阅读说明：本技术 一种阵列基板、显示面板和阵列基板的修复方法 (Array substrate, display panel and array substrate repairing method ) 是由 王小东 余思慧 于 2020-12-30 设计创作，主要内容包括：本申请公开了一种阵列基板、显示面板和阵列基板的修复方法,所述阵列基板包括第一金属走线；以及位于所述第一金属走线的下方,与所述第一金属走线之间设置有绝缘层的第二金属走线；所述第一金属走线与所述第二金属走线之间具有重叠部,所述重叠部设置有镭射孔；所述镭射孔作为所述第一金属走线和第二金属走线需要短路时的镭射熔接点；镭射孔的设置,提高了有效镭射面积,有利于提高镭射短路质量。(The application discloses an array substrate, a display panel and a repairing method of the array substrate, wherein the array substrate comprises a first metal routing; the second metal routing is positioned below the first metal routing, and an insulating layer is arranged between the second metal routing and the first metal routing; an overlapping part is arranged between the first metal wire and the second metal wire, and the overlapping part is provided with a laser hole; the laser holes are used as laser welding points when the first metal routing and the second metal routing need short circuit; the arrangement of the laser holes improves the effective laser area and is beneficial to improving the laser short circuit quality.)

1. An array substrate, comprising:

a first metal routing; and

the second metal wire is arranged below the first metal wire, and an insulating layer is arranged between the second metal wire and the first metal wire;

the laser wire is characterized in that an overlapping part is arranged between the first metal wire and the second metal wire, and the first metal wire is provided with a laser hole corresponding to the overlapping part;

the laser holes are used as laser welding points when the first metal wiring and the second metal wiring need to be in short circuit.

2. The array substrate of claim 1, wherein the laser hole is located in a middle portion of the first metal trace and penetrates through the first metal trace.

3. The array substrate according to claim 1, wherein at least two first metal traces are disposed and parallel to each other, at least one second metal trace is disposed and perpendicular to and staggered with the first metal traces to form a plurality of overlapping portions, and the overlapping portions are disposed with the laser holes;

at least two of the laser holes are used as laser welding points when the first metal routing and the second metal routing need to be in short circuit.

4. The array substrate according to claim 3, wherein the first metal trace is a data line or a scan line, the second metal trace is a repair line, and a portion of the second metal trace located between two adjacent first metal traces is a preliminary cut point.

5. The array substrate of claim 1, wherein the aperture D of the laser hole and the width W of the first metal trace corresponding to the overlapping portion are in a relationship: d is more than or equal to 0.5W and more than or equal to 0.1W.

6. The array substrate of claim 1, wherein the line width of the first metal trace corresponding to the overlapping portion is wider than the line width of the first metal trace at other positions; the relationship between the line width W of the first metal trace corresponding to the overlapping portion and the line widths W1 of other positions of the first metal trace is as follows: 1.5W1 is more than or equal to W1;

and/or the line width of the second metal routing corresponding to the overlapping portion is wider than the line width of the second metal routing at other positions; the relationship between the line width W2 of the second metal trace corresponding to the overlapping portion and the line widths W3 of the second metal trace at other positions is as follows: 1.5W3 is more than or equal to W2 and more than W3.

7. The array substrate according to claim 1, wherein the first metal trace and the second metal trace are disposed in parallel, the first metal trace has a first protrusion protruding toward the second metal trace, the second metal trace has a second protrusion protruding toward the first metal trace, the first protrusion and the second protrusion overlap between the first metal trace and the second metal trace to form the overlapping portion, and the laser holes are disposed at positions of the first protrusion corresponding to the overlapping portion.

8. The array substrate according to claim 1, wherein the first metal trace and the second metal trace are disposed in parallel, the array substrate further comprises a first reserved portion and a second reserved portion, and the overlapping portion comprises a first overlapping portion, a second overlapping portion and a third overlapping portion; the laser holes comprise a first laser through hole and a second laser through hole; the first reserved part and the second metal wiring are formed on the same layer, and the second reserved part and the first metal wiring are formed on the same layer;

one end of the first reserved portion is partially overlapped with the first metal routing wire to form a first overlapped portion, and the other end of the first reserved portion extends towards the second metal routing wire; one end of the second reserved portion is partially overlapped with the second metal routing wire to form a second overlapped portion, and the other end of the second reserved portion extends towards the first metal routing wire to form a third overlapped portion with the first reserved portion;

the first reserved portion is provided with the first laser through hole corresponding to the first overlapping portion, the first metal routing is provided with the second laser through hole corresponding to the second overlapping portion, and the third overlapping portion is provided with a through hole so as to conduct the first reserved portion and the second reserved portion;

the first laser through hole and the second laser through hole are used as laser welding points when the first metal wire and the second metal wire need to be in short circuit.

