阅读说明：本技术 一种金属层空心微点阵结构的制备方法及温控系统 (Preparation method of metal layer hollow micro-lattice structure and temperature control system ) 是由 许文军 刘龙权 陈俊铭 于 2021-07-06 设计创作，主要内容包括：本发明公开了一种金属层空心微点阵结构的制备方法及温控系统,该方法包括以下步骤：S1、制备复合化学镀液；S2、制备空心微点阵材料；S3、对所述空心微点阵材料进行铜电镀,形成加铜的复合镀层空心微点阵；S4、对所述复合镀层空心微点阵进行封口；S5、将相变材料注入到所述复合镀层空心微点阵中,形成金属层空心微点阵结构。本发明能保持热源的温度缓慢变化及使最高温和最低温差值缩小,延长热源的温度疲劳寿命,其散热效率高,散热效果好。(The invention discloses a preparation method of a metal layer hollow micro-lattice structure and a temperature control system, wherein the method comprises the following steps: s1, preparing a composite chemical plating solution; s2, preparing a hollow micro-lattice material; s3, carrying out copper electroplating on the hollow micro-lattice material to form a copper-added composite plating layer hollow micro-lattice; s4, sealing the hollow micro-lattice of the composite plating layer; and S5, injecting a phase change material into the composite plating layer hollow micro lattice to form a metal layer hollow micro lattice structure. The invention can keep the temperature of the heat source to change slowly, reduce the difference value between the highest temperature and the lowest temperature, prolong the temperature fatigue life of the heat source, and has high heat dissipation efficiency and good heat dissipation effect.)

1. A preparation method of a metal layer hollow micro-lattice structure is characterized by comprising the following steps:

s1, preparing a composite chemical plating solution;

s2, preparing a hollow micro-lattice material;

s3, carrying out copper electroplating on the hollow micro-lattice material to form a copper-added composite plating layer hollow micro-lattice;

s4, sealing the hollow micro-lattice of the composite plating layer;

and S5, injecting a phase change material into the composite plating layer hollow micro lattice to form a metal layer hollow micro lattice structure.

2. The method for preparing a hollow microarray structure of a metal layer according to claim 1, wherein the step S1 of preparing the composite electroless plating solution comprises:

s11, putting the graphene nanosheets with the diameters of 2 microns into the aqueous solution of the graphene container;

s12, sequentially adding sodium dodecyl sulfate, polyvinylpyrrolidone and deionized water in a mass ratio of 1:10: 10;

s13, dispersing the graphene nanosheets by an ultrasonic dispersion method to form a dispersed graphene solution;

and S14, mixing and stirring the alloy chemical plating solution and the dispersed graphene solution to obtain the uniform composite chemical plating solution.

3. The method for preparing a hollow metal microarray structure of claim 2, wherein the step S2 of preparing a hollow microarray material comprises:

s21, designing a micro-lattice structure on a computer by using a computer aided design technology;

s22, manufacturing a micro-lattice matrix by using the chemical solubility of photosensitive resin and adopting a three-dimensional photocuring 3D printing method, and removing oil stains on the surface of the matrix;

s23, activating the surface of the microarray matrix by using a colloidal palladium solution at 40 ℃ for 10 minutes;

s25, placing the microarray matrix in NaOH solution with the concentration of 50g/L, exposing the microarray matrix for 10S at room temperature, and exposing palladium nanoparticles which can be used as a catalyst for chemical reduction reaction;

s26, immersing the microarray matrix in water for 3 minutes for preheating, wherein the temperature of the water is the same as that required by chemical plating;

s27, placing the preheated microarray substrate into the composite chemical plating solution for chemical plating for 90min, and washing with clean water after chemical plating;

s28, grinding part of external nodes of the cleaned microarray matrix, exposing the resin matrix, soaking the ground microarray matrix in a chemical solution consisting of 20g/L NaOH and 700ml/L ethanol, etching the internal resin matrix of the microarray matrix for 24 hours in a water bath environment at 60 ℃, and melting the resin in the etching solution;

and S29, washing the residual resin with clear water to obtain the hollow microarray material.

