阅读说明：本技术 激光抛光装置和激光抛光方法 (Laser polishing apparatus and laser polishing method ) 是由 赵振宇 张玉洁 肖永山 周浩 帅词俊 罗博伟 于 2021-08-23 设计创作，主要内容包括：本发明涉及激光加工技术领域,公开了一种激光抛光装置和激光抛光方法,激光抛光装置包括：机箱；工作台,设于机箱内,并用于放置工件；激光发射机构,设于机箱内,用于先后发射第一激光和第二激光至工件上,第二激光的脉冲宽度小于第一激光的脉冲宽度；监测机构,设于机箱内,包括热成像仪、电子显微镜、监控摄像头中的至少一种,监测机构用于采集工件的表面信息。上述激光抛光装置可通过激光发射机构发射不同脉冲宽度的激光至工件上,对工件进行粗抛和精抛的结合,有效降低工件表面的粗糙度,并通过监测机构实时监测工件的抛光情况,有效改善了目前激光抛光装置抛光后的产品表面粗糙度大、抛光效果差、抛光过程无法实时观测的问题。(The invention relates to the technical field of laser processing, and discloses a laser polishing device and a laser polishing method, wherein the laser polishing device comprises: a chassis; the workbench is arranged in the case and used for placing a workpiece; the laser emission mechanism is arranged in the case and used for sequentially emitting a first laser and a second laser to the workpiece, and the pulse width of the second laser is smaller than that of the first laser; the monitoring mechanism is arranged in the case and comprises at least one of a thermal imager, an electron microscope and a monitoring camera, and the monitoring mechanism is used for acquiring surface information of the workpiece. The laser polishing device can emit laser with different pulse widths to a workpiece through the laser emitting mechanism, combines rough polishing and fine polishing on the workpiece, effectively reduces the roughness of the surface of the workpiece, monitors the polishing condition of the workpiece in real time through the monitoring mechanism, and effectively solves the problems that the surface roughness of a product polished by the conventional laser polishing device is large, the polishing effect is poor, and the polishing process cannot be observed in real time.)

1. A laser polishing apparatus for polishing a workpiece, comprising:

a chassis;

the workbench is arranged in the case and used for placing a workpiece;

the laser emission mechanism is arranged in the case and used for sequentially emitting a first laser and a second laser onto a workpiece, and the pulse width of the second laser is smaller than that of the first laser;

the monitoring mechanism is arranged in the case and comprises at least one of a thermal imager, an electron microscope and a monitoring camera, and the monitoring mechanism is used for acquiring surface information of the workpiece.

2. The laser polishing apparatus according to claim 1, wherein the laser emitting mechanism comprises:

a first laser for emitting the first laser light;

a second laser for emitting the second laser light;

the laser beam path adjusting device comprises a first laser galvanometer component and a second laser galvanometer component, wherein the first laser galvanometer component and the second laser galvanometer component are respectively used for adjusting the path of laser emitted by the first laser and the second laser.

3. The laser polishing apparatus according to claim 2, wherein the first laser is a nanosecond pulsed laser, and the second laser is a picosecond pulsed laser.

4. The laser polishing apparatus according to claim 2, wherein the first laser galvanometer assembly and the second laser galvanometer assembly respectively comprise a plurality of sets of first lenses and a plurality of sets of second lenses, at least one of the sets of first lenses and at least one of the sets of second lenses being movable lenses for adjusting the polished focal position in real time.

5. The laser polishing apparatus according to claim 4, further comprising a control device electrically connected to the laser emitting mechanism, the control device being configured to import a three-dimensional image of a workpiece and draw a two-dimensional image that can cover the three-dimensional image of the workpiece to determine a polishing range on the two-dimensional image, and to convert coordinate information of the polishing range into a coordinate system value of the movable mirror and generate a control command;

the laser polishing device also comprises an electric control mechanism electrically connected with the control device, and the electric control mechanism is used for receiving the control instruction and controlling the movable lens to move so as to control the laser emission mechanism to polish the workpiece according to a preset polishing range.

6. The laser polishing apparatus according to claim 1, wherein the monitoring mechanism includes the thermal imager, the electron microscope and the monitoring camera which are arranged at intervals, and the thermal imager, the electron microscope and the monitoring camera are connected to the worktable;

the laser polishing device further comprises a first display screen, a second display screen and a wireless transmission unit, wherein the first display screen and the second display screen are respectively and electrically connected with the thermal imager and the electron microscope to respectively display the surface temperature of the workpiece and the material removal state and defects of the workpiece, and the wireless transmission unit is electrically connected with the monitoring camera and is in communication connection with external terminal equipment and used for transmitting the picture shot by the monitoring camera to the external terminal equipment in real time.

