阅读说明：本技术 一种阵列扫描式半导体激光-电弧复合焊接方法 (Array scanning type semiconductor laser-electric arc hybrid welding method ) 是由 陈树君 闫朝阳 蒋凡 黄文浩 李�诚 于 2020-12-29 设计创作，主要内容包括：一种阵列扫描式半导体激光-电弧复合焊接方法,涉及焊接技术领域。由多个固体激光器固定在可控制扫描式卡具,可控制扫描式卡具通过电机带动并有电脑控制其扫描频率和幅度,从而实现阵列激光束焦点的径向往复式扫描运动,实现了激光与电弧的同轴复合,消除热源的不对称性,焊接无方向性,多个激光束焦点聚成一点时功率最大,实现高功率输出,激光为主热源,电弧为辅热源,有利于加大焊接熔深,提高焊接效率,多个激光束焦点不在一点上时,各个激光束焦点做径向往复式运动,此时激光为辅热源,电弧为主热源,激光充分有效地搅拌熔池,延长了熔池凝固时间,降低温度梯度,减少气孔和飞溅,细化晶粒抑制结晶裂纹的形成。(An array scanning type semiconductor laser-electric arc hybrid welding method relates to the technical field of welding. The controllable scanning type fixture is driven by a motor and has the scanning frequency and amplitude controlled by a computer, so that radial reciprocating type scanning movement of the array laser beam focus is realized, coaxial combination of laser and electric arc is realized, asymmetry of a heat source is eliminated, welding non-directivity is realized, the power is maximum when the laser beam focuses are converged into one point, high power output is realized, the laser is a main heat source, the electric arc is an auxiliary heat source, welding penetration is favorably increased, welding efficiency is improved, when the laser beam focuses are not on one point, each laser beam focus makes radial reciprocating type movement, the laser is an auxiliary heat source, the electric arc is a main heat source, the laser fully and effectively stirs a molten pool, the solidification time of the molten pool is prolonged, the temperature gradient is reduced, air holes and splashing are reduced, and crystal grains are refined to inhibit formation of crystal cracks.)

1. An array scanning semiconductor laser-electric arc composite welding method is characterized by comprising the following steps:

(1) preparing before welding: performing surface treatment on the workpiece to be welded, polishing the workpiece one by using sand paper, removing an oxide film on the surface, cleaning the workpiece by using acetone, drying the workpiece in the air and fixing the workpiece on a welding tool;

(2) setting the positions of a semiconductor laser beam and an arc welding gun: fixing a designed controllable scanning type fixture at the lower end of an arc welding gun, fixing a plurality of solid lasers on the designed controllable scanning type fixture, wherein the designed controllable scanning type fixture is driven by a motor and has the scanning frequency and amplitude of the designed controllable scanning type fixture controlled by a computer; the designed controllable scanning type fixture drives the solid laser to perform scanning movement together;

(3) setting process parameters: setting the power of each solid laser to be 100-200W, the arc current to be 80-120A, the dry extension of a welding wire to be 10-16 mm, the wire feeding speed to be 5-10 m/min at the welding speed to be 4-15 m/min, the laser protective gas to be pure argon, the gas flow to be 10-30L/min, and the welding gun protective gas to be pure argon or argon and CO₂The gas flow of the mixed gas is 10-30L/min;

(4) and (3) welding operation: after the process parameters are set, firstly introducing protective gas, then striking an arc welding gun on a workpiece to be welded, after the arc is stabilized for 1-2 s, enabling a plurality of solid lasers arranged in an array mode to surround and incline towards the arc welding gun to simultaneously emit laser beams, simultaneously controlling a scanning type clamp by a motor, driving the array surrounding type lasers fixed on the clamp to scan, and controlling the lasers and the welding gun through a robot to enable the array lasers and the arc on the workpiece to jointly move to complete laser-arc hybrid welding.

2. The array type scanning semiconductor laser-arc hybrid welding method according to claim 1, wherein the defocusing amount of the laser beams of the plurality of solid laser units is-4 to +4 mm.

3. The array scanning semiconductor laser-arc hybrid welding method according to claim 1, wherein the scanning amplitude of the controllable scanning type fixture is 2-4 mm, and the scanning frequency is 2-200 HZ.

4. The array type scanning semiconductor laser-arc hybrid welding method according to claim 1, wherein the plurality of solid state lasers are arranged in an array around the arc welding gun at an included angle of 45 ° to 75 °.

5. The arrayed scanning semiconductor laser-arc hybrid welding method of claim 1, wherein the plurality of solid state lasers are arrayed in a circular average circle.

6. The array type scanning semiconductor laser-arc hybrid welding method according to claim 1, wherein a plurality of solid laser devices are arranged around the arc welding torch in a circular shape, and a laser scanning path of each solid laser device is in a radial reciprocating type scanning.

