阅读说明：本技术 注射成型机及模具安装板 (Injection molding machine and mold mounting plate ) 是由 森谷知宽 上远野智祐 于 2020-02-27 设计创作，主要内容包括：本发明提供一种能够容易且有效地测定模具装置的温度的注射成型机及模具安装板。该发明的注射成型机为安装有模具装置(101)且向模具装置(101)内注射成型材料而进行成型的注射成型机(1),其具备测定模具装置(101)的温度的温度传感器(51)。(The invention provides an injection molding machine and a mold mounting plate capable of easily and effectively measuring the temperature of a mold device. The injection molding machine (1) is provided with a mold device (101) and performs molding by injecting a molding material into the mold device (101), and is provided with a temperature sensor (51) for measuring the temperature of the mold device (101).)

1. An injection molding machine, which is equipped with a mold device and performs molding by injecting molding material into the mold device,

the injection molding machine is provided with a temperature sensor for measuring the temperature of the mold device.

2. The injection molding machine according to claim 1,

the temperature sensor is used for measuring the temperature of the outer surface of the die device.

3. The injection molding machine according to claim 1 or 2, comprising:

a mold contact portion that contacts an outer surface of the mold device in a state where the mold device is mounted,

the temperature sensor is provided at the mold contact portion.

4. The injection molding machine according to claim 3, comprising:

a mold clamping device includes a pair of platens which are present to sandwich a mold device from both sides.

5. The injection molding machine according to claim 4,

the platen has a mold mounting face for mounting a mold apparatus, the mold contacting portion being the mold mounting face of at least one of the platens.

6. The injection molding machine according to claim 4, comprising:

a mold mounting plate interposed between the mold device and the platen,

the mold mounting plate has a mold mounting surface on which a mold device is mounted, and the mold contact portion is the mold mounting surface of the mold mounting plate.

7. The injection molding machine according to claim 5 or 6,

the mold mounting surface has a recess recessed from the mold mounting surface, and the temperature sensor is disposed in the recess.

8. The injection molding machine according to claim 7,

the temperature sensor comprises a contact temperature sensor,

the platen or the mold mounting plate has a sensor pressing mechanism that presses the contact temperature sensor in the recess against an outer surface of the mold device.

9. The injection molding machine according to any one of claims 1 to 8, configured to control an injection molding operation in accordance with a temperature of the mold device measured by the temperature sensor.

10. The injection molding machine according to claim 9, which determines whether a temperature of a mold device is in a stable state or an unstable state based on the temperature of the mold device measured by the temperature sensor,

when a determination result that the temperature of the mold apparatus is in a steady state is obtained, injection of the molding material into the mold apparatus is started.

11. A mold mounting plate for an injection molding machine, which is interposed between a platen of a mold clamping device and a mold device of the injection molding machine,

the mold mounting plate has a temperature sensor for measuring the temperature of the mold device.

12. The mold mounting plate of claim 11,

the temperature sensor is used for measuring the temperature of the outer surface of the die device.

13. The mold mounting plate according to claim 11 or 12, having a mold mounting surface on which a mold device is mounted, the temperature sensor being provided on the mold mounting surface.

14. The mold mounting plate of claim 13,

the mold mounting surface has a recess recessed from the mold mounting surface, and the temperature sensor is disposed in the recess.

15. The mold mounting plate of claim 14,

the temperature sensor comprises a contact temperature sensor,

the mold mounting plate has a sensor pressing mechanism that presses the contact temperature sensor in the recess against an outer surface of the mold device.

Technical Field

The present application claims priority based on japanese patent application No. 2019-053864, applied on 3/20/2019. The entire contents of this Japanese application are incorporated by reference into this specification.

The present invention relates to an injection molding machine and a mold mounting plate to which a mold device is attached and which performs injection molding using the mold device, and particularly provides a technique related to measurement, monitoring, or control of the temperature of the mold device.

Background

In order to obtain a molded product by injection molding, a molding material such as a resin material is injected into a mold device in a state where the mold device is mounted on an injection molding machine, and then the molding material is solidified by cooling the mold device.

Here, the mold apparatus is generally provided with a temperature controller such as an internal flow path for circulating water, oil, or other liquid, or a built-in heater. This enables the temperature of the mold apparatus to be maintained constant during injection molding.

In view of improving the quality of molded products and preventing a decrease in yield due to the occurrence of defective products, it is very important to appropriately control the temperature of the mold apparatus during injection molding.

As for a temperature regulator of a mold device, patent document 1 describes "a mold temperature regulating device that is controlled by an injection molding machine main body and regulates a temperature of a mold of an injection molding machine, the mold temperature regulating device including: a setting mechanism which is provided with a driving part of a mold temperature adjusting device for adjusting the temperature of the mold by circulating a heat medium to the mold and a temperature sensor for detecting the temperature of the heat medium flowing out of the mold, and sets the temperature of the mold and the allowable minimum/maximum temperature for a control part for controlling the injection molding machine main body; a temperature control means for reading a temperature detected by the temperature sensor and driving a driving unit of the mold temperature control device to control a mold temperature to a set temperature; and an abnormality determination means for determining whether or not the temperature detected by the temperature sensor is within an allowable minimum/maximum temperature range, and outputting an abnormality signal if the detected temperature is out of the allowable minimum/maximum temperature range, and stopping the operation of the injection molding machine main body and the drive unit of the mold temperature adjustment device by the control unit if the detected abnormality signal is detected.

