阅读说明：本技术 一种铜-镍-锰合金电镀液及其电镀方法 (Copper-nickel-manganese alloy electroplating solution and electroplating method thereof ) 是由 李鑫 齐梦轲 于 2020-05-22 设计创作，主要内容包括：本发明属于电镀液技术领域,具体的说是一种铜-镍-锰合金电镀液及其电镀方法,所述铜-镍-锰合金电镀液包括如下组份：硫酸铜80-120g/L、硫酸镍10-15g/L、硫酸锰20-25g/L、硫酸160-180g/L、盐酸5-8g/L、十二醇硫酸醋钠5-10g/L、络合剂25-30g/L、稳定剂2-5g/L,余量为去离子水；本发明的电镀液成本低、稳定性好、电镀效率高,同时,电镀后工件表面镀层性能优秀。(The invention belongs to the technical field of electroplating solutions, and particularly relates to a copper-nickel-manganese alloy electroplating solution and an electroplating method thereof, wherein the copper-nickel-manganese alloy electroplating solution comprises 80-120 g/L of copper sulfate, 10-15 g/L of nickel sulfate, 20-25 g/L of manganese sulfate, 180 g/L of sulfuric acid, 5-8 g/L of hydrochloric acid, 5-10 g/L of sodium lauryl sulfate, 25-30 g/L of a complexing agent, 2-5 g/L of a stabilizing agent, and the balance of deionized water.)

1. An electroplating method is characterized in that: the method comprises the following specific steps:

a1: adding a proper amount of copper-nickel-manganese alloy electroplating solution into the electroplating device, and inserting a workpiece to be processed into a mounting hole on a mounting plate (3) in the electroplating device;

a2: starting a power supply of electroplating equipment, controlling the mounting plate (3) inserted with the workpiece to sink to enable the workpiece to be completely immersed in the electroplating solution, electroplating the workpiece, controlling the mounting plate (3) to rise after the electroplating is finished, enabling the workpiece to be separated from the electroplating solution, and turning off the power supply of the electroplating equipment to finish the electroplating of the workpiece;

the electroplating equipment in A2 comprises a tank body (1); an electroplating chamber (11) and a reaction chamber (12) are arranged on the tank body (1); the electroplating chamber (11) and the reaction chamber (12) are separated by the side wall of the tank body (1); the electroplating chamber (11) is filled with the copper-nickel-manganese alloy electroplating solution; the reaction chamber (12) is filled with sulfuric acid liquid; a first bracket (14) is fixedly arranged on the side walls of the two ends of the electroplating chamber (11) in the length direction; an insulating rope (141) is fixedly connected to the first support (14); the tail end of the insulating rope (141) is connected with an anode plate (2); the anode plate (2) is made of copper metal; the anode plate (2) is connected to the positive pole of a power supply; the mounting seat (13) is fixedly arranged on the tank body (1); the mounting seat (13) is positioned right above the electroplating chamber (11); a threaded shaft (37) is rotatably mounted on the mounting seat (13); a turbine (33) is fixedly arranged on the threaded shaft (37); a worm (32) is fixedly arranged on the mounting seat (13); the worm wheel (33) and the worm (32) are mutually meshed; a motor support (35) is fixedly arranged on the mounting seat (13); a motor (34) is fixedly arranged on the motor support (35); the output shaft of the motor (34) is connected with the worm (32); the mounting seat (13) is provided with a guide rod (31), and the guide rod (31) can move up and down; the number of the guide rods (31) is two, and a connecting line between the guide rods (31) is parallel to the length direction of the electroplating chamber (11); a fixed frame (38) is arranged on the threaded shaft (37); the fixed frame (38) is provided with internal threads which are mutually meshed with the threaded shaft (37); the upper end of the guide rod (31) is fixedly connected to the lower surface of the fixed frame (38); the lower end of the guide rod (31) is fixedly provided with a mounting plate (3); mounting holes are uniformly formed in the mounting plate (3); the mounting plate (3) is positioned under the mounting seat (13); the mounting plate (3) is connected to the negative pole of the power supply; the bottom of the electroplating chamber (11) is fixedly provided with an annular pipe (4); the annular pipe (4) is positioned below the liquid level in the electroplating chamber (11); the annular pipe (4) is positioned right below the mounting plate (3); a plurality of openings are arranged on the annular pipe (4); a sealing cover (121) is arranged on the reaction chamber (12); the reaction chamber (12) is kept in a sealed state; a mesh plate (52) is arranged in the reaction chamber (12); the mesh plate (52) is positioned below the liquid level in the reaction chamber (12); blocky manganese carbonate and nickel carbonate are placed on the mesh plate (52) when the electroplating equipment works; a fifth pipe (81) is arranged on the side surface of the reaction chamber (12); the other end of the pipe five (81) is arranged on the annular pipe (4); a pressure valve is arranged on the pipe five (81); the reaction chamber (12) is filled with compressed gas up to a threshold pressure of the pressure valve before the electroplating apparatus is used.

