阅读说明：本技术 一种mlcc湿法工艺的生坯印刷用基板及其制备方法 (Substrate for green body printing of MLCC wet process and preparation method thereof ) 是由 万奕 廖朝俊 黄必相 黄洪喜 穆超 张国荣 杨凯 曾庆毅 张小枫 于 2020-05-25 设计创作，主要内容包括：本发明公开了一种MLCC湿法工艺的生坯印刷用基板及其制备方法,涉及MLCC湿法工艺技术领域。该制备方法包括：采用高分子材料一次注塑成型；其中,高分子材料为加纤聚醚酰亚胺。该方法采用高分子材料一次注塑成型即可得到基板,可有效地简化基板的制备流程,提高制备的效率。同时,该方法采用加纤聚醚酰亚胺该种高分子材料制备基板,通过其耐高温、高刚性、阻燃等优异的性能,使得制备得到的基板具有高轻度、高耐热以及低变形量的优点,从而使得该基板可重复利用,符合环保要求,进而降低生产和制造的成本。该基板通过上述的制备方法制备得到。因此,该基板环保,成本低,具有高轻度、高耐热、低变形量的优点。(The invention discloses a substrate for green body printing of an MLCC (multilayer ceramic capacitor) wet process and a preparation method thereof, and relates to the technical field of the MLCC wet process. The preparation method comprises the following steps: adopting a high polymer material for one-time injection molding; wherein the high molecular material is fiber-added polyetherimide. The method can obtain the substrate by adopting the high polymer material through one-time injection molding, can effectively simplify the preparation process of the substrate and improve the preparation efficiency. Meanwhile, the method adopts the fiber-added polyetherimide polymer material to prepare the substrate, and the prepared substrate has the advantages of high light, high heat resistance and low deformation through the excellent performances of high temperature resistance, high rigidity, flame retardance and the like, so that the substrate can be recycled, the environment-friendly requirement is met, and the production and manufacturing costs are reduced. The substrate is prepared by the preparation method. Therefore, the substrate is environment-friendly, low in cost, high in light degree, high in heat resistance and low in deformation.)

1. A preparation method of a green printing substrate for MLCC wet process is characterized by comprising the following steps:

adopting a high polymer material for one-time injection molding;

wherein the high polymer material is fiber-added polyetherimide.

2. The method for preparing a substrate for green printing of MLCC wet process according to claim 1, wherein the method comprises the steps of:

the fiber-added polyetherimide is one or more of PEI 2310, 2310EPR, 2310F and 2310R.

3. The method for preparing a green printing substrate for MLCC wet process according to claim 1, wherein the step of injection molding comprises:

and (3) sequentially carrying out material drying operation and injection molding operation on the high polymer material.

4. The method for preparing a substrate for green printing of MLCC wet process according to claim 3, wherein the method comprises the steps of:

the material drying operation comprises the step of baking the high polymer material for 4-6 hours at the temperature of 150-180 ℃.

5. The method for preparing a substrate for green printing of MLCC wet process according to claim 3, wherein the method comprises the steps of:

the mold temperature of the injection molding operation is 150-180 ℃, and the injection molding operation specifically comprises the step of dividing the injection molding process into multiple sections, wherein the temperature of the multiple sections in the injection molding process is gradually increased, and the temperature of the nozzle is the highest.

6. The method for preparing a substrate for green printing of MLCC wet process according to claim 5, wherein the method comprises the steps of:

the temperature of the multi-section injection molding process is raised in a step manner.

7. The method for preparing a substrate for green printing of MLCC wet process according to claim 6, wherein the method comprises the steps of:

the injection molding operation comprises four sections of injection molding processes, wherein the temperature of the first section of injection molding process is 340 ℃, the temperature of the second section of injection molding process is 350 ℃, the temperature of the third section of injection molding process is 360 ℃, the temperature of the fourth section of injection molding process is 370 ℃, and the temperature of the injection nozzle is 375 ℃.

