阅读说明：本技术 显示面板及其制作方法和显示装置 (Display panel, manufacturing method thereof and display device ) 是由 吴新风 李慧慧 李菲 王欣竹 胡友元 吴妍娴 陈超然 于 2019-11-13 设计创作，主要内容包括：本发明提供了显示面板及其制作方法和显示装置。显示面板包括相对设置的显示背板和封装盖板，显示背板的边缘上设置有多个间隔分布的连接线路，显示面板还包括：多个绝缘隔板，多个绝缘隔板设置在显示背板上，且绝缘隔板的至少一部分设置在相邻两个连接线路之间，其中，显示背板、封装盖板和相邻的两个绝缘隔板共同限定出容纳空间，至少一个连接线路位于容纳空间中；导电填充材料，导电填充材料填充在容纳空间中，且导电填充材料覆盖连接线路的至少一部分表面。由此，通过在容纳空间中填充覆盖连接线路的导电填充材料，在绑定COF时可以增加COF的绑定面积，从而降低阻抗，使得电流导通性较好，进而提升显示面板的显示效果。(The invention provides a display panel, a manufacturing method thereof and a display device. Display panel shows backplate and encapsulation apron including relative setting, shows the interconnecting link that is provided with a plurality of interval distribution on the edge of backplate, and display panel still includes: the display back plate, the packaging cover plate and the two adjacent insulating clapboards jointly define a containing space, and at least one connecting circuit is positioned in the containing space; the conductive filling material is filled in the accommodating space and covers at least one part of the surface of the connecting circuit. From this, through the electrically conductive filler material who covers connecting wire fills in accommodation space, can increase the area of binding of COF when binding the COF to reduce impedance, make the current conductivity better, and then promote display panel's display effect.)

1. The utility model provides a display panel, includes relative display backplate and the encapsulation apron that sets up, be provided with a plurality of interval distribution's interconnecting link on the edge of display backplate, its characterized in that still includes:

a plurality of insulating spacers disposed on the display backplane, and at least a portion of the insulating spacers is disposed between two adjacent connecting lines, wherein the display backplane, the package cover plate and two adjacent insulating spacers together define a receiving space, and at least one connecting line is located in the receiving space;

a conductive filling material filled in the accommodating space and covering at least a part of a surface of the connection line.

2. The display panel according to claim 1, wherein the conductive filling material fills the accommodating space.

3. The display panel according to claim 1 or 2, wherein the sum of the area of the first end surface of the conductive filling material facing the outside of the display backplane and the area of the second end surface of the connection line facing the outside of the display backplane is greater than or equal to 16 μm²。

4. The display panel according to claim 3, wherein the first end face is flush with the second end face.

5. The display panel according to claim 1 or 2, wherein a contact area of the connection line with the conductive filling material is 16 μm or more²。

6. The display panel according to claim 1 or 2, wherein a gap is provided between the insulating spacer and the connection wiring, and a part of the conductive filling material is filled in the gap.

7. The display panel according to claim 6, wherein the gap has a width of 0 to 3 μm.

8. The display panel according to claim 1, further comprising:

the electrode is arranged on the end face of the display panel facing to the outside and is electrically connected with the end face of the connecting circuit facing to the outside of the display panel and the end face of the conductive filling material facing to the outside of the display panel;

the chip on film is arranged on one side of the electrode, which is far away from the connecting circuit.

9. The display panel of claim 8, wherein the electrodes and the conductive filling material are of a unitary structure.

10. A method of making a display panel, comprising:

providing a display back plate, wherein a plurality of connecting circuits distributed at intervals are arranged on the edge of the display back plate;

forming an insulating layer on a surface of the edge, and the insulating layer covers the plurality of connection lines and a gap between the plurality of connection lines;

removing the insulating layer on at least a part of the surface of the connection wiring so as to obtain a plurality of insulating separators;

forming a package cover plate on the surface of the display back plate, wherein the package cover plate covers the insulating partition plates, the display back plate, the package cover plate and two adjacent insulating partition plates jointly define a containing space, and at least one connecting circuit is located in the containing space;

and filling a conductive filling material in the accommodating space, wherein the conductive filling material covers at least one part of the surface of the connecting circuit.

