阅读说明：本技术 电子部件以及电子部件的制造方法 (Electronic component and method for manufacturing electronic component ) 是由 原田敏宏 于 2019-05-22 设计创作，主要内容包括：本发明提供一种电子部件以及电子部件的制造方法,即使在对外部电极施加了弯曲应力的情况下也不易产生裂缝且能够抑制水分的侵入。电子部件具备层叠体和设置在层叠体的端面的外部电极(14b)。外部电极(14b)包含：Ni层(41),设置在端面；Ni-Sn合金层(42),设置在Ni层(41)上；以及树脂层(43),设置在Ni-Sn合金层(42)上,含有包含Sn粒子的金属粒子(50)。通过设置有Ni层(41)和Ni-Sn合金层(42),从而能够抑制从外部电极(14b)向层叠体的内部的水分的侵入,通过设置有树脂层(43),从而在对外部电极(14b)施加了弯曲应力的情况下,能够抑制裂缝的产生。(The invention provides an electronic component and a method for manufacturing the same, which are not easy to generate cracks and can inhibit the invasion of moisture even if bending stress is applied to an external electrode. The electronic component includes a laminate and an external electrode (14b) provided on an end face of the laminate. The external electrode (14b) includes: a Ni layer (41) provided on the end face; a Ni-Sn alloy layer (42) provided on the Ni layer (41); and a resin layer (43) that is provided on the Ni-Sn alloy layer (42) and contains metal particles (50) that contain Sn particles. The Ni layer (41) and the Ni-Sn alloy layer (42) are provided to suppress the intrusion of moisture from the external electrode (14b) into the laminate, and the resin layer (43) is provided to suppress the occurrence of cracks when bending stress is applied to the external electrode (14 b).)

1. An electronic component, comprising:

a laminate; and

an external electrode provided on an end face of the laminate,

the external electrode includes:

a Ni layer provided on the end face;

a Ni-Sn alloy layer disposed on the Ni layer; and

and a resin layer disposed on the Ni-Sn alloy layer and containing metal particles including Sn particles.

2. The electronic component of claim 1,

the metal particles include at least one of Ag particles, Cu particles, and Ni particles in addition to the Sn particles.

3. The electronic component according to claim 1 or 2,

the laminate is provided with internal electrodes containing Ni,

the internal electrode is drawn out to the end face where the external electrode is provided, and is connected to the external electrode,

the Ni layer and the internal electrode are sintered.

4. The electronic component according to any one of claims 1 to 3,

the metal particles have at least one of a flat shape and a spherical shape.

5. A method for manufacturing an electronic component including a laminate in which a plurality of dielectric layers and internal electrodes are alternately laminated and the internal electrodes are led out to both end surfaces, the method comprising:

preparing an unfired laminate which becomes the laminate after firing;

applying a conductive paste containing Ni to both end surfaces of the green laminate;

obtaining a laminate having an end face on which an Ni layer is formed by integrally firing the conductive paste containing Ni and the unfired laminate;

applying a resin paste containing metal particles including Sn particles on the Ni layer; and

and a step of performing heat treatment on the laminate coated with the resin paste to form a Ni — Sn alloy layer on the Ni layer and a resin layer containing the metal particles on the Ni — Sn alloy layer.

6. The method for manufacturing an electronic component according to claim 5,

the temperature at which the heat treatment is performed is 400 ℃ to 600 ℃.

Technical Field

The present invention relates to an electronic component having external electrodes on a surface of a laminate and a method for manufacturing such an electronic component.

Background

Electronic components having external electrodes on the surface of a laminate, such as a multilayer ceramic capacitor, are known. When a bending stress due to bending or the like is applied to the substrate in a state where such an electronic component is mounted on the substrate, cracks may occur in the external electrode. In this case, moisture may enter from the portion where the crack occurs, and the insulation resistance value may be lowered, thereby causing a short circuit of the internal electrodes provided in the stacked body.

Patent document 1 describes an electronic component in which resistance to bending stress is improved by forming an external electrode using a resin containing metal particles.

