阅读说明：本技术 一种银铜合金线的制备方法 (Preparation method of silver-copper alloy wire ) 是由 赖士浩 孙锋 徐慧 钱高翔 于 2021-09-13 设计创作，主要内容包括：本发明公开了一种银铜合金线的制备方法,将银和铜先复合制成银铜合金线,后在银铜合金线外表镀银,减少了预镀工序,银铜合金内的阴离子能在与黄基水杨酸和柠檬酸钾的络合反应下与电镀液内的银离子相络合,与增加镀前预处理工序时的银离子附着力相同,在银铜合金线外生成稳定的银镀层,并在制备电镀液时使用氯化钾和柠檬酸钾,氯化钾和柠檬酸钾产生络合效果的同时,其内的钾离子使得电镀液的导电效果更佳,并且少量的乙酸和草酸、磺基水杨酸、磷酸共同作用,其短链饱和的脂肪酸的阴离子及无机酸的阴离子生成杂多酸,在络合作用的同时能够加速银离子的催化,加快镀层成型速度,并且不影响镀层质量,生成的表面镀层均匀、稳定。(The invention discloses a preparation method of a silver-copper alloy wire, which is characterized in that silver and copper are firstly compounded to prepare the silver-copper alloy wire, then silver is plated on the surface of the silver-copper alloy wire, a pre-plating process is reduced, anions in the silver-copper alloy can be complexed with silver ions in an electroplating solution under the complexation reaction of xanthylic salicylic acid and potassium citrate, the adhesion force of the silver ions in the pre-plating process is the same as that of the silver ions in the pre-plating process, a stable silver plating layer is generated outside the silver-copper alloy wire, potassium chloride and potassium citrate are used in the preparation of the electroplating solution, the potassium ions in the electroplating solution enable the electric conduction effect of the electroplating solution to be better while the complexation effect is generated by the potassium chloride and the potassium citrate, a small amount of acetic acid, oxalic acid, sulfosalicylic acid and phosphoric acid act together, the anions of short-chain saturated fatty acid and the anions of inorganic acid generate heteropoly acid, and the catalysis of the silver ions can be accelerated while the complexation effect is realized, the forming speed of the coating is accelerated, the quality of the coating is not influenced, and the generated surface coating is uniform and stable.)

1. The preparation method of the silver-copper alloy wire is characterized by comprising the following steps:

s1, putting 6-10 wt% of silver and the balance of copper into a smelting furnace in an argon atmosphere at 800-900 ℃ for heat preservation and heating for 1-1.5 h, heating to 1100-1200 ℃, and then performing heat preservation and heating for 0.5-2 h to obtain a liquid alloy;

s2, conveying the liquid alloy into casting equipment for casting to obtain a silver-copper alloy rod;

s3, the silver-copper alloy rod penetrates through a wire drawing machine to be drawn, and annealing is carried out in annealing liquid after wire drawing to obtain a silver-copper alloy wire;

s4, performing pre-plating pretreatment on the silver-copper alloy wire prepared in the step S3 to obtain a pretreated silver-copper alloy wire;

s5, placing the silver-copper alloy wire serving as a cathode into an electroplating solution, and carrying out silver plating treatment under the operating condition that the current density is 1-20A/dm 2 to obtain the silver-copper alloy wire with the surface plated with silver, wherein the temperature of the electroplating solution is 25-45 ℃, and the electroplating solution comprises 80-110 g/L sulfosalicylic acid, 20-40 g/L silver salt, 10-70 g/L potassium chloride, 10-20 g/L phosphoric acid, 0.5-2 g/L acetic acid and 5-15 g/L potassium citrate.

2. The method of claim 1, wherein the step S1 includes the steps of:

further purifying the crude copper to prepare a crude copper plate serving as an anode and pure copper serving as a cathode, putting the crude copper plate into an electrolyte containing a copper sulfate solution, and electrolyzing to obtain an adsorbate on the cathode, wherein the adsorbate is the copper;

according to the required addition amount of each ton of copper, the electrolyte also comprises 30-55 g of gelatin, 30-75 g of thiourea, 20-50 g of acitretin, 160-190 g of hydrochloric acid and 30-50 g of polyethylene glycol.