11. The method of claim 10, further comprising:

forming electrodes on the end face of the conductive filling material facing the outside of the display back plate and the end face of the connecting circuit facing the outside of the display back plate;

and a flip chip film is connected and arranged on one side of the electrode, which is far away from the connecting circuit.

12. The method of claim 11, wherein the electrode and the conductive filler material are integrally formed.

13. The method according to claim 11 or 12, wherein the conductive filling material and the electrode are formed by screen printing or printing.

14. A display device comprising the display panel according to any one of claims 1 to 9.

Technical Field

The invention relates to the technical field of display, in particular to a display panel, a manufacturing method thereof and a display device.

Background

At present, in order to reduce the frame of the display panel, a Bonding (Bonding) is usually performed on the Side surface of a circuit exposed at the edge of the display panel to connect a Chip On Film (COF), that is, a Side Bonding (Side Bonding), and such a Bonding method can greatly reduce the size of the frame, which is beneficial to realizing a narrow frame of the display panel. However, the method has the defect that the display effect of the display screen is influenced.

Therefore, research on display panels is awaited.

Disclosure of Invention

The present invention is directed to solving, at least to some extent, one of the technical problems in the related art. Therefore, an object of the present invention is to provide a display panel, in which a contact area between a connection line and a flip chip is large, or a display effect is good.

In one aspect of the invention, a display panel is provided. According to an embodiment of the present invention, the display panel includes a display backplane and a package cover plate, which are disposed opposite to each other, a plurality of connection lines are disposed on an edge of the display backplane, and the display panel further includes: a plurality of insulating spacers disposed on the display backplane, and at least a portion of the insulating spacers is disposed between two adjacent connecting lines, wherein the display backplane, the package cover plate and two adjacent insulating spacers together define a receiving space, and at least one connecting line is located in the receiving space; a conductive filling material filled in the accommodating space and covering at least a part of a surface of the connection line. From this, through the electrically conductive filler material that fills in the accommodation space and cover connecting wire, can increase the area of binding of COF when binding the COF (including the area of binding between COF and the connecting wire and the area of binding between COF and the electrically conductive filler material) to reduce the impedance, make the current conductivity better, and then promote display panel's display effect.

According to an embodiment of the present invention, the conductive filling material fills the accommodating space.

According to the embodiment of the present invention, the sum of the area of the first end face of the conductive filling material facing the outside of the display backplane and the area of the second end face of the connection line facing the outside of the display backplane is greater than or equal to 16 μm²。

According to an embodiment of the invention, the first end face and the second end face are flush.

According to the embodiment of the invention, the contact area of the connecting line and the conductive filling material is more than or equal to 16 mu m²。

According to an embodiment of the present invention, there is a gap between the insulating spacer and the connection wiring, and a part of the conductive filling material is filled in the gap.

According to the embodiment of the invention, the width of the gap is 0-3 microns.

According to an embodiment of the present invention, the display panel further includes: the electrode is arranged on the end face of the display panel facing to the outside and is electrically connected with the end face of the connecting circuit facing to the outside of the display panel and the end face of the conductive filling material facing to the outside of the display panel; the chip on film is arranged on one side of the electrode, which is far away from the connecting circuit.

According to the embodiment of the invention, the electrode and the conductive filling material are in an integrated structure.

In another aspect of the present invention, a method of fabricating a display panel is provided. According to an embodiment of the present invention, a method of fabricating the display panel includes: providing a display back plate, wherein a plurality of connecting circuits distributed at intervals are arranged on the edge of the display back plate; forming an insulating layer on a surface of the edge, and the insulating layer covers the plurality of connection lines and a gap between the plurality of connection lines; removing the insulating layer on at least a part of the surface of the connection wiring so as to obtain a plurality of insulating separators; forming a package cover plate on the surface of the display back plate, wherein the package cover plate covers the insulating partition plates, the display back plate, the package cover plate and two adjacent insulating partition plates jointly define a containing space, and at least one connecting circuit is located in the containing space; and filling a conductive filling material in the accommodating space, wherein the conductive filling material covers at least one part of the surface of the connecting circuit. Therefore, the conductive filling material covering the connecting line is filled in the accommodating space, so that the binding area of the COF (including the binding area between the COF and the connecting line and the binding area between the COF and the conductive filling material) can be increased when the COF is bound, the impedance is reduced, the current conductivity is better, and the display effect of the display panel is further improved; moreover, the preparation method has the advantages of simple and mature process, easy operation, high efficiency and convenient industrial production.

