阅读说明：本技术 一种纳米刀具及其加工方法 (Nano cutter and machining method thereof ) 是由 袁志山 孙明杨 胡小月 王成勇 于 2020-11-20 设计创作，主要内容包括：本发明公开了一种纳米刀具,其包括固定连接的装夹部和工作部,所述装夹部用于将刀具装配在机床上,所述工作部用于切削加工；所述工作部包括基体,所述基体的表面涂覆硬质涂层,所述工作部包括主切削刃、连接所述主切削刃的副切削刃；所述副切削刃的尺寸为纳米尺度。本发明还公开了所述纳米刀具的加工方法。与现有技术相比,本发明的纳米刀具在用于切削加工的工作部涂覆了硬质涂层,再将副切削刃的尺寸加工至纳米尺度,可以实现对半导体和非半导体等材料的微纳加工,提高加工效率,减少了生产成本,提高了加工精度。(The invention discloses a nanometer cutter, which comprises a clamping part and a working part, wherein the clamping part and the working part are fixedly connected; the working part comprises a substrate, the surface of the substrate is coated with a hard coating, and the working part comprises a main cutting edge and an auxiliary cutting edge connected with the main cutting edge; the size of the secondary cutting edge is in the nanometer scale. The invention also discloses a processing method of the nanometer cutter. Compared with the prior art, the nanometer cutter has the advantages that the hard coating is coated on the working part for cutting, and then the size of the secondary cutting edge is processed to be nanometer scale, so that micro-nano processing on materials such as semiconductors and non-semiconductors can be realized, the processing efficiency is improved, the production cost is reduced, and the processing precision is improved.)

1. A nanometer cutter, which is characterized in that: the cutting tool comprises a clamping part and a working part which are fixedly connected, wherein the clamping part is used for assembling the cutting tool on a machine tool, and the working part is used for cutting; the working part comprises a substrate, the surface of the substrate is coated with a hard coating, and the working part comprises a main cutting edge and an auxiliary cutting edge connected with the main cutting edge; the size of the secondary cutting edge is in the nanometer scale.

2. The NanoTave according to claim 1, wherein: the hard coating is one of a diamond coating, a cubic boron nitride coating, a hard alloy coating, a ceramic coating or a high-speed steel coating.

3. The NanoTave according to claim 1, wherein: the width of the secondary cutting edge is 10 nm-1 um.

4. The machining method of a nano tool according to any one of claims 1 to 3, comprising the steps of:

s1: cleaning a cutter to be processed and then clamping the cutter to a machine tool;

s2: cutting the main cutting edge and the auxiliary cutting edge inwards from the outer surface of the tool to be machined by using femtosecond laser to enable the size of the auxiliary cutting edge of the tool to be machined to be continuously reduced;

s3: carrying out ultrasonic cleaning on the cutter to be processed;

s4: and milling the secondary cutting edge for multiple times by using a focused ion beam until the size of the secondary cutting edge reaches a nanometer scale.

5. The machining method according to claim 4, wherein in step S2, the femtosecond laser performs scanning cutting along a vertical path so that the outer contours of the main cutting edge and the minor cutting edge are stepped.

6. The machining method according to claim 4, wherein in step S2, the femtosecond laser scans and cuts along a stepped path so that the outer contours of the main cutting edge and the minor cutting edge are stepped.

7. The machining method according to claim 4, wherein in step S2, the femtosecond laser performs scanning cutting along an inclined line path forming an included angle with the secondary cutting edge, so that the outer contours of the primary cutting edge and the secondary cutting edge are formed in a step shape.

8. The processing method according to claim 4, wherein in step S2, the femtosecond laser has a power of 1W-20W, a repetition frequency of 5 kHz-50 kHz, a processing speed of 10-500 mm/S, and a cutting frequency of 100-1000.

9. The processing method according to claim 4, wherein in step S4, the focused ion beam is any one of a gallium ion beam, a helium ion beam, a neon ion beam and an argon ion beam, and a scanning path of the focused ion beam is a grating type or a vector type.

10. The machining method according to claim 4, wherein in step S4, the voltage of the focused ion beam is 0.5 k-50 kV, the current is 1 pA-1 uA, and the focused ion beam cuts the secondary cutting edge to 10 nm-1 um.