Prior art documents

Patent document

Patent document 1: japanese patent laid-open No. 2000-182883

However, since the resin easily transmits moisture, when the external electrode is formed using the resin, moisture may enter from the external electrode to the inside, and the insulation resistance value may decrease.

Disclosure of Invention

Problems to be solved by the invention

The present invention has been made to solve the above problems, and an object thereof is to provide an electronic component in which cracks are not easily generated and intrusion of moisture can be suppressed even when bending stress is applied to an external electrode, and a method for manufacturing such an electronic component.

Means for solving the problems

An electronic component according to the present invention includes: a laminate; and an external electrode provided on an end face of the laminate, the external electrode including: a Ni layer provided on the end face; a Ni-Sn alloy layer disposed on the Ni layer; and a resin layer provided on the Ni-Sn alloy layer and containing metal particles including Sn particles.

The metal particles may further include at least one of Ag particles, Cu particles, and Ni particles in addition to the Sn particles.

The laminate may include internal electrodes containing Ni, the internal electrodes may be drawn out to the end faces provided with the external electrodes and connected to the external electrodes, and the Ni layer and the internal electrodes may be sintered.

The metal particles may be configured to have at least one of a flat shape and a spherical shape.

A method for manufacturing an electronic component according to the present invention is a method for manufacturing an electronic component including a laminate in which a plurality of dielectric layers and internal electrodes are alternately laminated and the internal electrodes are drawn out to both end surfaces, the method including: preparing an unfired laminate which becomes the laminate after firing; applying a conductive paste containing Ni to both end surfaces of the green laminate; obtaining a laminate having an end face on which an Ni layer is formed by integrally firing the conductive paste containing Ni and the unfired laminate; applying a resin paste containing metal particles including Sn particles on the Ni layer; and a step of performing heat treatment on the laminate coated with the resin paste to form a Ni — Sn alloy layer on the Ni layer and a resin layer containing the metal particles on the Ni — Sn alloy layer.

The temperature at which the heat treatment is performed may be 400 ℃ or more and 600 ℃ or less.

Effects of the invention

The electronic component of the present invention is configured such that the external electrode includes: an Ni layer provided on an end face of the laminate; a Ni-Sn alloy layer disposed on the Ni layer; and a resin layer disposed on the Ni-Sn alloy layer and containing metal particles including Sn particles. The Ni layer and the Ni — Sn alloy layer are provided to suppress the penetration of moisture from the external electrode into the laminate, and the resin layer is provided to suppress the occurrence of cracks when a bending stress is applied to the external electrode.

Drawings

Fig. 1 is a perspective view of a multilayer ceramic capacitor according to an embodiment.

Fig. 2 is a sectional view of the laminated ceramic capacitor shown in fig. 1 taken along line II-II.

Fig. 3 is a cross-sectional view of the laminated ceramic capacitor shown in fig. 1 taken along the line III-III.

Fig. 4 is a sectional view showing a detailed structure of the second external electrode.

Description of the reference numerals

10: multilayer ceramic capacitor, 11: laminate, 12: dielectric layer, 13 a: first internal electrode, 13 b: second inner electrode, 14 a: first external electrode, 14 b: second external electrode, 15 a: first end face, 15 b: second end face, 16 a: first main surface, 16 b: second main surface, 17 a: first side, 17 b: second side, 41: ni layer, 42: ni — Sn alloy layer, 43: resin layer, 44: plating layer, 50: metal particles, 121: outer dielectric layer, 122: an inner dielectric layer.

Detailed Description

The following shows embodiments of the present invention and specifically describes features of the present invention.

In the following description, a multilayer ceramic capacitor is described as an example of an electronic component. However, the electronic component of the present invention is not limited to the multilayer ceramic capacitor.

Fig. 1 is a perspective view of a multilayer ceramic capacitor 10 according to an embodiment. Fig. 2 is a sectional view of the laminated ceramic capacitor 10 shown in fig. 1 taken along line II-II. Fig. 3 is a cross-sectional view of the laminated ceramic capacitor 10 shown in fig. 1 taken along the line III-III.