According to an embodiment of the present invention, the method of manufacturing a display panel further includes: forming electrodes on the end face of the conductive filling material facing the outer side of the display back plate and the end face of the connecting circuit facing the outer side of the display back plate; and a flip chip film is connected and arranged on one side of the electrode, which is far away from the connecting circuit.

According to an embodiment of the invention, the electrode and the conductive filling material are integrally formed.

According to an embodiment of the present invention, the conductive filling material and the electrode are formed by screen printing or printing.

In yet another aspect of the present invention, a display device is provided. According to an embodiment of the present invention, the display device includes the display panel described above. Therefore, the display device has better display effect. It will be understood by those skilled in the art that the display device has all the features and advantages of the display panel described above, and will not be described in detail herein.

Drawings

Fig. 1 is a schematic cross-sectional view of a display panel according to an embodiment of the present invention.

Fig. 2 is a schematic perspective view of a display panel according to another embodiment of the present invention.

Fig. 3 is a schematic cross-sectional view of a display panel according to another embodiment of the present invention.

Fig. 4 is a schematic perspective view of a display panel according to another embodiment of the invention.

Fig. 5 is a schematic perspective view of a display panel according to another embodiment of the invention.

Fig. 6 is a schematic perspective view of a display panel according to another embodiment of the invention.

Fig. 7 is a schematic cross-sectional view of a display panel according to still another embodiment of the present invention.

Fig. 8 is a schematic perspective view of a display panel according to another embodiment of the invention.

Fig. 9 is a schematic cross-sectional view of a display panel according to still another embodiment of the present invention.

Fig. 10 is a schematic cross-sectional structure along CC' in fig. 9.

FIG. 11 is a flowchart of a method for fabricating a display panel according to another embodiment of the present invention.

FIG. 12 is a flowchart of a method for fabricating a display panel according to another embodiment of the present invention.

Detailed Description

The following describes embodiments of the present invention in detail. The following examples are illustrative only and are not to be construed as limiting the invention. The examples, where specific techniques or conditions are not indicated, are to be construed according to the techniques or conditions described in the literature in the art or according to the product specifications.

At present, in order to realize the narrow frame of the display panel, a side bonding flip chip film (COF) is mostly adopted, and the specific flow comprises: the method comprises the steps of firstly coating insulating glue on the edge of a display back plate so as to flatly coat unevenness generated by a connecting circuit on the edge of the display back plate, then grinding the side edge of the display back plate to be flat, forming a metal electrode in contact connection with the end face of the connecting circuit on the side face of a display panel through screen printing or printing, and finally binding COF on the surface of the metal electrode. However, the inventor finds that the above process can effectively reduce the frame of the display panel, but the display effect is poor, and the inventor finds that in the above binding method, the binding area of the COF and the connection line (i.e. the contact area of the metal electrode and the connection line) is small, the resistance is large, and the conductivity of the current is seriously affected, thereby causing the display effect to be poor. In view of the above problems, the inventors found through intensive research that the display effect of the display panel can be effectively improved by filling the conductive filling material disposed in contact with the connection lines to increase the connection area for binding the COF, reduce the impedance.