3. The method according to claim 1, wherein the pre-plating pretreatment in step S4 includes the steps of,

oil removal: and (4) putting the silver-copper alloy wire prepared in the step (S3) into an oil removing solvent, wherein the oil removing solvent is prepared from 0.5-2% of sodium citrate, 0.1-1% of sodium hydroxide, 5-8% of glycerol, 3-5% of ethanol and the balance of deionized water in parts by weight.

4. The method according to claim 3, wherein the pre-plating pretreatment in step S4 further comprises the steps of,

removing surface oxidation: and (4) putting the deoiled silver-copper alloy wire into an ammonia solution to remove surface oxides.

5. The method of claim 1, wherein the plating solution in step S5 further comprises 1-3 mg/L ammonia water and 3-10 g/L potassium hydroxide.

6. The method of claim 1, wherein the degreasing solvent further comprises 0.03-1% sodium polydithio dipropyl sulfonate.

Technical Field

The invention relates to the field of copper alloy wire preparation, in particular to a preparation method of a silver-copper alloy wire.

Background

Copper is widely applied in the fields of electric power, light industry, mechanical manufacturing, building industry, national defense industry and the like because of good ductility, good heat conductivity, diamagnetism, durability and convenient recovery, but because copper has poor electric conductivity and the resistivity is 1.75 multiplied by 10 omega cm, the application of the copper in the field of metal heating materials is greatly limited, and the existing processing method mostly adopts a composite material mode, for example, patent CN104195613B discloses a silver-plated copper wire and a method for processing a carbon fiber heating cable electrode, the processing method comprises the pretreatment processes of copper wire deoiling, polishing, passivation and acidification and the processes of electroplating and cleaning, the processes are complicated, the electroplating effect is not ideal, the copper surface is directly plated with silver, the surface plating layer is often unstable and easy to generate bubbles, therefore, a mode which is simple and convenient, the plating layer is more stable and difficult to generate bubbles and can improve the electric conductivity of copper is needed, the surface of the copper wire is treated to be plated with silver, so that the copper is more widely applied.

Disclosure of Invention

The invention aims to overcome the defects of the prior art and provides a preparation method of a silver-copper alloy wire.

In order to solve the technical problems, the invention adopts the following technical scheme,

a preparation method of a silver-copper alloy wire comprises the following steps:

s1, putting 6-10 wt% of silver and the balance of copper into a smelting furnace in an argon atmosphere at 800-900 ℃ for heat preservation and heating for 1-1.5 h, heating to 1100-1200 ℃, and then performing heat preservation and heating for 0.5-2 h to obtain a liquid alloy;

s2, conveying the liquid alloy into casting equipment for casting to obtain a silver-copper alloy rod;

s3, the silver-copper alloy rod penetrates through a wire drawing machine to be drawn, and annealing is carried out in annealing liquid after wire drawing to obtain a silver-copper alloy wire;

s4, performing pre-plating pretreatment on the silver-copper alloy wire prepared in the step S3 to obtain a pretreated silver-copper alloy wire;

s5, placing the silver-copper alloy wire serving as a cathode into an electroplating solution, and carrying out silver plating treatment under the operating condition that the current density is 1-20A/dm 2 to obtain the silver-copper alloy wire with the surface plated with silver, wherein the temperature of the electroplating solution is 25-45 ℃, and the electroplating solution comprises 80-110 g/L sulfosalicylic acid, 20-40 g/L silver salt, 10-70 g/L potassium chloride, 10-20 g/L phosphoric acid, 0.5-2 g/L acetic acid and 5-15 g/L potassium citrate.