As shown in fig. 1 to 3, the multilayer ceramic capacitor 10 is an electronic component having a rectangular parallelepiped shape as a whole, and includes a multilayer body 11 and a pair of external electrodes 14(14a, 14 b). The pair of external electrodes 14(14a, 14b) are arranged to face each other as shown in fig. 1.

Here, a direction in which the pair of external electrodes 14 face each other is defined as a longitudinal direction L of the multilayer ceramic capacitor 10, a lamination direction of the internal electrodes 13(13a, 13b) described later is defined as a thickness direction T, and a direction orthogonal to both the longitudinal direction L and the thickness direction T is defined as a width direction W.

The laminate 11 has: a first end surface 15a and a second end surface 15b opposing each other in the longitudinal direction L; a first main surface 16a and a second main surface 16b opposed to each other in the thickness direction T; and a first side surface 17a and a second side surface 17b opposed in the width direction W.

The first end face 15a is provided with a first external electrode 14a, and the second end face 15b is provided with a second external electrode 14 b. The detailed structure of the first external electrode 14a and the second external electrode 14b will be described later.

The dimension of the laminate 11 in the longitudinal direction L is, for example, 0.4mm to 3.2mm, the dimension of the laminate in the width direction W is, for example, 0.2mm to 2.5mm, and the dimension of the laminate in the thickness direction T is, for example, 0.2mm to 2.5 mm. The dimension in the longitudinal direction L may be longer or shorter than the dimension in the width direction W. The size of the laminate 11 can be measured with a micrometer or an optical microscope.

The stacked body 11 is preferably rounded at the corner portions and the ridge portions. Here, the corner portion is a portion where three surfaces of the laminated body 11 intersect, and the ridge portion is a portion where two surfaces of the laminated body 11 intersect.

As shown in fig. 2 and 3, the laminated body 11 includes dielectric layers 12, first internal electrodes 13a, and second internal electrodes 13 b.

The dielectric layer 12 includes: an outer dielectric layer 121 located on the outer side in the thickness direction of the laminate 11; and an inner dielectric layer 122 between the first and second internal electrodes 13a and 13 b. The outer dielectric layer 121 has a thickness of, for example, 20 μm or more. The thickness of the interlayer dielectric layer 122 is, for example, 0.5 μm or more and 2.0 μm or less.

The first internal electrodes 13a are drawn out to the first end face 15a of the laminated body 11. Further, the second inner electrodes 13b are drawn to the second end face 15b of the laminated body 11. The first internal electrodes 13a and the second internal electrodes 13b are alternately arranged with the inter-layer dielectric layers 122 interposed therebetween in the thickness direction T.

The first inner electrode 13a includes: an opposite electrode portion as a portion opposite to the second inner electrode 13 b; and a lead electrode portion as a portion led from the opposite electrode portion to the first end face 15a of the laminated body 11. The second inner electrode 13b includes: an opposite electrode portion as a portion opposite to the first inner electrode 13 a; and a lead electrode portion as a portion led from the opposite electrode portion to the second end face 15b of the laminated body 11.

The counter electrode portion of the first inner electrode 13a and the counter electrode portion of the second inner electrode 13b face each other with the interlayer dielectric layer 122 interposed therebetween to form a capacitance, thereby functioning as a capacitor.

The first internal electrodes 13a and the second internal electrodes 13b contain, for example, metals such as Ni, Cu, Ag, Pd, and Au, alloys of Ag and Pd, and the like. Preferably, the first internal electrode 13a and the second internal electrode 13b contain Ni. The first internal electrode 13a and the second internal electrode 13b may further include dielectric particles having the same composition system as the ceramic included in the dielectric layer 12.

The thickness of the first internal electrode 13a and the second internal electrode 13b is preferably 0.5 μm or more and 2.0 μm or less.