7. The laser polishing apparatus according to claim 6, further comprising:

the sealed cabin is arranged in the case, the workbench is rotatably connected to the bottom of the sealed cabin, and the thermal imager, the electron microscope and the monitoring camera are all connected to the side wall of the sealed cabin;

the sealed cover plate is arranged at the top of the sealed cabin so as to form a closed space in the sealed cabin, and a light-transmitting part is arranged on the sealed cover plate so as to enable laser to penetrate through the sealed cover plate;

and the sealing ring is arranged at the joint of the sealed cabin and the sealed cover plate.

8. The laser polishing apparatus as claimed in claim 7, further comprising a venting mechanism in communication with the capsule for venting an inert gas into the enclosed space.

9. A laser polishing method using the laser polishing apparatus according to any one of claims 1 to 8, characterized in that the laser polishing method comprises:

arranging a workpiece on a workbench;

setting a polishing range of the laser emission mechanism, wherein the polishing range corresponds to a polishing area of a workpiece;

emitting first laser to a polishing area of a workpiece to perform first polishing;

and emitting a second laser to the polishing area of the workpiece to perform second polishing, wherein the pulse width of the second laser is smaller than that of the first laser.

10. The laser polishing method according to claim 9, wherein setting the polishing range of the laser emitting mechanism includes:

importing a three-dimensional image of a workpiece;

drawing a two-dimensional image capable of covering a three-dimensional image of a workpiece, and determining a polishing range on the two-dimensional image;

and converting the coordinate information of the polishing range into a coordinate system value of the laser emission mechanism and generating a control instruction, wherein the control instruction is used for controlling the laser emission mechanism to emit the first laser and the second laser to the polishing area of the workpiece.

Technical Field

The invention relates to the technical field of laser processing, in particular to a laser polishing device and a laser polishing method.

Background

The ceramic material is an inorganic non-metallic material prepared by forming and high-temperature sintering natural or synthetic compounds. It has the advantages of high melting point, high hardness, high wear resistance, oxidation resistance, etc. Ceramic is a hard and brittle material, and the surface polishing of the material by traditional mechanical processing has a great challenge.

The laser polishing technique is a new polishing technique which has been rapidly developed in the recent 10 years, and gradually replaces the conventional polishing process in many fields with its own advantages and irreplaceability. The use of laser equipment for cutting, drilling and welding in industrial production is also known to many people. The existing laser polishing mainly utilizes the melting principle to smooth the surface of an object to be polished, but the obtained object has large surface roughness; in addition, the existing laser polishing device cannot observe the polishing process condition in real time and adjust corresponding parameters, and the polishing effect is poor.

Disclosure of Invention

In view of the above, the invention provides a laser polishing device and a laser polishing method, so as to solve the problems that in the prior art, a polished product of the laser polishing device has large surface roughness and poor polishing effect, and a polishing process cannot be observed in real time.

In a first aspect, an embodiment of the present invention provides a laser polishing apparatus for polishing a workpiece, including:

a chassis;

the workbench is arranged in the case and used for placing a workpiece;

the laser emission mechanism is arranged in the case and used for sequentially emitting a first laser and a second laser onto a workpiece, and the pulse width of the second laser is smaller than that of the first laser;

the monitoring mechanism is arranged in the case and comprises at least one of a thermal imager, an electron microscope and a monitoring camera, and the monitoring mechanism is used for acquiring surface information of the workpiece.

The laser polishing device can sequentially emit the lasers with different pulse widths to the workpiece through the laser emitting mechanism, the smaller the pulse width is, the higher the instantaneous energy of the lasers is, the workpiece can be combined with rough polishing and fine polishing through sequential polishing of the lasers with different pulse widths, the roughness of the surface of the workpiece is effectively reduced, the polishing condition of the workpiece can be monitored in real time through the monitoring mechanism, and the problems that the surface roughness of a product polished by the conventional laser polishing device is large, the polishing effect is poor, and the polishing process cannot be observed in real time are effectively solved.

In one embodiment, the laser emitting mechanism includes:

a first laser for emitting the first laser light;

a second laser for emitting the second laser light;

the laser beam path adjusting device comprises a first laser galvanometer component and a second laser galvanometer component, wherein the first laser galvanometer component and the second laser galvanometer component are respectively used for adjusting the path of laser emitted by the first laser and the second laser. Therefore, the first laser and the second laser are independent from each other, and the routes of the first laser and the second laser can be controlled respectively, so that accurate control is realized.

In one embodiment, the first laser is a nanosecond pulsed laser and the second laser is a picosecond pulsed laser. Because the pulse width of the second laser is less than that of the first laser, the workpiece can be polished twice, and the surface roughness of the workpiece is greatly reduced.

In one embodiment, the first and second laser galvanometer assemblies respectively comprise a plurality of sets of first lenses and a plurality of sets of second lenses, wherein at least one set of the first lenses and at least one set of the second lenses are movable lenses to adjust the polished focal position in real time. Because the positions of part of the lenses in the first laser galvanometer component and the second laser galvanometer component are adjustable, the flexibility of the first laser galvanometer component and the second laser galvanometer component is improved, and the accuracy of the laser irradiation in the polishing range is further improved.

In one embodiment, the laser polishing device further comprises a control device electrically connected to the laser emitting mechanism, wherein the control device is used for importing a three-dimensional image of a workpiece and drawing a two-dimensional image capable of covering the three-dimensional image of the workpiece so as to determine a polishing range on the two-dimensional image, and converting coordinate information of the polishing range into a coordinate system value of the movable lens and generating a control command;

the laser polishing device also comprises an electric control mechanism electrically connected with the control device, and the electric control mechanism is used for receiving the control instruction and controlling the movable lens to move so as to control the laser emission mechanism to polish the workpiece according to a preset polishing range. Therefore, the polishing range can be adjusted in real time through the control device, the laser can be accurately controlled to reach the polishing area of the workpiece corresponding to the preset polishing range through the electric control mechanism, and the flexibility and the accuracy of the laser polishing device are improved.

In one embodiment, the monitoring mechanism includes the thermal imager, the electron microscope and the monitoring camera which are arranged at intervals, and the thermal imager, the electron microscope and the monitoring camera are all connected to the workbench;

the laser polishing device further comprises a first display screen, a second display screen and a wireless transmission unit, wherein the first display screen and the second display screen are respectively and electrically connected with the thermal imager and the electron microscope to respectively display the surface temperature of the workpiece and the material removal state and defects of the workpiece, and the wireless transmission unit is electrically connected with the monitoring camera and is in communication connection with external terminal equipment and used for transmitting the picture shot by the monitoring camera to the external terminal equipment in real time. So, accessible thermal imaging appearance, electron microscope and surveillance camera head camera monitor the polishing process real-time and comprehensively, can prevent the damage that people's eye direct observation laser caused to in time adjust the polishing process parameter, reduce the defect of work piece.

In one embodiment, the laser polishing apparatus further includes:

the sealed cabin is arranged in the case, the workbench is rotatably connected to the bottom of the sealed cabin, and the thermal imager, the electron microscope and the monitoring camera are all connected to the side wall of the sealed cabin;

the sealed cover plate is arranged at the top of the sealed cabin so as to form a closed space in the sealed cabin, and a light-transmitting part is arranged on the sealed cover plate so as to enable laser to penetrate through the sealed cover plate;

and the sealing ring is arranged at the joint of the sealed cabin and the sealed cover plate. Therefore, the sealing performance of the sealed cabin can be ensured, and the consistency of environmental conditions when different workpieces are polished is further improved.

In an embodiment, the laser polishing apparatus further comprises a venting mechanism, wherein the venting mechanism is communicated with the sealed cabin and is used for venting inert gas into the closed space. Therefore, the workpiece can be prevented from reacting with oxygen in the polishing process, and the formation of an oxide layer on the surface of the workpiece can be avoided.

In a second aspect, an embodiment of the present application further provides a laser polishing method using the laser polishing apparatus according to any embodiment of the first aspect, where the laser polishing method includes:

arranging a workpiece on a workbench;

setting a polishing range of the laser emission mechanism, wherein the polishing range corresponds to a polishing area of a workpiece;

emitting first laser to a polishing area of a workpiece to perform first polishing;

and emitting a second laser to the polishing area of the workpiece to perform second polishing, wherein the pulse width of the second laser is smaller than that of the first laser.

According to the laser polishing method, the surface of the workpiece is subjected to rough polishing and fine polishing by using the lasers with different pulse widths, so that the roughness of the surface of the workpiece can be effectively reduced, and the polishing effect is improved.

In one embodiment, setting a polishing range of the laser emitting mechanism includes:

importing a three-dimensional image of a workpiece;

drawing a two-dimensional image capable of covering a three-dimensional image of a workpiece, and determining a polishing range on the two-dimensional image;

and converting the coordinate information of the polishing range into a coordinate system value of the laser emission mechanism and generating a control instruction, wherein the control instruction is used for controlling the laser emission mechanism to emit the first laser and the second laser to the polishing area of the workpiece.

According to the laser polishing method, the laser emitting mechanism can be used for sequentially emitting the lasers with different pulse widths to the workpiece, the workpiece can be subjected to combination of rough polishing and fine polishing, the roughness of the surface of the workpiece is effectively reduced, the polishing condition of the workpiece can be monitored in real time through the monitoring mechanism, and the problems that the polished product of the conventional laser polishing device is large in surface roughness, poor in polishing effect and incapable of being observed in real time in the polishing process are effectively solved.

Drawings

In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to the drawings without creative efforts.

Fig. 1 is a schematic perspective view of a laser polishing apparatus according to an embodiment of the present invention;

FIG. 2 is a perspective view of the laser polishing apparatus shown in FIG. 1 illustrating another angle of the internal structure;

FIG. 3 is a schematic perspective view of a capsule in the laser polishing apparatus shown in FIG. 2;

FIG. 4 is an exploded perspective view of the capsule shown in FIG. 3;

FIG. 5 is a flowchart of a laser polishing method according to an embodiment of the present invention;

fig. 6 is a second flowchart of a laser polishing method according to an embodiment of the present invention.

The designations in the figures mean:

100. a laser polishing device;

10. a chassis; 11. a carrier; 12. an alarm;

20. a work table;

31. a first laser; 32. a second laser; 33. a first laser galvanometer component; 34. a second laser galvanometer component;

40. a monitoring mechanism; 41. a thermal imager; 42. an electron microscope; 43. a surveillance camera;

51. a computer;

61. a first display screen; 62. a second display screen; 63. a thermal imager host; 64. a rotation control end;

71. sealing the cabin; 711. a support table; 72. sealing the cover plate; 721. a light-transmitting portion; 73. a seal ring; 74. a locking member;

80. a venting mechanism; 81. an inert gas tank; 82. a connecting pipe;

91. a first water cooler; 92. a second water cooler; 93. a radiation-proof glass door; 94. a universal wheel; 95. a load-bearing foot.

Detailed Description

In order to make the objects, technical solutions and advantages of the present invention more apparent, the present invention will be described in further detail below with reference to the accompanying drawings, which are examples. It should be understood that the specific embodiments described herein are merely illustrative of the invention and are not intended to limit the invention.

It will be understood that when an element is referred to as being "secured to" or "disposed on" another element, it can be directly or indirectly secured to the other element. When an element is referred to as being "connected to" another element, it can be directly or indirectly connected to the other element. The terms "upper", "lower", "left", "right", and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience of description, and do not indicate or imply that the referred devices or elements must have a specific orientation, be constructed and operated in a specific orientation, and thus, are not to be construed as limiting the patent. The terms "first", "second" and "first" are used merely for descriptive purposes and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features. The meaning of "plurality" is two or more unless specifically limited otherwise.

The embodiment of the application provides a laser polishing device, can be used to polish ceramic material, also can be used to the finish polishing of metal materials such as die steel, titanium alloy.

Referring to fig. 1 to 4, an embodiment of a first aspect of the present application provides a laser polishing apparatus 100 for polishing a workpiece, including a housing 10, a worktable 20, a laser emitting mechanism and a monitoring mechanism 40.

The worktable 20 is disposed in the cabinet 10, and the worktable 20 is used for placing a workpiece.

The laser emission mechanism is arranged in the case 10, and is used for sequentially emitting first laser and second laser with different pulse widths to the workpiece, wherein the pulse width of the second laser is smaller than that of the first laser, so that the same polishing area on the workpiece is sequentially subjected to rough polishing and fine polishing.

The monitoring mechanism 40 is disposed in the case 10 and includes at least one of a thermal imager 41, an electron microscope 42 and a monitoring camera 43, and the monitoring mechanism 40 is configured to collect surface information of a workpiece.

It can be understood that the laser polishing apparatus 100 should firstly use the laser with large pulse width to roughly polish the workpiece, and then perform the fine polishing on the same polishing range of the workpiece by using the laser with smaller pulse width, so as to achieve the good polishing effect of the workpiece.

In the present embodiment, the monitoring mechanism 40 includes a thermal imaging camera 41, an electron microscope 42, and a monitoring camera 43, and is configured to collect various surface information of the workpiece so as to comprehensively monitor the polishing process of the workpiece. It will be appreciated that the path of travel of the laser should be clear of the positions of the thermal imager 41, the electron microscope 42 and the monitoring camera 43 to avoid irreversible damage to the monitoring mechanism 40.

It is understood that in other embodiments, the monitoring mechanism 40 may further include one or any two of the thermal imager 41, the electron microscope 42, and the monitoring camera 43, which are not limited herein.

The laser polishing device 100 can sequentially emit the lasers with different pulse widths to the workpiece through the laser emitting mechanism, the smaller the pulse width is, the higher the instantaneous energy of the lasers is, the sequential polishing of the lasers with different pulse widths can combine rough polishing and fine polishing on the workpiece, the roughness of the surface of the workpiece is effectively reduced, the polishing condition of the workpiece can be monitored in real time through the monitoring mechanism 40, and the problems that the surface roughness of a product polished by the conventional laser polishing device 100 is large, the polishing effect is poor, and the polishing process cannot be observed in real time are effectively solved.

Referring to fig. 1 and 2, in one embodiment of the present application, the laser emitting mechanism includes a first laser 31, a second laser 32, a first laser galvanometer assembly 33, and a second laser galvanometer assembly 34.

The first laser 31 is used to emit first laser light, and the second laser 32 is used to emit second laser light. Therefore, the workpiece can be polished twice, and the surface roughness of the workpiece is greatly reduced.

The first laser galvanometer assembly 33 and the second laser galvanometer assembly 34 are used for adjusting the routes of the laser light emitted by the first laser 31 and the second laser 32 respectively. In this way, the first laser 31 and the second laser 32 are independent of each other, and the routes of the first laser and the second laser can be controlled respectively, so as to realize accurate control.

In this embodiment, the first laser is a nanosecond pulse laser, and the second laser is a picosecond pulse laser. It is understood that in other embodiments, the first laser may be a nanosecond pulsed laser, and the second laser may also be a femtosecond pulsed laser having a pulse width smaller than that of the nano-pulsed laser, which is not limited herein.

In this embodiment, the case 10 is divided into an upper layer and a lower layer, the worktable 20 is disposed on the upper layer of the case 10, the first laser galvanometer assembly 33 and the second laser galvanometer assembly 34 are disposed on the top of the worktable 20 side by side, and the first laser 31 and the second laser 32 are disposed on the lower layer of the case 10 side by side.

It will be appreciated that the first laser 31 and the second laser 32 are electrically connected to the first laser galvanometer assembly 33 and the second laser galvanometer assembly 34, respectively.

In one embodiment of the present application, the first and second laser galvanometer assemblies 33, 34 include sets of first and second lenses, respectively, at least one of the sets of first and second lenses being movable lenses to adjust the polished focal position in real time. Because the positions of part of the lenses in the first laser galvanometer component 33 and the second laser galvanometer component 34 are adjustable, the flexibility of the first laser galvanometer component 33 and the second laser galvanometer component 34 is improved, and the accuracy of the laser irradiation polishing range is further improved.

In this embodiment, a first beam expander is further disposed between the first laser 31 and the first laser galvanometer assembly 33; similarly, a second beam expander is also disposed between the second laser 32 and the second galvanometer mirror assembly 34. The first beam expander and the second beam expander are used for adjusting the beam diameter and the divergence angle of the first laser and the second laser respectively. It will be appreciated that the first laser follows the following path: a first laser 31-a first beam expander-a first laser galvanometer assembly 33-a workpiece; the route of the second laser is as follows: second laser 32-second beam expander-second laser galvanometer assembly 34-workpiece.

In this embodiment, the first laser galvanometer component 33 and the second laser galvanometer component 34 are both three-dimensional galvanometers, and curved surfaces can be polished, that is, a polished workpiece can be a curved surface or a plane.

In one embodiment of the present application, the laser polishing apparatus 100 further comprises a control device electrically connected to the laser emitting mechanism, the control device being configured to import a three-dimensional image of the workpiece and render a two-dimensional image that can cover the three-dimensional image of the workpiece to determine a polishing range on the two-dimensional image, and to convert coordinate information of the polishing range into a coordinate system value of the movable lens and generate a control command.

The laser polishing apparatus 100 further comprises an electrical control mechanism electrically connected to the control device, and the electrical control mechanism is configured to receive the control command and control the movable lens to move, so as to control the laser emitting mechanism to polish the workpiece according to a preset polishing range. Therefore, the polishing range can be adjusted in real time through the control device, the electric control mechanism can accurately control the laser to reach the polishing area of the workpiece corresponding to the preset polishing range, and the flexibility and the accuracy of the laser polishing device 100 are improved.

Referring to fig. 1, in the present embodiment, the control device includes a computer 51, and the computer 51 is disposed on the rack 11 connected to the outer sidewall of the chassis 10 and electrically connected to the laser emitting mechanism. It is understood that in other embodiments, the computer 51 may be omitted, and the control device may include a tablet computer or the like, without limitation.

In this embodiment, the top of the housing 10 is further provided with an alarm 12, and the alarm 12 is connected to the control device to give an audible and visual alarm when the laser polishing apparatus 100 fails. It will be appreciated that in other embodiments, the alarm 12 may be omitted.

In the present embodiment, the image importing unit includes software "lenmurark _3 DS" (by which the first laser 31 and the second laser 32 are controlled separately), since a directly imported model cannot be used, a two-dimensional image of a square or circle or an irregular shape is drawn in the software, the size of the two-dimensional image is to cover the imported three-dimensional image, and then the two-dimensional image is projected onto a surface to be polished to determine a polishing range on the two-dimensional image, and coordinate information of the polishing range is obtained, and then the coordinate information is converted into a coordinate system value of the movable mirror. At this time, the first laser 31 or the second laser 32 is turned on for polishing, and the focus is changed according to the image.

Referring to fig. 1 to 4, in an embodiment of the present application, the monitoring mechanism 40 includes a thermal imager 41, an electron microscope 42 and a monitoring camera 43, which are arranged at intervals, and the thermal imager 41, the electron microscope 42 and the monitoring camera 43 are all connected to the worktable 20.

The laser polishing apparatus 100 further comprises a first display screen 61, a second display screen 62 and a wireless transmission unit, wherein the first display screen 61 and the second display screen 62 are respectively and electrically connected to the thermal imager 41 and the electron microscope 42 to respectively display the surface temperature of the workpiece and the material removal state and defects of the workpiece, and the wireless transmission unit is electrically connected to the monitoring camera 43 and is in communication connection with an external terminal device, and is used for transmitting the picture shot by the monitoring camera 43 to the external terminal device in real time. Therefore, the polishing process can be monitored comprehensively in real time by the cameras of the thermal imager 41, the electron microscope 42 and the monitoring camera 43, the damage caused by laser directly observed by human eyes can be prevented, the parameters of the polishing process can be adjusted in time, and the defects of workpieces are reduced.

In the present embodiment, the first display 61 and the second display 62 are disposed on the outer side wall of the casing 10 and are connected to the thermal imager 41 and the electron microscope 42, respectively, through connection wires. The thermal imaging instrument 41 is used for observing the temperature generated when the laser acts on the surface of the material in real time, whether heat accumulation exists or not, and the polishing principle is prevented from being changed from 'removal' to 'melting' when the heat accumulation reaches a certain temperature; the thermal imaging camera 41 can further predict the stress generated during polishing since the higher the temperature, the greater the stress generated on the surface of the workpiece. The electron microscope 42 is intended to observe the material removal state of a workpiece at the time of polishing and the generation of defects such as cracks, protrusions, waviness, etc., and analyze the defects, analyze the cause of the generation thereof, and then reduce the defects by controlling laser parameters such as pulse width, repetition frequency, etc.

It is to be understood that the laser polishing apparatus 100 further includes a thermal imager host 63 electrically connected to the thermal imager 41 and the first display screen 61 to control the thermal imager 41.

In the present embodiment, the monitoring camera 43 is connected to the mobile phone through a wireless transmission unit. It is understood that in other embodiments, the external terminal device may also be a tablet computer, a wearable device, or the like, without limitation.

Referring to fig. 1 to 4, in an embodiment of the present application, the laser polishing apparatus 100 further includes a seal chamber 71, a seal cover plate 72, and a seal ring 73.

The sealed cabin 71 is arranged in the case 10, the workbench 20 is rotatably connected to the bottom of the sealed cabin 71, and the thermal imager 41, the electron microscope 42 and the monitoring camera 43 are all connected to the side wall of the sealed cabin 71.

The sealing cover 72 is disposed on the top of the sealing chamber 71 to form a closed space in the sealing chamber 71, and the sealing cover 72 is provided with a light-transmitting portion 721 to allow laser light to pass through the sealing cover 72.

A sealing ring 73 is provided at the junction of the capsule 71 and the sealing cover 72. Therefore, the sealing performance of the sealed cabin 71 can be ensured, and the consistency of environmental conditions when different workpieces are polished is further improved.

In the present embodiment, the capsule 71 is cylindrical and is provided in the upper layer of the inside of the casing 10. The working platform 20 is connected to the bottom of the sealed cabin 71 through a rotating member and is driven to rotate relative to the sealed cabin 71 through the rotation control end 64. Wherein, the rotation control end 64 is disposed on the outer sidewall of the case 10, which facilitates the implementation of adjusting the rotation parameters of the worktable 20.

In this embodiment, a supporting platform 711 is disposed on a side wall of the sealed cabin 71, and the thermal imager 41, the electron microscope 42 and the monitoring camera 43 are disposed on the supporting platform 711.

In the present embodiment, a locking member 74 is further disposed between the sealing compartment 71 and the sealing cover plate 72, and it is understood that the locking member 74 can be a buckle or a screw, but is not limited thereto.

In the present embodiment, the light-transmitting portion 721 is provided at an intermediate position of the sealing cover 72, and the light-transmitting portion 721 is made of glass, and is resistant to high temperature and corrosion.

Referring to fig. 1 to 3, in an embodiment of the present application, the laser polishing apparatus 100 further includes a venting mechanism 80, and the venting mechanism 80 is communicated with the hermetic chamber 71 and is used for venting inert gas into the enclosed space. Therefore, the workpiece can be prevented from reacting with oxygen in the polishing process, and the formation of an oxide layer on the surface of the workpiece can be avoided.

In the present embodiment, the ventilation mechanism 80 includes an inert gas tank 81 and a connection pipe 82 disposed outside the enclosure 10, and both ends of the connection pipe 82 are respectively connected to the inert gas tank 81 and the sealed chamber 71 to convey the inert gas in the inert gas tank 81 into the sealed chamber 71. When polishing a ceramic material, an inert gas such as argon gas can be used. However, the need to fill with inert gas depends on the material, such as silicon nitride, which is susceptible to reaction with oxygen at high temperature, so that the inert gas is needed, while the need to fill with inert gas is avoided when the ceramic material, such as alumina, has oxygen.

In this embodiment, the venting mechanism 80 further includes a pressure reducing valve provided on the inert gas tank 81 for adjusting the pressure of the inert gas.

Referring to fig. 1 and 2, in an embodiment of the present application, the laser polishing apparatus 100 further includes a first water cooler 91 and a second water cooler 92, the first water cooler 91 is connected to the first laser 31 and the first laser galvanometer assembly 33, and the second water cooler 92 is connected to the second laser 32 and the second laser galvanometer assembly 34, and is configured to cool the laser emitting mechanism, prevent the normal operation of the apparatus from being affected by an excessive temperature, and improve safety.

In this embodiment, the first water cooler 91 and the second water cooler 92 are both disposed outside the case 10, and the first water cooler 91 is provided with four water pipes, which are two water inlet pipes and two water outlet pipes, respectively, and connected to the first laser 31 and the first laser galvanometer component 33 for cooling in advance, and ensuring that the operating temperature of these devices is maintained at about 24 ℃. It will be appreciated that the second water cooler 92 includes two water inlet pipes and two water outlet pipes, and is connected to the second laser 32 and the second laser galvanometer assembly 34.

Referring to fig. 1 and 2, in an embodiment of the present application, a radiation-proof glass door 93 is further disposed on the chassis 10 near the sealed cabin 71, so as to facilitate observation of the inside of the chassis 10, prevent laser leakage, and ensure safety. In addition, one end of the radiation-proof glass door 93 is connected with the top of the case 10 and is provided with a telescopic rod, one end of the radiation-proof glass door 93, which is far away from the top of the case body, is provided with a handle, when the handle is lifted upwards, the telescopic rod extends and rotates, and the radiation-proof glass door 93 moves upwards along with the telescopic rod.

In addition, the bottom of the chassis 10 is provided with a plurality of universal wheels 94 and a plurality of bearing feet 95, the bearing feet 95 are arranged adjacent to the universal wheels 94 in parallel, and the distance between the bearing feet 95 and the chassis 10 can be adjusted through threaded rotation. The casters 94 facilitate movement of the housing 10.

Referring to fig. 5 and 6, a second embodiment of the present application provides a laser polishing method, which uses the laser polishing apparatus 100 according to any embodiment of the first aspect, and the laser polishing method includes:

in step S10, the workpiece is set on the table 20.

Specifically, the lock 74 and the sealing lid 72 are opened, and the sample is placed on the table 20 in the sealed compartment 71.

Step S20, a polishing range of the laser emitting mechanism is set, the polishing range corresponding to the polishing area of the workpiece.

Specifically, the laser parameters and the polishing range are adjusted by the control device. After the setting is finished, previewing can be carried out, the polishing position can be adjusted through previewing, and at the moment, selective area polishing can be carried out.

Step S30, a first laser is emitted to the polishing area of the workpiece to perform a first polishing.

Specifically, the first laser 31 is controlled by the control device to run the first laser, and the route of the first laser is the first laser 31, the first beam expander, the first laser galvanometer assembly 33 and the workpiece.

And step S40, emitting a second laser to the polishing area of the workpiece for second polishing, wherein the pulse width of the second laser is smaller than that of the first laser.

Specifically, after the first laser runs for 1s, the control device controls the second laser 32 to run the second laser, and at this time, the route of the second laser is the second laser 32, the second beam expander, the second laser galvanometer assembly 34 and the workpiece.

Here, in steps S30 and S40, surface information of the workpiece is simultaneously acquired by the monitoring mechanism 40.

Further, before step S10, the first water cooler 91 and the second water cooler 92 are turned on to cool the laser emitting mechanism in advance.

After step S10 and before step S20, the first laser 31 and the second laser 32 are turned on, the control device is turned on, the rotation control terminal 64 is turned on, the thermal imager host 63 is turned on (the thermal imager 41 automatically enters a standby state after being turned on), the electron microscope 42 is turned on (manually), the monitoring camera 43 is turned on (manually, directly connected to a mobile phone), and the first display 61 and the second display 62 are turned on, where the entire laser polishing apparatus 100 is in a ready state.

After step S20 and before step S30, an inert gas is introduced to prevent oxidation of the workpiece surface during polishing, the inert gas tank 81 is opened, the hermetic chamber 71 is introduced with an inert gas such as argon, the sealing cover plate 72 is closed, and the locking member 74 is locked.

According to the laser polishing method, the surface of the workpiece is subjected to rough polishing and fine polishing by using the lasers with different pulse widths, so that the roughness of the surface of the workpiece can be effectively reduced, and the polishing effect is improved.

Referring to fig. 6, in one embodiment of the present application, a polishing range of the laser emitting mechanism is set, including:

s201, importing a three-dimensional image of the workpiece.

S202, drawing a two-dimensional image capable of covering the three-dimensional image of the workpiece, and determining a polishing range on the two-dimensional image.

And S203, converting the coordinate information of the polishing range into a coordinate system value of the laser emission mechanism and generating a control instruction, wherein the control instruction is used for controlling the laser emission mechanism to emit the first laser and the second laser to the polishing area of the workpiece.

According to the laser polishing method, the laser emitting mechanism can be used for sequentially emitting the lasers with different pulse widths to the workpiece, the workpiece can be subjected to combination of rough polishing and fine polishing, the roughness of the surface of the workpiece is effectively reduced, the polishing condition of the workpiece can be monitored in real time through the monitoring mechanism 40, and the problems that the polished product of the conventional laser polishing device 100 is large in surface roughness, poor in polishing effect and incapable of being observed in real time in the polishing process are effectively solved.

The above-mentioned embodiments are only used for illustrating the technical solutions of the present application, and not for limiting the same; although the present application has been described in detail with reference to the foregoing embodiments, it should be understood by those of ordinary skill in the art that: the technical solutions described in the foregoing embodiments may still be modified, or some technical features may be equivalently replaced; such modifications and substitutions do not substantially depart from the spirit and scope of the embodiments of the present application and are intended to be included within the scope of the present application.