阅读说明：本技术 一种叶脉仿生表面金刚石切削刀具的激光制备方法 (Laser preparation method of vein bionic surface diamond cutting tool ) 是由 戴厚富 蒙小松 岳海霞 吴威龙 于 2020-12-01 设计创作，主要内容包括：本发明公开了一种叶脉仿生表面金刚石切削刀具的激光制备方法,所述方法包含有如下步骤：一、采用热丝化学气相沉积法在金刚石刀具表面上加工涂层；二、将步骤一所制得的金刚石刀具进行表面处理；三、将经表面处理的刀具表面采用激光加工方法加工出叶脉仿生微结构；四、将加工好的刀具经有机溶剂超声清洗并干燥后用砂纸打磨即得到成品。通过改善刀具切削条件,以提高该新型金刚石刀具的制备效率与质量,增加寿命,能达到批量化生产,适应当今高效率、高规模、高质量的生产要求。(The invention discloses a laser preparation method of a vein bionic surface diamond cutting tool, which comprises the following steps: firstly, processing a coating on the surface of a diamond cutter by adopting a hot wire chemical vapor deposition method; secondly, carrying out surface treatment on the diamond cutter prepared in the step one; thirdly, processing the surface of the cutter subjected to surface treatment into a vein bionic microstructure by adopting a laser processing method; and fourthly, ultrasonically cleaning the machined cutter by using an organic solvent, drying and polishing by using sand paper to obtain a finished product. By improving the cutting conditions of the cutter, the preparation efficiency and quality of the novel diamond cutter are improved, the service life is prolonged, the batch production can be achieved, and the requirements of high efficiency, high scale and high quality production at present are met.)

1. A laser preparation method of a vein bionic surface diamond cutting tool is characterized by comprising the following steps: the method comprises the following steps: firstly, processing a coating on the surface of a diamond cutter by adopting a hot wire chemical vapor deposition method; secondly, carrying out surface treatment on the diamond cutter prepared in the step one; thirdly, processing the surface of the cutter subjected to surface treatment into a vein bionic microstructure by adopting a laser processing method; and fourthly, ultrasonically cleaning the machined cutter by using an organic solvent, drying and polishing by using sand paper to obtain a finished product.

2. The laser preparation method of the vein bionic surface diamond cutting tool according to claim 1, characterized in that: in the first step, the cutter is pretreated, the cutter is ultrasonically cleaned in an acetone solution for 8-15min, Co and carbide removal treatment is carried out on the hard alloy, and ultrasonic crystal implantation is carried out in a diamond micro powder suspension.

3. The laser preparation method of the vein bionic surface diamond cutting tool according to claim 1, characterized in that: in the first step, the adopted hot wire is a tantalum wire.

4. The laser preparation method of the vein bionic surface diamond cutting tool according to claim 1, characterized in that: in the step one, the processing equipment system needs to be vacuumized, and CH is introduced₄And H₂The pressure of the system working chamber is 1-3kPa, and the temperature of the substrate in the system is 650-850 ℃.

5. The laser preparation method of the vein bionic surface diamond cutting tool according to claim 1, characterized in that: in the first step, a film substrate is prepared on the diamond coating by adopting radio frequency magnetron sputtering equipment, and the sputtering time is 25-50 min.

6. The laser preparation method of the vein bionic surface diamond cutting tool according to claim 1, characterized in that: and in the second step, grinding and polishing the surface of the tool to be processed, cleaning the area to be processed by using an acetone solution, polishing the area by using sand paper, ultrasonically cleaning by using an organic solvent, drying and fixing the area on the ultra-precise platform.

7. The laser preparation method of the vein bionic surface diamond cutting tool according to claim 1, characterized in that: in the third step, the parameters of the vein bionic microstructure are as follows: the width of main stem of bionic vein is 70-90 μm, the depth is 20-30 μm, the width of small stem is 50-60 μm, the depth is 10-20 μm, and the distance between main stems is 200 μm.

8. The laser preparation method of the vein bionic surface diamond cutting tool according to claim 1, characterized in that: in the third step, the laser processing technological parameters are as follows: power 1-15W, speed 100-.

Technical Field

The invention relates to a preparation method of a cutter, in particular to a laser preparation method of a vein bionic surface diamond cutting cutter, and belongs to the technical field of diamond cutting cutter processing.

Background

The diamond tool has excellent performances in the aspects of hardness, cutting edge sharpness, heat conductivity and the like, so the diamond tool is commonly used for cutting a workpiece with high hardness, but the cutting performance and the service life of the diamond tool limit the efficient use of the diamond tool in the mechanical industry to a certain extent. The diamond cutter is used as the hardest cutting tool, and in recent years, micro-structures with a certain arrangement sequence are machined on the surface of the diamond cutter to form a research hotspot of current researchers, however, the preparation difficulty is high, the preparation efficiency is low, the precision is low, and the traditional preparation method can not meet the requirements of modern industry on the performance of the cutter.