Technical Field

The invention relates to the technical field of cutter manufacturing, in particular to a nanometer cutter and a preparation method thereof.

Background

With the trend of miniaturization development in manufacturing industry, the demands for semiconductor devices, micromachines, optical communications, microelectronic technologies, etc. are increasingly stringent, and the requirements for corresponding processing technologies are also higher and higher. The fine cutting is cutting processing for removing a micron-scale cutting layer from a millimeter-scale overall-scale structure. The basic principle is that on a precise or ultra-precise cutting machine, a micro cutting tool is used to remove redundant materials on a workpiece, so that the workpiece becomes a micro precise structural member meeting the requirements in the aspects of shape, precision, surface quality and the like. The traditional micro-cutting tool can only process parts with millimeter scale to the maximum extent, and the parts with nanometer scale are usually realized by processing means such as photoetching, electron beams, ion beams and the like. But common photoetching can not be realized below 2um, and only a planar process can be realized, so that the forming on a complex structure can not be realized; the electron beam exposure machine cannot solve the problem of large-area exposure efficiency, and generally only can turn to expensive deep ultraviolet lithography, so that the production cost is higher; although the processing precision of the focused ion beam is very high, the equipment is expensive, and the processing efficiency is low. Therefore, it is very important to design a method for manufacturing a nano-sized cutting tool that satisfies both high precision and high efficiency.

Disclosure of Invention

The invention aims to overcome the defect of high processing cost of processing parts with nanoscale dimensions in the prior art, and provides a nanometer cutter which can process parts with nanoscale dimensions and is suitable for being applied to microfluidic chips, micro-nano grooves, medical ophthalmic surgery, printed circuit boards, diffractive micro-optical elements, Fresnel reflectors, micro stamping dies/micro injection molding dies, tool electrodes of electric processing technology and masks of photoetching technology.

In order to achieve the purpose, the invention adopts the following technical scheme:

a nanometer cutter comprises a clamping part and a working part which are fixedly connected, wherein the clamping part is used for assembling the cutter on a machine tool, and the working part is used for cutting; the working part comprises a substrate, the surface of the substrate is coated with a hard coating, and the working part comprises a main cutting edge and an auxiliary cutting edge connected with the main cutting edge; the size of the secondary cutting edge is in the nanometer scale.

Further, the hard coating is one of a diamond coating, a cubic boron nitride coating, a hard alloy coating, a ceramic coating or a high-speed steel coating.

Further, the width of the secondary cutting edge is 10 nm-1 um.

Another object of the present invention is to provide a machining method of the nano-cutter, which includes the following steps:

s1: cleaning a cutter to be processed and then clamping the cutter to a machine tool;

s2: cutting the main cutting edge and the auxiliary cutting edge inwards from the outer surface of the tool to be machined by using femtosecond laser to enable the size of the auxiliary cutting edge of the tool to be machined to be continuously reduced;

s3: carrying out ultrasonic cleaning on the cutter to be processed;

s4: and milling the secondary cutting edge for multiple times by using a focused ion beam until the size of the secondary cutting edge reaches a nanometer scale.

Further, in step S2, the femtosecond laser performs scanning cutting along a vertical path so that the outer contours of the main cutting edge and the minor cutting edge are stepped.

Further, in step S2, the femtosecond laser performs scanning cutting along a stepped path so that the outer contours of the main cutting edge and the minor cutting edge are stepped.

Further, in step S2, the femtosecond laser performs scanning cutting along an inclined line path forming an included angle with the minor cutting edge, so that the outer contours of the major cutting edge and the minor cutting edge are stepped.

Further, in step S2, the femtosecond laser has a power of 1W-20W, a repetition frequency of 5 kHz-50 kHz, a processing speed of 10-500 mm/S, and a cutting frequency of 100-1000.

Further, in step S4, the focused ion beam is any one of a gallium ion beam, a helium ion beam, a neon ion beam, and an argon ion beam, and a scanning path of the focused ion beam is a grating type or a vector type.

Further, in step S4, the voltage of the focused ion beam is 0.5k to 50kV, the current is 1pA to 1uA, and the focused ion beam cuts the secondary cutting edge to 10nm to 1 um.