Preferably, the method for preparing copper described in step S1 includes the steps of:

further purifying the crude copper to prepare a crude copper plate serving as an anode and pure copper serving as a cathode, putting the crude copper plate into an electrolyte containing a copper sulfate solution, and electrolyzing to obtain an adsorbate on the cathode, wherein the adsorbate is the copper;

according to the required addition amount of each ton of copper, the electrolyte also comprises 30-55 g of gelatin, 30-75 g of thiourea, 20-50 g of acitretin, 160-190 g of hydrochloric acid and 30-50 g of polyethylene glycol.

Preferably, the pre-plating pretreatment in step S4 includes the steps of,

oil removal: and (4) putting the silver-copper alloy wire prepared in the step (S3) into an oil removing solvent, wherein the oil removing solvent is prepared from 0.5-2% of sodium citrate, 0.1-1% of sodium hydroxide, 5-8% of glycerol, 3-5% of ethanol and the balance of deionized water in parts by weight.

Preferably, the pre-plating pretreatment in step S4 further includes the steps of,

removing surface oxidation: and (4) putting the deoiled silver-copper alloy wire into an ammonia solution to remove surface oxides.

Preferably, the electroplating solution in step S5 further comprises 1-3 mg/L ammonia water and 3-10 g/L potassium hydroxide.

Preferably, the oil removing solvent further comprises 0.03-1% of sodium polydithio-dipropyl sulfonate.

Compared with the prior art, the invention has the advantages that:

1. silver and copper are firstly compounded into a silver-copper alloy wire, then silver is plated on the surface of the silver-copper alloy wire, so that the pre-plating process is reduced, and meanwhile, under the condition of reducing the pre-plating process, anions in the silver-copper alloy can be complexed with silver ions in the electroplating solution under the complexing reaction with the yellow salicylic acid and the potassium citrate, the adhesive force of the silver ions is the same as that of the silver ions in the pre-treatment process before plating, and a stable silver plating layer is generated outside the silver-copper alloy wire;

2. potassium chloride and potassium citrate are used, potassium ions in the potassium chloride and potassium citrate generate a complexing effect, so that the conductive effect of the electroplating solution is better, a small amount of acetic acid, oxalic acid, sulfosalicylic acid and phosphoric acid act together, anions of short-chain saturated fatty acid and anions of inorganic acid generate heteropoly acid, the catalysis of silver ions can be accelerated while the complexing effect is realized, the forming speed of the coating is accelerated, the quality of the coating is not influenced, the generated surface coating is uniform and stable, and the problems of low generating speed and poor stability of the coating of the traditional cyanide-free electroplating solution are solved;

3. through secondary heating-heat preservation heating in the smelting furnace, the precipitation amount of the silver element in the copper is higher, and the silver element and the copper are better fused, so that the formed crystal boundary is more regular, and the conductive effect is better;

4. the cyanide-free electroplating eliminates the potential personal safety accident danger of cyanide and greatly reduces the environmental pollution.

Detailed Description

The invention is further described in the following description and specific examples, but the scope of the invention is not limited thereby.

Comparative example 1:

a preparation method of copper wire with silver-plated surface comprises the following steps:

s1, putting copper into a smelting furnace in an argon atmosphere at 1100 ℃ and heating for 1h to obtain liquid copper liquid;

s2, conveying the liquid copper liquid into casting equipment for casting to obtain a copper rod;

s3, the copper rod penetrates through a wire drawing machine to be drawn, and annealing is carried out in annealing liquid after wire drawing to obtain a copper wire;

s4, performing pre-plating pretreatment on the copper wire prepared in the step S3 to obtain a pretreated copper wire;

s5, putting a copper wire serving as a cathode into an electroplating solution, and carrying out silver plating treatment under the operating condition of current density of 10A/dm2 to obtain the copper wire with a silver-plated surface, wherein the temperature of the electroplating solution is 30 ℃, and the electroplating solution comprises 90g/L sulfosalicylic acid, 30g/L silver salt, 20g/L potassium chloride, 10g/L phosphoric acid and 6g/L potassium citrate.