Disclosure of Invention

The technical problem to be solved by the invention is as follows: the laser preparation method of the vein bionic surface diamond cutting tool is provided, the cutting condition of the tool is improved, the preparation efficiency and quality of the novel diamond tool are improved, the service life is prolonged, and the problems of poor cutting performance, low processing efficiency and low sharpening quality of the diamond tool in the cutting process of the traditional diamond tool are effectively solved.

The technical scheme of the invention is as follows: a laser preparation method of a vein bionic surface diamond cutting tool comprises the following steps: firstly, processing a coating on the surface of a diamond cutter by adopting a hot wire chemical vapor deposition method; secondly, carrying out surface treatment on the diamond cutter prepared in the step one; thirdly, processing the surface of the cutter subjected to surface treatment into a vein bionic microstructure by adopting a laser processing method; and fourthly, ultrasonically cleaning the machined cutter by using an organic solvent, drying and polishing by using sand paper to obtain a finished product.

In the first step, the cutter is pretreated, the cutter is ultrasonically cleaned in an acetone solution for 8-15min, Co and carbide removal treatment is carried out on the hard alloy, and ultrasonic crystal implantation is carried out in a diamond micro powder suspension.

In the first step, the adopted hot wire is a tantalum wire.

In the step one, the processing equipment system needs to be vacuumized, and CH is introduced₄And H₂The pressure of the system working chamber is 1-3kPa, and the temperature of the substrate in the system is 650-850 ℃.

In the first step, a film substrate is prepared on the diamond coating by adopting radio frequency magnetron sputtering equipment, and the sputtering time is 25-50 min.

And in the second step, grinding and polishing the surface of the tool to be processed, cleaning the area to be processed by using an acetone solution, polishing the area by using sand paper, ultrasonically cleaning by using an organic solvent, drying and fixing the area on the ultra-precise platform.

In the third step, the parameters of the vein bionic microstructure are as follows: the width of main stem of bionic vein is 70-90 μm, the depth is 20-30 μm, the width of small stem is 50-60 μm, the depth is 10-20 μm, and the distance between main stems is about 200 μm.

In the third step, the laser processing technological parameters are as follows: power 1-15W, speed 100-.

The invention has the beneficial effects that: compared with the prior art, the invention has the following advantages:

(1) the production efficiency of the laser equipment matched with the high-precision numerical control working machine tool is far higher than that of other machining methods, the batch production can be achieved, and the method is suitable for the current production requirements of high efficiency, high scale and high quality. The surface of the laser processed workpiece is not subjected to mechanical processing, and no residual stress is generated to cause strain, so that the surface of the part has original precision;

(2) the bionic structure of the veins is processed on the front cutter surface of the cutter, so that the friction force and the cutting force in the cutting process can be obviously reduced, the micro grooves can effectively store lubricating agents and also can play a good role in accommodating chips and removing chips, the cutting contact length is reduced, the chip shape is changed, the chip accumulation is reduced, the friction performance is improved, and the service life is prolonged. The service life of the cutter is prolonged by 3-4 times, and the effect is very obvious.

Drawings

FIG. 1 is a schematic view of a microstructure manufacturing process according to the present invention;

FIG. 2 is a schematic view of a microstructured surface of the present invention;

figure 3 is a schematic view of laser machining according to the present invention,

FIG. 4 is a drawing of a cemented carbide substrate insert of the present invention.

Detailed Description

In order to make the objects, technical solutions and advantages of the present invention more apparent, the present invention will be described in further detail with reference to the accompanying drawings.

Example 1: as shown in the attached figures 1-4, a laser preparation method of a vein bionic surface diamond cutting tool comprises the following steps: firstly, processing a coating on the surface of a diamond cutter by adopting a hot wire chemical vapor deposition method; secondly, carrying out surface treatment on the diamond cutter prepared in the step one; thirdly, processing the surface of the cutter subjected to surface treatment into a vein bionic microstructure by adopting a laser processing method; and fourthly, ultrasonically cleaning the machined cutter by using an organic solvent, drying and polishing by using sand paper to obtain a finished product.

The method comprises the following specific steps:

1. diamond coated tool preparation

The Hot Filament Chemical Vapor Deposition (HFCVD) technology has the characteristics of simple equipment, low cost, high film forming speed, compact coating and the like, and comprises the following steps:

1) pretreating the cutter, and ultrasonically cleaning the cutter in an acetone solution for 8-15 min. Co removal and carbide treatment are carried out on the hard alloy, ultrasonic crystal planting is carried out in the suspension of the diamond micro powder, and a hard alloy matrix blade figure is shown in attached figure 4.

2) The cutter was placed in an HFCVD system and a hot wire, which was tantalum wire, was installed.