Patent document 1 teaches that a "temperature sensor for detecting the temperature of the heat medium flowing out of the die" is provided.

Patent document 2 describes "a molded article takeout machine that takes out a molded article by moving and controlling a chuck device provided with a chuck member for holding the molded article between molds attached to a molding machine and a release position where the chuck device is separated from the molds, wherein the chuck device is provided with a temperature detector, and when the chuck device approaches the mold holding the molded article during a takeout operation of the molded article, the temperature detector allows detection of a mold surface temperature.

Patent document 3 relates to a technique for detecting the temperature of a molten resin. Fig. 1 of patent document 3 shows that "the resin temperature detection sensor is attached to the cylinder head 12, the nozzle 13, and the mold cavity 14".

Patent document 1: japanese examined patent publication (Kokoku) No. 6-22837

Patent document 2: japanese patent laid-open publication No. 2002-240119

Patent document 3: japanese examined patent publication (Kokoku) No. 2-42339

However, in order to achieve more accurate control of the temperature of the mold apparatus and the like, it is effective to acquire temperature information of the mold apparatus.

In this case, it is conceivable to provide a thermocouple or the like in the mold device. However, if a thermocouple is provided in the mold apparatus, wiring of the thermocouple and wiring extending from the thermocouple in the injection molding machine becomes complicated when the mold apparatus is mounted on the injection molding machine. In addition, in this case, it is necessary to secure a space for arranging the thermocouple and the wiring of the mold apparatus in the injection molding machine.

Alternatively, the worker can measure the temperature by contacting the temperature sensor with the outer surface of the mold device by himself, but this not only increases the manual work, but also has a problem in measurement accuracy including the occurrence of variation in measurement results.

Patent document 2 describes that a "temperature detector" is provided in a "chuck device" of a "molded article takeout machine". The "molded article take-out machine" may be generally provided as a separate device from the injection molding machine. The "chuck device" is located close to the mold device so that the molded article is taken out of the chuck device after the molded article is molded in the mold device. In the "temperature detector" provided in the "chuck device" of the "molded article takeout machine", it is difficult to say that the temperature of the mold device can be always measured easily at an arbitrary timing such as before the injection of the molding material by the injection molding machine.

Disclosure of Invention

The present invention has been made to solve the above-described problems, and an object thereof is to provide an injection molding machine and a mold mounting plate that can easily and efficiently measure the temperature of a mold device.

An injection molding machine that has a mold device mounted thereon and injects a molding material into the mold device to perform molding, the injection molding machine including a temperature sensor that measures a temperature of the mold device.

Further, a mold mounting plate for solving the above problems is used in an injection molding machine and interposed between a platen of a mold clamping device provided in the injection molding machine and the mold device, and has a temperature sensor for measuring a temperature of the mold device.

Effects of the invention

According to the injection molding machine and the mold mounting plate, since the injection molding machine or the mold mounting plate to which the mold device is mounted is provided with the temperature sensor, the temperature of the mold device can be easily and efficiently measured by the temperature sensor.

Drawings

Fig. 1 is a partial cross-sectional view in the cylinder axis direction showing an injection molding machine according to an embodiment of the present invention together with a mold device attached to the injection molding machine.

Fig. 2 is a front view of one platen of the mold clamping device provided in the injection molding machine of fig. 1.

Fig. 3 is a front view of another platen of the mold clamping device provided in the injection molding machine of fig. 1.

Fig. 4 is an enlarged cross-sectional view taken along line IV-IV in fig. 2, showing a temperature sensor provided in the injection molding machine of fig. 1.

Fig. 5 is a cross-sectional view similar to fig. 4 showing a temperature sensor provided in an injection molding machine according to another embodiment.

Fig. 6 is a sectional view showing a mold mounting plate that can be provided in an injection molding machine, in a cylinder axis direction of a portion near the mold, and a front view of the mold mounting plate.

Fig. 7 is an enlarged sectional view taken along line VII-VII of fig. 6 (b).

Fig. 8 is a cross-sectional view showing a cylinder axial direction of a portion in the vicinity of a mold including a temperature sensor provided in an injection molding machine according to still another embodiment.

Fig. 9 is a sectional view similar to fig. 8 showing another arrangement example of the temperature sensor.

Fig. 10 is a cross-sectional view similar to fig. 8 showing still another arrangement example of the temperature sensor.

Fig. 11 is a sectional view similar to fig. 8 showing still another arrangement example of the temperature sensor.

In the figure: 1-injection molding machine, 11-injection device, 12-cylinder, 12 a-supply port, 12 b-nozzle, 12 c-cooler, 13-screw, 13 a-reverse flow prevention ring, 14-heater, 14 a-temperature detector, 15-motor box, 21-moving device, 22-hydraulic pump, 23-pump working motor, 24-hydraulic cylinder, 25-slide base, 26-linear guide, 31-clamping device, 32-platen, 32 a-fixed platen, 32 b-movable platen, 32 c-connecting rod, 32d, 32 e-through hole, 33-platen running mechanism, 34-back platen, 35-clamping motor, 36-motion conversion mechanism, 36 a-screw shaft, 36 b-nut, 37-toggle mechanism, 37 a-37 c-link, 37 d-crosshead, 38-die thickness adjusting motor, 41-ejector, 42-ejector rod, 43-rod drive source, 45-cover member, 51-temperature sensor, 51 a-wiring, 52, 72-recess, 52a, 72 a-deep, 52b, 72 b-opening, 53, 73-sensor pressing mechanism, 54, 74-slip ring, 54 a-stationary ring, 55a, 65, 75-annular cover member, 71-die mounting plate, 71 a-through hole, 101-die device, 102-stationary die, 103-movable die, 104-movable member, Fr-frame, Sm-outer surface of die device, the mold mounting surfaces of the SPa and SPb-platens, the mold mounting surface of the SB-mold mounting plate, the PL-parting line.

