1S1R unit reading control circuit
阅读说明：本技术 一种1s1r单元读控制电路 (1S1R unit reading control circuit ) 是由 雷宇 宋志棠 陈后鹏 于 2019-11-12 设计创作，主要内容包括：本发明公开了一种1S1R单元读控制电路,至少包括：选中单元读控制电路、阵列控制电路、第一低压差线性稳压器、第二低压差线性稳压器、灵敏放大器和1S1R阵列；阵列控制电路、第一低压差线性稳压器和灵敏放大器均与选中单元读控制电路连接；第二低压差线性稳压器和1S1R阵列均与阵列控制电路连接。实现了对选通器件不同状态的不同电压控制,保证了1S1R单元能被正确读取；在选通器件导通时,避免了存储器件两端的高电压,避免了读干扰,降低了功耗。(The invention discloses a 1S1R unit reading control circuit, which at least comprises: the selected cell reading control circuit, the array control circuit, the first low dropout linear regulator, the second low dropout linear regulator, the sense amplifier and the 1S1R array; the array control circuit, the first low dropout linear regulator and the sensitive amplifier are all connected with the reading control circuit of the selected unit; the second low dropout linear regulator and the 1S1R array are both connected with the array control circuit. Different voltage control of different states of the gating device is realized, and the 1S1R cell can be correctly read; when the gating device is conducted, high voltage at two ends of the storage device is avoided, reading interference is avoided, and power consumption is reduced.)
1. A1S 1R cell read control circuit, the 1S1R being a gate tube-resistor, comprising: the selected cell read control circuit comprises a selected cell read control circuit, an array control circuit, a first low dropout linear regulator, a second low dropout linear regulator, a sense amplifier and a 1S1R array, wherein the 1S1R array comprises a plurality of 1S1R cells which are connected with one another;
the array control circuit, the first low dropout regulator and the sense amplifier are all connected with the selected unit read control circuit; the second low dropout linear regulator and the 1S1R array are both connected with the array control circuit;
the selected unit reading control circuit is used for applying different reading operation voltages on the bit line according to different states of the selected unit and generating a reading current signal;
the array control circuit is used for selecting bit lines and word lines, applying a read unselected word line voltage to unselected bit lines and reading an unselected word line voltage to unselected word lines;
the first low dropout regulator is used for providing different reading operation voltages to the reading control circuit of the selected unit;
the second low dropout regulator is used for providing different read-unselected word line voltages and read-unselected bit line voltages to the array control circuit;
and the sensitive amplifier compares the reading current signal with the reading reference current signal and generates a reading signal of the selected memory cell.
2. The 1S1R cell read control circuit of claim 1, wherein the selected cell read control circuit applies a first read operation voltage to a selected bit line during a gate on phase for turning on the 1S1R cell.
3. The 1S1R cell read control circuit of any of claims 1 or 2, wherein the selected cell read control circuit applies a second read operation voltage to a selected bit line during a read phase for generating a selected cell read current signal.
4. The 1S1R cell read control circuit of claim 3, wherein the selected cell read control circuit includes: the device comprises a first transmission gate, a second transmission gate and a clamping tube;
the input end of the first transmission gate is connected with a first reading operation voltage end of the first low dropout regulator, the output end of the first transmission gate is connected with a clamping voltage end, and the control end of the first transmission gate is connected with a first reading control signal end;
the input end of the second transmission gate is connected with a second reading operation voltage section of the first low dropout linear regulator, the output end of the second transmission gate is connected with the clamping voltage end, and the control end of the second transmission gate is connected with a second reading control signal end;
the grid electrode of the clamping tube is connected with the clamping voltage end, the source electrode of the clamping tube is connected with the array control circuit through a first reading bit line, and the drain electrode of the clamping tube is connected with the sensitive amplifier through a second reading bit line end.
5. The 1S1R cell read control circuit of claim 4, wherein the read non-selected word line voltage includes: a first read non-select word line voltage, a second read non-select word line voltage; the read unselected bit line voltage comprises: the first read unselected bit line voltage and the second read unselected bit line voltage.