4. The method for preparing a hollow metal microarray structure of claim 3, wherein the step S3 of electroplating the hollow microarray material with copper to form a copper-added composite coated hollow microarray comprises:

s31, immersing the hollow micro-lattice material in an electroplating copper solution at room temperature under the current of 3-5A for electroplating for 10 minutes;

s32, cleaning with clear water after electroplating, and then soaking for 1 minute by using an anti-oxidation liquid;

and S33, washing with clear water to obtain the hollow micro-lattice of the composite coating.

5. The method for preparing the metal layer hollow microarray structure of claim 4, wherein the step S4 of sealing the composite coating hollow microarray structure comprises:

s41, mixing the glue of the two components of the AB glue together in a ratio of 1:1 before sealing by using the AB casting glue;

s42, sealing the gap of the hollow micro-lattice of the composite plating layer;

and S43, solidifying the AB casting adhesive for 6 hours at normal temperature.

6. The method for preparing the metal layer hollow microarray structure of claim 5, wherein the step S5 of injecting a phase change material into the composite plating layer hollow microarray comprises:

s51, melting the phase-change material at least comprising paraffin and gallium in a water bath environment at 60 ℃, and placing the composite plating layer hollow microarray in the same temperature environment;

s52, sucking the melted phase-change material by using a needle tube;

and S52, injecting the phase-change material into the composite plating layer hollow micro-lattice with different sizes.

7. A temperature control system, comprising:

a metal layer hollow micro-lattice structure (1), wherein the metal layer hollow micro-lattice structure (1) is prepared by the preparation method of the metal layer hollow micro-lattice structure according to any one of claims 1 to 6, the upper part and the lower part of the metal layer hollow micro-lattice structure (1) are respectively provided with an upper convection channel and a lower convection channel, and the metal layer hollow micro-lattice structure (1) is contacted with a heat source (7);

the two ends of the peristaltic convection pump (9) are respectively connected with the upper convection channel and the lower convection channel; the peristaltic convection pump (9) can enable the phase-change material (2) to circularly creep in the metal layer hollow micro-lattice structure (1) through the upper convection channel and the lower convection channel.

8. The temperature control system according to claim 7, wherein the upper convection channel comprises a first forced convection pipe (3) and a second forced convection pipe (6) which are arranged at two ends of the upper part of the metal layer hollow microarray structure (1), and the first forced convection pipe (3) and the second forced convection pipe (6) are connected with one end of a peristaltic convection pump (9) through a first connecting pipe (10);

the lower convection channel comprises a third forced convection pipeline (4) and a fourth forced convection pipeline (5) which are arranged at two ends of the lower part of the metal layer hollow micro-lattice structure (1), and the third forced convection pipeline (4) and the fourth forced convection pipeline (5) are connected with the other end of the peristaltic convection pump (9) through a second connecting pipeline (8);

the first forced convection pipeline (3), the second forced convection pipeline (6), the third forced convection pipeline (4) and the fourth forced convection pipeline (5) are communicated with the inside of the metal layer hollow micro-lattice structure (1).

9. The temperature control system according to claim 8, wherein an air supply device (11) is disposed at an end of the metal layer hollow micro-lattice structure (1) far away from the heat source (7), and the air supply device (11) is capable of performing forced air convection heat exchange on the metal layer hollow micro-lattice structure (1).

Technical Field

The invention relates to the technical field of temperature control, in particular to a preparation method of a metal layer hollow micro-lattice structure and a temperature control system.

Background

The aerospace field faces severe thermal protection issues. high-Mach aircraft such as hypersonic aircrafts, world shuttle aircrafts, hypersonic cruise missiles and the like bear complex thermal loads due to severe relative contact with air, and efficient thermal protection materials and technologies need to be developed. The spacecraft faces extreme thermal environment in outer space, and in order to guarantee the service life of the spacecraft and the normal operation of internal devices, a thermal protection method is needed to carry out thermal insulation protection on the spacecraft. Meanwhile, with the continuous increase of the integration density and power of electronic components, the density of the generated heat flow is also continuously increased, so that the heat dissipation and heat protection problems of electronic devices in the spacecraft are very important.