3) Vacuumizing the HFCVD system and introducing a certain proportion of CH₄And H₂The mixed reaction gas of (1);

4) starting an HFCVD system, adjusting the air pressure of a working chamber of the HFCVD system to be 1-3kPa, and adjusting the substrate temperature in the system to be 650-;

5) and preparing a film substrate on the diamond coating by adopting radio frequency magnetron sputtering equipment, wherein the sputtering time is 25-50 min.

2. A method for preparing a microstructure on the rake face of a diamond cutter based on femtosecond laser comprises the following steps (as shown in the preparation flow diagram of the microstructure shown in figure 1):

1) before the surface texturing processing, the surface of a workpiece to be processed is ground and polished, an acetone solution is used for cleaning an area to be processed, 600# abrasive paper is used for grinding, and the workpiece is fixed on an ultra-precise platform after being ultrasonically cleaned and dried by an organic solvent so as to ensure the safety and stability of the processing process and the accuracy of a result.

2) Clamping the diamond cutter on a numerical control machine tool and fixing the diamond cutter, exposing more than 80% of the front cutter surface, and adjusting the X-Y axis to adjust the cutter to an accurate processed position so as to ensure that the processed part is completely focused by laser. A bionic structure parallel to a cutting edge is processed on the front knife face of the knife tool, the size of a microstructure is reasonably selected according to the research on the bionic structure of the vein, the width of a main stem of the bionic vein is 70-90 mu m, the depth is 20-30 mu m, the width of a small stem is 50-60 mu m, the depth is 10-20 mu m, the distance between the main stems is about 200 mu m, and the distance between the main stems and the edge is 200 mu m before processing. The width and depth of the microstructure can be processed by controlling parameters such as laser energy, laser scanning speed and the like. The tool microstructured surface is schematically illustrated in fig. 2.

3) The method comprises the steps of firstly starting a laser, transmitting a laser beam to the surface of a workpiece by a computer through a laser controller to finish laser focusing, wherein the focusing position is-2-2 mm, then adjusting the rotation angle and the height of a focusing lens according to a Z axis and a processing angle to realize laser accurate focusing so as to ensure that the effective part of a cutter is not damaged, closing a laser generator after determining the focal position, and adjusting an ultra-precise platform to determine the processing area of the workpiece.

4) When a workpiece is machined, the laser controller is started by the control computer, the laser controller can select the femtosecond laser in the laser generator to emit laser beams, the laser beams are incident to the surface of the workpiece through the focusing lens, machining is carried out according to the required microstructure, meanwhile, the auxiliary gas device is started, and the laser machining process parameters can be adjusted on line through the control computer. The processing method of femtosecond laser microstructure preparation as claimed in claim, wherein the laser processing parameters adopted at this time include power of 1-15W, speed of 100-1000 μm/s, frequency of 1-3kHz, and scanning frequency of 2-5 times, considering the characteristics of the microstructure, as shown in the femtosecond laser processing diagram of FIG. 3.

5) And after the processing is finished, closing the equipment to take down the workpiece, ultrasonically cleaning the workpiece by using an organic solvent, drying the workpiece, and polishing the workpiece by using 600# abrasive paper to obtain a finished product.

The laser processing system comprises a laser controller, a laser generator, a light path switching module, a focusing module, a blowing auxiliary device and an ultra-precise three-axis X-Y-Z machine tool. The auxiliary gas comprises nitrogen and argon; the solvent includes acetone and alcohol.

The method adopts femtosecond laser for preparation. The femtosecond laser processing technology means that the pulse width is in femtosecond level (1fs = 10)^-15s) can form a micro-structure with micron or even nano-scale size and high precision, has the characteristics of small processing heat affected zone, high material removal efficiency, fine cutting edge and the like, belongs to a clean and pollution-free processing method, and is a green, environment-friendly, energy-saving and high-efficiency surface processing technology. And the processing process of the femtosecond laser belongs to non-contact type, surface stress can not be generated, and the method has the obvious advantage of removing materials without abrasion. In the laser processing process, a high-intensity laser beam is focused on the surface of a workpiece through an optical lens, and a processed material is heated, melted and gasified, as shown in a laser processing schematic diagram of fig. 2. The femtosecond laser processing is combined with the advanced computer technology, can process a complex structure, is suitable for the precision processing of high automation and special tissues, and can ensure that the cutter has special cutting performance. The selection of laser preparation and the selection of parameters greatly influence the performance and the service life of the tool, and because the special laser of the diamond tool can cause thermal defects such as microcracks, fractures and the like, the reasonable selection of processing parameters is also particularly important.

The present invention is not described in detail, but is known to those skilled in the art. Finally, the above embodiments are only for illustrating the technical solutions of the present invention and not for limiting, although the present invention has been described in detail with reference to the preferred embodiments, it should be understood by those skilled in the art that modifications or equivalent substitutions may be made to the technical solutions of the present invention without departing from the spirit and scope of the technical solutions of the present invention, and all of them should be covered in the claims of the present invention.