In view of the above, in one aspect of the present invention, a display panel is provided. According to an embodiment of the present invention, referring to fig. 1 (the conductive filling material 50 is not shown in fig. 1), fig. 2 (the package cover plate 20 and the conductive filling material 50 are not shown in fig. 2, and is a schematic structural diagram corresponding to one of the connection lines in fig. 1) and fig. 3, the display panel includes a display backplane 10 and a package cover plate 20 that are oppositely disposed, a plurality of connection lines 30 are disposed on an edge of the display backplane 10 at intervals, and the display panel further includes: a plurality of insulating spacers 40, the plurality of insulating spacers 40 being disposed on the display backplane 10, and at least a portion of the insulating spacers 40 being disposed between two adjacent connecting lines 30, wherein the display backplane 10, the package cover plate 20, and two adjacent insulating spacers 40 together define an accommodating space 124, and at least one connecting line 30 is located in the accommodating space 124; a conductive filling material 50, the conductive filling material 50 is filled in the accommodating space 124, and the conductive filling material 50 covers at least a part of the surface of the connection line 30. From this, through the electrically conductive filler material that fills in the accommodation space and cover connecting wire, can increase the area of binding of COF when binding the COF (including the area of binding between COF and the connecting wire and the area of binding between COF and the electrically conductive filler material) to reduce the impedance, make the current conductivity better, and then promote display panel's display effect.

According to the embodiment of the present invention, the accommodating space is defined by the display backplane 10, the package cover 20 and two adjacent insulating spacers 40, that is, as shown in fig. 3, the package cover covers the insulating spacers, or an orthographic projection of the package cover on the display backplane covers an orthographic projection of the insulating spacers on the display backplane.

It is understood by those skilled in the art that the connection lines extend from the display region of the display panel to the edge of the display panel, and the COF is bonded to the connection lines so as to be electrically connected to the driving circuit of the display region. Wherein, the material and size of the connecting circuit and the space between two adjacent connecting circuits have no special requirements, and the technicians in the field can flexibly select the connecting circuit according to the actual conditions of product size, resolution ratio and the like.

According to the embodiment of the invention, the specific structure of the display back plate is consistent with that of the display back plate in the conventional technology, including structures such as a thin film transistor, an OLED device and an encapsulation layer, and a person skilled in the art can flexibly select the display back plate with the conventional structure according to actual needs. In addition, the material of the package cover plate is not limited, and the material can be flexibly selected by a person skilled in the art according to the actual situation.

According to the embodiment of the present invention, the material of the insulating spacer is not particularly limited, and those skilled in the art can flexibly select the material according to actual conditions. In some embodiments, the material of the insulating spacer includes, but is not limited to, silicon oxide, silicon oxynitride, silicon nitride, aluminum oxide, and the like. Therefore, the material has wide sources, low cost and better stability, and can keep good insulation property under different environments for a long time so as to be electrically connected with the connecting circuit.

According to the embodiment of the present invention, the specific material type of the conductive filling material has no special requirement, and the field can be flexibly selected according to the actual situation, for example, the specific material of the conductive filling material includes, but is not limited to, silver paste, copper, aluminum, and other conductive materials. Therefore, the conductivity is better, and the cost is lower.

According to an embodiment of the present invention, referring to fig. 4, the conductive filling material 50 fills the receiving space. From this, can further increase the area of contact of interconnecting link and electrically conductive filler to and the area of first terminal surface, and then effectively promote the current conductivity of COF and interconnecting link after binding, reduce the impedance, promote display panel's display quality.

According to an embodiment of the present invention, referring to fig. 4, the sum of the area of the first end surface 51 of the conductive filling material 50 facing the outside of the display backplane and the area of the second end surface 31 of the connection line 30 facing the outside of the display backplane is equal to or greater than 16 μm²E.g. 16 μm²、17μm²、18μm²、19μm²、20μm²、21μm²、22μm²、23μm²、24μm²、25μm²、26μm²、27μm²、28μm²、29μm²、30μm²、31μm²、32μm²、33μm²、34μm²、35μm²、36μm²、37μm²、38μm²、39μm²Or 40 μm². Therefore, the area of the first end face and the second end face is larger, the binding area of the COF can be effectively increased, the impedance is reduced, the current conductivity is improved, and the display effect of the display panel is improved; if the area of the first end face and the second end face is less than 16 μm²Therefore, the bonding area is relatively small, the current conductivity is relatively insufficient, and the display effect of the display panel is not obviously improved.