Compared with the prior art, the invention has the beneficial effects that:

1. according to the nano cutting tool, the hard coating is coated on the working part for cutting, and then the size of the secondary cutting edge is processed to be nano-scale, so that micro-nano processing on materials such as semiconductors and non-semiconductors can be realized, the processing efficiency is improved, the production cost is reduced, and the processing precision is improved.

2. The nanometer cutter has the advantages of high hardness, smooth cutting edge, excellent sharpness and the like because the secondary cutting edge is coated with the hard coating and has nanometer scale, can be used in precise medical operation, has small extrusion and tearing damage to tissues, regular wound edges, easy wound healing and quick postoperative rehabilitation; especially when the hard coating is a diamond coating, the coating has good biocompatibility. Therefore, the nanometer cutter can greatly improve the wound healing speed of a patient and reduce the injury when being used in the ophthalmic surgery.

3. The processing method of the invention gives consideration to the requirements of two aspects of processing cost and processing precision, the femtosecond laser and the focused ion beam are skillfully utilized for composite processing, the tool is processed to the micrometer scale by the femtosecond laser, and then the tool is processed to the nanometer scale by the focused ion beam.

Drawings

FIG. 1 is a schematic structural diagram of a nano-knife according to an embodiment of the present invention;

FIG. 2 is a schematic structural diagram of a cutting portion of a nano-cutter according to an embodiment of the present invention;

FIG. 3 is a flow chart of a method for machining a nano-cutter according to an embodiment of the present invention;

FIG. 4 is an SEM image of a cut-off tool after femtosecond laser processing of example 1;

FIG. 5 is an SEM image of a cutting blade after focused ion beam processing in example 1;

FIG. 6 is a diagram illustrating a femtosecond laser scanning path of a nano-knife according to an embodiment of the present invention;

FIG. 7 is a diagram illustrating a femtosecond laser scanning path of a nano-tool according to another embodiment of the present invention;

fig. 8 is a femtosecond laser scanning path diagram of a nano-tool according to still another embodiment of the present invention.

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments obtained by a person skilled in the art without making any inventive step are within the scope of the present invention.

Referring to fig. 1, fig. 1 shows a schematic structural diagram of a nano-cutter according to the present invention. The nanometer cutter comprises a clamping part and a working part which are fixedly connected. The clamping part is used for assembling the cutter on the machine tool. The working part is used for cutting.

As shown in fig. 1, the clamping portion is a tool bar 30, and the working portion is a cutting blade 20. The blade 20 and the cutter bar 30 are fixedly connected together by means of a screw connection. The head of the blade 20 is the cutting portion 10. The cutting portion 10 includes a base body and a hard coating layer coated on the base body. The cutting portion 10 includes a main cutting edge 11 and a minor cutting edge 12 connected to the main cutting edge 11. The dimensions of the secondary cutting edge 12 are on the nanometer scale.

Illustratively, the hard coating includes, but is not limited to, one of a diamond coating, a cubic boron nitride coating, a cemented carbide coating, a ceramic coating, or a high speed steel coating.

In the present embodiment, the dimension of the minor cutting edge 12 refers to the width of the minor cutting edge 12. The width dimension of the secondary cutting edge 12 is 10nm to 1 um.

The nano-cutter can be prepared by the following processing method. The processing method comprises the following steps:

s1: cleaning a cutter to be processed and then clamping the cutter to a machine tool;

s2: cutting the cutting part inwards from the outer surface of the tool to be machined by using femtosecond laser to enable the size of a secondary cutting edge of the cutting part to be reduced continuously;

s3: carrying out ultrasonic cleaning on the cutter to be processed;

s4: and milling the secondary cutting edge for multiple times by using a focused ion beam until the size of the secondary cutting edge reaches a nanometer scale.

Referring to fig. 6, in step S2, for example, the femtosecond laser performs scanning cutting along the vertical path 41 so that the outer contour of the cutting portion is stepped, and the minor cutting edge of the to-be-machined tool is machined to be less than 10 um. In the present embodiment, the step-shaped outer contour of the cutting portion means that a step-shaped state is formed between the minor cutting edge and the major cutting edge, and the step-shaped state may be that the major cutting edge inclines and rises to the minor cutting edge, or that the major cutting edge vertically rises to the minor cutting edge.