Detailed Description

Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings.

(injection molding machine)

For example, as shown in fig. 1, an injection molding machine 1 according to an embodiment of the present invention is equipped with a mold apparatus 101 having a cavity corresponding to the shape of a molded product to be manufactured by the injection molding machine 1, and injection molding is performed using the mold apparatus 101.

In injection molding by the injection molding machine 1, a resin material such as a thermoplastic resin or another molding material is injected in a molten state into a cavity formed in the mold apparatus 101 in a state where the mold apparatus 101 is attached to the injection molding machine 1. Subsequently, the molding material is cooled and solidified in the mold apparatus 101. Thereby, a molded product is formed in the mold apparatus 101. Then, the molded article is taken out of the mold apparatus 101, thereby manufacturing a molded article having a predetermined shape corresponding to the cavity in the mold apparatus 101.

In the illustrated embodiment, the injection molding machine 1 mainly includes: an injection device 11 that melts the molding material by rotation and forward movement of a screw 13 inside a cylinder 12 and injects the molding material into a mold device 101; a moving device 21 that displaces the injection device 11 forward/backward with respect to the mold device 101; a mold clamping device 31 for opening and closing the mold device 101 between a mold clamping state and a mold opening state; and an ejector 41 for ejecting the molded product from the mold apparatus 101 in the mold opened state. A cover member 45 covering substantially all of the mold clamping device 31, the ejector 41, and the injection device 11 may be provided around the same. The details of each device provided in the injection molding machine 1 will be described later.

The mold apparatus 101 used in the injection molding machine 1 has, for example: a fixed mold 102 and a movable mold 103 which form a cavity in an inner region in a clamped state; and a movable member 104 such as an ejector pin that extrudes the molded product by displacement of the ejector 41. The mold apparatus 101 may be referred to as a 2-Plate mold divided mainly into two of the fixed mold 102 and the movable mold 103, but may be a 3-Plate mold further divided into three by having a slide mold, a slide core, or a push Plate (slider Plate). The mold apparatus 101 is appropriately attached to the injection molding machine 1 in accordance with the shape of a molded product to be manufactured, and can be replaced. Here, the mold apparatus 101 is not considered to be a part of the injection molding machine 1.

The mold apparatus 101 is attached to a mold clamping apparatus 31 including a platen 32 that is present from both sides across the mold apparatus 101 in a cylinder axis direction (left-right direction in fig. 1) along a central axis of the cylindrical cylinder 12. The mold clamping device 31 is generally configured to include: a fixed platen 32a as one of the platens fixed with respect to the frame Fr; a movable platen 32b as another platen that is present with the mold device 101 interposed between the stationary platen 32a and the other platen and is movable closer to and away from the stationary platen 32 a; and one or more tie bars 32c having one end mounted to the stationary platen 32 a. The displacement of the movable platen 32b relative to the fixed platen 32a is guided by a guide laid on the frame Fr. The displacement of the movable platen 32b may be guided by the connecting rods 32 c. Here, the fixed die 102 of the die apparatus 101 is attached to the fixed platen 32a and the movable die 103 is attached to the movable platen 32b out of the pair of platens 32a, 32 b.

When a molded article is produced by the injection molding machine 1, a molded article extractor, not shown, may be used in the vicinity of the injection molding machine 1. The molded product takeout machine is a device that receives and holds a molded product from the mold device 101 in the mold opened state and moves the molded product to another position, and is generally recognized as a device independent from the injection molding machine 1. Such a molded article takeout machine is not included in the injection molding machine 1.

An example of a molding process for producing a molded product using the injection molding machine 1 will be described below.

In a state where the molding material is already metered and disposed by a predetermined amount in the cylinder 12 of the injection device 11 in the latter half of the previous molding process, a mold clamping process is performed in which the mold device 101 is closed by using the mold clamping device 31 to bring the mold device 101 into a mold clamped state. Thus, the mold apparatus 101 in the mold-opened state in the take-out step of the previous molding process is brought into the mold-closed state through the mold-closed state.

Next, a filling step of injecting the molding material into the mold apparatus 101 by advancing the screw 13 to fill the cavity in the mold apparatus 101 with the molding material, and a pressure maintaining step of further advancing the screw 13 to maintain the molding material located inside the distal end portion of the cylinder 12 at a predetermined pressure are sequentially performed.

Then, a cooling step of cooling and solidifying the molding material filled in the cavity to obtain a molded product is performed. At this time, a metering step is performed in which the molding material separately charged into the cylinder 12 of the injection device 11 is melted while being conveyed toward the tip end portion of the injection device 11 by the rotation of the screw 13 under heating by the heater 14, and a predetermined amount of the molding material is disposed at the tip end portion.