In some embodiments, referring to fig. 1, the width H of the connection line is 14 micrometers, the thickness S is 0.6 micrometers, and the minimum value a of the height D (or thickness) of the insulating spacer is 16/14 ═ 1.14 micrometers, that is, the thickness of the insulating spacer is at least 0.54 micrometers greater than the thickness of the connection line, and after the accommodating space is filled with the conductive filling material, the area of the end face of the conductive filling material away from the outside of the display panel is at least 0.54 μm × 14 μm ═ 7.56 μm²Thus, can makeThe sum of the second end surface of the wiring circuit facing the outside of the display panel and the first end surface of the conductive filling material facing the outside of the display panel is 16 μm or more²And the impedance can be reduced by about one time. It should be noted that in this embodiment, there is no gap between the insulating spacer and the connection line, i.e. the width of the connection line is the same as the width of the conductive filling material.

According to an embodiment of the present invention, referring to fig. 4, the first end surface 51 of the conductive filling material 50 facing the outside of the display backplane is flush with the second end surface 31 of the connection line 30 facing the outside of the display backplane. Therefore, the bonding of the connecting lines and the conductive filling materials with the side edges of the COF and the stability of the COF after bonding are facilitated on the flat surface.

In some embodiments, when first terminal surface and second terminal surface are uneven, can utilize silver thick liquid to form subsequent electrode to fill the unevenness between connecting line and the electrically conductive filler material, so that the side of COF binds, further, can utilize silver thick liquid conducting material to fill accommodation space and form the electrode, utilize electrically conductive filler material of silver thick liquid one-step formation and electrode promptly, so that obtain the electrode that has level and smooth surface, and then the side of COF binds.

According to the embodiment of the invention, in order to better improve the display effect of the display panel, the contact area of the connecting circuit and the conductive filling material is more than or equal to 16 μm²E.g. 16 μm²、17μm²、18μm²、19μm²、20μm²、21μm²、22μm²、23μm²、24μm²、25μm²、26μm²、27μm²、28μm²、29μm²、30μm²、31μm²、32μm²、33μm²、34μm²、35μm²、36μm²、37μm²、38μm²、39μm²Or 40 μm². Therefore, the impedance between the connecting line and the conductive filling material is small, the conductivity of the current is good, the conductivity of the COF binding back circuit current can be effectively guaranteed, and the display effect of the display panel is effectively improved.

In this case, a person skilled in the art can design the filling depth and other dimensions of the conductive filling material according to the requirements on the contact area between the connection line and the conductive filling material and the actual conditions such as the dimensions of the connection line. In some embodiments, referring to fig. 4, the connection line has a width of 14 micrometers and a thickness of 0.6 micrometers, and the minimum value B of the filling depth h of the conductive filling material 50 is 16/14-1.14 micrometers. It should be noted that in this embodiment, there is no gap between the insulating spacer and the connection line, i.e. the width of the connection line is the same as the width of the conductive filling material.

According to an embodiment of the present invention, referring to fig. 5, 6 and 7, the insulating spacer 40 and the connection wire 30 have a gap 34 therebetween, and a portion of the conductive filling material 50 is filled in the gap 34. From this, electrically conductive filler material not only is connected with the upper surface contact of interconnecting link, still is connected with the side contact of at least one side of interconnecting link, and area of contact between increase interconnecting link that so can be further and the electrically conductive filler material reduces the impedance, and the conductivity of increase current, and then promotes display panel's display quality.

According to the embodiment of the present invention, as shown in fig. 5 to 7, the insulating spacer 40 and both sides of the connection line 30 have the gap 34 therebetween, or as shown in fig. 8, the insulating spacer 40 and one side of the connection line 30 have the gap 34 therebetween, which is not a limitation requirement, and those skilled in the art can flexibly design according to the actual situation such as the requirement of the contact area between the connection line and the conductive filling material.

According to an embodiment of the invention, the width d of the gap is 0-3 microns, such as 3 microns, 2.8 microns, 2.5 microns, 2.3 microns, 2.0 microns, 1.8 microns, 1.5 microns, 1.2 microns, 1.0 micron, 0.8 microns, 0.5 microns, 0.3 microns or 0.1 microns. Therefore, the structural stability of the insulating partition plate is effectively ensured while the contact area of the connecting circuit and the conductive filling material is increased.