Example 1:

a preparation method of a silver-copper alloy wire comprises the following steps:

s1, putting 8% of silver and the balance of copper into a smelting furnace in an argon atmosphere, keeping the temperature and heating for 1.2h at 850 ℃, then heating to 1100 ℃, keeping the temperature and heating for 1h to obtain a liquid alloy;

s2, conveying the liquid alloy into casting equipment for casting to obtain a silver-copper alloy rod;

s3, the silver-copper alloy rod penetrates through a wire drawing machine to be drawn, and annealing is carried out in annealing liquid after wire drawing to obtain a silver-copper alloy wire;

s4, performing pre-plating pretreatment on the silver-copper alloy wire prepared in the step S3 to obtain a pretreated silver-copper alloy wire;

s5, placing the silver-copper alloy wire as a cathode into an electroplating solution, and carrying out silver plating treatment under the operating condition of current density of 10A/dm2 to obtain the silver-copper alloy wire with the surface plated with silver, wherein the temperature of the electroplating solution is 30 ℃, and the electroplating solution comprises 90g/L sulfosalicylic acid, 30g/L silver salt, 20g/L potassium chloride, 10g/L phosphoric acid, 1g/L acetic acid and 6g/L potassium citrate.

Example 2:

a preparation method of a silver-copper alloy wire comprises the following steps:

s1, further purifying the crude copper to prepare a crude copper plate serving as an anode, taking pure copper as a cathode, putting the crude copper plate into an electrolyte containing a copper sulfate solution, and electrolyzing to obtain an adsorbate on the cathode, wherein the adsorbate is the copper;

according to the required addition amount of each ton of copper, the electrolyte also comprises 40g of gelatin, 32g of thiourea, 35g of avilamycin, 170g of hydrochloric acid and 40g of polyethylene glycol;

putting 8% of silver and the balance of copper into a smelting furnace in an argon atmosphere at 850 ℃ for heat preservation and heating for 1.2h, heating to 1100 ℃, and then carrying out heat preservation and heating for 1h to obtain a liquid alloy;

s2, conveying the liquid alloy into casting equipment for casting to obtain a silver-copper alloy rod;

s3, the silver-copper alloy rod penetrates through a wire drawing machine to be drawn, and annealing is carried out in annealing liquid after wire drawing to obtain a silver-copper alloy wire;

s4, performing pre-plating pretreatment on the silver-copper alloy wire prepared in the step S3 to obtain a pretreated silver-copper alloy wire;

s5, placing the silver-copper alloy wire as a cathode into an electroplating solution, and carrying out silver plating treatment under the operating condition of current density of 10A/dm2 to obtain the silver-copper alloy wire with the surface plated with silver, wherein the temperature of the electroplating solution is 30 ℃, and the electroplating solution comprises 90g/L sulfosalicylic acid, 30g/L silver salt, 20g/L potassium chloride, 10g/L phosphoric acid, 1g/L acetic acid and 6g/L potassium citrate.

Example 3:

a preparation method of a silver-copper alloy wire comprises the following steps:

s1, further purifying the crude copper to prepare a crude copper plate serving as an anode, taking pure copper as a cathode, putting the crude copper plate into an electrolyte containing a copper sulfate solution, and electrolyzing to obtain an adsorbate on the cathode, wherein the adsorbate is the copper;

according to the required addition amount of each ton of copper, the electrolyte also comprises 40g of gelatin, 32g of thiourea, 35g of avilamycin, 170g of hydrochloric acid and 40g of polyethylene glycol;

putting 8% of silver and the balance of copper into a smelting furnace in an argon atmosphere at 850 ℃ for heat preservation and heating for 1.2h, heating to 1100 ℃, and then carrying out heat preservation and heating for 1h to obtain a liquid alloy;

s2, conveying the liquid alloy into casting equipment for casting to obtain a silver-copper alloy rod;

s3, the silver-copper alloy rod penetrates through a wire drawing machine to be drawn, and annealing is carried out in annealing liquid after wire drawing to obtain a silver-copper alloy wire;