8. The method for preparing a substrate for green printing of the MLCC wet process according to any of claims 1 to 7, wherein:

the single substrate is rectangular and is obtained by injection molding of 50-60 g of the high polymer material;

the size of the single substrate is 85-86 mm in length, 85-86 mm in width and 1.8-1.9 mm in height.

9. The method for preparing a substrate for green printing of MLCC wet process according to claim 8, wherein the method comprises the steps of:

the single substrate is obtained by injection molding 55g of the high polymer material;

wherein, the size of the single substrate is 85mm in length, 85mm in width and 1.8mm in height.

10. A green printing substrate for MLCC wet process, characterized in that it is prepared by the method of any one of claims 1 to 9 for preparing a green printing substrate for MLCC wet process.

Technical Field

The invention relates to the technical field of MLCC wet process technology, in particular to a green printing substrate of MLCC wet process technology and a preparation method thereof.

Background

The wet process is used as one of the process methods for manufacturing the MLCC, the advantages of alternate complementary printing of drying and printing are utilized, the defects of internal air holes, sintering delamination cracking and the like of a product can be reduced, the method is particularly suitable for a new generation of high-end chip type special high-voltage MLCC, the product has the characteristics of high voltage resistance, low loss (DF), low Equivalent Series Resistance (ESR) and the like, and the method is widely applied to radio frequency/microwave circuits of various direct current high-voltage circuits, missile systems, airplane radars, navigation systems and the like.

MLCC green body printing is a critical step in a wet process where the release layer of its green body needs to be printed on a substrate, and conventional dry use steel plates and release tapes are not suitable for printing as substrates. In view of this, the invention is particularly proposed.

Disclosure of Invention

The invention aims to provide a preparation method of a green body printing substrate of an MLCC (multilayer ceramic chip carrier) wet process, which can be used for quickly forming to obtain the green body printing substrate of the wet process, is environment-friendly in preparation process and low in cost, and has the advantages of high strength, high heat resistance and low deformation, and the prepared substrate can be recycled.

Another object of the present invention is to provide a green sheet for MLCC wet process, which is prepared by the above method for preparing a green sheet for MLCC wet process. Therefore, the substrate is environment-friendly, low in cost, high in light degree, high in heat resistance and low in deformation.

The invention is realized by the following steps:

in a first aspect, an embodiment provides a method for preparing a substrate for green body printing of a MLCC wet process, including:

adopting a high polymer material for one-time injection molding;

wherein the high molecular material is fiber-added polyetherimide.

In an alternative embodiment, the fiberized polyetherimide is one or more of PEI 2310, 2310EPR, 2310F and 2310R.

In an alternative embodiment, the step of injection molding specifically comprises:

and (3) sequentially carrying out material drying operation and injection molding operation on the high polymer material.

In an optional embodiment, the material drying operation comprises drying the polymer material at 150-180 ℃ for 4-6 h.

In an optional embodiment, the mold temperature of the injection molding operation is 150-180 ℃, and the injection molding operation specifically comprises dividing the injection molding process into a plurality of sections, gradually increasing the temperature of the plurality of sections of the injection molding process, and having the highest nozzle temperature.

In an alternative embodiment, the temperature of the multi-stage injection molding process is increased in a stepwise manner.

In an alternative embodiment, the injection molding operation comprises a four-stage injection molding process, and the temperature of the first stage injection molding process is 340 ℃, the temperature of the second stage injection molding process is 350 ℃, the temperature of the third stage injection molding process is 360 ℃, the temperature of the fourth stage injection molding process is 370 ℃, and the nozzle temperature is 375 ℃.

In an optional embodiment, the single substrate is rectangular and is obtained by injection molding of 50-60 g of a polymer material;

wherein, the size of the single-chip substrate is 85-86 mm in length, 85-86 mm in width and 1.8-1.9 mm in height.

In an alternative embodiment, the monolithic substrate is obtained by injection molding 55g of a polymer material;

wherein, the size of the single substrate is 85mm in length, 85mm in width and 1.8mm in height.

In a second aspect, embodiments provide a green printing substrate for MLCC wet process, which is prepared by the method for preparing a green printing substrate for MLCC wet process according to any one of the foregoing embodiments.

