阅读说明：本技术 深度相机 (Depth camera ) 是由 陈文华 王铮 林杰 张合勇 白云峰 于 2019-10-24 设计创作，主要内容包括：本发明提供了一种深度相机,所述深度相机包括：壳体；设置在所述壳体内的深度镜头模组以及激光器模组；所述激光器模组通过第一支架固定安装在所述壳体的底部；其中,所述激光器模组包括：电连接的激光器和激光器电路板；第一导热基座,具有用于固定所述激光器的第一区域以及用于固定第二导热基座的第二区域,所述第二区域与所述第二导热基座之间具有隔热层,所述第二导热基座背离所述第二区域的表面用于固定所述激光器电路板；所述第一导热基座与所述第二导热基座分别与所述第一支架固定。应用本发明提供的技术方案,解决了激光器模组中,激光器电路板对激光器散热效果的不利影响。(The invention provides a depth camera, comprising: a housing; the depth lens module and the laser module are arranged in the shell; the laser module is fixedly arranged at the bottom of the shell through a first bracket; wherein, the laser instrument module includes: the laser and the laser circuit board are electrically connected; the first heat-conducting base is provided with a first area for fixing the laser and a second area for fixing a second heat-conducting base, a heat insulation layer is arranged between the second area and the second heat-conducting base, and the surface of the second heat-conducting base, which is far away from the second area, is used for fixing the laser circuit board; the first heat conduction base and the second heat conduction base are respectively fixed with the first support. By applying the technical scheme provided by the invention, the adverse effect of the laser circuit board on the heat dissipation effect of the laser in the laser module is solved.)

1. A depth camera, comprising:

a housing;

the depth lens module and the laser module are arranged in the shell; the laser module is fixedly arranged at the bottom of the shell through a first bracket;

wherein, the laser instrument module includes: the laser and the laser circuit board are electrically connected; the first heat-conducting base is provided with a first area for fixing the laser and a second area for fixing a second heat-conducting base, a heat insulation layer is arranged between the second area and the second heat-conducting base, and the surface of the second heat-conducting base, which is far away from the second area, is used for fixing the laser circuit board; the first heat conduction base and the second heat conduction base are respectively fixed with the first support.

2. The depth camera of claim 1, wherein the depth lens module is fixedly mounted to the bottom of the housing by a second bracket;

the shell is provided with an upper shell and a lower shell which are mutually buckled, and the first support and the second support are both fixed at the bottom of the lower shell; the upper shell is provided with a first window and a second window, the first window is arranged opposite to the first support, and the second window is arranged opposite to the second support.

3. The depth camera of claim 2, wherein the first window and the second window are each covered with an infrared light-transmissive cover plate.

4. The depth camera as claimed in claim 2, wherein the first bracket has two laser modules fixed thereon, the two laser modules having different orientations, and both of the two laser modules emit infrared light through the first window;

the second support is fixedly provided with two depth lens modules with different orientations, and the two depth lens modules acquire infrared light through the second window to perform imaging.

5. The depth camera of claim 4, wherein the first mount comprises:

the base is used for being fixed on the lower shell;

a support plate fixed on the base;

fix the mounting panel of backup pad upper end, the mounting panel has opens first daughter board and the second daughter board for predetermineeing the angle, is used for one of fixed mounting respectively the laser instrument module.

6. The depth camera as claimed in claim 5, wherein the predetermined angle is 30 ° -50 ° so that the light emitting direction of the laser module has an included angle of 30 ° -50 °.

7. The depth camera of claim 2, wherein the first window and the second window have a slot therebetween;

the first support is fixedly provided with a baffle, the lower end of the baffle is fixed on the first support, and the upper end of the baffle is used for being inserted into the slot.

8. The depth camera of claim 2, wherein one side wall of the lower housing is a detachable structure, and an inner side surface of the side wall is used for fixing a main circuit board of the depth camera.

9. The depth camera of claim 2, wherein one side wall of the lower housing is provided with an opening for mounting an aviation plug, the aviation plug being electrically connected with a main circuit board of the depth camera for charging the depth camera and data interaction with external devices.

10. The depth camera of any one of claims 1-9, wherein the first and second thermally conductive bases are both metal or ceramic plates.

Technical Field

The invention relates to the technical field of image acquisition equipment, in particular to a depth camera.

Background

A depth camera, a photoelectric sensor that uses a laser illumination light source to provide 3D images and point cloud data based on the Time of Flight (ToF) ranging principle.

At present, a laser and a laser circuit board in an existing depth camera use the same heat dissipation channel, the power of the laser circuit board is high, and the heat generated during working of the laser circuit board affects the heat dissipation effect of the laser.