9. A display panel comprising the array substrate according to any one of claims 1 to 8 and a color filter substrate in a box-to-box arrangement with the array substrate.

10. A repairing method of an array substrate for repairing the array substrate according to any one of claims 1 to 9, comprising the steps of:

when the first metal routing is detected to be broken, determining the broken position;

selecting a required laser welding point and a required laser cutting point according to the open circuit position;

using a laser welding point to short-circuit the first metal routing and the second metal routing for repairing at the laser welding point;

cutting the second metal wire at the laser cutting point by using the laser to disconnect the first metal wire and the second metal wire at the laser cutting point;

the laser welding points are selected from the laser holes, and the laser cutting points are selected at positions where the second metal routing lines and other metal routing lines are not overlapped.

Technical Field

The application relates to the technical field of display, in particular to an array substrate, a display panel and a repairing method of the array substrate.

Background

With the development and progress of science and technology, science and technology products such as televisions, computers and mobile phones become an essential part of people's lives, and display panels of the science and technology products are undoubtedly very important components of the science and technology products.

Be provided with various metal in the display panel and walk the line, some metal is walked the line and can be formed with overlap portion, when need the short circuit between two metal of having overlap portion walk the line, generally use the laser signal line of radium-shine laser and the overlap portion of function line to switch on both, but during prior art radium-shine, often appear radium-shine quality not good, and lead to not switching on between two metal are walked the line, appear the problem of broken string even.

Disclosure of Invention

The application aims to provide an array substrate, a display panel and a repair method of the array substrate, so that the laser area is increased, and the laser short-circuit quality is improved.

The application discloses array substrate includes:

a first metal routing; the second metal wire is arranged below the first metal wire, and an insulating layer is arranged between the second metal wire and the first metal wire;

an overlapping part is arranged between the first metal wire and the second metal wire, and laser holes are arranged on the first metal wire corresponding to the overlapping part; the laser holes are used as laser welding points when the first metal wiring and the second metal wiring need to be in short circuit.

Optionally, the laser hole is located in the middle of the first metal trace and penetrates through the first metal trace.

Optionally, at least two first metal traces are arranged and are parallel to each other, at least one second metal trace is arranged, the second metal trace is perpendicular to and staggered with the plurality of first metal traces to form a plurality of overlapping portions, and the overlapping portions are provided with the laser holes;

at least two of the laser holes are used as laser welding points when the first metal routing and the second metal routing need to be in short circuit.

Optionally, the first metal wire is a data line or a scan line, the second metal wire is a repair line, and a portion of the second metal wire, which is located between two adjacent first metal wires, is a preparatory cut point;

when the first metal routing wire is broken, the laser holes are used as laser welding points, the prepared cutting points are used as laser cutting points, one part of the second metal routing wire is in short connection with the first metal routing wire so as to repair the broken wire of the first metal routing wire, and the other part of the second metal routing wire is disconnected with the second metal routing wire.

Optionally, the relationship between the aperture D of the laser hole and the width W of the overlapping portion corresponding to the first metal trace is as follows: d is more than or equal to 0.5W and more than or equal to 0.1W.

Optionally, the line width of the first metal trace corresponding to the overlapping portion is wider than the line widths of other positions of the first metal trace;

and/or the line width of the second metal routing corresponding to the overlapping portion is wider than the line width of the second metal routing at other positions.

Optionally, the relationship between the line width W of the first metal trace corresponding to the overlapping portion and the line widths W1 of other positions of the first metal trace is as follows: 1.5W1 is more than or equal to W1;

and/or the relationship between the line width W2 of the overlapping portion corresponding to the second metal trace and the line widths W3 of other positions of the second metal trace is: 1.5W3 is more than or equal to W2 and more than W3.

Optionally, the first metal trace and the second metal trace are arranged in parallel, the first metal trace protrudes towards the second metal trace and is provided with a first protruding portion, the second metal trace protrudes towards the first metal trace and is provided with a second protruding portion, the first protruding portion and the second protruding portion are overlapped between the first metal trace and the second metal trace to form the overlapping portion, and the laser hole is arranged at a position where the first protruding portion corresponds to the overlapping portion.