The first external electrode 14a is formed on the entire first end surface 15a of the laminate 11, and is formed so as to extend from the first end surface 15a to the first main surface 16a, the second main surface 16b, the first side surface 17a, and the second side surface 17 b. The first external electrode 14a is electrically connected to the first internal electrode 13 a.

The second external electrode 14b is formed on the entire second end surface 15b of the laminate 11, and is formed so as to extend from the second end surface 15b to the first main surface 16a, the second main surface 16b, the first side surface 17a, and the second side surface 17 b. The second external electrode 14b is electrically connected to the second internal electrode 13 b.

Fig. 4 is a sectional view showing a detailed structure of the second external electrode 14 b. Hereinafter, the structure of the second external electrode 14b will be described, but the same applies to the structure of the first external electrode 14 a.

The second external electrode 14b includes a Ni layer 41, a Ni — Sn alloy layer 42, a resin layer 43, and a plating layer 44.

An Ni layer 41 made of Ni is provided on the second end face 15b of the laminated body 11. In the present embodiment, the Ni layer 41 is provided only on the second end face 15b without passing over the first main face 16a, the second main face 16b, the first side face 17a, and the second side face 17 b.

The thickness of the Ni layer 41 is preferably 2 μm or more and 10 μm or less, for example. If the thickness of Ni layer 41 is less than 2 μm, the effect of suppressing the intrusion of moisture from the outside to the inside becomes low. When the thickness of the Ni layer 41 exceeds 10 μm, the thickness of the entire external electrode increases, and the size of the multilayer ceramic capacitor 10 increases.

The Ni layer 41 is integrally sintered with the second internal electrode 13 b. Although not shown, the Ni layer provided on the first external electrode 14a side is integrally sintered with the first internal electrode 13 a. By integrally sintering the Ni layer 41 and the second internal electrode 13b, the adhesion between the Ni layer 41 and the second internal electrode 13b is increased, and the occurrence of a weak portion at the interface between the stacked body 11 and the Ni layer 41 can be suppressed.

The Ni — Sn alloy layer 42 is a layer made of an alloy of Ni and Sn, and is provided on the Ni layer 41. In the present embodiment, the Ni — Sn alloy layer 42 is provided so as not to go over the first main surface 16a, the second main surface 16b, the first side surface 17a, and the second side surface 17b, as in the Ni layer 41. By providing the Ni — Sn alloy layer on the Ni layer 41, the penetration of moisture from the outside to the inside can be more effectively suppressed, and the reduction in insulation resistance can be suppressed.

The thickness of the Ni-Sn alloy layer 42 is preferably 1 μm or more and 5 μm or less. If the thickness of the Ni — Sn alloy layer 42 is less than 1 μm, the effect of suppressing the intrusion of moisture from the outside to the inside becomes low. When the thickness of the Ni — Sn alloy layer 42 exceeds 5 μm, the thickness of the entire external electrode increases, and the size of the multilayer ceramic capacitor 10 increases.

The resin layer 43 is provided on the Ni — Sn alloy layer 42, and contains metal particles 50 including Sn particles. The resin layer 43 is provided not only on the Ni — Sn alloy layer 42 but also so as to bypass the first main surface 16a, the second main surface 16b, the first side surface 17a, and the second side surface 17 b.

The metal particles 50 contained in the resin layer 43 may be Sn particles alone, or may contain at least one of Ag particles, Cu particles, and Ni particles in addition to Sn particles. By including at least one of Ag particles, Cu particles, and Ni particles in addition to Sn particles as the metal particles 50 included in the resin layer 43, the equivalent series resistance can be reduced as compared with a structure including only Sn particles.

The metal particles 50 contained in the resin layer 43 have at least one of a flat shape and a spherical shape. That is, the resin layer 43 may contain only the flat-shaped metal particles 50, may contain only the spherical-shaped metal particles 50, or may contain both of them. The spherical shape includes not only a true sphere but also a shape close to a sphere.