Disclosure of Invention

In view of this, the present invention provides a depth camera, which solves the adverse effect of a laser circuit board on the heat dissipation effect of a laser in a laser module.

In order to achieve the above purpose, the embodiments of the present invention provide the following technical solutions:

a depth camera, comprising:

a housing;

the depth lens module and the laser module are arranged in the shell; the laser module is fixedly arranged at the bottom of the shell through a first bracket;

wherein, the laser instrument module includes: the laser and the laser circuit board are electrically connected; the first heat-conducting base is provided with a first area for fixing the laser and a second area for fixing a second heat-conducting base, a heat insulation layer is arranged between the second area and the second heat-conducting base, and the surface of the second heat-conducting base, which is far away from the second area, is used for fixing the laser circuit board; the first heat conduction base and the second heat conduction base are respectively fixed with the first support.

Preferably, in the above depth camera, the depth lens module is fixedly mounted at the bottom of the housing through a second bracket;

the shell is provided with an upper shell and a lower shell which are mutually buckled, and the first support and the second support are both fixed at the bottom of the lower shell; the upper shell is provided with a first window and a second window, the first window is arranged opposite to the first support, and the second window is arranged opposite to the second support.

Preferably, in the above depth camera, the first window and the second window are respectively covered with cover plates that transmit infrared light.

Preferably, in the depth camera, the first bracket is fixed with two laser modules facing different directions, and the two laser modules emit infrared light through the first window;

the second support is fixedly provided with two depth lens modules with different orientations, and the two depth lens modules acquire infrared light through the second window to perform imaging.

Preferably, in the above depth camera, the first support includes:

the base is used for being fixed on the lower shell;

a support plate fixed on the base;

fix the mounting panel of backup pad upper end, the mounting panel has opens first daughter board and the second daughter board for predetermineeing the angle, is used for fixed mounting respectively the laser instrument module.

Preferably, in the depth camera, the preset angle is 30 ° to 50 °, so that the light emitting direction of the laser module has an included angle of 30 ° to 50 °.

Preferably, in the above depth camera, a slot is provided between the first window and the second window;

the first support is fixedly provided with a baffle, the lower end of the baffle is fixed on the first support, and the upper end of the baffle is used for being inserted into the slot.

Preferably, in the depth camera, one side wall of the lower casing is a detachable structure, and an inner side surface of the side wall is used for fixing a main circuit board of the depth camera.

Preferably, in the depth camera, one side wall of the lower shell is provided with an opening for installing an aviation plug, and the aviation plug is electrically connected with a main circuit board of the depth camera and is used for charging the depth camera and performing data interaction with external equipment.

Preferably, in the depth camera, the first heat-conducting base and the second heat-conducting base are both metal plates or ceramic plates.

As can be seen from the above description, in the depth camera provided by the present invention, the heat dissipation base structure of the first heat conduction base, the heat insulation layer and the second heat conduction base is adopted to separate the laser in the laser module from the heat conduction channel of the laser circuit board, so that the influence of the high power consumption of the laser circuit board on the temperature rise of the laser is reduced, and the heat dissipation efficiency of the laser is improved. By applying the technical scheme provided by the invention, the adverse effect of the laser circuit board on the heat dissipation effect of the laser in the laser module is solved.

Drawings

In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to the provided drawings without creative efforts.

FIG. 1 is an exploded view of a depth camera according to an embodiment of the present invention;

FIG. 2 is an assembled structural schematic diagram of a depth camera according to an embodiment of the present disclosure;

fig. 3 is a view of a usage scenario of a laser module according to an embodiment of the present invention;

fig. 4 is a schematic structural diagram of a laser module according to an embodiment of the present invention;

fig. 5 is a manufacturing diagram of a heat dissipation base according to an embodiment of the invention.

Detailed Description

The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.

As described in the background art, in the prior art, a depth camera with a single-lens architecture is mostly adopted, the field angle is relatively small, and the requirement of a customer on a relatively large field angle cannot be met.

In order to solve the above-mentioned problems, the present invention provides a depth camera including:

a housing;

the depth lens module and the laser module are arranged in the shell; the laser module is fixedly arranged at the bottom of the shell through a first bracket;

wherein, the laser instrument module includes: the laser and the laser circuit board are electrically connected; the first heat-conducting base is provided with a first area for fixing the laser and a second area for fixing a second heat-conducting base, a heat insulation layer is arranged between the second area and the second heat-conducting base, and the surface of the second heat-conducting base, which is far away from the second area, is used for fixing the laser circuit board; the first heat conduction base and the second heat conduction base are respectively fixed with the first support.