The embodiment of the invention has at least the following beneficial effects:

the embodiment of the invention provides a preparation method of a green body printing substrate of an MLCC wet process, which comprises the following steps: adopting a high polymer material for one-time injection molding; wherein the high molecular material is fiber-added polyetherimide. The method can obtain the substrate by adopting the high polymer material through one-time injection molding, can effectively simplify the preparation process of the substrate and improve the preparation efficiency. Meanwhile, the method adopts the fiber-added polyetherimide polymer material to prepare the substrate, and the prepared substrate has the advantages of high light, high heat resistance and low deformation through the excellent performances of high temperature resistance, high rigidity, flame retardance and the like, so that the substrate can be recycled, the environment-friendly requirement is met, and the production and manufacturing costs are reduced.

The embodiment of the invention also provides a green printing substrate for the MLCC wet process, which is prepared by the preparation method of the green printing substrate for the MLCC wet process. Therefore, the substrate is environment-friendly, low in cost, high in light degree, high in heat resistance and low in deformation.

Drawings

In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings needed to be used in the embodiments will be briefly described below, it should be understood that the following drawings only illustrate some embodiments of the present invention and therefore should not be considered as limiting the scope, and for those skilled in the art, other related drawings can be obtained according to the drawings without inventive efforts.

Fig. 1 is a schematic structural diagram of a substrate under a first viewing angle according to an embodiment of the present invention;

fig. 2 is a schematic structural diagram of a substrate under a second viewing angle according to an embodiment of the present invention.

Icon: 100-a substrate; 101-chamfering; 103-grooves.

Detailed Description

In order to make the objects, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below. The examples, in which specific conditions are not specified, were conducted under conventional conditions or conditions recommended by the manufacturer. The reagents or instruments used are not indicated by the manufacturer, and are all conventional products available commercially.

The features and properties of the present invention are described in further detail below with reference to examples.

The substrate 100 is used as a carrying object in the wet MLCC printing process, loaded from a magazine and introduced into a conveying track of equipment, and ceramic and conductive paint are circularly printed in the equipment to finally form an MLCC green block. In the process, the temperature difference of +/-110 ℃ to-55 ℃ needs to be borne, and the bottom die of the green block has quite high flatness and smoothness. The subsequent cutting process and recycling after circulation are convenient. Accordingly, an embodiment of the present invention provides a method for preparing a green printing substrate 100 for MLCC wet process, including: adopting a high polymer material for one-time injection molding; wherein the high molecular material is fiber-added polyetherimide.

In detail, the method adopts a high polymer material to obtain the substrate 100 through one-time injection molding, so that the preparation process of the substrate 100 can be effectively simplified, and the preparation efficiency is improved. Meanwhile, the method adopts the fiber-added polyetherimide polymer material to prepare the substrate 100, and the prepared substrate 100 has the advantages of high light, high heat resistance and low deformation through the excellent performances of high temperature resistance, high rigidity, flame retardance and the like, so that the substrate 100 can be recycled, the environment-friendly requirement is met, and the production and manufacturing costs are reduced.

The polyetherimide added with fibers has one or more of the marks of PEI 2310, 2310EPR, 2310F and 2310R. Through the use of the fiber-added polyetherimide high polymer materials with the marks, the technical problem that the substrate 100 such as a steel plate or a glass adhesive tape used in a dry process in the prior art cannot be printed can be solved, so that the heat resistance and the low deformation performance of the prepared substrate 100 are more excellent, the product quality after wet printing is ensured, and the defects of internal pores of the product, sintering delamination cracking and the like are effectively reduced. Of course, in other embodiments of the present invention, the number of the polyetherimide with fiber added is not limited to the above-mentioned ones, and can be selected according to the requirement, and the embodiments of the present invention are not limited.

It should be further noted that, in the embodiment of the present invention, the injection molding specifically includes:

and (3) sequentially carrying out material drying operation and injection molding operation on the high polymer material.