Then, a removal step is performed in which the mold clamping device 31 is operated to open the mold device 101 to a mold open state, and the ejector device 41 moves the movable member 104 to remove the molded article from the mold device 101.

The operations of the injection molding machine 1 and the mold apparatus 101 performed through a series of steps in the molding process are collectively referred to as an injection molding operation.

(temperature sensor)

For example, in the case of injection molding, a temperature controller may be provided in the mold apparatus 101 in order to maintain the mold apparatus 101 at a constant temperature. Specific examples of the temperature regulator include an internal flow path for circulating a liquid formed to extend inside the mold apparatus 101 except for the cavity, and a heater built in the mold apparatus 101.

In adjusting the temperature of the mold apparatus 101, it is sometimes desirable to acquire temperature information of the mold apparatus 101, for example, temperature information of the outer surface Sm of the mold apparatus 101, from the viewpoints of improving the quality of molded products, shortening molding cycles, and the like. Further, any abnormality in the injection molding operation or the like may be detected from the temperature of the outer surface Sm or the like of the mold apparatus 101.

Therefore, in this embodiment, the injection molding machine 1 is provided with a temperature sensor for measuring the temperature of the mold device 101. It is also conceivable to measure the temperature of the inside or inner surface of the mold apparatus 101 by a temperature sensor, but from the viewpoint of practical use, it is preferable to use a temperature sensor for measuring the temperature of the outer surface Sm of the mold apparatus 101. In many cases, the outer surface Sm of the mold apparatus 101 corresponds to the outer surface exposed to the outside of the fixed mold 102 and the movable mold 103 in a state where the mold apparatus 101 is closed and the fixed mold 102 and the movable mold 103 are brought into close contact with each other. The outer surface Sm of the mold device 101 includes the surface portions of the fixed mold 102 and the movable mold 103 that contact the platen 32 and the surface portions that face the periphery of the cover member 45 and the frame Fr.

By providing the injection molding machine 1 itself with a temperature sensor for measuring the temperature of the mold apparatus 101, the wiring of the temperature sensor can be attached to an appropriate position in the injection molding machine 1. Therefore, in this case, as described above, the problem of the wiring and the space for wiring and the like does not occur when such a temperature sensor is installed in the mold apparatus 101 attached to and detached from the injection molding machine 1.

Further, since the injection molding machine 1 can acquire the temperature information of the mold device 101 by providing the injection molding machine 1 itself with the temperature sensor for measuring the temperature of the mold device 101, it is easy to link with the control of the molding operation.

In addition, since the temperature of the mold apparatus 101 can be detected by the temperature sensor provided in the injection molding machine 1, the workload of the worker can be reduced, and the variation in the measurement result to such an extent as in the case of manual operation does not occur.

When a temperature sensor for measuring the temperature of the outer surface Sm of the mold apparatus 101 is provided, the temperature sensor can be disposed at various positions outside the mold apparatus 101 in the injection molding machine 1 as long as the temperature of the outer surface Sm can be measured. However, the temperature sensor depends on the type of contact or noncontact, and is desirably disposed as close as possible to the die apparatus 101 from the viewpoint of improving the measurement accuracy. Preferably, in a state where the mold apparatus 101 is mounted, a temperature sensor is provided at a mold contact portion that contacts the outer surface Sm of the mold apparatus 101.

In this embodiment, as shown in fig. 2 and 3 by front views of the fixed platen 32a and the movable platen 32b, the fixed platen 32a and the movable platen 32b are provided with temperature sensors 51 for measuring the outer surface temperature of the mold apparatus 101, respectively.

More specifically, the fixed platen 32a and the movable platen 32b have, as surfaces facing the mold apparatus 101 (surfaces of the fixed platen 32a and the movable platen 32b facing each other), mold attachment surfaces SPa and SPb to which the mold apparatus 101 is attached, respectively. The temperature sensor 51 is provided on each of the die attachment surfaces SPa and SPb of the fixed platen 32a and the movable platen 32 b. In this case, the mold contact portions are the mold mounting surfaces SPa and SPb of the fixed platen 32a and the movable platen 32 b.

The temperature sensor 51 may be provided on the die attachment surface SPa or SPb of only one of the fixed platen 32a and the movable platen 32b, but is preferably provided on the die attachment surfaces SPa and SPb of both the fixed platen 32a and the movable platen 32b as in the present embodiment. By providing both the fixed platen 32a and the movable platen 32b, the temperature difference between the outer surface Sm of the die apparatus 101 on the fixed platen 32a side and the outer surface Sm on the movable platen 32b side can be grasped.

The position of the temperature sensor 51 on the mold attachment surfaces SPa and SPb is not particularly limited, but in many cases, the temperature sensor 51 is preferably disposed near the centers of the mold attachment surfaces SPa and SPb near the cavity that may be located near the center of the interior of the mold apparatus 101.

As shown in fig. 2, a through-hole 32d is formed in the center of the fixed platen 32a in a front view, and the through-hole 32d is passed when the nozzle 12b of the cylinder 12 of the injection device 11 is inserted and the molding material is injected from the cylinder 12 into the mold device 101. As shown in fig. 3, a through hole 32e for passing an ejector rod 42, which will be described later, of the ejector device 41 is formed in the center of the movable platen 32b in front view.