Therefore, in the embodiment of the invention, the heat dissipation base structure of the first heat conduction base, the heat insulation layer and the second heat conduction base is adopted, so that the laser in the laser module is separated from the heat conduction channel of the laser circuit board, the influence of high power consumption of the laser circuit board on the temperature rise of the laser is reduced, and the working temperature of the laser is effectively reduced.

Furthermore, the depth camera provided by the embodiment of the invention can improve the field angle by arranging the double laser module and the double-depth lens module, solves the problem that the field angle of a single-lens depth camera in the industry is not large enough, better meets the application scene requirement of the market, and solves the problem that the fusion precision and the detection precision error are large due to the installation of multiple devices.

Furthermore, the heat dissipation material adopts a heat dissipation base structure formed by adding copper into a heat insulation material and copper, so that a heat dissipation channel between the laser and the laser circuit board in the laser module is separated to the maximum extent, the influence of high power consumption of the laser circuit board on the temperature rise of the laser is reduced, and the heat dissipation efficiency of the laser is improved.

Furthermore, the invention can also avoid the mutual interference of light rays through the isolation design of the laser module and the depth lens module.

Preferably, in the depth camera, the whole structure comprises a front shell, a rear shell, two sets of depth lenses, a main control module, two sets of laser modules, 2 sets of infrared-transmitting PC (personal computer) sheets and an aerial plug interface. Novel degree of depth camera structure is exquisite pleasing to the eye, and the installation is convenient, has promoted production efficiency.

In order to make the aforementioned objects, features and advantages of the present application more comprehensible, the present application is described in further detail with reference to the accompanying drawings and the detailed description.

Referring to fig. 1 and 2, fig. 1 is an exploded view of a depth camera according to an embodiment of the present invention, and fig. 2 is an assembled structural schematic diagram of a depth camera according to an embodiment of the present invention. Wherein fig. 2 is a general assembly view of fig. 1 after assembly is completed.

As shown, the depth camera includes:

a housing;

a depth lens module 5 and a laser module 10 arranged in the housing; the laser module 10 is fixedly arranged at the bottom of the shell through a first bracket 9;

wherein, the laser module 10 includes: the laser and the laser circuit board are electrically connected; the first heat-conducting base is provided with a first area for fixing the laser and a second area for fixing a second heat-conducting base, a heat insulation layer is arranged between the second area and the second heat-conducting base, and the surface of the second heat-conducting base, which is far away from the second area, is used for fixing the laser circuit board; the first heat conducting base and the second heat conducting base are respectively fixed with the first bracket 9.

As the laser can independently radiate heat through the first area of the first heat-conducting base, the laser circuit board can radiate heat through the second heat-conducting base which is insulated from the first heat-conducting base, the laser and the laser circuit board respectively adopt the circuit heat-radiating channels, adverse effects on the laser caused by heat radiation of the laser circuit board are avoided, and the heat radiation efficiency of the laser is improved.

In the embodiment of the invention, the depth lens module 5 is fixedly arranged at the bottom of the shell through a second bracket 7-1; the shell is provided with an upper shell 2 and a lower shell 7 which are buckled with each other, and the first bracket 9 and the second bracket 7-1 are both fixed at the bottom of the lower shell 7; the upper shell 2 has a first window 11 and a second window 12, the first window 11 is disposed opposite to the first bracket 9, and the second window 12 is disposed opposite to the second bracket 7-1. Like this, can make degree of depth lens module 5 gather light through second window 12 for the laser instrument module is through first window 11 outgoing light, the degree of depth camera is respectively through different window outgoing and gather light, has avoided the crosstalk of emission light and collection light. One depth lens module 5 corresponds to one laser module 10, and the two are parallel in orientation and do not coincide, so that the depth lens module 5 obtains infrared light reflected by an object and corresponding to the infrared light emitted by the laser module 10.

In the scheme of the invention, the laser module 10 emits infrared light, and the depth lens module 5 receives the infrared light reflected by an object to perform imaging. The first window 11 and the second window 12 are provided to be covered with the infrared light transmitting cover plate 1, respectively. The cover plate 1 can enable infrared rays to pass through, filter visible light and improve infrared detection and imaging quality.

Specifically, the first bracket 9 is fixed with two laser modules 10 with different orientations, and the two laser modules 10 emit infrared light through the first window 11; the second bracket 7-1 is fixed with two depth lens modules 5 with different orientations, and the two depth lens modules 5 collect infrared light through the second window 12 for imaging. By arranging two depth lens modules 5 with different orientations and two matched laser modules 10, the field angle of the depth camera can be improved.