In detail, the material drying operation comprises the step of drying the high polymer material for 4-6 hours at the temperature of 150-180 ℃. The polymer material is baked at a high temperature to meet the requirement of injection molding operation, so that the substrate 100 can be obtained by one-step injection molding. Of course, in other embodiments of the present invention, the specific parameters of the material drying operation may also be adjusted according to requirements, and the embodiments of the present invention are not limited.

In detail, the injection molding operation is generally performed on an injection molding apparatus, and the mold temperature of the injection molding operation is generally set to 150 to 180 ℃. Meanwhile, the injection molding operation specifically comprises the steps of dividing the injection molding process into multiple sections, gradually raising the temperature of the multiple sections of injection molding process, and enabling the temperature of the injection nozzle to be the highest. Thereby ensuring the heat resistance and low deformation of the injection molded substrate 100.

Specifically, in the embodiment of the invention, the temperature of the multi-stage injection molding process is increased in a stepped manner. And specifically, the injection molding operation comprises four stages of injection molding processes, wherein the temperature of the first stage of injection molding process is 340 ℃, the temperature of the second stage of injection molding process is 350 ℃, the temperature of the third stage of injection molding process is 360 ℃, the temperature of the fourth stage of injection molding process is 370 ℃, and the temperature of the nozzle is 375 ℃. Injection molding is performed in a stepwise temperature rise manner, and the nozzle temperature is set to be the highest, so that the heat resistance of the molded substrate 100 can be sufficiently ensured. Of course, in other embodiments of the present invention, the temperature of each injection molding process may also be adjusted according to requirements, and the embodiments of the present invention are not limited.

Fig. 1 is a schematic structural diagram of a substrate 100 according to an embodiment of the invention; fig. 2 is a schematic structural diagram of the substrate 100 according to the embodiment of the invention under a second viewing angle. Referring to fig. 1 and 2, in the embodiment of the present invention, the shape of the substrate 100 obtained after injection molding is substantially a cuboid, a groove 103 may be formed on the top surface, the radius of the groove 103 may be set to R1, and the specific value of R1 may be selected according to requirements, so as to meet production requirements, of course, each top corner of the cuboid may also be selected to be a chamfer 101, the radius of the chamfer 101 is R2, and the specific value of R2 may also be adjusted according to requirements on the shape of the substrate 100.

Specifically, when the substrate 100 is injection molded, 50-60 g of polymer material is required for injection molding of the substrate 100 having a length of 85-86 mm, a width of 85-86 mm, and a height of 1.8-1.9 mm. For example, injection molding a substrate 100 having a length of 85mm, a width of 85mm, and a height of 1.8mm requires 55g of a polymer material. The use amount of the polymer material and the selection of the injection molding parameters are strictly controlled, so that the substrate 100 with high light, high heat resistance and low deformation can be obtained. Of course, in other embodiments of the present invention, the length and width dimensions have an error of 0.25, and the height dimensions have an error of 0.05, which can be adjusted and improved according to the processing requirement, and of course, the amount of the polymer material used can also be adjusted according to the size requirement of the substrate 100, which is not limited in the embodiments of the present invention.

It should be noted that in the embodiments of the present invention, the injection-molded cylinder is clean and has no residual low-temperature material, so as to avoid affecting the toughness and appearance of the product. Meanwhile, the specific equipment adopted by injection molding is an alloy screw machine, the alloy screw machine is adopted for rapid molding, the process cannot be interrupted, and all materials need to be beaten at one time. Of course, the molding parameters can be adjusted finely, but the injection temperature cannot be too low, and if the temperature is too low and the product is not fully melted, the product is a defective product, and if the injection temperature is too high, the product is also a defective product.

In addition, an embodiment of the present invention further provides a green printing substrate 100 for a MLCC wet process, and the green printing substrate 100 for the MLCC wet process is prepared by the method for preparing the green printing substrate 100 for the MLCC wet process according to any one of the foregoing embodiments. Therefore, the substrate 100 is environmentally friendly, has a low cost, and has advantages of high light, high heat resistance, and low deformation.

The preparation process is described in detail below with reference to specific examples.