In this embodiment, in each of the fixed platen 32a and the movable platen 32b, the two temperature sensors 51 are disposed on the die attachment surfaces SPa and SPb on both sides in the width direction (the left-right direction in fig. 2 and 3) that separates the through- holes 32d or 32e so as to be adjacent to the through- holes 32d or 32 e. The width direction is a direction orthogonal to the cylinder axial direction in a plane parallel to the horizontal plane. In addition, other through holes and the like that can be provided in the fixed platen 32a and the movable platen 32b are omitted here for simplification of the drawings and for ease of understanding of the description.

The number of the temperature sensors 51 provided on the fixed platen 32a and/or the movable platen 32b may be one, or three or more. When a plurality of temperature sensors 51 are provided on the respective pressure plates 32a and 32b, they are preferably arranged around the through holes 32d and 32e in the central portion as in the present embodiment. The provision of the plurality of temperature sensors 51 has an advantage in that the temperature at a plurality of different positions of the outer surface Sm of the mold apparatus 101 corresponding to the plurality of temperature sensors 51 can be detected, and the temperature distribution or deviation of the outer surface Sm can be grasped.

As shown in the sectional view of fig. 4, a recessed portion 52 recessed from the die attachment surface SPa may be provided on the die attachment surface SPa of the fixed platen 32 a. The temperature sensor 51 can be disposed in the recess 52.

In this example, the temperature sensor 51 is a contact temperature sensor such as a thermocouple having a substantially cylindrical housing. The rear end portion of the temperature sensor 51 is located on the deep portion 52a side (right side in fig. 4) deep in the recess 52, and the front end portion is located on the opening 52b side (left side in fig. 4) of the recess 52, and is disposed in a direction substantially extending in the depth direction of the recess 52. An elastic member such as a coil spring that biases the temperature sensor 51 in a direction in which the distal end portion thereof protrudes from the opening 52b is disposed as the sensor pressing mechanism 53 in the deep portion 52a of the recess 52. The wiring 51a of the temperature sensor 51 can be connected to a power supply, not shown, via a channel or the like provided in the deepest portion located deeper than the deep portion 52a in the recess 52.

In a state where the fixed mold 102 of the mold apparatus 101 is not mounted on the fixed platen 32a, as shown in fig. 4(a), the temperature sensor 51 arranged in the recess 52 of the mold mounting surface SPa in this manner is positioned by the sensor pressing mechanism 53 at a position where the tip end portion slightly protrudes outward from the opening 52b of the recess 52.

On the other hand, in a state where the fixed mold 102 is attached to the fixed platen 32a, as shown in fig. 4(b), the temperature sensor 51 is press-fitted to the deep portion 52a side in the recess 52 by the outer surface Sm of the fixed mold 102 of the mold apparatus 101 contacting the mold attachment surface SPa of the fixed platen 32 a. At this time, the sensor pressing mechanism 53 such as an elastic member disposed in the deep portion 52a of the recess 52 is compressed between the temperature sensor 51 and the bottom surface of the recess 52 on the deep portion 52a side, thereby urging the temperature sensor 51 outward of the recess 52. Thus, the temperature sensor 51 is pressed against the outer surface Sm of the fixed die 102 of the die apparatus 101, and the contact state between the distal end portion of the temperature sensor 51 and the outer surface Sm of the fixed die 102 is ensured. As a result, the temperature of the outer surface Sm of the die apparatus 101 can be measured with very high accuracy by the temperature sensor 51 which is a contact temperature sensor.

Here, a slip ring 54 is attached around the temperature sensor 51, and when the elastic member of the sensor pressing mechanism 53 is compressed and restored with the attachment and detachment of the mold apparatus 101, the slip ring 54 slides the temperature sensor 51 in an appropriate posture in the recess 52. An annular cover member 55 is provided at the opening 52b of the recess 52, and the annular cover member 55 covers the opening 52b while allowing the distal end portion of the temperature sensor 51 to protrude from the opening 52 b. When the sensor pressing mechanism 53 shown in fig. 4(a) is restored, the slide ring 54 around the temperature sensor 51 abuts against the annular cover member 55 of the opening 52b of the recess 52 to prevent the temperature sensor 51 from excessively protruding from or falling off from the recess 52.

Although not shown in the drawings, the sensor pressing mechanism may be a sensor pressing mechanism based on electric power or other motive power such as a motor or an actuator, in addition to the sensor pressing mechanism based on the elastic member such as the coil spring.

When the temperature sensor 51 is disposed in the recess 52 of the mold mounting surface SPa as a non-contact temperature sensor such as a radiation temperature sensor, the sensor pressing mechanism may be omitted. For example, as shown in fig. 5, in a state where the fixed mold 102 of the mold apparatus 101 is attached to the fixed platen 32a, the temperature sensor 51 is fixed and disposed in the recess 52 by a stationary ring 54a or the like provided therearound so that the distal end portion of the noncontact-type temperature sensor 51 is positioned slightly apart from the outer surface Sm of the fixed mold 102. Here, the annular cover member 55a may have an inner diameter to an extent that does not interfere with the measurement of the temperature of the outer surface Sm of the temperature sensor 51 such as a radiation temperature sensor. The wiring 51a of the temperature sensor 51 and the like may be the same as those described above with reference to fig. 4.

