阅读说明：本技术 一种增强薄膜电容器喷金层强度的喷金工艺 (Gold spraying process for enhancing strength of gold spraying layer of thin film capacitor ) 是由 陆国平 朱雪坤 郭靖 于 2020-04-29 设计创作，主要内容包括：本发明公开了一种增强薄膜电容器喷金层强度的喷金工艺,所述增强薄膜电容器喷金层强度的喷金工艺的工艺包括以下步骤：S1,将薄膜电容器放置在操作台上,利用工装进行夹紧固定；S2,调整喷枪与电容器之间的距离,对薄膜电容器的两个端面进行一次喷金,使用锡材料为基底进行喷金；S3,对薄膜电容器的两个端面进行二次喷金,使用锌材料加厚进行喷金。本发明中,通过三次喷金工艺,将锌材料镀在锡材料的中间位置,解决了电容器薄膜喷金过程产生的热量对薄膜电容器产生损伤的问题,增强了薄膜电容器端面的喷金层的整体强度,减小了强电流冲击对包薄膜电容器的损伤,提高了薄膜电容器的使用寿命。(The invention discloses a gold spraying process for enhancing the strength of a gold spraying layer of a thin film capacitor, which comprises the following steps: s1, placing the film capacitor on an operation table, and clamping and fixing the film capacitor by using a tool; s2, adjusting the distance between the spray gun and the capacitor, spraying gold on two end faces of the film capacitor for the first time, and spraying gold on the substrate made of tin material; and S3, performing secondary metal spraying on the two end faces of the film capacitor, and performing metal spraying by thickening a zinc material. According to the invention, the zinc material is plated in the middle of the tin material through the three-time gold spraying process, so that the problem that the film capacitor is damaged by heat generated in the gold spraying process of the film of the capacitor is solved, the overall strength of the gold spraying layer on the end surface of the film capacitor is enhanced, the damage of strong current impact on the film-covered capacitor is reduced, and the service life of the film capacitor is prolonged.)

1. The gold spraying process for enhancing the strength of the gold spraying layer of the thin film capacitor is characterized by comprising the following steps of:

s1, placing the film capacitor on an operation table, and clamping and fixing the film capacitor by using a tool;

s2, adjusting the distance between the spray gun and the film capacitor, spraying gold on two end faces of the film capacitor for the first time, and spraying gold on the substrate made of tin material;

s3, performing secondary metal spraying on two end faces of the film capacitor, and thickening by using a zinc material to perform metal spraying;

s4, fixing copper wires on the end faces of the two ends of the thin film capacitor, spraying gold on the two end faces of the thin film capacitor for three times, and spraying gold on the two end faces of the thin film capacitor by using a tin material;

s5, cutting off redundant copper wires after spraying gold; and obtaining the film capacitor with complete metal spraying.

2. The process of claim 1, wherein the thickness of the sputtered Sn material in step S2 is 0.04-0.06 mm.

3. The metal spraying process for enhancing the strength of the metal spraying layer of the thin film capacitor as claimed in claim 1, wherein the thickness of the metal spraying layer of the zinc material in the step S3 is 0.20-0.30 mm.

4. The metal spraying process for enhancing the strength of the gold spraying layer of the thin film capacitor as claimed in claim 1, wherein the thickness of the gold spraying layer of the tin material in the step S4 is 0.04-0.06 mm.

5. The process of claim 1, wherein the diameter of the copper wire is determined by the thickness of the tin material.

Technical Field

The invention relates to the technical field of capacitor film processing, in particular to a gold spraying process for enhancing the strength of a gold spraying layer of a film capacitor.

Background

The gold spraying process of the thin film capacitor is one of key procedures in the production of the metalized capacitor, and the gold spraying method comprises the following steps: and performing electric spraying, air spraying and high-speed spraying on the crushed metal particles in a gap of a thin film layer of the surface of the capacitor core group with extremely high sensitivity to heat energy, so that the end surface of the core group forms an equipotential metal electrode surface from an inner winding layer to an outer winding layer, and the metal electrode surface on the thin film leads out the electrode degree through metal spraying paint.

In the prior art, after the thin film capacitor is subjected to metal spraying, a tiny gap can be formed in the metal spraying surface, and the conductivity of the thin film capacitor can be changed under the impact of strong current, so that the service life of the thin film capacitor is shortened.

Disclosure of Invention

The invention aims to: in order to solve the problem of unstable conductivity of the thin film capacitor, the gold spraying process for enhancing the strength of the gold spraying layer of the thin film capacitor is provided.