6. The 1S1R cell read control circuit of claim 5, wherein the first read operation voltage is greater than a sum of a gate threshold voltage and a clamp threshold voltage, and the first read operation voltage is less than a sum of the gate threshold voltage, the clamp threshold voltage, and a memory device threshold voltage.
7. The 1S1R cell read control circuit of claim 6, wherein the first read operation voltage is also less than a sum of the gate transistor threshold voltage, the first read non-select word line voltage, and the clamp transistor threshold voltage.
8. The 1S1R cell read control circuit of claim 7, wherein a voltage value of the first read non-selection word line voltage is equal to two-thirds of the first read operation voltage.
9. The 1S1R cell read control circuit of claim 8, wherein a voltage value of the first read unselected bit line voltage is less than the gate tube threshold voltage.
10. The 1S1R cell read control circuit of claim 9, wherein the voltage value of the first read unselect bit line voltage is equal to two-thirds of the first read operation voltage.
11. The selected cell read control circuit of claim 10, wherein the second read operation voltage is equal to a sum of a gate hold voltage, a read voltage across a memory device, and a clamp threshold voltage, and wherein the second read operation voltage is less than a sum of the gate hold voltage, the memory device threshold voltage, and the clamp threshold voltage.
12. The selected cell read control circuit of claim 11, wherein the second read operating voltage is also less than a sum of the gate tube holding voltage, a second read non-select word line voltage, and the clamp tube threshold voltage.
13. The 1S1R cell read control circuit of claim 12, wherein the voltage value of the second read non-select word line voltage is equal to two-thirds of the second read operating voltage.
14. The 1S1R cell read control circuit of claim 13, wherein a voltage value of the second read unselected bit line voltage is less than the gate tube holding voltage.
15. The 1S1R cell read control circuit of claim 14, wherein the voltage value of the second read unselected bit line voltage is equal to two-thirds of the second read operating voltage.
16. The selected cell read control circuit of claim 15, wherein the first read control signal is between 0 and TonIs high level, so that the 1S1R unit read control circuit outputs the first read operation voltage, 0 represents the start time of the read operation, TonRepresenting the open time of the gate tube.
17. The selected cell read control circuit of claim 16, wherein the second read control signal is at TonAnd the voltage level is high between the end time of the reading operation, so that the 1S1R unit reading control circuit outputs the second reading operation voltage.
Technical Field
The invention relates to the technical field of integrated circuits, in particular to a 1S1R unit reading control circuit.
Background
The planar and three-dimensional 1-gate tube-1-resistance (1S1R) array has great application potential in the fields of high-density storage and neural network calculation. The 1S1R array memory cell is composed of a memory device and a gate tube connected in series. The memory device may use a magnetic memory (MRAM), a resistance change memory (RRAM), a Phase Change Memory (PCM), or the like. The gating device may use OTS, MIEC, etc.
The OTS is a two-way conducting device with high threshold voltage and low holding voltage, long on and off times, etc., and the electrical characteristics and operation method are very different from those of conventional gate transistors such as transistors. When the 1S1R cell is in a read operation, firstly, high voltage is loaded at two ends of the cell, and the holding time is longer than the opening time of the gate tube, so that the OTS is switched from the closed state to the conductive state; the OTS has a low holding voltage in the on state, which raises the voltage across the storage resistor device, causing read disturb and power loss.
Therefore, how to provide a 1S1R cell read control circuit to improve the problems of read disturb and high power consumption of the current 1S1R cell and develop an effective circuit control technique has become a technical issue to be solved by those skilled in the art.
