is reduced, and the probability that the remaining electrode layer pointing to the connecting terminal in the direction of the connecting terminal in fig. 2 (i.e, the probability of forming a U-shaped loop between two different bonding terminals is reduced, thereby reducing the occurrence of short circuit between the bonding terminals 220 of the display module and the different bonding terminals 220 at the time of bonding the flexible circuit board.

The display module provided by the embodiment comprises an array substrate and an insulating layer, wherein the insulating layer is positioned on one side, away from a driving circuit layer, of a planarization layer of the array substrate, the insulating layer covers at least part of a set side face of the planarization layer, and the position, covered by the planarization layer, of the set side face of the insulating layer at least corresponds to a bonding terminal in the first direction; setting a side surface as the surface of the outermost side of the planarization layer along a first direction, wherein the first direction is a direction in which the display area points to the bonding area; even can be so that position department electrode layer material of settlement side of bonding district planarization layer has the residue, set for the corresponding position department of side and bonding terminal in the first direction, it also can be covered by the insulating layer to remain the electrode layer, and then make flexible line way board and display module group bind when, the probability that connecting terminal and the settlement side position department of planarization layer remained the electrode layer and take place the contact among the flexible line way board reduces, then the probability that remaining electrode layer and bonding terminal take place to be connected reduces, and then reduce the emergence of the short circuit phenomenon between the different bonding terminals of bonding terminal of display module group and flexible line way board bonding, guarantee the good display effect of display module group.

With continued reference to fig. 3, on the basis of the above technical solution, optionally, in a direction in which the driving circuit layer 211 points to the planarization layer 212, a pixel defining layer 260 and a support column layer 270 are sequentially stacked on the array substrate 210, and the pixel defining layer 260 and/or the support column layer 270 located in the bonding area NAA1 are/is used as the insulating layer 230. In which the case where the pixel defining layer 260 located at the bonding area NAA1 is schematically shown in fig. 3 as the insulating layer 230.

Wherein the pixel defining layer 260 includes a plurality of openings in which the light emitting layer 240 of the light emitting device can be disposed. The supporting posts are disposed on a side of the pixel defining layer 260 away from the driving circuit layer 211, and are used for supporting a mask during a manufacturing process of the display module. Wherein the pixel is injectd layer 260 and support post layer 270 and is the current membranous layer structure in the display module assembly, utilize the pixel of bonding district NAA1 to injectd layer 260 and/or support post layer 270 and regard as insulating layer 230, need not to set up extra membranous layer structure in the display module assembly, when reducing bonding terminal 220 short circuit, only need to form the pixel injects layer 260 and/or support post layer 270's mask version structure improve can, need not to increase the process step, guarantee that the preparation technology complexity of display module assembly can not increase, and then guarantee the productivity.

It should be noted that, in other alternative embodiments of the present invention, another insulating film structure on the side of the electrode layer 213 away from the planarization layer 212 may be used as the insulating layer 230, and the embodiment is not limited in this respect. Of course, in other alternative embodiments of the present invention, a film structure may be additionally added as the insulating layer 230, but the insulating layer 230 needs to be formed after the electrode layer 213 to ensure that the insulating layer 230 can cover at least a portion of the residual electrode layer 2132 at the set side 2121.

With continued reference to fig. 4, optionally, the insulation layer 230 includes a first insulation portion 2321 corresponding to the bonding terminals 220 in the first direction x in a one-to-one manner, i.e., the first insulation portion 2321 is located on the extending path of the bonding terminals 220 in the first direction x, and the first insulation portion 2321 is at least partially located on the set side 2121 of the planarization layer 212.

Specifically, in first direction x, first insulating portions 2321 correspond to bonding terminals 220 one-to-one. When the display module includes a plurality of bonding terminals 220, the corresponding display module includes a plurality of first insulating portions 2321, one side of each bonding terminal 220 away from the display area AA is provided with one first insulating portion 2321 corresponding to the bonding terminal 220, the first insulating portion 2321 is at least partially located on the setting side 2121 of the planarization layer 212, so that for any bonding terminal 220, at least partially covered by the first insulating portion 2321 at a position corresponding to the setting side 2121 in the first direction x, and, accordingly, when the flexible printed circuit board is bonded to the display module, the probability that the connection terminal of the flexible printed circuit board corresponding to each bonding terminal 220 is connected to the residual electrode layer 2132 is reduced, the probability that each bonding terminal 220 is connected to the residual electrode layer 2132 in the first direction x is reduced, and the probability that each adjacent bonding terminal 220 is short-circuited is reduced.