Optionally, the first metal trace and the second metal trace are arranged in parallel, the array substrate further includes a first reserved portion and a second reserved portion, and the overlapping portion includes a first overlapping portion, a second overlapping portion, and a third overlapping portion; the laser holes comprise a first laser through hole and a second laser through hole; the first reserved part and the second metal wiring are formed on the same layer, and the second reserved part and the first metal wiring are formed on the same layer;

one end of the first reserved portion is partially overlapped with the first metal routing wire to form a first overlapped portion, and the other end of the first reserved portion extends towards the second metal routing wire; one end of the second reserved portion is partially overlapped with the second metal routing wire to form a second overlapped portion, and the other end of the second reserved portion extends towards the first metal routing wire to form a third overlapped portion with the first reserved portion;

the first reserved portion is provided with the first laser through hole corresponding to the first overlapping portion, the first metal routing is provided with the second laser through hole corresponding to the second overlapping portion, and the third overlapping portion is provided with a through hole so as to conduct the first reserved portion and the second reserved portion;

the first laser through hole and the second laser through hole are used as laser welding points when the first metal wire and the second metal wire need to be in short circuit.

The application also discloses a method for repairing the array substrate, which comprises the following steps:

when the first metal routing is detected to be broken, determining the broken position;

selecting a required laser welding point and a required laser cutting point according to the open circuit position;

using a laser welding point to short-circuit the first metal routing and the second metal routing for repairing at the laser welding point;

cutting the second metal wire at the laser cutting point by using the laser to disconnect the first metal wire and the second metal wire at the laser cutting point;

the laser welding points are selected from the laser holes, and the laser cutting points are selected at positions where the second metal routing lines and other metal routing lines are not overlapped.

A scheme of enabling two layers of metal to be conducted by laser relative to a corner (metal climbing position) where a first metal wire and a second metal wire are overlapped through laser; in this application, in two-layer metal, be located the first metal of top and walk to be provided with radium-shine hole on the line, reduced radium-shine the membrane thickness that need puncture and butt fusion, improved production efficiency, and radium-shine hole makes radium-shine area increase of radium-shine laser, and this is favorable to improving the quality of radium-shine short circuit, reduces the problem of not switching on or broken string.

Drawings

The accompanying drawings, which are included to provide a further understanding of the embodiments of the application, are incorporated in and constitute a part of this specification, illustrate embodiments of the application and together with the description serve to explain the principles of the application. It is obvious that the drawings in the following description are only some embodiments of the application, and that for a person skilled in the art, other drawings can be derived from them without inventive effort. In the drawings:

fig. 1 is an exemplary array substrate according to an embodiment of the present disclosure;

fig. 2 is a schematic front layout view of metal traces of an array substrate according to an embodiment of the present disclosure;

fig. 3 is a schematic view illustrating a back layout of metal traces of an array substrate according to an embodiment of the present application;

fig. 4 is a schematic layout view of metal traces of an array substrate arranged in parallel according to an embodiment of the present disclosure;

fig. 5 is a schematic front view of another embodiment of the present application showing metal traces arranged in parallel on an array substrate;

fig. 6 is a schematic view of a back layout of an array substrate according to another embodiment of the present disclosure, in which metal traces are arranged in parallel;

FIG. 7 is a flowchart illustrating a method for repairing an array substrate according to an embodiment of the present disclosure;

fig. 8 is a schematic diagram of a display device according to the present application.

10, a display device; 20. an array substrate; 30. an array substrate; 40. a color film substrate; 100. a first metal routing; 110. lower than the projection; 200. a second metal routing; 210. a second projection; 300. an overlapping portion; 310. a first overlapping portion; 320. a second overlapping portion; 330. a third overlapping portion; 400. laser perforation; 410. a first laser through hole; 420. a second laser through hole; 500. a first reserved portion; 600. and a second reserved portion.

Detailed Description

It is to be understood that the terminology, the specific structural and functional details disclosed herein are for the purpose of describing particular embodiments only, and are representative, but that the present application may be embodied in many alternate forms and should not be construed as limited to only the embodiments set forth herein.