7. The array type scanning semiconductor laser-arc hybrid welding method according to claim 1, wherein power is maximized when a plurality of laser beam focuses are converged into one point, high power output is realized, laser is a main heat source, electric arc is an auxiliary heat source, which is beneficial to increasing welding penetration and improving welding efficiency, when the plurality of laser beam focuses are not on one point, each laser beam focus makes radial reciprocating motion, the laser is an auxiliary heat source, the electric arc is a main heat source, the laser fully and effectively stirs a molten pool, the solidification time of the molten pool is prolonged, temperature gradient is reduced, pores and splashing are reduced, crystal grains are refined, formation of crystal cracks is inhibited, and weld quality is improved.

Technical Field

The invention relates to the technical field of welding, in particular to an array type scanning semiconductor laser-arc hybrid welding method.

Background

In recent decades, semiconductor lasers have been developed more rapidly and have become the fastest growing laser technology in the world. The application range of the semiconductor laser covers the whole photoelectronics field and becomes the core technology of the current photoelectronics. The semiconductor laser has the advantages of small volume, simple structure, low input energy, long service life, easy modulation, low price and the like, so that the semiconductor laser is widely applied in the field of photoelectronics at present and has received high attention from all countries in the world.

The laser-arc hybrid heat source welding was proposed at the earliest in the late 70 20 th century, because the laser at that time is very high in cost and low in power, in order to obtain sufficient penetration depth, the Steen teaching in the uk proposes to use GTAW arc to assist laser for welding, and tests show that the welding speed and the forming quality of a thin plate can be greatly improved after the laser is combined with GTAW arc.

At present, the laser welding method can be divided into coaxial compounding and paraxial compounding according to the different spatial positions of the laser and the electric arc during welding. The coaxial compounding can eliminate the asymmetry of the heat source and the welding is non-directional, but the welding fixture used in the compounding mode is designed more complicated. The paraxial composite welding fixture has the advantages of simpler design, more flexible installation mode and large adjustment range, but the asymmetry of the heat source has great influence on the welding quality.

Disclosure of Invention

The invention aims to solve the problems of complex design of a welding gun head, expensive high-power laser equipment and the like in the conventional laser-arc coaxial composite mode and the problem of asymmetric paraxial composite welding heat source, and provides an array type scanning semiconductor laser-arc composite welding method which has the advantages of low manufacturing cost, simple structure of the coaxial welding gun head, elimination of air holes and improvement of the quality of a welding seam.

The technical solution adopted by the invention is as follows: an array type scanning semiconductor laser-electric arc composite welding method comprises the following steps:

(1) preparing before welding: performing surface treatment on the workpiece to be welded, polishing the workpiece one by using sand paper, removing an oxide film on the surface, cleaning the workpiece by using acetone, drying the workpiece in the air and fixing the workpiece on a welding tool;

(2) setting the positions of a semiconductor laser beam and an arc welding gun: fixing a designed controllable scanning type fixture at the lower end of an arc welding gun, fixing a plurality of solid lasers on the designed controllable scanning type fixture, wherein the designed controllable scanning type fixture is driven by a motor and has the scanning frequency and amplitude of the designed controllable scanning type fixture controlled by a computer; the designed controllable scanning type fixture drives the solid laser to perform scanning movement together;

(3) setting process parameters: setting the power of each solid laser to be 100-200W, the arc current to be 80-120A, the dry extension of a welding wire to be 10-16 mm, the wire feeding speed to be 5-10 m/min at the welding speed to be 4-15 m/min, the laser protective gas to be pure argon, the gas flow to be 10-30L/min, and the welding gun protective gas to be pure argon or argon and CO₂The gas flow rate of the mixed gas is 10-30L/min.

(4) And (3) welding operation: after the process parameters are set, firstly introducing protective gas, then striking an arc welding gun on a workpiece to be welded, after the arc is stabilized for 1-2 s, enabling a plurality of solid lasers arranged in an array mode to surround and incline towards the arc welding gun to simultaneously emit laser beams, simultaneously controlling a scanning type clamp by a motor, driving the array surrounding type lasers fixed on the clamp to scan, and controlling the lasers and the welding gun through a robot to enable the array lasers and the arc on the workpiece to jointly move to complete laser-arc hybrid welding.

The defocusing amount of the laser beams of the solid lasers is-4 to +4 mm.

The scanning amplitude of the controllable scanning type fixture is 2-4 mm, and the scanning frequency is 2-200 HZ.

The plurality of solid laser devices are arrayed and surround the arc welding gun to form an included angle of 45-75 degrees.

The plurality of solid laser devices are arranged in an array mode and surround the array mode into a circular average surrounding mode.

The plurality of solid laser devices are arranged around the arc welding gun to form a circle, and the laser scanning path of each solid laser device is in radial reciprocating type scanning.