Disclosure of Invention
In order to solve the above technical problem, the present invention discloses a 1S1R cell read control circuit, wherein the 1S1R is a gate transistor-resistor, and comprises: the selected cell read control circuit comprises a selected cell read control circuit, an array control circuit, a first low dropout linear regulator, a second low dropout linear regulator, a sense amplifier and a 1S1R array, wherein the 1S1R array comprises a plurality of 1S1R cells which are connected with one another;
the array control circuit, the first low dropout regulator and the sense amplifier are all connected with the selected unit read control circuit; the second low dropout linear regulator and the 1S1R array are both connected with the array control circuit;
the selected unit reading control circuit is used for applying different reading operation voltages on the bit line according to different states of the selected unit and generating a reading current signal;
the array control circuit is used for selecting bit lines and word lines, applying a read unselected word line voltage to unselected bit lines and reading an unselected word line voltage to unselected word lines;
the first low dropout regulator is used for providing different reading operation voltages to the reading control circuit of the selected unit;
the second low dropout regulator is used for providing different read-unselected word line voltages and read-unselected bit line voltages to the array control circuit;
and the sensitive amplifier compares the reading current signal with the reading reference current signal and generates a reading signal of the selected memory cell.
Further, the selected cell read control circuit applies a first read operation voltage to the selected bit line during the gate on phase for turning on the 1S1R cell.
Furthermore, the selected unit reading control circuit applies a second reading operation voltage to the selected bit line in the reading phase for generating a selected unit reading current signal.
Further, the selected cell read control circuit includes: the device comprises a first transmission gate, a second transmission gate and a clamping tube;
the input end of the first transmission gate is connected with a first reading operation voltage end of the first low dropout regulator, the output end of the first transmission gate is connected with a clamping voltage end, and the control end of the first transmission gate is connected with a first reading control signal end;
the input end of the second transmission gate is connected with a second reading operation voltage section of the first low dropout linear regulator, the output end of the second transmission gate is connected with the clamping voltage end, and the control end of the second transmission gate is connected with a second reading control signal end;
the grid electrode of the clamping tube is connected with the clamping voltage end, the source electrode of the clamping tube is connected with the array control circuit through a first reading bit line, and the drain electrode of the clamping tube is connected with the sensitive amplifier through a second reading bit line end.
Further, the reading the non-selected word line voltage includes: a first read non-select word line voltage, a second read non-select word line voltage; the read unselected bit line voltage comprises: the first read unselected bit line voltage and the second read unselected bit line voltage.
Further, the first read operation voltage is larger than the sum of the threshold voltage of the gating tube and the threshold voltage of the clamping tube, and the first read operation voltage is smaller than the sum of the threshold voltage of the gating tube, the threshold voltage of the clamping tube and the threshold voltage of the storage device.
Further, the first read operation voltage is also smaller than the sum of the gate tube threshold voltage, the first read non-selection word line voltage and the clamping tube threshold voltage.
Further, the voltage value of the first read non-selection word line voltage is equal to two-thirds of the first read operation voltage.
Further, the voltage value of the first read unselected bit line voltage is less than the gate tube threshold voltage.
Further, the voltage value of the first read unselected bit line voltage is equal to two-thirds of the first read operation voltage.
Further, the second read operation voltage is equal to the sum of a gate holding voltage, a reading voltage across the memory device and a clamping tube threshold voltage, and the second read operation voltage is smaller than the sum of the gate holding voltage, the memory device threshold voltage and the clamping tube threshold voltage.
Further, the second read operating voltage is also less than a sum of the gate tube holding voltage, a second read non-select word line voltage, and the clamp tube threshold voltage.
Further, the voltage value of the second read non-select word line voltage is equal to two-thirds of the second read operating voltage.
Further, the voltage value of the second read non-selected bit line voltage is less than the gate tube holding voltage.
Further, the second read unselected bit line voltage has a voltage value equal to two-thirds of the second read operating voltage.
Further, the first read control signal is at a high level between 0 and Ton, so that the 1S1R cell read control circuit outputs the first read operation voltage, 0 represents the start time of the read operation, and Ton represents the turn-on time of the gate tube.
Further, the second read control signal is at a high level between Ton and the end time of the read operation, so that the 1S1R unit read control circuit outputs the second read operation voltage.