Disclosure of Invention

Therefore, it is necessary to provide a method for manufacturing a metal layer hollow micro-lattice structure with high heat dissipation efficiency and good heat dissipation effect and a temperature control system.

A preparation method of a metal layer hollow micro-lattice structure comprises the following steps:

s1, preparing a composite chemical plating solution;

s2, preparing a hollow micro-lattice material;

s3, carrying out copper electroplating on the hollow micro-lattice material to form a copper-added composite plating layer hollow micro-lattice;

s4, sealing the hollow micro-lattice of the composite plating layer;

and S5, injecting a phase change material into the composite plating layer hollow micro lattice to form a metal layer hollow micro lattice structure.

In one embodiment, the step S1, preparing the composite electroless plating solution includes:

s11, putting the graphene nanosheets with the diameters of 2 microns into the aqueous solution of the graphene container;

s12, sequentially adding sodium dodecyl sulfate, polyvinylpyrrolidone and deionized water in a mass ratio of 1:10: 10;

s13, dispersing the graphene nanosheets by an ultrasonic dispersion method to form a dispersed graphene solution;

and S14, mixing and stirring the alloy chemical plating solution and the dispersed graphene solution to obtain the uniform composite chemical plating solution.

In one embodiment, the step S2, the preparing the hollow microarray material includes:

s21, designing a micro-lattice structure on a computer by using a computer aided design technology;

s22, manufacturing a micro-lattice matrix by using the chemical solubility of photosensitive resin and adopting a three-dimensional photocuring 3D printing method, and removing oil stains on the surface of the matrix;

s23, activating the surface of the microarray matrix by using a colloidal palladium solution at 40 ℃ for 10 minutes;

s25, placing the microarray matrix in NaOH solution with the concentration of 50g/L, exposing the microarray matrix for 10S at room temperature, and exposing palladium nanoparticles which can be used as a catalyst for chemical reduction reaction;

s26, immersing the microarray matrix in water for 3 minutes for preheating, wherein the temperature of the water is the same as that required by chemical plating;

s27, placing the preheated microarray substrate into the composite chemical plating solution for chemical plating for 90min, and washing with clean water after chemical plating;

s28, grinding part of external nodes of the cleaned microarray matrix, exposing the resin matrix, soaking the ground microarray matrix in a chemical solution consisting of 20g/L NaOH and 700ml/L ethanol, etching the internal resin matrix of the microarray matrix for 24 hours in a water bath environment at 60 ℃, and melting the resin in the etching solution;

and S29, washing the residual resin with clear water to obtain the hollow microarray material.

In one embodiment, in step S3, the step of performing copper electroplating on the hollow microarray material to form a copper-added composite coated hollow microarray includes:

s31, immersing the hollow micro-lattice material in an electroplating copper solution at room temperature under the current of 3-5A for electroplating for 10 minutes;

s32, cleaning with clear water after electroplating, and then soaking for 1 minute by using an anti-oxidation liquid;

and S33, washing with clear water to obtain the hollow micro-lattice of the composite coating.

In one embodiment, in step S4, the sealing the composite plating hollow microarray comprises:

s41, mixing the glue of the two components of the AB glue together in a ratio of 1:1 before sealing by using the AB casting glue;

s42, sealing the gap of the hollow micro-lattice of the composite plating layer;

and S43, solidifying the AB casting adhesive for 6 hours at normal temperature.

In one embodiment, the step S5, injecting the phase change material into the composite plating hollow microarray includes:

s51, melting the phase-change material at least comprising paraffin and gallium in a water bath environment at 60 ℃, and placing the composite plating layer hollow microarray in the same temperature environment;

s52, sucking the melted phase-change material by using a needle tube;

and S52, injecting the phase-change material into the composite plating layer hollow micro-lattice with different sizes.