Referring to fig. 7, in step S2, for example, the femtosecond laser scans and cuts along the stepped path 42 to make the outer contour of the cutting portion stepped, so as to machine the minor cutting edge of the to-be-machined tool to a size of 10um or less. In the present embodiment, the step-shaped outer contour of the cutting portion means that a step-shaped state is formed between the minor cutting edge and the major cutting edge, and the step-shaped state may be that the major cutting edge inclines and rises to the minor cutting edge, or that the major cutting edge vertically rises to the minor cutting edge.

Referring to fig. 8, in an exemplary step S2, a femtosecond laser performs scanning cutting along an inclined line path forming an included angle with the minor cutting edge, so that the outer contours of the major cutting edge and the minor cutting edge are stepped, and the dimension of the minor cutting edge of the to-be-machined tool is machined to be less than 10um by multiple times of cutting. In the present embodiment, the step-shaped outer contour of the cutting portion means that a step-shaped state is formed between the minor cutting edge and the major cutting edge, and the step-shaped state may be that the major cutting edge is inclined and ascends to the minor cutting edge.

Illustratively, in step S2, the femtosecond laser has a power of 1W-20W, a repetition frequency of 5 kHz-50 kHz, a processing speed of 10-500 mm/S, and a cutting frequency of 100-1000.

In step S3, the specific method for ultrasonically cleaning the tool to be machined is as follows: and immersing the cutter to be processed in absolute ethyl alcohol for ultrasonic cleaning.

Illustratively, in step S4, the focused ion beam includes, but is not limited to, any one of a gallium ion beam, a helium ion beam, a neon ion beam, and an argon ion beam, and the scan path of the focused ion beam is in a raster or vector manner.

Illustratively, in step S4, the voltage of the focused ion beam is 0.5k to 50kV and the current is 1pA to 1uA, and the focused ion beam cuts the secondary cutting edge to 10nm to 1 um.

Example 1

Referring to fig. 5, taking a tool to be processed as a cutting blade as an example, the surface of the cutting blade is coated with a diamond coating. The groove width of the cutting-off tool blade is 2mm, and the arc angle of the tool nose is 0.1 mm. The cutting knife is prepared according to the following processing method:

s1: and cleaning the cutting knife and then clamping the cutting knife on a machine tool.

S2: cutting the cutting part along the inward direction of the outer surface of the cutting-off tool by femtosecond laser to continuously reduce the size of a secondary cutting edge of the cutting-off tool, and the specific method comprises the following steps: the femtosecond laser selects 10W of laser power, the processing speed is 10mm/s, the cutting frequency is 500 times, the repetition frequency is 10kHz, and the cutting mode adopts a vertical line path scanning cutting mode to ensure that the outer contour of the cutting part of the cutting-off knife is in a step shape. The outer contour has i steps, the more the steps are, the shorter the processing time for processing each step is, and the better the surface quality of the main cutting edge of the cutting-off tool is. After the femtosecond laser scanning process, an image obtained by scanning the cutting blade is shown in fig. 4.

S3: the cutting knife is subjected to ultrasonic cleaning, and the specific method comprises the following steps: and immersing the cutting knife in ethanol with the concentration of 99.7% for ultrasonic cleaning.

S4: and (2) milling the secondary cutting edge for multiple times by using a focused ion beam until the size of the secondary cutting edge reaches a nanometer scale, wherein the specific method comprises the following steps: and milling by using a gallium ion beam, wherein the current of a focused ion beam is 30nA, and the voltage is 30 kV. An image obtained by scanning the cutting blade after the focused ion beam machining is shown in fig. 5.

Example 2

Taking a tool to be processed as a turning tool as an example, the surface of the turning tool is coated with a cubic boron nitride coating. The front angle of the turning tool is 25 degrees, the rear angle of the turning tool is 8 degrees, the main deflection angle of the turning tool is 45 degrees, the auxiliary deflection angle of the turning tool is 10 degrees, and the blade inclination angle of the turning tool is 0 degree. The arc angle of the tool nose is 0.5 mm. The turning tool is prepared by the following processing method:

s1: and cleaning the turning tool and then clamping the turning tool on a machine tool.