The first bracket 9 described above includes: a base 9-4 for fixing to the lower case 7; a support plate 9-3 fixed on the base 9-4; and a mounting plate 9-1 fixed at the upper end of the supporting plate 9-3, wherein the mounting plate 9-1 is provided with a first sub-plate B1 and a second sub-plate B2 which are opened to a preset angle and are respectively used for fixedly mounting one laser module 10, that is, the mounting plate 9-1 is in a V-shaped structure.

In the laser module 10, the first heat-conducting base and the second heat-conducting base are both relatively fixed with the corresponding daughter board. Therefore, the laser device can conduct heat to the daughter board through the first heat conducting base, the laser circuit board conducts heat to the daughter board through the second heat conducting base, after the heat of the laser device of the laser module 10 and the heat of the laser circuit board converge to the daughter board, the heat is conducted to the supporting plate 9-3 through the mounting plate 9-1 and then conducted to the base 9-4 through the supporting plate 9-3, and then conducted to the lower shell 7 and dissipated to the external atmosphere through the lower shell 7.

The preset angle may be 30-50 degrees, so that the light emitting direction of the laser module 10 has an included angle of 30-50 degrees. For example, the preset angle may be 40 °, so that the light emitting direction of the laser module 10 has an included angle of 40 °.

A slot 2-1 is arranged between the first window 11 and the second window 12; a baffle 9-2 is fixed on the first support 9, the lower end of the baffle 9-2 is fixed on the first support 9, and the upper end of the baffle is used for being inserted into the slot 2-1. The slot 2-1 is used for inserting the vertical baffle 9-1 to completely isolate light between the laser module 10 and the depth lens module 5, so as to avoid light crosstalk.

One side wall 3 of the lower shell 7 is of a detachable structure, and the inner side surface of the side wall 3 is used for fixing a main circuit board 4 of the depth camera. After the side wall 3 and the main circuit board 4 are assembled together, the side wall is buckled at the opening of the side wall of the lower shell 7. The side cover 3 may be any side wall of the lower case 7.

One side wall of the lower shell 7 is provided with an opening for installing an aviation plug 6, and the aviation plug 6 is electrically connected with the main circuit board 4 of the depth camera and used for charging the depth camera and performing data interaction with external equipment. The side wall for mounting the aviation plug 6 may be the same side wall of the lower case 7 as the side wall for mounting the main circuit board 4, or may be a different side wall of the lower case 7, and in the manner shown in fig. 1 and 2, the side wall for mounting the aviation plug 6 may be a different side wall of the lower case 7 from the side wall for mounting the main circuit board 4.

Optionally, the first heat conducting base and the second heat conducting base are both metal plates or ceramic plates. In the embodiment of the present invention, if a metal plate is used, the first heat conducting base and the second heat conducting base may be both copper plates.

In the scheme of the invention, firstly two infrared light transmitting cover plates 1 are fixed on an upper shell 2, then two groups of laser modules 10 are fixed on a mounting plate 9-1, then two groups of depth lens modules 5 are fixed on a second bracket 7-1 at the bottom of a lower shell 7, a side wall 3 is fixed on one side wall of the shell 7 and can be an opening, after the side wall 3 and a main circuit board 4 are assembled together, the side wall is buckled at the opening of the side wall of the lower shell 7, an aviation plug 6 is fixed on the lower shell 7, and all the assembled modules are fixed together to complete the installation of the whole machine, as shown in figure 2.

In the depth camera provided by the invention, the depth camera with a double-lens structure is adopted, the problem that the field angle of the depth camera is not large enough is solved, and meanwhile, the heat-conducting channel of the laser and the laser circuit board in the laser module is separated by adopting the heat-radiating base structure of the first heat-conducting base, the heat-insulating layer and the second heat-conducting base, so that the influence of high power consumption of the laser circuit board on the temperature rise of the laser is reduced, and the heat-radiating efficiency of the laser is improved. By applying the technical scheme provided by the invention, the adverse effect of the laser circuit board on the heat dissipation effect of the laser in the laser module is solved.

Referring to fig. 3, fig. 4 and fig. 5, fig. 3 is a view of a usage scenario of a laser module according to an embodiment of the present invention, fig. 4 is a schematic view of a composition structure of the laser module according to the embodiment of the present invention, and fig. 5 is a manufacturing view of a heat dissipation base according to the embodiment of the present invention.

As shown in fig. 3, in a usage scenario of the laser, the laser module 10 and the heat conducting member 21 are included, and the heat conducting member 21 may be the mounting board 9-1. The laser module 10 conducts heat of the laser and the laser circuit board to the heat sink through the heat conducting component 21.