s4, preparing a degreasing solvent from 0.5-2% of sodium citrate, 0.1-1% of sodium hydroxide, 5% of glycerol, 4% of ethanol and the balance of deionized water in parts by weight, and putting the silver-copper alloy wire prepared in the step S3 into the degreasing solvent for degreasing;

putting the degreased silver-copper alloy wire into an ammonia solution to remove surface oxides to obtain a pretreated silver-copper alloy wire;

s5, placing the silver-copper alloy wire as a cathode into an electroplating solution, and carrying out silver plating treatment under the operating condition of current density of 10A/dm2 to obtain the silver-copper alloy wire with the surface plated with silver, wherein the temperature of the electroplating solution is 30 ℃, and the electroplating solution comprises 90g/L sulfosalicylic acid, 30g/L silver salt, 20g/L potassium chloride, 10g/L phosphoric acid, 1g/L acetic acid and 6g/L potassium citrate.

Example 4

A preparation method of a silver-copper alloy wire comprises the following steps:

s1, further purifying the crude copper to prepare a crude copper plate serving as an anode, taking pure copper as a cathode, putting the crude copper plate into an electrolyte containing a copper sulfate solution, and electrolyzing to obtain an adsorbate on the cathode, wherein the adsorbate is the copper;

according to the required addition amount of each ton of copper, the electrolyte also comprises 40g of gelatin, 32g of thiourea, 35g of avilamycin, 170g of hydrochloric acid and 40g of polyethylene glycol;

putting 8% of silver and the balance of copper into a smelting furnace in an argon atmosphere at 850 ℃ for heat preservation and heating for 1.2h, heating to 1100 ℃, and then carrying out heat preservation and heating for 1h to obtain a liquid alloy;

s2, conveying the liquid alloy into casting equipment for casting to obtain a silver-copper alloy rod;

s3, the silver-copper alloy rod penetrates through a wire drawing machine to be drawn, and annealing is carried out in annealing liquid after wire drawing to obtain a silver-copper alloy wire;

s4, preparing a degreasing solvent from 0.5-2% of sodium citrate, 0.1-1% of sodium hydroxide, 5% of glycerol, 4% of ethanol and the balance of deionized water in parts by weight, and putting the silver-copper alloy wire prepared in the step S3 into the degreasing solvent for degreasing;

putting the degreased silver-copper alloy wire into an ammonia solution to remove surface oxides to obtain a pretreated silver-copper alloy wire;

s5, placing the silver-copper alloy wire as a cathode into an electroplating solution, and carrying out silver plating treatment under the operating condition of current density of 10A/dm2 to obtain the silver-copper alloy wire with the surface plated with silver, wherein the temperature of the electroplating solution is 30 ℃, and the electroplating solution comprises 90g/L sulfosalicylic acid, 30g/L silver salt, 20g/L potassium chloride, 10g/L phosphoric acid, 1g/L acetic acid, 6g/L potassium citrate, 2mg/L ammonia water and 5g/L potassium hydroxide.

Example 5

A preparation method of a silver-copper alloy wire comprises the following steps:

s1, further purifying the crude copper to prepare a crude copper plate serving as an anode, taking pure copper as a cathode, putting the crude copper plate into an electrolyte containing a copper sulfate solution, and electrolyzing to obtain an adsorbate on the cathode, wherein the adsorbate is the copper;

according to the required addition amount of each ton of copper, the electrolyte also comprises 40g of gelatin, 32g of thiourea, 35g of avilamycin, 170g of hydrochloric acid and 40g of polyethylene glycol;

putting 8% of silver and the balance of copper into a smelting furnace in an argon atmosphere at 850 ℃ for heat preservation and heating for 1.2h, heating to 1100 ℃, and then carrying out heat preservation and heating for 1h to obtain a liquid alloy;

s2, conveying the liquid alloy into casting equipment for casting to obtain a silver-copper alloy rod;

s3, the silver-copper alloy rod penetrates through a wire drawing machine to be drawn, and annealing is carried out in annealing liquid after wire drawing to obtain a silver-copper alloy wire;