In the description of the present application, the terms "first", "second" are used for descriptive purposes only and are not to be construed as indicating relative importance or as implicitly indicating the number of technical features indicated. Thus, unless otherwise specified, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature; "plurality" means two or more. The terms "comprises" and "comprising," and any variations thereof, are intended to cover a non-exclusive inclusion, such that one or more other features, integers, steps, operations, elements, components, and/or combinations thereof may be present or added.

Further, terms of orientation or positional relationship indicated by "center", "lateral", "upper", "lower", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", and the like, are described based on the orientation or relative positional relationship shown in the drawings, are simply for convenience of description of the present application, and do not indicate that the referred device or element must have a specific orientation, be constructed and operated in a specific orientation, and thus, should not be construed as limiting the present application.

Furthermore, unless expressly stated or limited otherwise, the terms "mounted," "connected," and "connected" are to be construed broadly and may include, for example, fixed connections, removable connections, and integral connections; can be mechanically or electrically connected; either directly or indirectly through intervening media, or through both elements. The specific meaning of the above terms in the present application can be understood by those of ordinary skill in the art as appropriate.

In a display panel, a large number of metal wires are arranged, overlapping parts exist among some metal wires, for example, an array substrate is provided with metal wires such as data wires, scanning wires and common wires, and when testing or repairing is performed, the metal wires positioned at two layers are short-circuited (for example, the repairing wire is connected into the broken data wire or scanning wire) through laser and other modes; in some cases, in addition to short-circuiting the two layers of metal traces, it is also necessary to cut off some of the metal traces (for example, when a bright spot occurs in a pixel electrode, the active switch needs to be cut off to disconnect the thin film transistor and the pixel electrode, so as to realize a dark spot).

Fig. 1 is an exemplary array substrate according to an embodiment of the present application, where the array substrate 30 includes a first metal trace 100 and a second metal trace 200, which are arranged in a crossing manner, and generally, corners (i.e., positions of five stars in the figure) of two layers of metal traces are subjected to laser, so as to achieve the purpose of short-circuiting the two layers of metal traces, but there may be problems of a small effective laser area and low laser quality; and if the laser energy is too high, the risk of wire breakage still exists.

In this regard, the inventors of the present application further developed the following scheme:

fig. 2 is a schematic front-side layout view of metal traces of an array substrate according to an embodiment of the present application, and fig. 3 is a schematic back-side layout view of metal traces of an array substrate according to an embodiment of the present application, as shown in fig. 2 and fig. 3, the present application discloses an array substrate, including:

a first metal trace 100; the second metal trace 200 is disposed below the first metal trace 100, and an insulating layer (not shown) is disposed between the second metal trace 200 and the first metal trace 100;

an overlapping portion 300 is formed between the first metal wire 100 and the second metal wire 200, and the first metal wire 100 is provided with a laser hole 400 corresponding to the overlapping portion 300; the laser holes 400 are used as laser welding points when the first metal wire 100 and the second metal wire 200 need to be short-circuited.

A scheme of enabling two layers of metal to be conducted by laser relative to a corner (metal climbing position) where a first metal wire and a second metal wire are overlapped through laser; in this application, in two-layer metal, be located the first metal of top and walk to be provided with radium-shine hole on the line, reduced radium-shine the membrane thickness that need puncture and butt fusion, improved production efficiency, and radium-shine hole makes radium-shine area increase of radium-shine laser, and this is favorable to improving the quality of radium-shine short circuit, reduces the problem of not switching on or broken string.

Specifically, the laser holes 400 are laser through holes, are located in the middle of the first metal trace 100, and penetrate through the first metal trace 100. The setting of radium-shine through-hole for radium-shine laser need not puncture first metal earlier and walks the line when handling radium-shine through-hole department, can directly radium-shine first metal walk the insulating layer between line and the second metal is walked, and radium-shine laser can radium-shine the pore wall of radium-shine through-hole in addition, increases effective radium-shine area, improves radium-shine short circuit quality, and is favorable to reducing the possibility of broken string.

The aperture of the laser through hole 400 can be a structure with a narrow lower part and a wide upper part, and the structure can facilitate laser to hit the hole wall of the laser through hole. The laser through holes 400 can be regular through holes such as diamond through holes or circular through holes, and the regular through holes are uniform in all directions during laser, so that the laser short-circuit effect is facilitated; of course, irregular shapes are also possible, for example, when it is desired to avoid certain structures, the irregular shapes can play their role without too much affecting the laser effect.