The resin layer 43 contains the metal particles 50 having a flat shape, thereby improving conductivity. Further, by including spherical metal particles 50 in resin layer 43, it is possible to provide a structure in which cracks are less likely to occur in external electrode 14 when bending stress is applied to laminated ceramic capacitor 10. Therefore, the resin layer 43 preferably contains the metal particles 50 having a flat shape and the metal particles 50 having a spherical shape.

As the resin contained in the resin layer 43, for example, a thermosetting resin such as an epoxy resin can be used.

For example, when the laminated ceramic capacitor 10 has a 1005 size (length direction L: 1.0mm, width direction W: 0.5mm), the thickness of the resin layer 43 is 20 μm or more and 30 μm or less. The resin layer 43 is formed so as to extend around the first main surface 16a, the second main surface 16b, the first side surface 17a, and the second side surface 17b of the laminate 11.

The particle diameter of the metal particles 50 is, for example, 1 μm or more and 10 μm or less. The particle diameter in the case where the metal particles are not spherical is the sphere equivalent diameter. The content of the metal particles in the resin layer 43 is preferably 40 vol% or more. By setting the content of the metal particles to 40 vol% or more, good conductivity of the resin layer 43 can be ensured.

The plating layer 44 is provided on the resin layer 43. The plating layer 44 contains, for example, at least one of Cu, Ni, Ag, Pd, an alloy of Ag and Pd, Au, and the like.

The plating layer 44 may be one layer or a plurality of layers. However, the plating layer 44 is preferably a two-layer configuration of a Ni plating layer and a Sn plating layer. The Ni plating layer functions to prevent solder corrosion when the resin layer 43 and the like are mounted on the multilayer ceramic capacitor 10. The Sn plating layer also functions to improve the wettability of the solder when the multilayer ceramic capacitor 10 is mounted.

The thickness of each layer of the plating layer 44 is preferably 2 μm or more and 8 μm or less, for example.

(method for manufacturing multilayer ceramic capacitor)

First, a ceramic slurry in which a binder and an organic solvent are mixed and dispersed in a dielectric ceramic powder is prepared, and a ceramic slurry is applied to a resin film to produce a ceramic green sheet.

Next, an internal electrode conductive paste is prepared, and the internal electrode conductive paste is printed on the ceramic green sheets, thereby forming an internal electrode pattern. The conductive paste for internal electrodes contains, for example, Ni powder, an organic solvent, a binder, and the like. The conductive paste for internal electrodes can be printed by a printing method such as screen printing or gravure printing.

Next, a predetermined number of ceramic green sheets on which no internal electrode pattern is formed are stacked, ceramic green sheets on which internal electrode patterns are formed are sequentially stacked, and a predetermined number of ceramic green sheets on which no internal electrode pattern is formed are further stacked, thereby producing a mother laminate.

Next, the mother laminate is pressed by a rigid body press, an isostatic press, or the like.

Next, the pressed mother laminate is cut into a given size by a cutting method such as cutting, scribing, laser, or the like. Then, the corner portions and the ridge portions are rounded by barrel polishing or the like. Through the above-described steps, an unfired laminate was obtained. In the green laminate, the internal electrode patterns are exposed at both end surfaces.

Next, a conductive paste containing Ni is applied to the stage to form a conductive paste layer containing Ni. Then, one end face of the green laminate having the internal electrode patterns exposed on both end faces is immersed in the conductive paste layer containing Ni, and one end face is covered with the conductive paste containing Ni. In this case, one end surface may be immersed in the conductive paste layer containing Ni while holding the side surface of the green laminate with an elastic body, or the other end surface of the green laminate may be bonded and held to a holding member, not shown, via an adhesive, and one end surface may be immersed in the conductive paste layer containing Ni. In addition, the conductive paste containing Ni may contain glass.

The thickness of the Ni-containing conductive paste layer formed on the stage is preferably equal to or less than the R amount of the ridge portion of the green laminate. If the thickness of the conductive paste layer containing Ni is equal to or less than the R amount of the ridge portion of the green laminate, the conductive paste containing Ni can be applied almost only to the end face when the end face of the green laminate is immersed in the conductive paste layer containing Ni.