The focus of the array laser always surrounds under the arc welding gun and makes radial reciprocating motion

The invention has the beneficial effects that: the invention provides an array scanning semiconductor laser-electric arc composite welding method, which arranges and surrounds a plurality of solid lasers in an array manner to realize high-power output, reduces the cost of the lasers, has simple structure of a designed controllable scanning type clamp, realizes the coaxial combination of the lasers and the electric arcs, eliminates the asymmetry of the heat sources, has no directionality in welding, has maximum power when a plurality of laser beam focuses are converged into one point, has the main laser source and the auxiliary electric arc source, is favorable for increasing the welding penetration and improving the welding efficiency, when the focuses of the laser beams are not on one point, the focuses of each laser beam do radial reciprocating motion, at the moment, the lasers are the auxiliary heat sources, the electric arcs are the main heat sources, the lasers fully and effectively stir a molten pool, prolongs the solidification time of the molten pool, reduces the temperature gradient, reduces air holes and splashes, refines crystal grains and inhibits the formation of crystal cracks, the quality of the welding seam is improved.

Drawings

Fig. 1 is a schematic diagram of an array scanning semiconductor laser-arc hybrid welding method according to an embodiment of the invention.

FIG. 2 is a schematic diagram of the focal paths of the array scanning semiconductor laser.

Detailed Description

The present invention will be described in detail with reference to examples, which are only preferred embodiments of the present invention and are not intended to limit the present invention.

Example 1

Firstly, before welding, performing surface treatment on a workpiece to be welded, polishing the workpiece one by using sand paper, removing an oxide film on the surface, cleaning the workpiece by using acetone, drying the workpiece in the air and fixing the workpiece on a welding tool;

secondly, the laser beams are always kept circularly and averagely surrounding the arc welding gun in the welding process, the laser beams jointly act on a welded area, the geometric parameters are set as follows, the included angle between the laser devices and the arc welding gun is 45-75 degrees in an array mode, and the defocusing amount is-4 to +4 mm;

thirdly, setting a welding mode and technological parameters:

fixing a designed controllable scanning type fixture at the lower end part of an arc welding gun, fixing a plurality of solid lasers on the designed controllable scanning type fixture, wherein the controllable scanning type fixture is driven by a motor and has the scanning frequency and the scanning amplitude controlled by a computer;

the laser beam focuses of a plurality of solid lasers are focused into one point, the scanning type fixture is controlled by the motor, so that the array lasers are driven to scan, and the focuses of the array lasers always surround the position under the arc welding gun and do radial reciprocating motion. The welding mode related to the device can be realized by adjusting the relative positions of the laser heat source and the electric arc heat source.

Setting technological parameters: setting the power of each solid laser to be 100-200W, the arc current to be 80-120A, the dry extension of a welding wire to be 10-16 mm, the wire feeding speed to be 5-10 m/min at the welding speed to be 4-15 m/min, the laser protection gas to be pure argon, the gas flow to be 10-30L/min, and the welding gun protection gas to be pure argon or the mixed gas of argon and CO2, wherein the gas flow to be 10-30L/min.

Fourthly, welding operation: after the process parameters are set, firstly introducing protective gas, then striking an arc welding gun on a workpiece to be welded, after the arc is stabilized for 1-2 s, enabling a plurality of solid lasers arranged in an array mode to surround and incline towards the arc welding gun to simultaneously emit laser beams, simultaneously controlling a scanning type clamp by a motor, driving the array surrounding type lasers fixed on the clamp to scan, and controlling the lasers and the welding gun through a robot to enable the array lasers and the arc on the workpiece to jointly move to complete laser-arc hybrid welding.

The array scanning semiconductor laser adopted by the invention is fixed on a controllable scanning type clamp by a plurality of solid lasers, the controllable scanning type clamp is driven by a motor and has a computer to control the scanning frequency and amplitude, thereby realizing the radial reciprocating type scanning movement of the focus of the array laser beam, realizing the coaxial combination of the laser and the electric arc, eliminating the asymmetry of the heat source, welding nondirectionality and reducing the cost, the power is maximum when the focuses of a plurality of laser beams are converged into one point, realizing high power output, the laser is a main heat source, the electric arc is an auxiliary heat source, being beneficial to increasing the welding penetration and improving the welding efficiency, when the focuses of a plurality of laser beams are not on one point, each focus of the laser beams makes the radial reciprocating type movement, the laser is the auxiliary heat source, the electric arc is the main heat source, the laser fully and effectively stirs the molten pool, the solidification time of the, reduce air holes and splash, refine crystal grains, inhibit the formation of crystal cracks and improve the quality of welding seams.

The foregoing is a more detailed description of the present invention that is presented in conjunction with specific embodiments, and the practice of the invention is not to be considered limited to those descriptions. For those skilled in the art to which the present invention pertains, the architecture form can be flexible and varied without departing from the concept of the present invention, and a series of products can be derived. But rather a number of simple derivations or substitutions are made which are to be considered as falling within the scope of the invention as defined by the appended claims.