According to an embodiment of the present invention, referring to fig. 9 and 10 (fig. 10 is a cross-sectional view taken along CC' in fig. 9), the display panel further includes: an electrode 60 disposed on an end surface of the display panel facing outward, the electrode 60 being electrically connected to an end surface of the connection line 30 facing outward of the display panel (i.e., a second end surface) and an end surface of the conductive filling material 50 facing outward of the display panel (i.e., a first end surface); a flip-chip film 70, the flip-chip film 70 being disposed on a side of the electrode 60 away from the connection line 30. Therefore, through the electrodes, the chip on film is bound on the end face of the connecting circuit 30 facing the outer side of the display panel and the end face of the conductive filling material 50 facing the outer side of the display panel, so that the binding area is increased, and the display effect of the display panel is further improved. The bonding area of the flip chip is the area of the contact connection between the electrode and the end face of the connection line 30 facing the outside of the display panel, and the area of the contact connection between the electrode and the end face of the conductive filling material 50 facing the outside of the display panel.

According to the embodiment of the invention, the electrode and the conductive filling material are in an integrated structure. Therefore, the electrode and the conductive filling material are convenient to prepare in process, and the connection stability between the electrode and the conductive filling material is good. It should be noted that the electrode and the conductive filling material are integrally formed, that is, the electrode and the conductive filling material are integrally formed in terms of process, that is, the material of the electrode is the same as the material of the conductive filling material.

In another aspect of the present invention, a method of fabricating a display panel is provided. According to an embodiment of the present invention, referring to fig. 11, a method of fabricating the display panel includes:

s100: and providing a display back plate, wherein a plurality of connecting circuits distributed at intervals are arranged on the edge of the display back plate.

S200: an insulating layer is formed on the surface of the edge, and the insulating layer covers the plurality of connection lines and the gap between the plurality of connection lines. The method for forming the insulating layer is not particularly required, and those skilled in the art can flexibly select the method according to the actual situation, for example, the method for forming the insulating layer includes, but is not limited to, coating, deposition and the like.

S300: the insulating layer on at least a portion of the surface of the connection line 30 is removed to obtain a plurality of insulating spacers 40, and the structural schematic diagram refers to fig. 2.

The specific method for removing the insulating layer on at least a portion of the surface of the connecting line is not limited, for example, the insulating layer may be removed by exposure and development, and those skilled in the art may select the method flexibly according to actual requirements, and thus, the method is not described in detail herein.

S400: a package cover plate 20 is formed on the surface of the display backplane 10, and the package cover plate 20 covers the insulating spacer 40, wherein the display backplane 10, the package cover plate 20 and two adjacent insulating spacers 40 together define a receiving space 124, and at least one connection line 30 is located in the receiving space 124, and the structural schematic diagram refers to fig. 1.

S500: the accommodating space 124 is filled with the conductive filling material 50, and the conductive filling material 50 covers at least a part of the surface of the connection line 30, and the structural schematic diagrams refer to fig. 3 and 4.

According to an embodiment of the present invention, referring to fig. 4, the sum of the area of the first end surface 51 of the conductive filling material 50 facing the outside of the display backplane and the area of the second end surface 31 of the connection line 30 facing the outside of the display backplane is equal to or greater than 16 μm²E.g. 16 μm²、17μm²、18μm²、19μm²、20μm²、21μm²、22μm²、23μm²、24μm²、25μm²、26μm²、27μm²、28μm²、29μm²、30μm²、31μm²、32μm²、33μm²、34μm²、35μm²、36μm²、37μm²、38μm²、39μm²Or 40 μm². Therefore, the COF has a larger binding area, so that the impedance can be effectively reduced, the current conductivity can be improved, and the display effect of the display panel can be improved; if the binding area is less than 16 μm²The current conductivity is relatively insufficient, and the display effect of the display panel is not significantly improved.

According to an embodiment of the present invention, referring to fig. 4, the first end surface 51 of the conductive filling material 50 facing the outside of the display backplane is flush with the second end surface 31 of the connection line 30 facing the outside of the display backplane. Therefore, the bonding of the connecting lines and the conductive filling materials with the side edges of the COF and the stability of the COF after bonding are facilitated on the flat surface.