When the temperature sensor 51 is provided on the die attachment surface SPb of the movable platen 32b, the same configuration as that of the fixed platen 32a described above may be adopted. On the movable platen 32b side, substantially the same concave portion can be formed on the die attachment surface SPb. In such a recess, the temperature sensor 51 can be disposed inside together with the sensor pressing mechanism 53 as described above as needed, and the annular cover member 65 can be attached to the opening portion.

However, as shown in fig. 6(a), the injection molding machine 1 may further include a mold mounting plate 71 disposed between the mold device 101 and the platens 32a, 32 b. The die attachment Plate 71, which may also be called an Adapter Plate (or the like), is used for the purpose of uniformizing the temperature distribution of the die apparatus 101, realizing the precise opening and closing operation of the die apparatus 101, or the like, and there is also a die attachment Plate 71 provided with a temperature adjusting function such as a flow path. In the illustrated example, two mold mounting plates 71 are provided between the fixed platen 32a and the fixed mold 102 and between the movable platen 32b and the movable mold 103, respectively. However, there may be a case where only one mold mounting plate 71 is disposed between the fixed platen 32a and the fixed mold 102 or between the movable platen 32b and the movable mold 103.

In this case, the mold contact portion described above serves as a mold mounting surface SB of the mold mounting plate 71 to which the mold device 101 is mounted. Here, as shown in fig. 6(b), the temperature sensor 51 is provided on the mold mounting surface SB of the mold mounting plate 71. More specifically, two temperature sensors 51 are attached to the die attachment surface SB of the die attachment plate 71 on both sides in the width direction so as to be adjacent to the through-hole 71a provided in the center portion of the die attachment plate 71.

The temperature sensor 51 can be disposed on the mold mounting surface SB of the mold mounting plate 71 substantially in the same manner as in the case where the temperature sensor 51 is provided on the mold mounting surface SPa of the fixed platen 32a described above with reference to fig. 2, 4, and 5. That is, for example, as shown in fig. 7, the temperature sensor 51 may be disposed in a recess 72 formed in the mold mounting surface SB of the mold mounting plate 71. Here, if necessary, a sensor pressing mechanism 73 such as an elastic member or a motor for pressing the temperature sensor 51 in the recess 72 against the outer surface Sm of the die apparatus 101 may be provided in the deep portion 72a in the recess 72. In addition to the slide ring 74 being able to be attached to the temperature sensor 51 in the recess 72, an annular cover member 75 may be provided at the opening 72b of the recess 72. When the temperature sensor 51 is disposed in the recess 72, the temperature sensor 51 is preferably a contact temperature sensor, but may be a noncontact temperature sensor.

Although not shown in the drawings, for example, a member with a temperature sensor, such as a rod or a plate, extending from the cover member 45, the platen 32, the frame Fr, or the like toward the mold apparatus 101 and coming into contact with the outer surface Sm of the mold apparatus 101 may be provided separately as the mold contact portion.

When the temperature sensor 51 is a noncontact temperature sensor, the temperature sensor 51 is preferably disposed at a position where it is possible to measure the outer surface temperature of the parting line PL near the parting plane of the fixed mold 102 and the movable mold 103 of the mold device 101. For example, when the mold apparatus 101 is preheated before the injection step, the outer surface temperature of the mold apparatus 101, particularly in the vicinity of the parting line PL, may greatly vary. By performing the injection step in a state where the outer surface temperature near the parting line PL of the mold device 101 is stable, a molded product of excellent quality can be easily obtained.

Specifically, the temperature sensor 51 can be disposed at a position illustrated in fig. 8 to 11 in the injection molding machine 1.

In fig. 8, a temperature sensor 51 is disposed on an inner surface of the cover member 45 on the upper side, which substantially surrounds the periphery of the mold apparatus 101 on the parting line PL, so that the tip end portion faces the mold apparatus 101 side, i.e., the lower side. The temperature sensor 51 may be disposed on the inner surface of the cover member 45 of the mold apparatus 101 on the lateral side.

In fig. 9, a temperature sensor 51 is disposed on a surface of the frame Fr substantially immediately below the mold device 101 on the parting line PL.

Fig. 10 is a view in which the temperature sensor 51 is disposed on a connecting rod 32c extending in parallel to the cylinder axis direction substantially around the mold device 101 on the parting line PL.

By disposing the distal end portions of the temperature sensors 51 all toward the die apparatus 101, the temperature of the outer surface Sm of the die apparatus 101 can be measured.

Alternatively, as shown in fig. 11, the temperature sensor 51 may be disposed at a position on the inner surface of the cover member 45, for example, at a position deviated from the parting line PL, such that the tip end thereof faces the vicinity of the parting line PL of the outer surface Sm of the mold device 101.

The injection molding machine 1 including the temperature sensor 51 as described above is preferably configured to control the injection molding operation based on the temperature of the outer surface Sm of the mold apparatus 101 and the like measured by the temperature sensor 51. That is, the injection molding machine 1 is preferably configured to transmit the temperature of the outer surface Sm of the mold apparatus 101 or the like detected by the temperature sensor 51 to the control unit as the temperature information of the mold apparatus 101, and based on the temperature information, the control unit controls the operation of the injection molding machine 1 in at least a part of the series of steps of the molding process.