The implementation of the invention has the following beneficial effects:
different voltage control of different states of the gating device is realized, and the 1S1R cell can be correctly read;
when the gating device is conducted, high voltage at two ends of the storage device is avoided, reading interference is avoided, and power consumption is reduced.
Drawings
In order to make those skilled in the art better understand the technical solutions in the present application, the technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application, and it is obvious that the described embodiments are only a part of the embodiments of the present application, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.
Fig. 1 is a schematic structural diagram of a 1S1R cell read control circuit according to the present invention;
FIG. 2 is a circuit diagram of a selected cell read control circuit according to the present invention;
FIG. 3 is a circuit diagram of a first LDO of the present invention;
FIG. 4 is a circuit diagram of a sense amplifier according to the present invention;
FIG. 5 is a schematic diagram of a three-dimensional cross-stacked array structure of a 1S1R array according to the present invention;
FIG. 6 is a timing diagram of a selected cell control circuit according to the present invention;
Detailed Description
In order to make those skilled in the art better understand the technical solutions in the present application, the technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application, and it is obvious that the described embodiments are only a part of the embodiments of the present application, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.
It will be understood that when an element is referred to as being "coupled" to another element, it can be directly coupled to the other element or intervening elements may also be present.
Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs. The terminology used herein in the description of the present application is for the purpose of describing particular embodiments only and is not intended to be limiting of the application.
Fig. 1 is a schematic structural diagram of a 1S 1R-unit read control circuit provided in the present invention, and as shown in fig. 1, the present invention provides a 1S 1R-unit read control circuit, where 1S1R is a gate transistor-resistor, and at least includes: the selected cell read control circuit comprises a selected cell read control circuit, an array control circuit, a first low dropout linear regulator, a second low dropout linear regulator, a sense amplifier and a 1S1R array, wherein the 1S1R array comprises a plurality of 1S1R cells which are connected with one another;
the array control circuit, the first low dropout regulator and the sense amplifier are all connected with the selected unit read control circuit; the second low dropout linear regulator and the 1S1R array are both connected with the array control circuit;
the selected unit reading control circuit is used for applying different reading operation voltages on the bit line according to different states of the selected unit and generating a reading current signal;
the array control circuit is used for selecting bit lines and word lines, applying a read unselected word line voltage to unselected bit lines and reading an unselected word line voltage to unselected word lines;
the first low dropout regulator is used for providing different reading operation voltages to the reading control circuit of the selected unit;
the second low dropout regulator is used for providing different read-unselected word line voltages and read-unselected bit line voltages to the array control circuit;
and the sensitive amplifier compares the reading current signal with the reading reference current signal and generates a reading signal of the selected memory cell.
Specifically, as shown in fig. 5, fig. 5 is a schematic diagram of a three-dimensional cross stacked array structure of a 1S1R array according to the present invention, the 1S1R array may adopt a three-dimensional cross stacked array structure, and the row control signal is a word line signal WLUP_1～WLUP_2And WLDN_1～WLDN_2The column transfer signals are bit line signals BL1 BLm. In a three-dimensional cross-stacked (cross point) array structure, word lines and bit lines form an included angle of 90 degrees and are stacked layer by layer, and memory cells exist at each intersection point.
Specifically, the array control circuit may include a word line driving unit, a bit line driving unit, a decoder, and a transmission gate; the word line driving unit is used for applying a read unselected word line voltage to the word lines of the 1S1R array, and the bit line driving unit is used for applying a read unselected bit line voltage to the bit lines of the 1S1R array, so that unselected cells are not selected; the decoder is used for converting the address signal into a control signal so as to operate the word line driving unit, the bit line driving unit and the transmission gate to select one bit line and one word line; the transmission gate is used for enabling the reading circuit and the selected unit reading control circuit to operate the selected unit;
the bit lines are BL to BLm, and the selected bit line is one of them and is in the selected state. We can select the bit line as BL1，WLUP_1The selected cell is the selected cell and the two lines are the selected bit line and word line, respectively.