s4, preparing an oil removing solvent from 0.5-2% of sodium citrate, 0.1-1% of sodium hydroxide, 5% of glycerol, 4% of ethanol, 0.1% of sodium polydithio-dipropyl sulfonate and the balance of deionized water in parts by weight, and placing the silver-copper alloy wire prepared in the step S3 into the oil removing solvent for oil removal;

putting the degreased silver-copper alloy wire into an ammonia solution to remove surface oxides to obtain a pretreated silver-copper alloy wire;

s5, placing the silver-copper alloy wire as a cathode into an electroplating solution, and carrying out silver plating treatment under the operating condition of current density of 10A/dm2 to obtain the silver-copper alloy wire with the surface plated with silver, wherein the temperature of the electroplating solution is 30 ℃, and the electroplating solution comprises 90g/L sulfosalicylic acid, 30g/L silver salt, 20g/L potassium chloride, 10g/L phosphoric acid, 1g/L acetic acid, 6g/L potassium citrate, 2mg/L ammonia water and 5g/L potassium hydroxide.

The resistivity of the silver-copper alloy wires with silver plated on the surfaces, prepared in comparative example 1 and examples 1 to 5, was measured at 20 ℃ and the specific results are shown in table 1:

TABLE 1

	Resistivity of
		Comparative example 1	1.637×10-6Ω·cm
Example 1	1.598×10-6Ω·cm
		Example 2	1.582×10-6Ω·cm
Example 3	1.575×10-6Ω·cm
		Example 4	1.568×10-6Ω·cm
Example 5	1.562×10-6Ω·cm

The surface plating layers of the silver-plated silver-copper alloy wires prepared in comparative example 1 and example 1, and examples 3 to 5 were observed, respectively, and the results of the specific sensory evaluation are shown in table 2:

TABLE 2

	Sensory evaluation
		Comparative example 1	The plating layer occasionally drops, the surface is often provided with bubbles and is often uneven
Example 1	Micro bubbles and occasional unevenness on the surface
		Example 3	Occasional bubbles and irregularities
Example 4	Almost no bubble and occasional unevenness
		Example 5	Smooth surface, almost no bubbles and unevenness

Referring to tables 1-2, and the contents of the above comparative examples and examples, comparing comparative example 1 with example 1, it can be seen that, in comparative example 1, after copper is made into a copper rod, a silver layer is plated on the surface of the copper rod to improve the conductivity of the copper rod, and a cyanide-free electroplating solution is used during silver plating, which eliminates the risk of potential personal safety accidents of cyanide and greatly reduces the pollution to the environment, but because a pre-plating process is not added, the surface state of the plating layer is not ideal, the bubbling phenomenon is serious, the plating layer is unstable, potassium chloride and potassium citrate are used to generate a complexing effect, while potassium ions in the plating solution make the conductive effect of the electroplating solution better, and meanwhile, oxalic acid, sulfosalicylic acid and phosphoric acid are added to complex, the bubbling and plating layer are slightly improved, but the electroplating time is long, and the bubbling and plating layer are still serious, example 1 is based on comparative example 1, silver and copper are firstly compounded into a silver-copper alloy wire, then silver is plated on the surface of the silver-copper alloy wire, the pre-plating process is reduced, under the condition of reducing the pre-plating process, anions in the silver-copper alloy can be complexed with silver ions in electroplating solution under the complexation reaction of yellow salicylic acid and potassium citrate, the adhesive force of the silver ions is the same as that of the silver ions in the pre-treatment process before plating, a stable silver plating layer is generated outside the silver-copper alloy wire, the commercial amount of acetic acid is added into the electroplating solution, the anions of short-chain saturated fatty acid and the anions of inorganic acid generate heteropoly acid, the catalysis of the silver ions can be accelerated during the complexation action, the plating layer forming speed is accelerated, the plating layer quality is not influenced, the generated surface plating layer is uniform and stable, the problems of low generating speed and poor plating layer stability of the traditional cyanide-free electroplating solution are solved, and the problems of low plating layer generating speed and poor plating layer stability are solved by secondary heating-heat preservation in a smelting furnace, the precipitation amount of the silver element in the copper is higher, and the silver element and the copper are better fused, so that the formed crystal boundary is more regular, and the conductive effect is better;