With continued reference to fig. 4, based on the above technical solution, optionally, in the second direction y, a dimension d1 of the first insulating portion 2321 is greater than a dimension d2 of the corresponding bonding terminal 220; wherein the second direction y is perpendicular to the first direction x.

Specifically, the size of the connection terminal of the flexible printed circuit board, which is correspondingly connected to the bonding terminal 220 of the display module, is generally consistent with the size of the bonding terminal 220. Setting the size d1 of the first insulation portion 2321 to be larger than the size d2 of the bonding terminal 220 in the second direction y can ensure that the size of the first insulation portion 2131 in the second direction y is larger than the size of the connection terminal of the flexible circuit board, thereby avoiding a short circuit caused by the contact between the two sides of the bonding terminal 220 in the second direction y of the first insulation portion 2321 and the residual electrode layer 2132 when the size of the bonding terminal 220 in the second direction y is larger than the size of the first insulation portion 2321. When the size of the connection terminal of the flexible wiring board is known, in other alternative embodiments of the present invention, the size of the first insulating portion 2321 in the second direction y may also be directly set to be larger than the size of the connection terminal of the flexible wiring board.

Fig. 5 is a top view of another display module according to an embodiment of the invention, where fig. 5 may correspond to a top view of the bonding area NAA1 of fig. 3, and referring to fig. 4 and 5, optionally, at least two adjacent first insulating portions 2321 are separated from each other.

Specifically, in this embodiment, the adjacent first insulating portions 2321 may be separated from each other, or may be connected to each other, and at least two adjacent first insulating portions 2321 are separated from each other. When the adjacent first insulating portions 2321 are connected to each other, the structure connecting the adjacent first insulating portions 2321 is also the structure included in the insulating layer 230, that is, the first insulating portions 2321 and the structure connecting the adjacent first insulating portions 2321 are made of the same material.

Fig. 6 is a top view of another display module according to an embodiment of the present invention, where fig. 6 may correspond to a top view of the bonding area NAA1 of fig. 3, and referring to fig. 5 and fig. 6, optionally, the display module further includes a second insulating portion 2322, and at least two adjacent first insulating portions 2321 are connected by the second insulating portion 2322.

Specifically, since the flexible printed circuit board and the display module need to be aligned when being bonded, when the alignment is not accurate, a part of the connection terminal of the flexible printed circuit board may be located at a position other than the first insulation portion 2321, and at this time, the first insulation portion 2321 may not ensure good insulation between the flexible printed circuit board and the residual electrode layer 2132. In this embodiment, even if the flexible circuit board and the display module are misaligned due to the second insulating portion 2322, the flexible circuit board does not contact the residual electrode layer 2132 due to the presence of the second insulating portion 2322, that is, the second insulating portion 2322 can prevent the residual electrode layer 213 between the adjacent first insulating portions 2321 from contacting the connection terminal of the flexible circuit board, thereby further reducing the occurrence of short circuit.

Optionally, each adjacent first insulating portion 2321 is connected by a second insulating portion 2322.

Specifically, the insulating layer 230 may include a plurality of second insulating portions 2322, and every two adjacent first insulating portions 2321 may be connected by one second insulating portion 2322, so that the residual electrode layer 213 between the adjacent first insulating portions 2321 may be insulated from the connection terminal of the flexible circuit board by the second insulating portion 2322, thereby further reducing the occurrence of a short circuit phenomenon.

For the display module structure shown in fig. 5 and 6 in which the insulating layer 230 includes the second insulating portion 2322, the second insulating portion 2322 and the first insulating portion 2321 may be made of the same material. The second insulating portion 2322 and the first insulating portion 2321 may be prepared in the same process, thereby simplifying the preparation process of the display module.