A specific example of the control is described below, for example: before the injection step, when the mold apparatus 101 is preheated, the temperature of the outer surface Sm of the mold apparatus 101 is continuously measured by the temperature sensor 51, and the measured value obtained thereby is sent to the control unit as needed as temperature information.

When the temperature of the outer surface Sm of the mold apparatus 101 reaches a predetermined temperature and the difference between the predetermined temperature and the measured value falls within a predetermined range continues for a predetermined time, the control unit determines that the temperature of the mold apparatus 101 is in a steady state.

When the determination result that the temperature of the mold apparatus 101 is in the steady state is obtained, the control unit causes the injection device 11 to start the injection of the molding material into the mold apparatus 101.

On the other hand, when the phenomenon that the difference between the predetermined temperature and the measured value falls within the predetermined range does not continue for the predetermined time, the control unit determines that the temperature of the mold apparatus 101 is in an unstable state. In this case, the control unit controls the injection device 11 not to start injection of the molding material into the mold device 101.

In the determination, not only the measurement value by the temperature sensor 51 but also the measurement value by another sensor that measures the temperature of the mold apparatus 101 may be considered.

Further, the heating or cooling operation of the mold apparatus 101 by the temperature regulator of the mold apparatus 101 may be controlled based on the temperature of the outer surface Sm or the like of the mold apparatus 101 measured by the temperature sensor 51. Specifically, the temperature of the outer surface Sm of the mold apparatus 101 measured by the temperature sensor 51 automatically increases or decreases the set temperature of the internal heater of the mold apparatus 101.

(injection device)

The injection device 11 mainly includes: a cylinder 12 such as a cylinder extending toward the die apparatus 101; a screw 13 disposed inside the cylinder 12 so that the cylinder 12 is parallel to the central axis and having a flight provided in a spiral shape around the screw; a band-shaped heater 14 disposed around the periphery of the cylinder 12; and a motor case 15 disposed on the rear side of the cylinder 12 and the screw 13. Although not shown, a metering motor for rotating the screw 13 about the center axis, an injection motor for performing forward and backward displacements of the screw 13 in respective directions of a direction approaching the mold apparatus 101 and a direction separating from the mold apparatus 101, a pressure detection sensor for detecting a pressure applied to the screw 13 from the molding material, and the like are disposed in the motor case 15 in order to fill a predetermined amount of the molding material into the front end portion of the cylinder 12.

Here, the direction in which the clamping unit 31 of the fixed mold 102 to which the mold apparatus 101 is attached is toward the fixed platen 32a is the front side, and the direction away from the fixed platen 32a is the rear side. Therefore, when the injection device 11 is viewed on the right side of the fixed platen 32a in fig. 1, the left direction closer to the fixed platen 32a is the front side, and the right direction farther from the fixed platen 32a is the rear side.

The cylinder 12 is provided with a supply port 12a on the rear side immediately before the motor case 15, and a hopper for feeding the molding material into the cylinder 12 may be attached to the supply port 12 a. Further, a nozzle 12b having a smaller cross-sectional area on the front side thereof is provided at the front end of the cylinder 12 near the die apparatus 101. A cooler 12c that is cooled by water cooling or the like may be provided in the vicinity of the supply port 12 a.

For example, as shown in the drawing, the heater 14 disposed around the cylinder 12 including the nozzle 12b can be divided into a plurality of portions in the cylinder axis direction, and the inside of the cylinder 12 inside each heater portion can be heated to different temperatures. A temperature detector 14a may be provided at each heater portion.

A backflow prevention ring 13a is disposed around a scraping portion provided by locally reducing the outer diameter of the screw 13 on the front end side, and the backflow prevention ring 13a prevents the molding material, which is conveyed to the front side of the screw 13 by being moved forward and backward together with the screw, from flowing backward on the rear side. The backflow prevention ring 13a is displaced forward and backward with respect to the screw 13 by, for example, pressure received from the molding material located on the more forward side or the more rearward side than the backflow prevention ring, thereby allowing only the flow of the molding material from the rearward side toward the forward side.

According to the injection device 11 having such a configuration, the molding material charged into the cylinder 12 from the supply port 12a is conveyed forward in the cylinder 12 while being melted by the rotation of the screw 13 driven by the metering motor under the heating of the heater 14 on the outer peripheral side of the cylinder 12 in the metering step, and fills the front end portion of the cylinder 12. At this time, the screw 13 is moved backward by the injection motor to form a space filled with the molding material at the distal end of the cylinder 12. As described above, the metering step may be performed in the cooling step or the like of the previous molding process.

Then, in the filling step, the screw 13 is advanced and displaced, whereby the molding material at the distal end portion of the cylinder 12 is injected toward the mold apparatus 101 through the nozzle 12 b. In the subsequent pressure holding step, the pressure is applied to the molding material filled in the cavity of the mold device 101 by the molding material remaining at the distal end portion of the cylinder 12. In this case, the molding material that is insufficient in the cavity of the mold apparatus 101 due to cooling shrinkage of the molding material can be replenished.

The injection molding machine 1 is a coaxial screw type injection molding machine, but may be a screw preplasticizing type injection molding machine which is structurally and functionally separated into a plasticizing cylinder and a plasticizing screw, and an injection cylinder and an injection plunger.