S2: the femtosecond laser is used for scanning and cutting the cutting part inwards along the outer surface of the cutting-off tool, so that the size of a secondary cutting edge of the turning tool is continuously reduced, and the specific method comprises the following steps: the femtosecond laser selects 10W of laser power, the processing speed is 15mm/s, the cutting frequency is 500 times, the repetition frequency is 1kHz, the cutting mode carries out scanning cutting along a step-shaped path, and then laser scanning cutting is carried out along an inclined line path which forms an included angle with the secondary cutting edge clamp, so that the outer contour of the turning tool is in a step shape. The outer contour has i steps, the more the steps are, the shorter the processing time for processing each step is, and the better the surface quality of the main cutting edge of the cutting-off tool is.

S3: the turning tool is subjected to ultrasonic cleaning, and the specific method comprises the following steps: and immersing the turning tool in 99.7% ethanol for ultrasonic cleaning.

S4: and (2) milling the secondary cutting edge for multiple times by using a focused ion beam until the size of the secondary cutting edge reaches a nanometer scale, wherein the specific method comprises the following steps: milling with helium ion beam with focused ion beam current of 3nA and voltage of 30 kV.

Example 3

Taking a cutter to be machined as an example of a milling cutter, the surface of the milling cutter is coated with a ceramic coating. The diameter of the cutting edge of the milling cutter is 2mm, the diameter of the handle is 3mm, the total length is 40mm, and the length of the cutting edge is 5 mm. The arc angle of the tool nose is 0.5 mm. The milling cutter is prepared by the following processing method:

s1: and cleaning the milling cutter and then clamping the milling cutter on a machine tool.

S2: cutting the cutting part along the inward direction of the outer surface of the milling cutter by femtosecond laser to continuously reduce the size of a secondary cutting edge of the milling cutter, and the specific method comprises the following steps: the femtosecond laser selects laser power of 10W, processing speed of 800mm/s, cutting frequency of 400 times, repetition frequency of 100kHz, and laser cutting along the inclined line path forming an included angle with the secondary cutting edge in a cutting mode, so that the outer contour of the milling cutter is in a step shape.

S3: the milling cutter is subjected to ultrasonic cleaning, and the specific method comprises the following steps: and immersing the milling cutter in ethanol with the concentration of 99.7% for ultrasonic cleaning.

S4: and (2) milling the secondary cutting edge for multiple times by using a focused ion beam until the size of the secondary cutting edge reaches a nanometer scale, wherein the specific method comprises the following steps: the milling was carried out with neon ion beam at a focused ion beam current of 3nA and a voltage of 30 kV.

Example 4

Taking a cutter to be processed as an example of a cutting-off cutter, the surface of the cutting-off cutter is coated with a high-speed steel coating. The groove width of the cutting-off cutter is 2mm, and the arc angle of the cutter point is 0.1 mm. The arc angle of the tool nose is 0.5 mm. The cutting knife is prepared according to the following processing method:

s1: and cleaning the cutting knife and then clamping the cutting knife on a machine tool.

S2: cutting the cutting part along the inward direction of the outer surface of the cutting-off tool by femtosecond laser to continuously reduce the size of a secondary cutting edge of the cutting-off tool, and the specific method comprises the following steps: the femtosecond laser selects laser power as 12W, the processing speed is 1000mm/s, the cutting frequency is 200 times, the repetition frequency is 20kHz, and the cutting mode cuts along a stepped path, so that the outer contour of the milling cutter is stepped.

S3: the milling cutter is subjected to ultrasonic cleaning, and the specific method comprises the following steps: and immersing the milling cutter in ethanol with the concentration of 99.7% for ultrasonic cleaning.

S4: and (2) milling the secondary cutting edge for multiple times by using a focused ion beam until the size of the secondary cutting edge reaches a nanometer scale, wherein the specific method comprises the following steps: milling with argon ion beam, with a focused ion beam current of 3nA and a voltage of 30 kV.

The above description is only for the preferred embodiment of the present invention, but the present invention should not be limited to the embodiment and the disclosure of the drawings, and therefore, all equivalent or modifications that do not depart from the spirit of the present invention are intended to fall within the scope of the present invention.