Fig. 7 is a schematic structural diagram of another display module provided in an embodiment of the present invention, fig. 8 is a schematic structural diagram of another display module provided in an embodiment of the present invention, and fig. 9 is a schematic structural diagram of another display module provided in an embodiment of the present invention, where fig. 7-9 only schematically illustrate a partial structure of the display module at a position near a set side 2121 of the planarization layer 212, and referring to fig. 7-9, optionally, a dimension of a vertical projection of the first insulating portion 2321 on the driving circuit layer 211 in the first direction x is greater than or equal to a dimension of a vertical projection of the set side 2121 of the planarization layer 212 on the driving circuit layer 211 in the first direction x.

Wherein fig. 7 shows a case where a dimension of a vertical projection of the first insulating portion 2321 on the driving circuit layer 211 in the first direction x is equal to a dimension of a vertical projection of the set side 2121 of the planarization layer 212 on the driving circuit layer 211 in the first direction x, and fig. 8 and 9 show a case where a dimension of a vertical projection of the first insulating portion 2321 on the driving circuit layer 211 in the first direction x is larger than a dimension of a vertical projection of the set side 2121 of the planarization layer 212 on the driving circuit layer 211 in the first direction x.

Specifically, the dimension of the vertical projection of the first insulating portion 2321 on the driving circuit layer 211 in the first direction x is greater than or equal to the dimension of the vertical projection of the setting side surface 2121 of the planarization layer 212 on the driving circuit layer 211 in the first direction x, and the first insulating portion 2321 corresponds to the bonding terminal 220 in the first direction x one by one, so that the first insulating portion 2321 can completely cover the corresponding position on the setting side surface 2121 and the bonding terminal 220, and further ensure that the residual electrode layer 2132 on the setting side surface 2121 and the bonding terminal 220 can be completely covered by the corresponding first insulating portion 2321, and further ensure that when the flexible circuit board is bonded to the display module, the connecting terminal of the flexible circuit board cannot contact with the residual electrode layer 2132 at the position where the setting side surface 2121 corresponds to the bonding terminal 220 in the first direction x, and thus realizing good insulation between the connecting terminal of the flexible circuit board and the residual electrode layer 2132, thereby ensuring the normal display effect.

Referring to fig. 8, optionally, the first insulating portion 2321 includes a first sub-insulating portion 2321a and a second sub-insulating portion 2321b connected to the first sub-insulating portion 2321a, the first sub-insulating portion 2321a is located on the setting side 2121 of the planarization layer 212, the second sub-insulating portion 2321b is located on the same side of the driving circuit layer 211 as the planarization layer 212, and the second sub-insulating portion 2321b is located on a side of the setting side 2121 away from the display area AA.

Specifically, when the electrode layer 213 is etched, the electrode layer 213 is likely to remain at a position in contact with the set side surface 2121. In this embodiment, by providing the first insulating portion 2321 including the first sub-insulating portion 2321a and the second sub-insulating portion 2321b, the first sub-insulating portion 2321a is located on the setting side 2121 of the planarization layer 212, so that the contact between the connection terminal of the flexible wiring board and the residual electrode layer 2132 at the setting side 2121 is reduced. The second sub-insulating part 2321b is located at a side of the setting side 2121 away from the display area AA, so that the residual electrode layer 2132 at a position where the side of the setting side 2121 away from the display area AA is connected with the setting side 2121 can be covered by the second sub-insulating part 2321b, accordingly, contact between the connection terminal of the flexible circuit board and the residual electrode layer 2132 at a position where the side of the setting side 2121 away from the display area AA is connected with the setting side 2121 is reduced, and further, the probability of short circuit between adjacent bonding terminals 220 is further reduced.

With continued reference to fig. 8, optionally, a dimension of a perpendicular projection of the first sub-insulating part 2321a on the driving circuit layer 211 in the first direction x is equal to a dimension of a perpendicular projection of the set side 2121 of the planarization layer 212 on the driving circuit layer 211 in the first direction x; further, it is ensured that the first sub-insulating portion 2321a completely covers the corresponding position of the corresponding bonding terminal 220 on the set side surface 2121 in the first direction x, and further that the connection terminal of the flexible circuit board cannot contact with the residual electrode layer 2132 at the position corresponding to the bonding terminal 220 in the first direction x on the set side surface 2121, thereby further reducing the probability of short circuit between adjacent bonding terminals 220.

Referring to fig. 9, optionally, the first insulating portion 2321 further includes a third sub-insulating portion 2321c, and the third sub-insulating portion 2321c is connected to the second sub-insulating portion 2321b through the first sub-insulating portion 2321 a.