A temperature control system, comprising:

the metal layer hollow micro-lattice structure is prepared by a preparation method of the metal layer hollow micro-lattice structure, the upper part and the lower part of the metal layer hollow micro-lattice structure are respectively provided with an upper convection channel and a lower convection channel, and the metal layer hollow micro-lattice structure is contacted with a heat source;

the two ends of the peristaltic convection pump are respectively connected with the upper convection channel and the lower convection channel; the peristaltic convection pump can enable the phase-change material to circularly creep in the metal layer hollow micro-lattice structure through the upper convection channel and the lower convection channel.

In one embodiment, the upper convection channel comprises a first forced convection pipeline and a second forced convection pipeline which are arranged at two ends of the upper part of the metal layer hollow micro-lattice structure, and the first forced convection pipeline and the second forced convection pipeline are connected with one end of the peristaltic convection pump through a first connecting pipeline;

the lower convection channel comprises a third forced convection pipeline and a fourth forced convection pipeline which are arranged at two ends of the lower part of the metal layer hollow micro-lattice structure, and the third forced convection pipeline and the fourth forced convection pipeline are connected with the other end of the peristaltic convection pump through a second connecting pipeline;

the first forced convection pipeline, the second forced convection pipeline, the third forced convection pipeline and the fourth forced convection pipeline are communicated with the inside of the metal layer hollow micro-lattice structure.

In one embodiment, an air supply device is arranged at one end of the metal layer hollow micro-lattice structure far away from the heat source, and the air supply device can perform forced air convection heat exchange on the metal layer hollow micro-lattice structure.

When the temperature control system is in contact with a heat source, on one hand, heat is transferred to the outside through the high surface area of the metal layer hollow micro-lattice structure, on the other hand, heat absorption and heat release are carried out through phase change of the phase change material in the metal layer hollow micro-lattice structure, the temperature of the heat source can be kept to be changed slowly, the difference value between the highest temperature and the lowest temperature is reduced, the temperature fatigue life of the heat source is prolonged, the heat dissipation efficiency is high, and the heat dissipation effect is good.

Drawings

In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the drawings needed to be used in the embodiments will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and it is obvious for those skilled in the art that other drawings can be obtained according to these drawings without creative efforts.

FIG. 1 is a schematic structural diagram of a metal layer hollow micro-lattice structure according to the present invention

FIG. 2 is another schematic view of the metal layer hollow micro-lattice structure according to the present invention;

fig. 3 is a schematic structural diagram of the temperature control system of the present invention.

Detailed Description

To facilitate an understanding of the invention, the invention will now be described more fully with reference to the accompanying drawings. Preferred embodiments of the present invention are shown in the drawings. This invention may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete.

It will be understood that when an element is referred to as being "secured to" another element, it can be directly on the other element or intervening elements may also be present. When an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements may also be present. The terms "vertical," "horizontal," "left," "right," and the like as used herein are for illustrative purposes only and do not represent the only embodiments.

Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. The terminology used in the description of the invention herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. As used herein, the term "and/or" includes any and all combinations of one or more of the associated listed items.

Referring to fig. 1 to 3, an embodiment of the present invention provides a method for preparing a metal layer hollow micro-lattice structure, which includes the following steps:

s1, preparing a composite chemical plating solution;

s2, preparing a hollow micro-lattice material;

s3, carrying out copper electroplating on the hollow micro-lattice material to form a copper-added composite plating layer hollow micro-lattice; s4, sealing the hollow micro-lattice of the composite plating layer;

and S5, injecting a phase change material into the composite plating layer hollow micro lattice to form a metal layer hollow micro lattice structure.

Specifically, in step S1 of the present invention, the preparing the composite electroless plating solution includes:

s11, putting the graphene nanosheets with the diameters of 2 microns into the aqueous solution of the graphene container;

s12, sequentially adding sodium dodecyl sulfate, polyvinylpyrrolidone and deionized water in a mass ratio of 1:10: 10;

s13, dispersing the graphene nanosheets by an ultrasonic dispersion method to form a dispersed graphene solution;

and S14, mixing and stirring the alloy chemical plating solution and the dispersed graphene solution to obtain the uniform composite chemical plating solution.