Of course, it is also possible that laser hole 400 is a blind hole, which can also reduce the thickness of the film that needs to be punched and welded.

In addition, if there are other film layers above the first metal trace 10, these film layers may also be provided with through holes corresponding to the laser through holes; for example, when the first metal trace 100 is a data line, a film layer such as a passivation layer (not shown in the figure) is further disposed above the first metal trace 100, and the passivation layer may be provided with a through hole corresponding to the laser through hole; so set up, laser can direct radium-shine to the insulating layer to and the pore wall of radium-shine through-hole, effectively reduce radium-shine laser's energy consumption, and the time of radium-shine processing, and can effectively improve radium-shine short circuit's quality.

In the array substrate 30, first metal traces 100 and second metal traces 200 may be arranged in a cross manner, at least two first metal traces 100 are arranged and arranged in parallel to each other, at least one second metal trace 200 is arranged (the number of the first metal traces 100 and the second metal traces 200 is only illustrated and not limited), the second metal traces 200 are respectively perpendicular to and staggered with a plurality of first metal traces 100 to form a plurality of overlapping portions 300, and the overlapping portions 300 are respectively provided with the laser holes 400;

at least two of the laser holes 400 are used as laser welding points when the first metal wire 100 and the second metal wire 200 need to be short-circuited. Taking the first metal wire as the clock signal wire and the second metal wire as the input end (not shown in the figure) connected to the output module in each level of gate driving unit as an example, the clock signal wires to be connected to each level of gate driving unit are different, the first metal wire and the second metal wire may be crossed, and then the second metal wire and the corresponding clock signal wire are laser-shorted by the laser, compared with the connection method through the via hole and the ITO (Indium Tin oxide), because there is no obvious via hole, the film thickness uniformity may be better.

Certainly, the first metal trace and the second metal trace of the present application may also be other signal lines, for example, the first metal trace 100 may be a data line or a gate line, and the second metal trace 200 may be a repair line, at this time, the first metal trace 100 may be above or below the second metal trace 200, as long as it is applicable; of course, the first metal trace and the second metal trace may be other signal lines, and no matter which signal line is used, no matter which trace line is above the first metal trace and the second metal trace, the laser hole is disposed at the metal trace above the laser hole.

Examples are as follows:

the first metal wire 100 is a data line or a scanning line, the second metal wire 200 is a repair line, and the portions of the second metal wire 200, which are located on two adjacent first metal wires 100, are prepared cut points;

when the first metal trace 100 is broken, the laser hole 400 serves as a laser welding point, the prepared cutting point serves as a laser cutting point, a part of the second metal trace 200 is used for short-circuiting with the first metal trace 100, so that the broken line of the first metal trace 100 is repaired, and the other part of the second metal trace 200 is disconnected with the second metal trace 200. The problem of broken lines or short circuits of the data lines or the scanning lines may occur, and if the data lines or the scanning lines are not repaired, the display problems of black lines or bright lines and the like may occur.

In this embodiment, the repair line may also be disposed above, that is, the first metal trace is a repair line, and the second metal trace is a data line or a scan line, which is adjusted according to the panel structure.

In an embodiment, the relationship between the aperture D of the laser hole 400 and the width W of the first metal trace 100 corresponding to the overlapping portion 300 is: d is more than or equal to 0.5W and more than or equal to 0.1W. The laser aperture should not be too little, and too little is difficult to play a role, if too big, laser when handling, may lead to laser welding point department broken string, and this embodiment sets up 0.5W and is more than or equal to D and is more than or equal to 0.1W can guarantee to play the effect of laser welding point, simultaneously, avoids the problem emergence of broken string.

In this embodiment, in order to avoid radium-shine influence metal to walk the resistance of line to and in order to reduce the risk of broken string, have carried out the setting of local increase line width at radium-shine welding point department, promptly: the line width of the first metal trace 100 corresponding to the overlapping portion 300 is wider than the line widths of other positions of the first metal trace 100;

and/or the line width of the second metal trace 200 corresponding to the overlapping portion 300 is wider than the line width of the second metal trace 200 at other positions.

The line width of overlap portion department should not be too big, widens too much, increases the wiring space, causes adjacent metal to walk the line distance too closely moreover easily, and leads to the problem of short circuit, in this embodiment: the relationship between the line width W of the first metal trace 100 corresponding to the overlapping portion 300 and the line widths W1 of other positions of the first metal trace 100 is as follows: 1.5W1 is more than or equal to W1;

and/or the relationship between the line width W2 of the second metal trace 200 corresponding to the overlapping portion 300 and the line width W3 of the second metal trace 200 at other positions is: 1.5W3 is more than or equal to W2 and more than W3.