In the same manner, the conductive paste containing Ni was also applied to the other end face of the green laminate.

The method of applying the conductive paste containing Ni to the end face of the green laminate is not limited to the above-described method, and other methods such as screen printing may be used.

Next, the organic solvent contained in the Ni-containing conductive paste is removed by drying. For example, the drying is performed in a high-temperature atmosphere of 80 ℃ to 150 ℃. However, the drying method is not particularly limited, and for example, hot air may be blown or drying may be performed using far infrared rays.

Next, the unfired laminate coated with the conductive paste containing Ni is fired at a temperature of, for example, 1000 ℃ to 1200 ℃. In the present embodiment, a fired laminate and an Ni layer are obtained by so-called co-firing in which an unfired laminate and an electrically conductive paste containing Ni are fired simultaneously. By integrally firing the unfired laminate and the Ni-containing conductive paste, the adhesion between the laminate obtained after firing and the Ni layer is increased, and the formation of weak portions at the interface between the laminate and the Ni layer can be suppressed.

Further, by using Ni powder as the metal powder contained in the internal electrode conductive paste, the bonding force between the internal electrode obtained after firing and the Ni layer can be further improved.

Further, since the conductive paste containing Ni is applied only to the end faces, the laminate does not become tight due to shrinkage during the formation of the Ni layer during firing, and the occurrence of cracks in the laminate due to shrinkage can be suppressed.

In addition, when a large number of green laminates are fired at a time to improve productivity, if a conductive paste containing Ni is applied to the side surfaces and the main surfaces, the conductive paste containing Ni may adhere to other green laminates. However, in the present embodiment, since the conductive paste containing Ni is not applied to the side surfaces and the main surface, adhesion to other green laminates can be suppressed, and productivity can be improved.

Next, a resin paste in which metal particles are mixed with an epoxy resin is applied to a table to form a resin paste layer. The metal particles contain at least Sn particles. The thickness of the resin paste layer is preferably thicker than the thickness of the conductive paste layer containing Ni formed on the stage.

Then, the Ni layer provided on the end face of the laminate was impregnated in the resin paste layer. The impregnation into the resin paste layer can be performed by the same method as the impregnation into the Ni-containing conductive paste layer described above.

After Ni layers provided on both end surfaces of a laminate are impregnated in a resin paste layer, the resin paste is thermally cured at a temperature of 100 ℃ to 200 ℃, and further heat-treated at a temperature of 400 ℃ to 600 ℃. By the heat treatment, Sn particles contained in the resin paste react with Ni contained in the Ni layer, and a Ni — Sn alloy layer is formed on the sintered Ni layer. Further, a resin layer containing metal particles is formed on the Ni — Sn alloy layer.

Next, a plating layer is formed on the resin layer. For example, a Ni plating layer is formed on the resin layer, and a Sn plating layer is formed on the Ni plating layer. The plating layer can be formed by electrolytic plating, for example.

Through the above-described steps, a multilayer ceramic capacitor in which external electrodes including a Ni layer, a Ni — Sn alloy layer, a resin layer containing metal particles including Sn particles, and a plating layer are formed on both end surfaces of a multilayer body in which a plurality of dielectric layers and internal electrodes are alternately laminated can be manufactured.

The present invention is not limited to the above embodiments, and various applications and modifications can be made within the scope of the present invention.

For example, although the above embodiment has been described with the plating layer provided on the external electrodes, the external electrodes may be configured without the plating layer.

The method for manufacturing the multilayer ceramic capacitor 10 as an electronic component is not limited to the above-described method. In the above embodiment, the following is explained: in forming the external electrode, a resin paste containing metal particles including Sn particles is applied to the Ni layer, and then heat treatment is performed to simultaneously form a Ni — Sn alloy layer and a resin layer. However, the Ni layer, the Ni — Sn alloy layer, and the resin layer may be formed in this order.