In an embodiment of the present invention, in step S2, the preparing the hollow microarray material includes:

s21, designing a micro-lattice structure on a computer by using a computer aided design technology; in this embodiment, the microarray structure includes, but is not limited to, octahedral unit cell, pyramidal unit cell structure, and the like.

S22, manufacturing a micro-lattice matrix by using the chemical solubility of photosensitive resin and adopting a three-dimensional photocuring 3D printing method, and removing oil stains on the surface of the matrix; in this embodiment, the detergent solution and the ultrasonic wave may be used together to remove the oil stain possibly existing on the surface of the microarray substrate.

S23, activating the surface of the microarray matrix by using a colloidal palladium solution at 40 ℃ for 10 minutes;

s25, placing the microarray matrix in NaOH solution with the concentration of 50g/L, exposing the microarray matrix for 10S at room temperature, and exposing palladium nanoparticles which can be used as a catalyst for chemical reduction reaction;

s26, immersing the microarray matrix in water for 3 minutes for preheating, wherein the temperature of the water (such as 90 ℃) is the same as the temperature required by chemical plating;

s27, placing the preheated microarray substrate into the composite chemical plating solution for chemical plating for 90min, and washing with clean water after chemical plating;

s28, grinding part of external nodes of the cleaned microarray matrix, exposing the resin matrix, soaking the ground microarray matrix in a chemical solution consisting of 20g/L NaOH and 700ml/L ethanol, etching the internal resin matrix of the microarray matrix for 24 hours in a water bath environment at 60 ℃, and melting the resin in the etching solution;

and S29, washing the residual resin with clear water to obtain the hollow microarray material.

In an embodiment of the present invention, in step S3, the step of performing copper electroplating on the hollow micro-lattice material to form a copper-added composite plating layer hollow micro-lattice includes:

s31, immersing the hollow micro-lattice material in an electroplating copper solution at room temperature under the current of 3-5A for electroplating for 10 minutes; therefore, the heat-conducting property of the hollow micro-lattice material can be improved. Specifically, the anode is connected with the phosphor copper plate by a conductive metal wire, the cathode is connected with the metal hollow lattice by a metal wire, the distance between the electroplated sample and the anode plate is about 3-5 cm, and the electroplating material is stirred and turned over during electroplating, so that the electroplated layer is uniformly plated on the hollow micro lattice material.

S32, cleaning with clear water after electroplating, and then soaking for 1 minute by using an anti-oxidation liquid;

and S33, washing with clear water to obtain the hollow micro-lattice of the composite coating. In some embodiments, the hollow microarray material may also be subjected to a secondary electroless plating operation.

In an embodiment of the present invention, in step S4, the sealing the hollow composite coating micro-lattice includes:

s41, mixing the glue of the two components of the AB glue together in a ratio of 1:1 before sealing by using the AB casting glue;

s42, sealing the gap of the hollow micro-lattice of the composite plating layer;

and S43, solidifying the AB casting adhesive for 6 hours at normal temperature.

In an embodiment of the present invention, in step S5, injecting a phase change material into the composite plating layer hollow microarray includes:

s51, melting the phase-change material at least comprising paraffin and gallium in a water bath environment at 60 ℃, and placing the composite plating layer hollow microarray in the same temperature environment;

s52, sucking the melted phase-change material by using a needle tube;

and S52, injecting the phase-change material into the composite plating layer hollow micro-lattice with different sizes.

Referring to fig. 2, an embodiment of the present invention provides a temperature control system, which includes: a metal layer hollow micro-lattice structure 1 and a peristaltic convection pump 9.