2. An electroplating method according to claim 2, characterized in that: a first cylinder (36) is fixedly mounted on the mounting seat (13); a first piston rod of the first cylinder (36) is fixedly connected to the lower surface of the fixing plate; a second air cylinder (5) is fixedly arranged on the side wall of the reaction chamber (12); the two cylinders (5) are respectively positioned at two ends of the reaction chamber (12) in the length direction; a second piston rod (51) of the second cylinder (5) is fixedly connected to the mesh plate (52); a third pipe (7) is arranged on the first cylinder (36); a fourth pipe (71) is arranged on the second cylinder (5); the pipe III (7) is communicated with the pipe IV (71).

3. An electroplating method according to claim 2, characterized in that: a liquid storage tank (6) is fixedly arranged on the tank body (1); the liquid storage tank (6) is positioned at one end of the reaction chamber (12); a suction cavity (54) is arranged on the side wall in the reaction chamber (12); a movable rod (541) is arranged in the suction cavity (54); the tail end of the movable rod (541) is fixedly connected to the mesh plate (52); a through hole is arranged in the resin direction on the movable rod (541); a first cross rod (552) is arranged in the through hole; the first cross rod (552) is positioned at one end, close to the upper surface of the tank body (1), in the through hole; a first baffle plate (55) is arranged at the opening of the through hole close to the mesh plate (52); a first spring (551) is installed in the through hole; two ends of the first spring (551) are fixedly connected to the first cross bar (552) and the first baffle plate (55) respectively; the first spring (551) is an extension spring; a second pipe (61) is arranged at the end of the suction cavity (54); the other end of the second pipe (61) is arranged on the liquid storage tank (6); the connection part of the upper end of the suction cavity (54) and the second pipe (61) is provided with a hole, so that the suction cavity (54) is communicated with the liquid storage tank (6) through the second pipe (61); a second cross rod (562) is arranged in a hole formed in the upper end of the suction cavity (54); the second cross rod (562) is close to the upper surface of the tank body (1); a second baffle plate (56) is arranged in the suction cavity (54); the second baffle plate (56) is tightly attached to an opening of the upper end opening of the suction cavity (54); a second spring (561) is arranged in the hole; two ends of the second spring (561) are fixedly connected to the second cross rod (562) and the second baffle (56) respectively; the second spring (561) is an extension spring.

4. An electroplating method according to claim 2, characterized in that: a plurality of spray heads (41) are uniformly arranged on the annular pipe (4); an elastic membrane (411) is arranged at the outlet of the spray head (41); the elastic film (411) is provided with a crack; the split is normally in a closed state; an included angle is formed between the spray head (41) and the horizontal plane; the projection of the spray head (41) on the plane where the annular pipe (4) is located is tangential to the annular pipe (4).

5. An electroplating method according to claim 1, wherein: a liquid extractor (8) is arranged on the outer side surface of the reaction chamber (12); the liquid extractor (8) is vertical to the outer side wall of the reaction chamber (12); the liquid extractor (8) and the liquid storage tank (6) are positioned on the same side, and the liquid extractor (8) is positioned above the liquid storage tank (6); one end of the second pipe (61) is connected to the liquid extractor (8), and the other end of the second pipe is connected to the annular pipe (4); the bottom of the liquid extractor (8) is provided with a through hole (82), and the through hole (82) is communicated with the inside of the reaction chamber (12); the opening of the through hole (82) in the reaction chamber (12) is positioned above the liquid level; a negative pressure cavity (83) is arranged in the liquid pumping device (8); a first pipe (53) is arranged on the side wall of the liquid pumping device (8); the outlet of the first pipe (53) at one end in the liquid extractor (8) is close to the center line of the through hole (82); the other end of the first pipe (53) is arranged on the side wall of the reaction chamber (12); the joint of the first pipe (53) and the reaction chamber (12) is positioned below the liquid level.