This application not only is applicable to the condition that first metal was walked line and second metal and is walked line cross arrangement, and it does not have the crisscross condition, specific to be applicable to first metal to walk line and second metal to walk the line equally:

fig. 4 is a schematic layout view of metal traces of an array substrate in parallel arrangement according to an embodiment of the present disclosure, as shown in fig. 4, and as can be seen from fig. 2 and fig. 3, the first metal trace 100 and the second metal trace 200 are arranged in parallel, the first metal trace 100 is provided with a first protrusion 110 protruding towards the second metal trace 200, the second metal trace 200 is provided with a second protrusion 210 protruding towards the first metal trace 100, the first protrusion 110 and the second protrusion 210 are overlapped between the first metal trace 100 and the second metal trace 200 to form the overlapping portion, and the radium perforation 400 is disposed at a position of the first protrusion 110 corresponding to the overlapping portion 300. This embodiment, when needs short circuit, only need radium-shine hole of radium-shine overlap portion department can, simple and convenient. And the position that first bulge is located between first metal is walked line and the overlap portion can regard as first preparation cutting point, and the position that the second bulge is located between second metal is walked line and the overlap portion then can regard as the second to prepare the cutting point, when the connection of first metal of needs disconnection and second metal is walked line, radium-shine first prepare cutting point and second prepare the cutting point can, like this, after the cutting off, hardly influence the resistance of first metal is walked.

The first metal wire 100 may be an alignment circuit wire, the second metal wire 200 may be used as a shorting bar, and when liquid crystal alignment is required, the first metal wire 100 and the second metal wire 200 are communicated to perform alignment operation; after the alignment is completed, when the glass large plate is cut into a plurality of small glass plates, a cutting line (not shown in the figure) can be arranged between the first metal wiring 100 and the second metal wiring 200, so that the laser cutting is not needed, but the first metal wiring and the second metal wiring are disconnected during the cutting, and the laser cutting steps are saved.

For the first metal wire and the second metal wire which are not crossed and arranged on different layers, in addition to the above technical scheme of arranging the protruding part to form the overlapping part, the following design can be made:

fig. 5 is a schematic front layout view of parallel metal traces of another array substrate according to an embodiment of the present disclosure, fig. 6 is a schematic back layout view of parallel metal traces of another array substrate according to an embodiment of the present disclosure, as shown in fig. 5 and fig. 6, and as can be seen from fig. 2 and fig. 3, the first metal trace 100 and the second metal trace 200 are arranged in parallel, the array substrate 30 further includes a first reserved portion 500 and a second reserved portion 600, and the overlapping portion 300 includes a first overlapping portion 310, a second overlapping portion 320, and a third overlapping portion 330; the laser holes 400 comprise a first laser through hole 410 and a second laser through hole 420; the first reserved portion 500 and the second metal trace 200 are formed on the same layer, and the second reserved portion 600 and the first metal trace 100 are formed on the same layer;

one end of the first reserved portion 500 is partially overlapped with the first metal trace 100 to form a first overlapping portion 310, and the other end extends towards the second metal trace 200; one end of the second reserved portion 600 partially overlaps the second metal trace 200 to form a second overlapping portion 320, and the other end extends toward the first metal trace 100 to form a third overlapping portion 330 with the first reserved portion 500;

the first reserved portion 500 is provided with the first laser through hole 410 corresponding to the first overlapping portion 310, the first metal trace 100 is provided with the second laser through hole 420 corresponding to the second overlapping portion 320, and the third overlapping portion 330 is provided with a via hole 700 for communicating the first reserved portion 500 with the second reserved portion 600;

the first laser through hole 410 and the second laser through hole 420 are used as laser welding points when the first metal trace 100 and the second metal trace 200 need to be short-circuited.

Wherein a portion of the first reserved portion 500 between the first overlapping portion 310 and the third overlapping portion 320 is a first cutting point, and a portion of the second reserved portion 600 between the second overlapping portion 320 and the third overlapping portion 330 is a second cutting point;

the first cutting point and the second cutting point are used as laser cutting points when the first metal wire 100 and the second metal wire 200 which are laser-conducted need to be cut off, so as to cut off the connection between the first metal wire 100 and the second metal wire 200. When first metal of needs short circuit is walked line and second metal and is walked the line, radium-shine first radium-shine through-hole of radium-shine and second radium-shine through-hole can, and when the first metal of needs disconnection is walked the connection of line and second metal and is walked the line, then can radium-shine first breakpoint and second breakpoint.

