阅读说明：本技术 一种利用激光加工面膜基材的方法 (Method for processing facial mask base material by using laser ) 是由 赵晓杰 吴双 秦国双 于 2019-09-20 设计创作，主要内容包括：本发明公开了一种利用激光加工面膜基材的方法,涉及激光加工技术领域。所述方法包括以下步骤：在面膜基材上用激光加工出微型间隔结构,所述微型间隔结构的相邻间隔20～100μm；其中,所述激光的聚焦光斑大小控制在5～30μm,激光波段参数为400～800nm,光斑圆度要求在85％以上,激光可调节的重复频率在80kHz～1000kHz,光束质量M<Sup>2</Sup>小于1.3。本发明是利用激光技术,选择合适的激光参数,对面膜基材进行处理,在面膜基材表面加工出微型间隔结构,既可以满足对材料作用的阈值,也不会改变材料本身的功能,破坏面膜基材原结构；本发明利用激光加工面膜基材的方法,得到的面膜基材对于不同的分子有选择性的透过或吸附,既可以充分发挥精华液的作用,也可以拓宽基材的选择范围。(The invention discloses a method for processing a mask base material by using laser, and relates to the technical field of laser processing. The method comprises the following steps: processing a micro spacing structure on the mask base material by using laser, wherein the adjacent interval of the micro spacing structure is 20-100 mu m; wherein the size of a focusing light spot of the laser is controlled to be 5-30 mu M, the parameters of a laser wave band are 400-800 nm, the roundness requirement of the light spot is more than 85%, the adjustable repetition frequency of the laser is 80-1000 kHz, and the beam quality M is 2 Less than 1.3. The method utilizes a laser technology, selects proper laser parameters, processes the facial mask base material, and processes a micro spacing structure on the surface of the facial mask base material, thereby not only meeting the threshold value of the action on the material, but also not changing the function of the material and damaging the original structure of the facial mask base material; according to the invention, by using the method of processing the mask base material by using the laser, the obtained mask base material selectively permeates or adsorbs different molecules, so that the effect of the essence can be fully exerted, and the selection range of the base material can be widened.)

1. A method of processing a mask substrate using a laser, the method comprising the steps of:

processing a micro spacing structure on the mask base material by using laser, wherein the adjacent interval of the micro spacing structure is 20-100 mu m;

wherein the size of a focusing light spot of the laser is controlled to be 5-30 mu M, the parameters of a laser wave band are 400-800 nm, the roundness requirement of the light spot is more than 85%, the adjustable repetition frequency of the laser is 80-1000 kHz, and the beam quality M is²Less than 1.3.

2. The method of processing a mask substrate using a laser as claimed in claim 1, wherein the mask substrate comprises a synthetic fiber nonwoven fabric, a natural fiber nonwoven fabric.

3. The method for processing the mask substrate by using the laser as claimed in claim 2, wherein when the mask substrate is a synthetic fiber non-woven fabric, the pulse width of the laser is less than 2ps, the laser band parameter is 515-532 nm, and the laser focusing spot size is 10 μm.

4. The method for processing a mask substrate using a laser according to claim 3, wherein the micro spacer structure comprises micro pores, and the diameter of the micro pores is 15 to 35 μm.

5. The method of using a laser to process a mask substrate according to claim 4, wherein said laser processing a micro spacer structure on the mask substrate further comprises:

in the light path, 1/4 wave plate is adopted to make the light beam become circular polarization and act on each part of the mask base material.

6. The method for processing the mask base material by using the laser as claimed in claim 2, wherein the natural fiber non-woven fabric is one of a fruit and vegetable fiber non-woven fabric and a pure cotton fiber non-woven fabric, the pulse width of the laser is 800 fs-10 ns, the parameter of the laser band is 400-800 nm, and the size of the laser focusing spot is controlled to be 5-30 μm.

7. The method for processing a mask substrate using a laser according to claim 6, wherein the micro-spacer structure comprises one or more of a grid, a concentric circle, a spiral structure or a pit with a certain depth, and the width of the grid is 5 to 30 μm.

8. The method of processing a mask substrate using a laser as claimed in claim 7, wherein the depth of the micro spacer structure is not more than 50% of the thickness of the mask substrate itself.

Technical Field

The invention relates to the technical field of laser processing, in particular to a method for processing a mask base material by using laser.