FIG. 3 is a circuit diagram of a first low dropout linear regulator according to the present invention, wherein the OPA is an operational amplifier, VbgIs the reference voltage. LDO2 is similar in structure to LDO1 and therefore will not be described in detail.
FIG. 4 shows a sense amplifier circuit diagram, a sense amplifier module, and a second read bit line RBL according to the present invention2Connection for reading the selected 1S1R sheet after the gate tube is openedData stored in the meta. In some possible embodiments, the sense amplifier module comprises at least: and a second read bit line RBL2A current mirror unit connected to the read reference voltage VrefThe circuit comprises a current conversion unit, a comparison unit and an SR latch unit which are connected. The current mirror unit extracts the read current I in the selected 1S1RreadAnd the transistor comprises a third PMOS transistor PM3 and a fourth PMOS transistor PM 4. The current conversion unit reads the reference voltage VrefReduced to read reference current IrefAnd a seventh PMOS transistor PM 7. The comparison unit is respectively connected with the current mirror unit and the current conversion unit and used for comparing the read current I in the selected 1S1R unitreadAnd a read reference current IrefComparing, and representing data stored in the selected 1S1R cell with the comparison result, including a fifth PMOS transistor PM5, a sixth PMOS transistor PM6, a fourth NMOS transistor NM4, a fifth NMOS transistor NM5, a sixth NMOS transistor NM6, and a seventh NMOS transistor NM 7; the drain terminal of the fifth PMOS transistor PM5 is connected to the drain terminal of the fifth NMOS transistor NM5, and forms a current mirror with the third PMOS transistor PM3 and the fourth PMOS transistor PM4 to provide a read current I for the selected 1S1R cellreadMirror the fifth PMOS transistor PM 5. The drain terminal of the fourth NMOS transistor NM4 is connected to the drain terminal of the fourth PMOS transistor PM4, and forms a current mirror with the sixth NMOS transistor NM6 to convert the read current IreadMirror the drain of the sixth NMOS transistor NM 6. The drain terminal of the seventh NMOS transistor NM7 is connected to the drain terminal of the seventh PMOS transistor PM7, and forms a current mirror with the fifth NMOS transistor NM5 for reading the reference current IrefMirror the drain of the fifth NMOS transistor NM 5. The sixth PMOS transistor PM6 and the seventh PMOS transistor PM7 form a current mirror for reading the reference current IrefMirrored to the drain of the sixth PMOS transistor PM 6. The drain terminal of the fifth PMOS transistor PM5 is connected to the drain terminal of the fifth NMOS transistor NM5 as the first output terminal V of the comparison unit1. The drain terminal of the sixth PMOS transistor PM6 is connected to the drain terminal of the sixth NMOS transistor NM6 as the second output terminal V of the comparison unit2. First output terminal V of comparison unit1And a second output terminal V2Is a differential output. The R end of the SR latch unit is connected with the first output end V of the comparison unit1The S end of the SR latch unit is connected with the second output end V of the comparison unit2The data stored in the selected 1S1R cell is derived from the output signal DO of the SR latch cell。
It should be noted that the voltage values provided by the first low dropout regulator and the second low dropout regulator may be set according to actual needs, and are not specifically limited in the embodiment of the present specification.
On the basis of the above embodiments, in an embodiment of the present specification, the selected cell read control circuit applies the first read operation voltage V to the selected bit line in the turn-on phase of the gate transistorR1For turning on the 1S1R unit.
Based on the above embodiments, in one embodiment of the present specification, the selected cell read control circuit applies the second read operation voltage V to the selected bit line in the read phaseR2For generating a selected cell read current signal.