(moving device)

The moving device 21 is, for example, a forward/backward driving mechanism provided at a lower portion of the motor case 15 of the injection device 11 and configured to move the injection device 11 forward and backward with respect to the fixed platen 32 a.

Various mechanisms can be used as the forward/backward driving mechanism constituting the traveling device 21, and the illustrated traveling device 21 includes a hydraulic pump 22 such as a hydraulic pump, a pump operation motor 23 based on an electric motor or the like for operating the hydraulic pump 22, and a double-acting hydraulic cylinder 24 for supplying a hydraulic fluid from the hydraulic pump 22 and performing a piston rod extruding/drawing motion in which the tip end is fixed to the fixed platen 32 a.

The moving device 21 further includes: a slide base 25 on which the hydraulic pump 22, the pump operation motor 23, and the hydraulic cylinder 24 are mounted; and a linear guide 26 laid on the frame Fr and guiding the linear movement of the slide base 25. This realizes the forward and backward displacement of the injection device 11 placed on the upper part of the slide base 25.

By moving the injection device 11 away from the mold device 101 and moving the injection device 11 closer to the mold device 101 by the moving device 21, the nozzle 12b of the cylinder 12 of the injection device 11 can be pressed against the nozzle of the mold device 101 at a predetermined pressure.

(mold clamping device)

The mold clamping device 31 moves the movable mold 103 relative to the fixed mold 102 of the mold device 101 to open and close the mold device 101, thereby bringing the mold device 101 into a mold clamping state, a mold closing state, or a mold opening state. The mold clamping device 31 includes: the aforementioned pressure plate 32 including a fixed pressure plate 32a, a movable pressure plate 32b, and a connecting rod 32 c; and a platen operation mechanism 33 for operating the platen 32.

At a position where the movable platen 32b is separated from the fixed platen 32a, the movable mold 103 of the mold apparatus 101 is in an open state in which it is opened from the fixed mold 102. By moving the movable platen 32b closer to the fixed platen 32a from the separated position, the movable mold 103 is closed with respect to the fixed mold 102. When the movable platen 32b is moved closer to the fixed platen 32a, the movable mold 103 is brought into a clamped state in which it is pressed against the fixed mold 102.

In fig. 1, most of the mold clamping device 31 except the fixed platen 32a and the ejector 41 described later are located on the left side of the fixed platen 32a, and therefore, when the most of the mold clamping device 31 and the ejector 41 are viewed, the right direction closer to the fixed platen 32a becomes the front side, and the left direction farther from the fixed platen 32a becomes the rear side.

Further, the platen operation mechanism 33 herein includes: a rear platen 34 disposed on the frame Fr; a mold clamping motor 35 provided on the rear platen 34; a motion conversion mechanism 36 that converts the rotational motion of the mold clamping motor 35 into linear motion in the displacement direction of the movable platen 32 b; and a toggle mechanism 37 for increasing the force transmitted to the motion conversion mechanism 36 and transmitting the force to the movable platen 32 b.

The motion conversion mechanism 36 may be any of various mechanisms that convert rotational motion into linear motion, but in this example, it includes a screw shaft 36a that is rotationally driven by the mold clamping motor 35, and a nut 36b that is screwed to the screw shaft 36 a. The motion conversion mechanism 36 may be a ball screw.

The toggle mechanism 37 for increasing the transmission force from the motion conversion mechanism 36 is formed by connecting a plurality of links 37a to 37c connecting the rear platen 34, the nut 36b, and the movable platen 32b by joints in a swingable manner.

The number and shape of the links and joints can be changed as appropriate, and a pair of link groups composed of links 37a to 37c located at upper and lower positions with the cross head 37d interposed therebetween are connected to a cross head 37d connected to the nut 36b and extending in the upper and lower directions so as to be swingable in the portion shown in fig. 1.

Further, a mold thickness adjusting motor 38 may be provided in the rear platen 34 in addition to the mold clamping motor 35. The die thickness adjusting motor 38 functions to adjust the distance between the fixed platen 32a and the rear platen 34 movably disposed on the frame Fr via the guide rails by applying a rotational driving force to a screw shaft and a nut connected to the extended portion of each connecting rod 32c of the platen 32. Thus, even when the mold apparatus 101 is replaced or the thickness of the mold apparatus 101 is changed due to a temperature change, the mold thickness can be adjusted so that a desired mold clamping force can be applied to the mold apparatus 101. Although not shown in the drawings, the die thickness can be adjusted even when the fixed platen side is movable and the rear platen side is fixed on the frame Fr.

The mold clamping device 31 shown in the figure is a horizontal type mold clamping device in which the moving direction of the movable platen 32b is parallel to the horizontal direction, but may be a vertical type mold clamping device in which the moving direction is vertical.

(Ejection device)

The ejector 41 provided on the movable platen 32b includes: an ejector rod 42 extending through the movable platen 32b and driven to advance and retreat to press a movable member 104 such as an ejector pin of the mold apparatus 101 from the rear side; and a rod driving source 43 including a motion conversion mechanism such as a motor and a ball screw for operating the ejector rod 42.

In the molded product taking-out step, the ejector 41 advances the ejector rod 42 driven by the rod driving source 43 to eject the movable member 104 in the mold device 101, thereby ejecting the molded product from the mold device 101. After the movable member 104 is ejected, the ejector lever 42 can be retracted by the lever drive source 43 to return to the home position.