The metal layer hollow micro-lattice structure 1 is prepared by a preparation method of the metal layer hollow micro-lattice structure, the upper part and the lower part of the metal layer hollow micro-lattice structure 1 are respectively provided with an upper convection channel and a lower convection channel, and the metal layer hollow micro-lattice structure 1 is contacted with a heat source 7; in this embodiment, the bottom surface of the metal layer hollow micro-lattice structure 1 can contact with a heat source 7,

two ends of the peristaltic convection pump 9 are respectively connected with the upper convection channel and the lower convection channel; the peristaltic convection pump 9 can make the phase-change material 2 circularly peristaltically creep in the metal layer hollow micro-lattice structure 1 through the upper convection channel and the lower convection channel. Namely, the peristaltic convection pump 9 applies a forced force in modes of peristalsis and the like, so that the heat conduction and natural convection of the phase-change material 2 in the metal layer hollow micro-lattice structure 1 are changed into forced convection, the heat transfer efficiency can be increased, and the heat exchange capacity can be improved.

In an embodiment of the present invention, the upper convection channel includes a first forced convection pipe 3 and a second forced convection pipe 6 disposed at two ends of the upper portion of the metal layer hollow micro-lattice structure 1, and the first forced convection pipe 3 and the second forced convection pipe 6 are connected with one end of a peristaltic convection pump 9 through a first connection pipe 10; the lower convection channel comprises a third forced convection pipeline 4 and a fourth forced convection pipeline 5 which are arranged at two ends of the lower part of the metal layer hollow micro-lattice structure 1, and the third forced convection pipeline 4 and the fourth forced convection pipeline 5 are connected with the other end of the peristaltic convection pump 9 through a second connecting pipeline 8; the first forced convection pipeline 3, the second forced convection pipeline 6, the third forced convection pipeline 4 and the fourth forced convection pipeline 5 are communicated with the interior of the metal layer hollow micro-lattice structure 1.

In an embodiment of the present invention, an air supply device 11 (e.g., a fan, etc.) is disposed at an end of the metal layer hollow micro-lattice structure 1 away from the heat source 7, and the air supply device 11 can perform forced air convection heat exchange on the metal layer hollow micro-lattice structure 1. The natural air cooling mode of the air supply device 11 for the metal layer hollow micro-lattice structure 1 is changed into a forced air cooling mode, the high specific surface area of the metal layer hollow micro-lattice structure 1 is utilized, and the heat exchange capability of the metal layer hollow micro-lattice structure 1 is enhanced by adopting a mode of combining the forced convection heat exchange of the in-pipe circulation cooling and the forced air cooling convection heat exchange of the outside.

It should be noted that, when the metal layer hollow micro-lattice structure 1 of the temperature control system contacts the heat source 7, on one hand, heat is transferred to the outside through the metal layer hollow micro-lattice structure 1, and on the other hand, heat is transferred to the phase change material through the metal layer hollow micro-lattice structure 1, and heat absorption and heat release are performed through phase change. Thus, the main forms of heat transfer for the present invention are: the pipe wall of the metal layer hollow micro-lattice structure 1 conducts heat, the metal layer of the metal layer hollow micro-lattice structure 1 conducts heat with the outside air through natural convection, the phase-change material conducts heat, and the possible liquid phase-change material conducts heat through natural convection.

When the temperature control system is converted from a passive cooling mode to an active cooling mode, the heat dissipation efficiency of the temperature control system can be improved. Namely: the internal phase-change material 2 is forced to convect by a peristaltic convection pump 9, and the metal layer hollow micro-lattice structure 1 is forced to convect and exchange heat with air by an external air supply device 11. At this point, the primary heat transfer modalities are: the heat conduction and temperature control system of the pipe wall of the metal layer hollow micro-lattice structure 1 is in a comprehensive heat transfer form of forced convection heat exchange with air and forced convection heat exchange with liquid phase-change materials.

The technical features of the embodiments described above may be arbitrarily combined, and for the sake of brevity, all possible combinations of the technical features in the embodiments described above are not described, but should be considered as being within the scope of the present specification as long as there is no contradiction between the combinations of the technical features.

The above-described examples merely represent several embodiments of the present application and are not to be construed as limiting the scope of the claims. It should be noted that, for a person skilled in the art, several variations and modifications can be made without departing from the concept of the present application, which falls within the scope of protection of the present application. Therefore, the protection scope of the present patent shall be subject to the appended claims.