The laser module 10 is fixedly connected to the heat conducting member 21. Wherein, the heat sink: it means that its temperature does not change with the amount of heat energy transferred to it, and it may be the atmosphere, the earth, etc.

As shown in fig. 4, the laser module 10 includes a laser 23, a laser circuit board 24, and a heat sink.

As shown in fig. 5, the heat sink base includes a first heat-conducting base 25, a second heat-conducting base 26, and a thermal insulation layer 27. Wherein the thermally insulating layer 27 is disposed intermediate the first and second thermally conductive bases 25, 26.

Specifically, the laser module 10 includes: a laser 23 and a laser circuit board 24 electrically connected; a first thermally conductive base 25 having a first region for holding the laser 23 and a second region for holding a second thermally conductive base 26 with a thermally insulating layer 27 between the second region and the second thermally conductive base 26, the surface of the second thermally conductive base back 26 away from the second region for holding the laser circuit board 24; the first heat-conducting base 25 and the second heat-conducting base 26 are fixed to the first bracket 9, respectively.

The first heat conducting base 25 and the second heat conducting base 26 may be metal plates, for example, copper blocks, and the two heat dissipating copper blocks may guide heat of the laser 23 and the laser circuit board 24 to the first support 9, respectively, so as to avoid thermal crosstalk between the two.

According to the usage scenario of fig. 3, the heat of the laser 23 and the laser circuit board 24 is conducted to the heat sink through the corresponding first heat conducting base 25 and the second heat conducting base 26, respectively, and the two heat flows converge before being led into the heat sink and are dissipated together through the heat conducting component. Because the two strands of heat converge in advance, the temperature difference between the heat dissipation base and the heat sink is greatly increased, spontaneous conduction from high temperature to low temperature is facilitated, and the temperature of the laser circuit board 24 and the temperature of the laser 23 in the working state are finally increased. In order to avoid the two heat flows directly converging on the heat conducting base of the laser 23, the way of sharing a copper base is abandoned, and two heat sources (the laser 23 and the laser circuit board 24) are respectively provided with a single heat conducting channel and are separated by a heat insulating layer 27 to finally form an integrated structure. Under the same use scene, the heat of the laser circuit board 24 is directly conducted to the heat conducting part 21 through the second heat conducting base 26, the heat of the laser 23 is also directly conducted to the heat conducting part 21 through the first heat conducting base 25, the heat of the two heat sources is not influenced mutually, and finally the temperature crosstalk of the two parts in the working state is reduced.

Specifically, two copper bases are arranged at the positions of the laser circuit board 24 and the laser 23, the middle of the laser circuit board is provided with a hard heat insulation layer 27 with low heat conductivity, the heat insulation layer 27 can be double-sided adhesive tape, and the adhesive tape needs to be high-temperature-resistant adhesive tape. Finally, the three components are glued together in a hamburger configuration, wherein the insulating layer 27 is disposed between the first and second heat-conducting bases 25, 26.

The difference between the scheme of the invention and the prior art is as follows: the laser 23 is separated from the laser circuit board 24 thermal channel, and is distinguished from a commonly used integrated copper substrate structure and also distinguished from two complete copper substrate structures.

According to the technical scheme, the depth camera with the double-lens structure is adopted, the problem that the field angle of the depth camera is not large enough is solved, meanwhile, the heat dissipation base structure of the first heat conduction base, the heat insulation layer and the second heat conduction base is adopted, the laser in the laser module is separated from the heat conduction channel of the laser circuit board, the influence of high power consumption of the laser circuit board on the temperature rise of the laser is reduced, and the heat dissipation efficiency of the laser is improved. By applying the technical scheme provided by the invention, the adverse effect of the laser circuit board on the heat dissipation effect of the laser in the laser module is solved.

The embodiments in the present description are described in a progressive manner, or in a parallel manner, or in a combination of a progressive manner and a parallel manner, each embodiment focuses on differences from other embodiments, and the same and similar parts among the embodiments can be referred to each other.

It is further noted that, herein, relational terms such as first and second, and the like may be used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Also, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that an article or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such article or apparatus. Without further limitation, an element defined by the phrase "comprising an … …" does not exclude the presence of other like elements in an article or device that comprises the element.

The previous description of the disclosed embodiments is provided to enable any person skilled in the art to make or use the present application. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the generic principles defined herein may be applied to other embodiments without departing from the spirit or scope of the application. Thus, the present application is not intended to be limited to the embodiments shown herein but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.