comparing the embodiment 1 and the embodiment 2, it can be known that the embodiment 2 further optimizes the crude copper purification step on the basis of the embodiment 1, adopts an electrolytic purification method, is convenient, the brightness of the purified raw material copper is higher, the brightness of the finished product is directly improved from the raw material, the electrolyte is further optimized, gelatin, thiourea, avilamycin, hydrochloric acid and polyethylene glycol are added, the gelatin is used as a main additive and is dissociated into cations in the acid electrolyte, polymerization is formed on the protruding surface of the cathode, the growth of the protruding surface crystal grains is prevented, new crystal nuclei are generated, the final crystal grains of the cathode are more regular and compact, the inhibition effect of the gelatin on the protruding crystal grains on the surface of the cathode is effectively increased under the combined action of the thiourea, the avilamycin and the gelatin, the chloride ions generated by the hydrochloric acid reaction have the depolarization effect, the anode passivation is reduced, the crystal is further refined, the crystal purity is higher, and the conductivity is better;

comparing the embodiment 2 with the embodiment 3, it can be seen that, in the embodiment 3, on the basis of the embodiment 2, the pretreatment of the silver-copper alloy wire is refined, the modes of degreasing first and then ammonia water soaking and washing are performed, the degreasing solvent is soaked first to remove oil stains on the surface of the silver-copper alloy wire, then ammonia water soaking is performed to remove crystal dendrites on the surface of the silver-copper alloy wire, but the crystal boundaries of the silver-copper alloy wire are not damaged, the surface is more regular when the ammonia water is soaked due to degreasing first, pot holes generated due to the oil stains on the surface are reduced, the surface of the silver-copper alloy wire is smoother, the electroplating effect is better, meanwhile, glycerin is used as a main agent, sodium citrate and sodium hydroxide are used as auxiliary agents to enhance the saponification effect, the addition of ethanol reduces the alloy oxidation when degreasing, the degreasing effect is better, fewer impurities are oxidized, and the prepared silver-copper alloy wire has better conductivity;

comparing example 3 with example 4, it is known that in example 4, based on example 3, the components of the plating solution are optimized, ammonia water and potassium hydroxide are added, irregular crystal branches generated during plating are stabilized, the generation of the crystal branches is reduced, and meanwhile, hydrogen ions generated during reaction are acted by the potassium hydroxide and the sodium hydroxide together, so that the film forming compactness is better, the film forming speed is slightly reduced, and the film surface is more flat and regular.

Comparing embodiment 4 and embodiment 5, it can be seen that embodiment 5 optimizes the formulation of the degreasing solvent on the basis of embodiment 4, adds the sodium polydithio dipropyl sulfonate component, and cooperates with the hydride formed by sodium hydroxide and sodium citrate to increase the activity of the degreasing solvent, so that the degreasing solvent has better dissolving effect on the oil stain in the surface industry and good degreasing effect, and thus the surface of the alloy copper wire after electroplating is smoother, and the phenomena of unstable plating and bubbling are further reduced.

As can be seen from the above, the silver-copper alloy wire obtained in example 5 has the best conductive performance, the most stable surface silver plating layer, and the least blistering and unevenness compared to those obtained in examples 1 to 4, and therefore, example 5 is considered as the most preferable example of the present invention.

The above description is only a preferred embodiment of the present invention, and the protection scope of the present invention is not limited to the above-described embodiments. All technical schemes belonging to the idea of the invention belong to the protection scope of the invention. It should be noted that modifications and embellishments within the scope of the invention may be made by those skilled in the art without departing from the principle of the invention, and such modifications and embellishments should also be considered as within the scope of the invention.