In order to achieve the purpose, the invention adopts the following technical scheme:

a gold spraying process for enhancing the strength of a gold spraying layer of a thin film capacitor comprises the following steps:

s1, placing the film capacitor on an operation table, and clamping and fixing the film capacitor by using a tool;

s2, adjusting the distance between the spray gun and the capacitor, spraying gold on two end faces of the film capacitor for the first time, and spraying gold on the substrate made of tin material;

s3, performing secondary metal spraying on two end faces of the film capacitor, and thickening by using a zinc material to perform metal spraying;

s4, fixing copper wires on the end faces of the two ends of the thin film capacitor, spraying gold on the two end faces of the thin film capacitor for three times, and spraying gold on the two end faces of the thin film capacitor by using a tin material;

s5, cutting off redundant copper wires after spraying gold; and obtaining the film capacitor with complete metal spraying.

As a further description of the above technical solution:

the gold spraying thickness of the tin material in the step S2 is 0.04-0.06 mm.

As a further description of the above technical solution:

the thickness of the gold spraying of the zinc material in the step S3 is 0.20-0.30 mm.

As a further description of the above technical solution:

and in the step S4, the gold spraying thickness of the tin material is 0.04-0.06 mm.

As a further description of the above technical solution:

the diameter of the copper wire is determined by the thickness of the tin material sprayed with gold.

In summary, due to the adoption of the technical scheme, the invention has the beneficial effects that:

1. according to the invention, the zinc material is plated in the middle of the tin material through the three-time gold spraying process, so that the problem that the film capacitor is damaged by heat generated in the gold spraying process of the film of the capacitor is solved, the overall strength of the gold spraying layer on the end surface of the film capacitor is enhanced, the damage of strong current impact on the film-covered capacitor is reduced, and the service life of the film capacitor is prolonged.

2. According to the thin film capacitor, the copper wire is wrapped in the gold-sprayed layer through the arrangement of the copper wire, the conductive stability of the thin film capacitor is improved by utilizing the excellent conductive performance of electrification, the loss rate of the thin film capacitor in the charging and discharging processes is effectively reduced, and the service life of the thin film capacitor is prolonged.

Detailed Description

The following will clearly and completely describe the technical solutions in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.

Example 1

A gold spraying process for enhancing the strength of a gold spraying layer of a thin film capacitor comprises the following steps:

s1, placing the film capacitor on an operation table, and clamping and fixing the film capacitor by using a tool;

s2, adjusting the distance between the spray gun and the capacitor, spraying gold on two end faces of the film capacitor for the first time, and spraying gold on a tin material serving as a substrate, wherein the thickness of the sprayed gold of the tin material is 0.04-0.06 mm;

s3, performing secondary metal spraying on two end faces of the thin film capacitor, and performing metal spraying by thickening a zinc material, wherein the thickness of the metal spraying of the zinc material is 0.20-0.30mm, so that the strength of the metal spraying layer on the end faces of the thin film capacitor is enhanced, and the current impact resistance strength of the thin film capacitor is improved;

s4, fixing copper wires on the end faces of the two ends of the thin film capacitor, spraying gold on the two end faces of the thin film capacitor for three times, spraying gold on a tin material, wherein the thickness of the sprayed gold on the tin material is 0.04-0.06mm, the loss rate of the thin film capacitor in the continuous charging and discharging process is effectively reduced, the attenuation of the capacity of the thin film capacitor is reduced, the diameter of the copper wires is determined by the thickness of the sprayed gold on the zinc material, and the diameter of the copper wires is smaller than or equal to the thickness of the sprayed gold on the tin material, so that the end face smoothness of the thin film capacitor is ensured, and the conductive stability of the thin film capacitor is improved;

s5, cutting off redundant copper wires after spraying gold; the film capacitor with complete metal spraying is obtained, the copper wire has excellent conductivity, and the conductivity of the film capacitor can be enhanced by the additionally arranged copper wire.

Example 2

Different from the embodiment 1, S2, the thickness of the gold spraying of the tin material is 0.02-0.04 mm;

example 3

Different from the embodiment 1, S2, the thickness of the gold spraying of the tin material is 0.06-0.08 mm;

dielectric strength (breakdown strength): the maximum voltage required to cause dielectric breakdown of a polymer material is generally expressed as the number of voltages at which a sample per unit thickness is broken down.

E＝V/d；

Wherein: e-dielectric strength, KV/mm;

v-breakdown voltage, KV;

d, the thickness of the metal spraying of the thin film capacitor is mm.

The following table shows the test data for the dielectric strength obtained under the same test conditions:

from the experimental data of the table above, it can be seen that: when the thickness of the zinc material sprayed with gold is 0.20-0.30mm and the thickness of the tin material sprayed with gold is 0.04-0.06mm, the breakdown voltage of the film capacitor is the highest and the dielectric strength is the highest.

The above description is only for the preferred embodiment of the present invention, but the scope of the present invention is not limited thereto, and any person skilled in the art should be considered to be within the technical scope of the present invention, and the technical solutions and the inventive concepts thereof according to the present invention should be equivalent or changed within the scope of the present invention.