Background

With the improvement of the living standard, people pay more attention to the physical health and the maintenance of the appearance. In our daily skin care products, besides well-known moisturizing water, essence and the like, there are also patch type facial masks which are increasingly widely used nowadays. According to different functional liquid components added in the facial mask, different skin care effects can be realized, and the effects of moisturizing, whitening, cleaning, aging resistance and the like are common. According to different mask materials, the surface mount type mask base materials in the market at present are divided into natural fiber non-woven fabrics and synthetic fiber non-woven fabrics, and can be further divided into fruit and vegetable fiber masks, pure cotton fabric masks, crystal type surface films, invisible silk masks and the like. However, different facial masks have advantages and disadvantages due to substrate limitations. For example, the non-woven fabric mask base material is fluffy and soft, has good uniformity of a cotton net, does not generate fiber scraps, is tough and durable, but is thick and not skin-friendly, has poor affinity with the skin, can cause non-fitting, has general air permeability and influences the whole using effect.

The invention utilizes the technology of laser processing the facial mask base material to carry out laser processing on the facial mask base material, so that the preparation of the facial mask is not limited by the selection of the facial mask base material. The surface treatment is carried out on the facial mask base material through the laser, so that the facial mask base material can selectively permeate or adsorb different molecules, the effect of essence can be fully exerted, the selection range of the base material can be widened, and the research and development of the facial mask industry can be further broken through.

Disclosure of Invention

In order to overcome the problems in the prior art, the invention provides a method for processing a facial mask base material by using laser, which utilizes the laser technology to process the facial mask base material so that the facial mask base material selectively permeates or adsorbs different molecules, thus not only allowing a human body to fully absorb essence, but also widening the selection range of the facial mask base material.

According to the invention, the method for processing the mask substrate by using the laser comprises the following steps:

processing a micro spacing structure on the mask base material by using laser, wherein the adjacent interval of the micro spacing structure is 20-100 mu m;

wherein the size of a focusing light spot of the laser is controlled to be 5-30 mu M, the parameters of a laser wave band are 400-800 nm, the roundness of the light spot is required to be more than 85%, the adjustable repetition frequency of the laser is 80-1000 kHz, and the beam quality M is²Less than 1.3.

Preferably, the mask base material comprises a synthetic fiber non-woven fabric and a natural fiber non-woven fabric.

Preferably, when the mask base material is a synthetic fiber non-woven fabric, the pulse width of laser is less than 2ps, the laser wave band parameter is 515-532 nm, and the laser focusing spot size is 10 μm.

Preferably, when the mask base material is a synthetic fiber non-woven fabric, the micro spacing structure comprises micro pores, and the diameter of the micro pores is 15-35 μm.

Preferably, when the mask base material is a synthetic fiber nonwoven fabric, the laser processing of the micro spacer structure on the mask base material further includes:

in the light path, 1/4 wave plate is adopted to make the light beam become circular polarization and act on each part of the mask base material.

Preferably, the natural fiber non-woven fabric is one of fruit and vegetable fiber non-woven fabrics and pure cotton fiber non-woven fabrics, the pulse width of laser is 800 fs-10 ns, the parameter of the laser wave band is 400-800 nm, and the size of the laser focusing spot is controlled to be 5-30 μm.

Preferably, when the mask base material is a natural fiber non-woven fabric, the micro spacing structure comprises one or more of a grid with a certain depth, a concentric circle, a spiral structure or a pit, and the grid width is 5-30 μm.

Preferably, when the mask base material is a natural fiber non-woven fabric, the depth of the micro-spacer structure is not more than 50% of the thickness of the mask base material.

The method utilizes a laser technology, selects proper laser parameters, processes the facial mask base material, and processes a micro spacing structure on the surface of the facial mask base material, thereby not only meeting the threshold value of the action on the material, but also not changing the function of the material and damaging the original structure of the facial mask base material (such as melting and other phenomena); according to the invention, by using the method of processing the mask base material by using the laser, the obtained mask base material selectively permeates or adsorbs different molecules, so that the effect of the essence can be fully exerted, and the selection range of the base material can be widened.

Through on the facial mask substrate at synthetic fiber non-woven fabrics with laser beam machining play miniature pore structure, modify its surface, can make more gas molecules pass through the facial mask substrate, because miniature pore edge is clear clean simultaneously, more do benefit to passing through of gas molecule like this, pin nutrient composition when improving the air permeability. The surface area of the base material is increased by processing the structures such as grid lines on the mask base material of the natural fiber non-woven fabric by laser, so that the adsorption of essence on the surface of the base material is improved, and the nutrient components are locked.

Detailed Description

In order to more fully understand the technical content of the present invention, the technical solution of the present invention will be further described and illustrated with reference to the following specific examples, which are given as preferred embodiments of the present invention. The present invention may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete.