阅读说明：本技术 电子组件及其制造方法 (Electronic assembly and method of manufacturing the same ) 是由 梁正承 具本锡 李相旭 金政民 赵成珉 于 2020-11-02 设计创作，主要内容包括：本公开提供一种电子组件及其制造方法,所述电子组件包括：电子组件主体部,包括主体和设置在所述主体上的外电极。所述主体包括介电层和内电极。所述电子组件还包括涂覆部,所述涂覆部包括设置在所述电子组件主体部的外表面上的涂覆层和设置在所述涂覆层上的多个突起。(The present disclosure provides an electronic component and a method of manufacturing the same, the electronic component including: an electronic assembly body portion including a body and an outer electrode disposed on the body. The body includes a dielectric layer and an inner electrode. The electronic component further includes a coating portion including a coating layer disposed on an outer surface of the electronic component main body portion and a plurality of protrusions disposed on the coating layer.)

1. An electronic assembly, comprising:

an electronic component body portion including a body and an outer electrode disposed on the body, the body including a dielectric layer and an inner electrode; and

a coating part including a coating layer disposed on an outer surface of the electronic component main body part and a plurality of protrusions disposed on the coating layer.

2. The electronic assembly of claim 1, wherein the coating has an average thickness of 5nm to 30 nm.

3. The electronic assembly of claim 1, wherein at least one of the plurality of protrusions has a height of greater than or equal to 3 nm.

4. The electronic component of any of claims 1-3, wherein a centerline average roughness of the surface of the coating is 0.3nm or greater.

5. The electronic assembly of any of claims 1-3, wherein the coated portion has a contact angle with water of 100 degrees or greater.

6. The electronic assembly of any of claims 1-3, wherein the coating portion comprises a silicone-based polymer and/or a fluorine-based polymer.

7. The electronic assembly of any of claims 1-3, wherein the coating layer and the protrusion comprise the same material.

8. The electronic assembly of any of claims 1-3, wherein the coating layer has one or more openings.

9. The electronic assembly of claim 8, wherein the one or more openings have an area greater than 0 and equal to or less than 10% of a total area of the coating layer.

10. The electronic assembly of any of claims 1-3, wherein the coating layer is in contact with an outer surface of the external electrode and in contact with an area of the outer surface of the body where the external electrode is not disposed.

11. The electronic component of any of claims 1-3, wherein the external electrode comprises an electrode layer disposed on the body and a plating layer disposed on the electrode layer.

12. A method of manufacturing an electronic assembly, the method comprising:

preparing an electronic component main body part, wherein the electronic component main body part comprises a main body and an external electrode arranged on the main body, and the main body comprises a dielectric layer and an internal electrode; and

forming a coating part including a coating layer disposed on an outer surface of the electronic component main body part and a plurality of protrusions disposed on the coating layer using vapor deposition.

13. The method of claim 12, wherein the coating has an average thickness of 5nm to 30 nm.

14. The method of claim 12 or 13, wherein at least one of the plurality of protrusions has a height of greater than or equal to 3 nm.

15. The method of claim 12 or 13, wherein the external electrode comprises an electrode layer disposed on the body and a plating layer disposed on the electrode layer.

16. The method of claim 12 or 13, wherein the vapor deposition comprises an initiated chemical vapor deposition.

17. An electronic assembly, comprising:

an electronic component body portion including a body and an outer electrode disposed on the body, the body including a dielectric layer and an inner electrode; and

an organic material disposed on an outer surface of the electronic assembly body portion and including a plurality of protrusions.

18. The electronic assembly of claim 17, wherein the organic material comprises a siloxane-based polymer and/or a fluorine-based polymer.

19. The electronic assembly of claim 17, wherein at least one of the plurality of protrusions has a height of greater than or equal to 3 nm.

20. The electronic assembly of any of claims 17-19, wherein the organic material has an average thickness of 5nm to 30 nm.

Technical Field

The present disclosure relates to an electronic component and a method of manufacturing the same.

Background

A multilayer ceramic capacitor (MLCC), a kind of multilayer chip electronic component, is a chip capacitor mounted on a printed circuit board of various electronic products, such as display devices including Liquid Crystal Displays (LCDs) and Plasma Display Panels (PDPs), computers, smart phones, cell phones, etc., to allow charging and discharging therein and therefrom.

Since a multilayer ceramic capacitor (MLCC) is relatively small and can be easily mounted while achieving high capacitance, it is used in various types of electronic devices.

Recently, with the trend of miniaturization and higher performance of electronic devices, multilayer ceramic capacitors have tended to be miniaturized and have higher capacitance. With such a trend, the importance of reliability of the multilayer ceramic capacitor has increased, and in particular, the importance of reliability against moisture has increased.

In the automobile industry, as electric automobiles, autonomous automobiles, and the like develop, a greater number of multilayer ceramic capacitors are required. Further, multilayer ceramic capacitors used in automobiles and the like are required to secure more severe moisture-proof reliability conditions.

Disclosure of Invention

An aspect of the present disclosure is to provide an electronic component having improved moisture-proof reliability and a method of manufacturing the same.

An aspect of the present disclosure is to provide an electronic component having improved mountability and a method of manufacturing the same.

An aspect of the present disclosure is to provide an electronic component having improved productivity and reduced manufacturing costs, and a method of manufacturing the same.

However, the purpose of the present disclosure is not limited to the above description, and will be more easily understood in describing specific embodiments of the present disclosure.

According to an aspect of the present disclosure, an electronic component includes: an electronic component body portion including a body and an outer electrode disposed on the body, the body including a dielectric layer and an inner electrode; and a coating part including a coating layer disposed on an outer surface of the electronic component main body part and a plurality of protrusions disposed on the coating layer.

According to an aspect of the present disclosure, a method of manufacturing an electronic assembly includes: preparing an electronic component main body part, wherein the electronic component main body part comprises a main body and an external electrode arranged on the main body, and the main body comprises a dielectric layer and an internal electrode; and forming a coating part using vapor deposition, the coating part including a coating layer disposed on an outer surface of the electronic component main body part and a plurality of protrusions disposed on the coating layer.

According to an aspect of the present disclosure, an electronic component includes: an electronic component body portion including a body and an outer electrode disposed on the body, the body including a dielectric layer and an inner electrode; and an organic material disposed on an outer surface of the electronic component main body portion and including a plurality of protrusions.

Drawings

The above and other aspects, features and advantages of the present disclosure will be more clearly understood from the following detailed description taken in conjunction with the accompanying drawings.

Fig. 1 is a schematic perspective view of an electronic assembly according to an embodiment of the present disclosure.

Fig. 2 is a schematic perspective view of a main body portion of the electronic component in fig. 1 except for a coating portion.

Fig. 3 is a sectional view taken along line I-I' in fig. 1.

Fig. 4 is a schematic exploded perspective view of a main body in which the dielectric layers and the internal electrodes of fig. 2 are stacked.

Fig. 5 is an enlarged view of the region P in fig. 3.

Fig. 6 is an image captured by an Atomic Force Microscope (AFM) showing the surface of the coating portion provided on the (1 μm × 1 μm) area of the central portion of the second surface of the main body portion of the electronic component according to the embodiment of the present disclosure in the width direction and the length direction (the Y direction and the X direction).

Fig. 7 is a graph showing the surface roughness of the coated portion measured along the measurement line L1 of fig. 6 using an Atomic Force Microscope (AFM).

Fig. 8A, 8B, and 8C illustrate a process of forming a coated portion according to the present disclosure by vapor deposition.

Fig. 9 shows a coated portion formed when a deposition process is performed for a very long period of time, and shows a region corresponding to the region P in fig. 5.

Fig. 10 is a graph showing the contact angles in table 1.

Fig. 11 is a graph showing the center line average roughness Ra in table 1.

Detailed Description

Hereinafter, embodiments of the present disclosure will be described with reference to specific embodiments and drawings. However, the embodiments of the present disclosure may be modified to have various other forms, and the scope of the present disclosure is not limited to the embodiments described below. Furthermore, embodiments of the present disclosure may be provided to more fully describe the present disclosure to those of ordinary skill. Therefore, the shapes and sizes of elements in the drawings may be exaggerated for clarity of the description, and elements denoted by the same reference numerals in the drawings may be the same elements.

Values for parameters describing, for example, 1D dimensions of an element (including, but not limited to, "length," "width," "thickness," "diameter," "distance," "gap," and/or "dimension"), 2D dimensions of an element (including, but not limited to, "area" and/or "dimension"), 3D dimensions of an element (including, but not limited to, "volume" and/or "dimension"), and properties of an element (including, but not limited to, "roughness," "density," "weight ratio," and/or "molar ratio") can be obtained by the methods and/or tools described in this disclosure. However, the present disclosure is not limited thereto. Other methods and/or tools that would be understood by one of ordinary skill in the art, even if not described in this disclosure, may also be used.

In the drawings, portions irrelevant to the description will be omitted for the purpose of illustrating the present disclosure, and the thickness may be enlarged to clearly show layers and regions. Further, throughout the specification, unless otherwise specifically stated, when an element is referred to as being "comprising" or "including" an element, it means that the element may also include other elements, without departing from the description.

In the drawings, the X direction may be defined as a second direction, an L direction, or a length direction; the Y direction may be defined as a third direction, a W direction, or a width direction; the Z-direction may be defined as a first direction, a stacking direction, a T-direction, or a thickness direction.

Electronic assembly

Fig. 1 is a schematic perspective view of an electronic assembly according to an embodiment of the present disclosure.

Fig. 2 is a schematic perspective view of a main body portion of the electronic component in fig. 1 except for a coating portion.

Fig. 3 is a sectional view taken along line I-I' in fig. 1.

Fig. 4 is a schematic exploded perspective view of a main body portion in which the dielectric layers and the internal electrodes in fig. 2 are stacked.

Fig. 5 is an enlarged view of the region P in fig. 3.

Hereinafter, an electronic assembly 1000 according to an embodiment of the present disclosure will be described with reference to fig. 1 to 5.

The electronic assembly 1000 according to an embodiment may include: an electronic component main body part 100 including a main body 110 and external electrodes 131 and 132 disposed on the main body 110, the main body 110 including a dielectric layer 111 and internal electrodes 121 and 122; and a coating part 140 including a coating layer 140a disposed on an outer surface of the electronic component main body part 100 and a plurality of protrusions 140b disposed on the coating layer 140 a.

The electronic component main body portion 100 includes a main body 110 and external electrodes 131 and 132 disposed on the main body 110.

In the body 110, dielectric layers 111 and internal electrodes 121 and 122 are alternately stacked.

Although the specific shape of the body 110 is not necessarily limited, as shown in the drawings, the body 110 may have a hexahedral shape or the like. The body 110 may not have a perfect hexahedral shape of a perfect straight line due to shrinkage of ceramic powder particles contained in the body 110 during a sintering process, but may have a generally hexahedral shape as a whole.

The body 110 may have a first surface 1 and a second surface 2 opposite to each other in a thickness direction (Z direction), a third surface 3 and a fourth surface 4 connected to the first surface 1 and the second surface 2 and opposite to each other in a length direction (X direction), and a fifth surface 5 and a sixth surface 6 connected to the first surface 1 and the second surface 2, connected to the third surface 3 and the fourth surface 4, and opposite to each other in a width direction (Y direction).

The plurality of dielectric layers 111 forming the body 110 may be in a sintered state, and adjacent dielectric layers 111 may be integrated with each other, so that boundaries between them are not easily apparent without using a Scanning Electron Microscope (SEM).

According to the embodiment, the raw material for forming the dielectric layer 111 is not necessarily limited as long as a sufficient capacitance can be obtained therefrom. For example, the raw material may be a barium titanate-based material, a lead composite perovskite-based material, a strontium titanate-based material, or the like. The barium titanate-based material may include BaTiO₃Based ceramic powder particles. An example of the ceramic powder particle may be one in which calcium (Ca), zirconium (Zr), or the like is partially solid-dissolved in BaTiO₃Of (Ba)_1-xCa_x)TiO₃、Ba(Ti_1-yCa_y)O₃、(Ba_1-xCa_x)(Ti_1-yZr_y)O₃Or Ba (Ti)_1-yZr_y)O₃And the like.

As a raw material for forming the dielectric layer 111, various ceramic additives, organic solvents, binders, dispersants, and the like may be added in addition to the ceramic powder particles according to the purpose of the present disclosure.

The body 110 may include: a capacitance forming part disposed in the body 110, in which a capacitance is formed and which includes a first internal electrode 121 and a second internal electrode 122 disposed to be opposite to each other with the dielectric layer 111 interposed therebetween; and an upper protective layer 112 and a lower protective layer 113 provided above and below the capacitance forming part, respectively.

The capacitance forming part contributes to forming the capacitance of the capacitor, and may be formed by repeatedly laminating a plurality of first and second internal electrodes 121 and 122 with respective dielectric layers 111 interposed therebetween.

The upper and lower protective layers 112 and 113 may be formed by laminating one or two or more dielectric layers on the upper and lower surfaces of the capacitance formation part, respectively, in the vertical direction, and may serve to prevent the first and second internal electrodes 121 and 122 from being damaged by physical or chemical stress.

The upper and lower protective layers 112 and 113 may not include the inner electrode and may include the same material as the dielectric layer 111.

The internal electrodes 121 and 122 may include a first internal electrode 121 and a second internal electrode 122. The first and second internal electrodes 121 and 122 are alternately disposed to be opposite to each other with the respective dielectric layers 111 constituting the body 110 interposed therebetween, and the first and second internal electrodes 121 and 122 may be exposed to the third and fourth surfaces 3 and 4 of the body 110, respectively.

Referring to fig. 2 and 4, the first internal electrode 121 may be spaced apart from the fourth surface 4 and may be exposed through the third surface 3, and the second internal electrode 122 may be spaced apart from the third surface 3 and may be exposed through the fourth surface 4.

In this case, the first and second internal electrodes 121 and 122 may be electrically separated from each other by the respective dielectric layers 111 interposed therebetween.

Referring to fig. 4, the body 110 may be formed by alternately stacking ceramic green sheets on which the first internal electrodes 121 are printed and ceramic green sheets on which the second internal electrodes 122 are printed, and then sintering the stacked ceramic green sheets.

The material for forming the internal electrodes 121 and 122 is not necessarily limited, and a material having improved conductivity may be used. For example, the internal electrodes 121 and 122 may be formed by printing a conductive paste for internal electrodes on a ceramic green sheet, the conductive paste including at least one of nickel (Ni), copper (Cu), palladium (Pd), silver (Ag), gold (Au), platinum (Pt), tin (Sn), tungsten (W), titanium (Ti), and alloys thereof.

A printing method of the conductive paste as the internal electrode may be used, such as a screen printing method, a gravure printing method, etc., but the present disclosure is not limited thereto.

The outer electrodes 131 and 132 may be disposed on the body 110 and connected to the inner electrodes 121 and 122, respectively. In addition, the external electrodes 131 and 132 may include first and second external electrodes 131 and 132, the first and second external electrodes 131 and 132 being disposed on the third and fourth surfaces 3 and 4 of the body 110 to be connected to the first and second internal electrodes 121 and 122, respectively.

Although the structure in which the electronic component 1000 includes the two outer electrodes 131 and 132 is described in the present embodiment, the number, shape, and the like of the outer electrodes 131 and 132 may be changed according to the shape of the inner electrodes 121 and 122 or other purposes.

The external electrodes 131 and 132 may be formed using any material such as metal, etc., as long as it has conductivity, and may be determined in consideration of electrical characteristics, structural stability, etc. In addition, each of the external electrodes 131 and 132 may have a multi-layered structure.

For example, the external electrodes 131 and 132 may include electrode layers 131a and 132a disposed on the body 110, and plating layers 131b and 132b formed on the electrode layers 131a and 132 a.

According to the present disclosure, the organic acid and the molten tin (Sn) may easily penetrate into the external electrodes 131 and 132 through the region of the coating layer 140a where the protrusion 140b is not provided (e.g., the region where the portion of the coating layer 140 is thin during the soldering process) to improve mountability. Accordingly, even when the external electrodes 131 and 132 include the electrode layers 131a and 132a disposed on the body 110 and the plated layers 131b and 132b formed on the electrode layers 131a and 132a and the coating part 140 is disposed on the plated layers 131b and 132b, improved mountability may be achieved.

As a more detailed example of the electrode layers 131a and 132a, each of the electrode layers 131a and 132a may be a sintered electrode including a conductive metal and glass or a resin-based electrode including a conductive metal and a resin.

Alternatively or additionally, the electrode layers 131a and 132a may have a form in which sintered electrodes and resin-based electrodes are sequentially formed on the body. The electrode layers 131a and 132a may be formed by transferring a sheet including a conductive metal to the body, or may be formed by transferring a sheet including a conductive metal to the sintered electrode.

As the conductive metal included in the electrode layers 131a and 132a, a material having improved conductivity may be used, and the present disclosure is not limited thereto. For example, the conductive metal may be at least one of nickel (Ni), copper (Cu), and an alloy thereof.

As a more detailed example of the plating layers 131b and 132b, the plating layers 131b and 132b may be Ni plating layers or Sn plating layers, and may have a structure in which Ni plating layers and Sn plating layers are sequentially formed on the electrode layers 131a and 132a, or a structure in which Sn plating layers, Ni plating layers, and Sn plating layers are sequentially formed. Alternatively or additionally, the plating layers 131b and 132b may include a plurality of Ni plating layers and/or a plurality of Sn plating layers.

The coating part 140 may include a coating layer 140a disposed on an outer surface of the electronic component main body part 100 and a plurality of protrusions 140b disposed on the coating layer 140 a.

Since the body prepared by sintering the ceramic powder particles is formed by high-temperature sintering, the metal oxide having a high surface energy may be exposed to the outside. Therefore, the surface of the body has high hydrophilicity and has a structure in which ion migration is easily caused by water condensed on the surface of the body under high temperature and high humidity conditions. The term "ion migration" refers to a phenomenon in which a conductive metal is dissolved and ionized at the surface, boundary surface and inside of an insulator to migrate and precipitate.

A method of coating a material having a low surface energy on the surface of a body has been proposed to prevent ion migration. However, since not only the outer surface of the body but also the external electrodes are coated, the electrical connectivity of the external electrodes is deteriorated. In addition, during a process of performing reflow soldering on a Printed Circuit Board (PCB) using Sn, defects such as slipping or unmounting may occur.

Therefore, in the related art, a coating prevention portion is provided to prevent the surface of the external electrode from being coated. After the coating is completed, the coating prevention part is removed. Alternatively, the body and the external electrode are integrally coated, and then a portion coated on the external electrode is separately removed. Therefore, productivity may be reduced or manufacturing costs may be increased.

According to the present disclosure, since the coating part 140 includes the coating layer 140a disposed on the outer surface of the electronic component main body part 100 and the plurality of protrusions 140b disposed on the coating layer 140a, moisture-proof reliability can be improved, and mountability can be secured and electrical connectivity can be improved by the region of the coating layer 140a where the protrusions 140b are not disposed.

Accordingly, a process of preventing the coating part 140 from being disposed on the external electrodes 131 and 132 or a process of removing the coating part 140 formed on the external electrodes 131 and 132 is not required, and thus, the productivity of the electronic component 1000 may be improved and the manufacturing cost may be reduced.

The coating layer 140a may substantially seal pores or cracks of the electronic assembly body portion 100 to prevent moisture from penetrating into the body 110 through the outer surface of the body 110. In addition, since the organic acid or the melted Sn may easily penetrate into the external electrodes 131 and 132 through the region of the overcoat layer 140a where the protrusion 140b is not provided (e.g., a locally thin region of the overcoat portion 140), mountability may be improved.

According to the present disclosure, since the coating layer 140a may have a thin portion or a locally broken region, a sufficient moisture-proof reliability improvement effect may not be obtained only by the coating layer 140 a. However, since the plurality of protrusions 140b are provided on the coating layer 140a, sufficient moisture-proof reliability can be ensured even in a high-temperature and high-humidity environment.

The coating layer 140a is disposed to contact the outer surfaces of the external electrodes 131 and 132, and may be disposed to contact the region of the outer surface of the body 110 where the external electrodes 131 and 132 are not disposed.

Fig. 6 is an image of a surface of a coated portion disposed on a (1 μm × 1 μm) area of a central portion of a second surface of a main body of an electronic component according to an embodiment of the present disclosure in width and length directions (Y and X directions) captured by an Atomic Force Microscope (AFM). As can be seen from fig. 6, the height of the brightest portion is 3.5nm, the height of the darkest portion is-3.0 nm, and the coating portion includes a coating layer (dark portion) and a plurality of protrusions (light portions) provided on the coating layer.

The average thickness of the coating part 140 may be 5nm to 30 nm.

When the average thickness of the coating portion 140 is less than 5nm, it may be difficult to ensure that the contact angle of the coating portion 140 with water is 100 degrees or more. When the contact angle of the coating part 140 is less than 100 degrees, the moisture-proof reliability improving effect may be insufficient.

On the other hand, when the average thickness of the coating portion 140 is greater than 30nm, it may be difficult to achieve a locally thin region in the coating portion. Therefore, the organic acid and the molten tin (Sn) may be difficult to penetrate into the external electrodes 131 and 132 during the soldering process, which results in deterioration of mountability. In addition, electrical connectivity of the external electrodes 131 and 132 may be deteriorated, and it may be difficult to realize a structure in which the coating part 140 may include the coating layer 140a and the plurality of protrusions 140 b.

In one example, referring to fig. 6, the average thickness of the coating part 140 may be an average of the thickness of the coating part measured using an ellipsometer with respect to a specific line L1 having a length of, for example, 400nm selected in a (1 μm × 1 μm) region of a central portion of the first surface or the second surface of the body in the width direction and the length direction (Y direction and X direction). An ellipsometer is an instrument that can measure a difference in polarization state between incident light and reflected light on the surface of a thin film to measure the thickness, reflectivity, etc. of the thin film.

At least one of the plurality of protrusions 140b may have a height tb of 3nm or more.

When the height tb of at least one of the plurality of protrusions 140b is less than 3nm, the average thickness of the coated part 140 may be less than 5nm and the moisture-proof reliability improving effect may be insufficient.

The height tb of the protrusion can be measured by observing the surface of the coated portion with an atomic force microscope (AMF).

In one example, the height tb of the protrusion may be a difference Δ t between a valley and a ridge in a graph of surface roughness measured using an atomic force microscope (AMF) along a specific line L1 having a length of 400nm selected in a (1 μm × 1 μm) region of a central portion of the first surface or the second surface of the body in the width direction and the length direction (the Y direction and the X direction).

As can be seen from fig. 7, which is a surface roughness graph obtained by measuring the surface roughness of the coated portion in fig. 6 along L1 with an atomic force microscope (AMF), the difference Δ t between the valley and the ridge was 3.875nm, and sufficient protrusions were formed.

In addition, the height tb of the protrusion 140b may be greater than twice the thickness ta of the coating layer 140 a. Specifically, this is because the height tb of the protrusion 140b may be equal to or greater than twice the thickness ta of the coating layer 140a so that the coating portion 140 has an average thickness of 5nm to 30 nm.

The center line average roughness Ra of the surface of the coated portion may be 0.3nm or more.

As an example, the center line average roughness Ra of the surface of the coating portion may be a value obtained from a surface roughness graph measured using an atomic force microscope (AMF) along a specific line L1 having a length of 400nm selected in a (1 μm × 1 μm) region of a central portion of the first surface or the second surface of the body in the width direction and the length direction based on formula 1. For example, the center line average roughness Ra is expressed in nm, and is a value obtained by dividing the area of roughness by the measurement length based on the center line. In addition, since the center line average roughness Ra is measured with respect to a line having a length of 400nm, L in formula 1 has a length of 400nm and the center line is a line in the horizontal axis direction of which the vertical axis is 0 in fig. 7.

Formula 1:

the coated portion 140 may have a contact angle with water of 100 degrees or more. This is because when the contact angle of the coated portion 140 with water is less than 100 degrees, the moisture-proof reliability improving effect may be insufficient.

The width of the protrusion 140b is not necessarily limited, but the width of the protrusion 140b may be, for example, 30nm to 100 nm. Specifically, this is because the width of the protrusion 140b may be 30nm to 100nm so that the coating portion 140 has an average thickness of 5nm to 30 nm.

The area occupied by the plurality of protrusions 140b is not necessarily limited, but the area occupied by the plurality of protrusions 140b may be, for example, 10% to 60% of the total area of the coating portion 140. Specifically, this is because the area occupied by the plurality of protrusions 140b is 10% to 60% of the total area of the coating portion 140, so that the coating portion 140 has an average thickness of 5nm to 30 nm.

The coating portion 140 may include a siloxane-based polymer and/or a fluorine-based polymer. The siloxane-based polymer and the fluorine-based polymer may have a low surface energy and have a hydrophobic property to improve moisture-proof reliability. In addition, the siloxane-based polymer and the fluorine-based polymer may easily implement the coating part 140 of the present disclosure using vapor deposition. In this case, the coating part 140 may include or be made of an organic material.

Since the coating layer 140a and the protrusion 140b may be formed using a single process, they may include the same material.

The method for preparing the coating portion 140 is not necessarily limited, and the coating portion 140 may be formed using Atomic Layer Deposition (ALD), Molecular Layer Deposition (MLD), Chemical Vapor Deposition (CVD), or the like.

The coating layer 140a' may have one or more openings. This is because the growth of the coating layer 140a' may be insufficient in a specific region and thus may exist in the form of cracks, as shown in fig. 8B.

In this case, the area of the one or more openings may be greater than 0 and equal to or less than 10% of the total area of the coating layer 140 a'. This is because, when the area of the one or more openings is greater than 10% of the total area of the coating layer 140a', the moisture-proof reliability may be deteriorated.

Method for manufacturing electronic assembly

Hereinafter, a method of manufacturing an electronic component according to another aspect of the present disclosure will be described in detail. However, descriptions overlapping with those given in the electronic components will be omitted to avoid the overlapping descriptions.

A method of manufacturing an electronic component according to another aspect of the present disclosure may include preparing an electronic component main body part including a main body (including a dielectric layer and an inner electrode) and an outer electrode disposed on the main body, and forming a coating part including a coating layer disposed on an outer surface of the electronic component main body part and a plurality of protrusions disposed on the coating layer using vapor deposition.

Preparing an electronic component body

The conductive paste of the internal electrodes may be applied to the ceramic green sheets using a printing method or the like to print the internal electrodes. The printing method of the conductive paste may be a screen printing method, a gravure printing method, or the like, but the present disclosure is not limited thereto.

The ceramic green sheets on which the internal electrodes are printed may be stacked and sintered to form the body 110. The number of the laminated sheets on which the internal electrodes are printed may be adjusted according to the capacitance of the capacitor.

The external electrodes 131 and 132 may be formed on the body 110 to form the electronic component body part 100.

The external electrodes 131 and 132 may be formed by forming electrode layers 131a and 132a on the body 110 and forming plated layers 131b and 132b on the electrode layers 131a and 132 a.

The method of forming the electrode layers 131a and 132a is not necessarily limited, and the electrode layers 131a and 132a may be formed by coating a paste including a conductive metal and glass, a paste including a conductive metal and a resin, or the like. Alternatively or additionally, the electrode layers 131a and 132a may be formed by a method of transferring a sheet including a conductive metal to the body 110 or a method of transferring a sheet including a conductive metal to a sintered electrode.

Forming a coating portion

The coating part 140 may be formed on the outer surface of the electronic component main body part 100 using vapor deposition.

The vapor deposition forming the coating part 140 may be Atomic Layer Deposition (ALD), Molecular Layer Deposition (MLD), Chemical Vapor Deposition (CVD), or the like.

When the Initiation Chemical Vapor Deposition (iCVD), a kind of CVD, is used, the formation of the coating portion 140 can be more easily achieved. This is because ALD, MLD, or the like may cause the coated portion to have a uniform, significantly low thickness, so that when the coated portion includes the coating layer and the plurality of protrusions, it may be difficult to ensure moisture-proof reliability. In addition, iCVD can implement a structure: the coating portion includes a coating layer and a plurality of protrusions while achieving a suitable thickness.

According to the iCVD, a monomer M of a polymer constituting the coating part 140 in a chamber (chamber) may be evaporated to form the coating part 140 through a gas-phase polymerization reaction in which a polymerization reaction of the polymer and a film-forming process are simultaneously performed. The initiator I and the monomer M may be evaporated by iCVD, so that a chain polymerization reaction may be performed using the radical R in a gas phase to deposit the coating portion on the surface of the electronic component main body portion 100.

As a detailed example, the monomer M of the siloxane-based polymer and/or the fluorine-based polymer may be evaporated into a gas phase to form the coating part 140 through a gas phase polymerization reaction in which a polymerization reaction of the polymer and a film forming process are simultaneously performed.

Fig. 8A, 8B, and 8C illustrate a process of forming a coated portion according to the present disclosure by vapor deposition.

Referring to fig. 8A, at the beginning of the deposition process, the coating material 40b begins to adhere to a portion of the surface of the body 110.

Referring to fig. 8B, as the deposition process is performed, the coating material attached to the portion of the surface of the body 110 starts to be separated into a thin coating layer 140a 'and a protrusion 140B'.

Referring to fig. 8C, as the deposition process is further performed, the coating part 140 including the coating layer 140a and the plurality of protrusions 140b may be formed to obtain the electronic component 1000.

When the deposition process is performed for a very short period of time, it is possible to realize the coating part 40 having a uniform thickness in which the coating layer and the protrusion are not distinguished, and the average thickness of the coating part 40 may be increased to deteriorate the electrical connectivity of the external electrode, as shown in fig. 9.

It is necessary to appropriately adjust the time required for the deposition process so that the coating portion 140 may include a coating layer 140a disposed on the outer surface of the electronic component main body portion 100 and a plurality of protrusions 140b disposed on the coating layer 140 a.

The coating layer 140a' may have one or more openings. As shown in fig. 8B, this is because the growth of the coating layer 140a 'is insufficient in a specific region, and thus, the coating layer 140a' may exist in the form of local cracks.

In this case, the area of the one or more openings may be equal to or less than 10% of the total area of the coating layer 140 a'. This is because, when the area of the one or more openings is greater than 10% of the total area of the coating layer 140a', the moisture-proof reliability may be deteriorated.

Examples of the invention

The siloxane-based polymer was evaporated to form a coated portion having an average thickness listed in table 1 on the surface of the capacitor chip by gas phase polymerization. Thus, sample pieces were prepared, and then the contact angle and center line average roughness Ra of each of the samples are listed in table 1. In addition, poor mountability testing was performed on the samples and the test results are listed in table 1.

The average thickness of the coated portion is an average of thicknesses of the coated portions measured using an ellipsometer with respect to a specific line L1 having a length of 400nm selected in a (1 μm × 1 μm) region of a central portion of the second surface of the body in the width direction and the length direction (Y direction and X direction).

The contact angles are listed as the average of values obtained by measuring the contact angle with water in specific five points of the (1 μm × 1 μm) region using a contact angle measuring instrument.

The center line average roughness Ra is expressed in nm, and is a value obtained by dividing the area of roughness by the measurement length based on the center line in a surface roughness graph measured with respect to a measurement line using an Atomic Force Microscope (AFM).

Poor mountability indicates the number of sample pieces with poor mountability. The 12 sample pieces in each sample were soldered on the substrate. The case in which tombstone (tombstone) occurred or neither of the two outer electrodes was fixed was determined to be poor. The term "tombstone" refers to a phenomenon in which one of the two outer electrodes is lifted up to cause the sheet to rise upward.

TABLE 1

In the case of sample nos. 1 to 3 in which the average thickness of the coated portions was less than 5nm, a contact angle of 100 degrees or more could not be ensured, so that the moisture-proof reliability was deteriorated.

In the case of sample No. 9 in which the average thickness of the coated portion was more than 30nm, poor mountability occurred.

Further, in the case of sample nos. 4 to 8 in which the average thickness of the coated portion was 5nm to 30nm, the contact angle was 100 degrees or more, so that the moisture-proof reliability was improved and no poor mountability occurred.

Referring to fig. 10 showing the graph of the contact angle in table 1 and fig. 11 showing the graph of the center line average roughness Ra in table 1, it was confirmed that the contact angle of 100 degrees or more from 5nm (average thickness of the coated portion) can be stably secured and the center line average roughness Ra of 0.3nm or more can be stably secured.

As described above, the coating portion including the coating layer and the plurality of protrusions provided on the coating layer may be provided on the outer surface of the electronic component main body portion to improve moisture-proof reliability.

In addition, mountability can be ensured by the area of the coating portion where no protrusion is provided.

In addition, the coating portion may be implemented using vapor deposition to improve productivity and reduce manufacturing costs.

While embodiments have been shown and described above, it will be apparent to those skilled in the art that modifications and variations can be made without departing from the scope of the disclosure as defined by the appended claims.