As described in the above embodiment, the electrode layer 213 is likely to remain even at the position in contact with the setting side surface 2121. In this embodiment, by providing that the first insulating portion 2321 further includes the third sub-insulating portion 2321c, the third sub-insulating part 2321c is disposed on opposite sides of the first insulating part 2321 from the second insulating part 2322, when the size of the perpendicular projection of the first sub-insulating part 2321a on the driving circuit layer 211 in the first direction x is equal to the size of the perpendicular projection of the set side 2121 of the planarization layer 212 on the driving circuit layer 211 in the first direction x, the third sub-insulating part 2321c is located on a surface of the set side 2121 of the planarization layer 212 on a side close to the display area AA, further, it is possible to reduce the possibility that the residual electrode layer 2132 is covered by the third sub-insulating portion 2321c at the position where the display area AA side contacts the setting side surface 2121, reduce the contact between the connection terminal of the flexible wiring board and the residual electrode layer 2132 at the position where the display area AA side contacts the setting side surface 2121, and further reduce the probability of short circuit between adjacent bonding terminals 220.

In the above embodiment, the size of the first insulating portion 2321 and the second insulating portion 2322 in the first direction x is greater than or equal to the size of the residual electrode layer 2132 in the first direction x, so that the first insulating portion 2321 and the second insulating portion 2322 can cover the residual electrode layer 2132 in the first direction x. However, the size of the first insulating portion 2321 and the second insulating portion 2322 in the first direction x does not need to be too large, and alternatively, the size of the first insulating portion 2321 in the first direction x is 1.1 to 1.5 times the size of the residual electrode layer 2132; when the insulating layer includes the second insulating portion 2132, the size of the second insulating portion 2132 is 1.1-1.5 times that of the residual electrode layer 2132 in the first direction x, so that a narrow frame of the display module is ensured.

Fig. 10 is a schematic structural diagram of a display panel according to an embodiment of the present invention, and referring to fig. 10, the display panel includes the display module 20 according to any embodiment of the present invention, and further includes a flexible printed circuit 30, where the flexible printed circuit 30 includes a connection terminal 310, and the connection terminal 310 and the bonding terminal 220 are bonded and connected in a one-to-one correspondence manner.

With reference to fig. 10, optionally, at the setting side 2121 of the planarization layer 212, the residual electrode layer 2132 is completely covered by the insulating layer 230 (specifically, the bonding region insulating portion where the insulating layer 230 is located in the bonding region), so as to ensure that the connection terminal 310 of the flexible printed circuit board 30 cannot contact with the residual electrode layer 2132, thereby preventing a short circuit.

The display panel provided by the embodiment includes, by providing the display module, an array substrate and an insulating layer, where the insulating layer is located on a side, away from the driving circuit layer, of the planarization layer of the array substrate, and the insulating layer covers at least part of the set side surface of the planarization layer, and in the first direction, a position, where the set side surface of the insulating layer covers the planarization layer, corresponds to at least the bonding terminal; setting a side surface as the surface of the outermost side of the planarization layer along a first direction, wherein the first direction is a direction in which the display area points to the bonding area; even can be so that position department electrode layer material of settlement side of bonding district planarization layer has the residue, set for the corresponding position department of side and bonding terminal in the first direction, it also can be covered by the insulating layer to remain the electrode layer, and then make flexible line way board and display module group bind when, the probability that connecting terminal and the settlement side position department of planarization layer remained the electrode layer and take place the contact among the flexible line way board reduces, then the probability that remaining electrode layer and bonding terminal take place to be connected reduces, and then reduce the emergence of the short circuit phenomenon between the different bonding terminals of bonding terminal of display module group and flexible line way board bonding, guarantee the good display effect of display module group.

It is to be noted that the foregoing is only illustrative of the preferred embodiments of the present invention and the technical principles employed. It will be understood by those skilled in the art that the present invention is not limited to the particular embodiments described herein, but is capable of various obvious changes, rearrangements and substitutions as will now become apparent to those skilled in the art without departing from the scope of the invention. Therefore, although the present invention has been described in greater detail by the above embodiments, the present invention is not limited to the above embodiments, and may include other equivalent embodiments without departing from the spirit of the present invention, and the scope of the present invention is determined by the scope of the appended claims.