In addition to the improvement of the array substrate 30, the repair method of the array substrate of the present application is also changed, and the laser welding point is no longer the corner position of the two crossed metal traces, but is a laser hole located at the first metal trace, specifically:

fig. 7 is a flowchart of a repairing method of an array substrate according to an embodiment of the present disclosure, and as shown in fig. 7, the present disclosure further discloses a repairing method of an array substrate, which is used for repairing any one of the display panels disclosed in the present disclosure, and the repairing method includes the steps of:

s1, when the first metal wire is detected to be broken, the broken position is determined;

s2, selecting the needed laser welding point and laser cutting point according to the open circuit position;

s3, using the laser welding point to short-circuit the first metal trace and the second metal trace for repair at the laser welding point;

s4, cutting the second metal wire at the laser cutting point to disconnect the first metal wire and the second metal wire at the laser cutting point;

the laser welding points are selected from the laser holes, and the laser cutting points are selected at positions where the second metal routing lines and other metal routing lines are not overlapped.

A scheme of enabling two layers of metal to be conducted by laser relative to a corner (metal climbing position) where a first metal wire and a second metal wire are overlapped through laser; in this application, in two-layer metal, be located the first metal of top and walk to be provided with radium-shine hole on the line, reduced the membrane thickness that radium-shine needs to puncture, and radium-shine hole makes the radium-shine area increase of radium-shine laser, and this is favorable to improving the quality of radium-shine short circuit, reduces the problem of not switching on or broken string. The first metal wire may be a data line or a scan line, and the second metal wire may be a repair line, or of course, the first metal wire and the second metal wire may also be other signal lines.

Fig. 8 is a schematic view of a display device according to the present application, and as shown in fig. 8, the present application discloses a display device 10, where the display device 10 includes a display panel 20, and the display panel 20 includes an array substrate 30 and a color filter substrate 40 arranged in a box-to-box manner with the array substrate 30.

Certainly, in the present application, the improved laser holes and the arrangement structure between the double-layer metal traces are not limited to the metal traces applied to the array substrate; the method can also be applied to positions such as short-circuit strips for testing, color film substrates and the like as long as the method is applicable; in addition, the laser hole structure can be arranged between the metal wiring and the transparent conductive layer (ITO) besides the overlapping part between the first metal wiring and the second metal wiring.

It should be noted that, the limitations of each step involved in the present solution are not considered to limit the order of the steps on the premise of not affecting the implementation of the specific solution, and the steps written in the foregoing may be executed first, or executed later, or even executed simultaneously, and as long as the present solution can be implemented, all the steps should be considered as belonging to the protection scope of the present application; in addition, in the technical solutions of the embodiments of the present application, other technical features besides the mutually conflicting technical features may be combined and applied.

For example, the improved structure shown in fig. 2 and 3, the improved structure shown in fig. 4, and the improved structure shown in fig. 5 and 6 may be formed on the same array substrate at two or three times, depending on the arrangement of the first metal traces and the second metal traces, where the two metal traces are directly crossed vertically and horizontally, the improved structure shown in fig. 2 and 3 is preferably adopted, and when the two metal traces are arranged in parallel, the improved structure shown in fig. 4, or the improved structure shown in fig. 5 and 6 is adopted.

The technical solution of the present application can be widely applied to manufacturing methods of array substrates of various display panels, such as TN (Twisted Nematic) display panels, IPS (In-Plane Switching) display panels, VA (Vertical Alignment) display panels, MVA (Multi-Domain Vertical Alignment) display panels, and of course, other types of display panels, such as OLED (Organic Light-Emitting Diode) display panels, and can be applied to the above solutions.

The technical features of the embodiments described above may be arbitrarily combined, and for the sake of brevity, all possible combinations of the technical features in the embodiments described above are not described, but should be considered as being within the scope of the present specification as long as there is no contradiction between the combinations of the technical features. For those skilled in the art to which the present application pertains, several simple deductions or substitutions may be made without departing from the concept of the present application, and all should be considered as belonging to the protection scope of the present application.