According to the embodiment of the invention, in order to better improve the display effect of the display panel, the contact area of the connecting circuit and the conductive filling material is more than or equal to 16 μm²E.g. 16 μm²、17μm²、18μm²、19μm²、20μm²、21μm²、22μm²、23μm²、24μm²、25μm²、26μm²、27μm²、28μm²、29μm²、30μm²、31μm²、32μm²、33μm²、34μm²、35μm²、36μm²、37μm²、38μm²、39μm²Or 40 μm². Therefore, the impedance between the connecting line and the conductive filling material is small, the conductivity of the current is good, the conductivity of the COF binding back circuit current can be effectively guaranteed, and the display effect of the display panel is effectively improved.

According to the embodiment of the invention, the conductive filling material for covering the connecting line is filled in the accommodating space, so that the binding area of the COF (including the binding area between the COF and the connecting line and the binding area between the COF and the conductive filling material) can be increased when the COF is bound, the impedance is reduced, the current conductivity is better, and the display effect of the display panel is further improved; moreover, the preparation method has the advantages of simple and mature process, easy operation, high efficiency and convenient industrial production.

According to an embodiment of the present invention, referring to fig. 12, the method of fabricating the display panel further includes:

s600: the electrodes 60 are formed on the end surface of the conductive filling material 50 facing the outside of the display backplane 10 and the end surface of the connection line 30 facing the outside of the display backplane, and the structural schematic diagram refers to fig. 10.

Wherein the electrode 60 and the conductive filling material 50 are integrally formed. Therefore, the electrode and the conductive filling material are convenient to prepare in process, and the connection stability between the electrode and the conductive filling material is good.

According to an embodiment of the present invention, the conductive filling material and the electrode are formed by screen printing or printing. Therefore, the method not only has mature process, easy operation and convenient industrial production, but also can effectively and quickly fill the conductive filling material into the accommodating space.

S700: a flip chip film 70 is disposed on a side of the electrode 60 away from the connection line 30, and the structure diagram is shown in fig. 10.

The specific method for connecting and disposing the Chip On Film (COF) has no special requirement, and those skilled in the art can flexibly select the method according to the actual situation, and thus, the detailed description is omitted.

According to an embodiment of the present invention, the method for manufacturing a display panel may be used to manufacture the display panel, wherein requirements for the conductive filling material, the electrode material, the contact area between the conductive filling material and the connection circuit, the binding area, and the like in the method for manufacturing a display panel are consistent with the requirements for the corresponding structure in the display panel, and are not repeated here.

In yet another aspect of the present invention, a display device is provided. According to an embodiment of the present invention, the display device includes the display panel described above. Therefore, the display device has better display effect. It will be understood by those skilled in the art that the display device has all the features and advantages of the display panel described above, and will not be described in detail herein.

According to the embodiment of the present invention, the specific type of the display device has no special requirement, and those skilled in the art can flexibly select the display device according to the actual situation. In some embodiments, the monkey, the specific category of the display device includes but is not limited to all devices or apparatuses with display function such as mobile phone, notebook, iPad, game machine, etc.

It can be understood by those skilled in the art that the display device includes, in addition to the display panel, the structures or components necessary for the conventional display device, and in addition to the display panel, the structures or components such as a touch panel, an audio module, a camera module, a CPU, a fingerprint module, etc. are included, taking a mobile phone as an example.

In the description herein, references to the description of the term "one embodiment," "some embodiments," "an example," "a specific example," or "some examples," etc., mean that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the invention. In this specification, the schematic representations of the terms used above are not necessarily intended to refer to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples. Furthermore, various embodiments or examples and features of different embodiments or examples described in this specification can be combined and combined by one skilled in the art without contradiction.

Although embodiments of the present invention have been shown and described above, it is understood that the above embodiments are exemplary and should not be construed as limiting the present invention, and that variations, modifications, substitutions and alterations can be made to the above embodiments by those of ordinary skill in the art within the scope of the present invention.