On the basis of the above embodiments, in an embodiment of the present specification, the selected cell read control circuit includes: the device comprises a first transmission gate, a second transmission gate and a clamping tube;
the input end of the first transmission gate is connected with a first reading operation voltage end of the first low dropout regulator, the output end of the first transmission gate is connected with a clamping voltage end, and the control end of the first transmission gate is connected with a first reading control signal end;
the input end of the second transmission gate is connected with a second reading operation voltage section of the first low dropout linear regulator, the output end of the second transmission gate is connected with the clamping voltage end, and the control end of the second transmission gate is connected with a second reading control signal end;
the grid electrode of the clamping tube is connected with the clamping voltage end, the source electrode of the clamping tube is connected with the array control circuit through a first reading bit line, and the drain electrode of the clamping tube is connected with the sensitive amplifier through a second reading bit line end.
Specifically, as shown in fig. 2, fig. 2 is a circuit diagram of a read control circuit for a selected cell according to the present invention; the selected cell read control circuit comprises a first transmission gate TG1, a second transmission gate TG2 and a clamp tube NM1, and the input end of the selected cell read control circuit is connected with a first read operation voltage V of the first low-dropout linear regulatorR1End, output end connected with clamping voltage VclampThe control end is connected with the first reading control signal P1 end; second transmissionA gate TG2 with its input connected to the second read voltage V of the first low dropout regulatorR2An output terminal connected to the clamping voltage VclampThe control end is connected with the second reading control signal P2 end; a clamping tube NM1 with its gate connected to the clamping voltage VclampTerminal and source connected to first read bit line RBL1Terminal, drain electrode connected to second read bit line RBL2And (4) an end.
On the basis of the above embodiments, in one embodiment of the present specification, the reading non-selection word line voltage includes: a first read non-select word line voltage, a second read non-select word line voltage; the read unselected bit line voltage comprises: the first read unselected bit line voltage and the second read unselected bit line voltage.
On the basis of the above embodiments, in one embodiment of the present specification, the first read operation voltage VR1Greater than the threshold voltage V of the gating tubesthAnd clamping tube threshold voltage Vth1And the first read operation voltage VR1Less than the threshold voltage V of the gating tubesthClamping tube threshold voltage Vth1And memory device threshold voltage VPTThe sum of (a) and (b).
Specifically, the first read operation voltage VR1The following formula needs to be satisfied: vsth+Vth1＜VR1＜Vsth+VPT+Vth1In which V issthIs the gate tube threshold voltage, Vth1Is the threshold voltage of the clamping tube, VPTIs the memory device threshold voltage.
On the basis of the above embodiments, in one embodiment of the present specification, the first read operation voltage VR1Yet less than the gate threshold voltage VsthFirst read unselected word line voltage VDESWL1And clamping tube threshold voltage Vth1The sum of (a) and (b).
Specifically, the first read operation voltage VR1The following formula needs to be satisfied: vR1＜Vsth+VDESWL1+Vth1Wherein V isDESWL1Is the first read unselected word line voltage.
Based on the above embodiments, in one embodiment of the present specification, the voltage value of the first read non-selection word line voltage is equal to two-thirds of the first read operation voltage.
Specifically, the first read-unselected word line voltage VDESWL1The following formula is also required:
based on the above embodiments, in one embodiment of the present specification, a voltage value of the first read unselected bit line voltage is smaller than the gate transistor threshold voltage.
Specifically, the first read unselected bit line voltage VDESBL1The following formula is also required: vDESBL1＜Vsth。
Based on the above embodiments, in one embodiment of the present disclosure, the voltage value of the first read unselected bit line voltage is equal to two-thirds of the first read operation voltage.
Specifically, the first read unselected bit line voltage VDESBL1The following formula is also required:
in one embodiment of the present disclosure, based on the above embodiments, the second reading operation voltage VR2Equal to the holding voltage V of the gate tubeshA read voltage V across the memory devicePRAnd clamping tube threshold voltage Vth1And a second read operating voltage VR2Less than the gate tube holding voltage VshThe threshold voltage V of the memory devicePTAnd the threshold voltage V of the clamping tubeth1The sum of (a) and (b).
In particular, the second read operating voltage VR2The following formula needs to be satisfied: vR2＝Vsh+VPR+Vth1＜Vsh+VPT+Vth1In which V is sh Is the gate tube holding voltage, VPRIs the read voltage across the memory device.
On the basis of the above embodiments, the first specificationIn one embodiment, the second read operating voltage VR2And is also less than the gate tube holding voltage VshSecond read unselected word line voltage VDESWL2And the threshold voltage V of the clamping tubeth1The sum of (a) and (b).
In particular, the second read operating voltage VR2The following formula needs to be satisfied: vR2＜Vsh+VDESWL2+Vth1Wherein V isDESWL2Is the second read unselected word line voltage.
Based on the above embodiments, in one embodiment of the present specification, the second read non-selection word line voltage VDESWL2The following formula is also required:
in one embodiment of the present disclosure, the second read unselect bit line voltage V is based on the above embodimentsDESBL2The following formula is also required: vDESBL2＜Vsh。
In one embodiment of the present disclosure, the second read unselect bit line voltage V is based on the above embodimentsDESBL2The following formula is also required:
on the basis of the above embodiments, in one embodiment of the present specification, the first read control signal is between 0 and TonIs high level, so that the 1S1R unit read control circuit outputs the first read operation voltage, 0 represents the start time of the read operation, TonRepresenting the open time of the gate tube.
In one embodiment of the present disclosure, based on the above embodiment, the second read control signal is at TonAnd the voltage level is high between the end time of the reading operation, so that the 1S1R unit reading control circuit outputs the second reading operation voltage.
By way of example, the following briefly describes the read process of the present invention in a turn-on phase and a read phase: as shown in fig. 6, fig. 6 is a timing diagram of a selected cell control circuit according to the present invention;
1. the array control circuit causes one bit line and one word line to be selected (BL in the embodiment)1And WLUP_1Unselected bit lines and word lines are the remaining lines), WLUP_1Is at a low level, BL1Is connected to RBL1。
2. At the same time (i.e., 0 in FIG. 6), P1 goes high from low, P2 remains low, and the cell control circuit is selected to RBL1Application of VR1The array control circuit adds V to unselected bit linesDESBL1Applying V to unselected word linesDESWL1。
3. After the gate tube is completely opened (T)onTime), entering a reading phase, P1 is decreased from high level to low level, P2 is increased from low level to high level, and the unit control circuit is selected to supply RBL1Application of VR2The array control circuit adds V to unselected bit linesDESBL2Applying V to unselected word linesDESWL2. 1S1R unit generates reading current signal IreadWhen the sense amplifier is to be IreadAnd a read reference current IrefAnd comparing and outputting a comparison result.
4. The read ends, P1 goes back low, P2 remains low, and all word lines and bit lines remain unselected.
The 1S1R unit reading control circuit provided by the invention can realize different voltage control on different states of the gating device, and ensure that the 1S1R unit can be correctly read; when the gating device is conducted, high voltage at two ends of the storage device is avoided, reading interference is avoided, and power consumption is reduced.
It should be noted that, in the description of the present application, the terms "first", "second", and the like are used for descriptive purposes only and for distinguishing similar objects, and no precedence between the two is intended or should be construed to indicate or imply relative importance. In addition, in the description of the present application, "a plurality" means two or more unless otherwise specified.
It is to be understood that the above description is intended to be illustrative, and not restrictive. Many embodiments and many applications other than the examples provided will be apparent to those of skill in the art upon reading the above description. The scope of the present teachings should, therefore, be determined not with reference to the above description, but should instead be determined with reference to the appended claims, along with the full scope of equivalents to which such claims are entitled. The disclosures of all articles and references, including patent applications and publications, are hereby incorporated by reference for all purposes. The omission in the foregoing claims of any aspect of subject matter that is disclosed herein is not intended to forego the subject matter and should not be construed as an admission that the applicant does not consider such subject matter to be part of the disclosed subject matter.
- 上一篇：一种医用注射器针头装配设备
- 下一篇：数据处理系统及其操作方法