6. A copper-nickel-manganese alloy electroplating bath characterized by: the copper-nickel-manganese alloy plating solution is suitable for the plating method according to any one of claims 1 to 5; the copper-nickel-manganese alloy electroplating solution comprises the following components:

80-120 g/L g of copper sulfate, 10-15 g/L g of nickel sulfate, 20-25 g/L g of manganese sulfate, 160-180 g/L g of sulfuric acid, 5-8 g/L g of hydrochloric acid, 5-10 g/L g of sodium lauryl sulfate, 25-30 g/L g of a complexing agent, 2-5 g/L g of a stabilizing agent and the balance of deionized water, wherein the relative density of the sulfuric acid is 1.28, the relative density of the hydrochloric acid is 1.12, the complexing agent is a mixture of ethylenediamine tetraacetic acid (DETA), hydroxyethylidene diphosphonic acid (HEDP) and sodium citrate in equal proportion, and the stabilizing agent is phytic acid;

the preparation method of the copper-nickel-manganese alloy electroplating solution comprises the following steps:

s1: adding a proper amount of deionized water into a container, then mixing ethylenediamine tetraacetic acid (DETA), hydroxyethylidene diphosphonic acid (HEDP) and sodium citrate in equal proportion, adding into the container, stirring uniformly, keeping the stirring state, and continuously adding phytic acid serving as a stabilizer into the container to prepare a solution;

s2: on the basis of the step S1, stirring, and sequentially adding sulfuric acid and hydrochloric acid into a container;

and SS, sequentially adding copper sulfate, nickel sulfate and manganese sulfate into the container on the basis of the step S2, keeping the stirring state, continuously adding deionized water into the container to supplement the liquid in the container to 1L, and then continuously stirring for 3-5min to obtain the copper-nickel-manganese alloy electroplating solution.

Technical Field

The invention belongs to the technical field of electroplating solution, and particularly relates to copper-nickel-manganese alloy electroplating solution and an electroplating method thereof.

Background

With the continuous development of science and technology, the requirements on products are more and more strict, the coating of a single element is difficult to meet the requirements of electroplating products, and researchers gradually aim at alloy electroplating. The nickel plating process is widely applied to various aspects of the electroplating industry and is used for surface treatment of metal devices for the purposes of corrosion prevention and decoration. However, as the nickel resource is non-renewable and natural, the supply is seriously insufficient with the increasing consumption of nickel, and the price is increased dramatically. Meanwhile, the existing copper-nickel alloy electroplating solution has the problems of poor stability and low electroplating efficiency, and a new electroplating solution is needed to replace the existing copper-nickel alloy electroplating solution in order to reduce the cost and improve the stability of the electroplating solution. Meanwhile, when the existing electroplating equipment using the electroplating solution to carry out electroplating, the concentration of each component in the electroplating solution needs to be paid attention to at any time so as to add corresponding components in time and ensure that the electroplating is carried out orderly and well.

Disclosure of Invention

The invention provides a copper-nickel-manganese alloy electroplating solution and an electroplating method thereof, aiming at making up for the defects of the prior art and solving the problems that the prior copper-nickel electroplating solution has poor stability and can not automatically replenish lost ions in the electroplating process.

The technical scheme adopted by the invention for solving the technical problems is as follows: the invention is as described

An electroplating method is suitable for the copper-nickel-manganese alloy electroplating solution, and comprises the following specific steps:

a1: adding a proper amount of copper-nickel-manganese alloy electroplating solution into the electroplating device, and inserting a workpiece to be processed into a mounting hole on a mounting plate in the electroplating device;

a2: starting a power supply of electroplating equipment, controlling the mounting plate inserted with the workpiece to sink to enable the workpiece to be completely immersed in the electroplating solution, electroplating the workpiece, controlling the mounting plate to ascend after the electroplating is finished, enabling the workpiece to be separated from the electroplating solution, and turning off the power supply of the electroplating equipment to finish the electroplating of the workpiece;

the electroplating equipment in A2 comprises a tank body; the tank body is provided with an electroplating chamber and a reaction chamber; the electroplating chamber and the reaction chamber are separated by the side wall of the tank body; the electroplating chamber is filled with the copper-nickel-manganese alloy electroplating solution; the reaction chamber is filled with sulfuric acid liquid; the side walls of the two ends of the electroplating chamber in the length direction are fixedly provided with a first bracket; an insulating rope is fixedly connected to the first support; the tail end of the insulating rope is connected with an anode plate; the anode plate is made of copper metal; the anode plate is connected to the positive pole of a power supply; the mounting seat is fixedly arranged on the tank body; the mounting seat is positioned right above the electroplating chamber; a threaded shaft is rotatably arranged on the mounting seat; a turbine is fixedly arranged on the threaded shaft; a worm is fixedly arranged on the mounting seat; the worm wheel and the worm are meshed with each other; a motor support is fixedly arranged on the mounting seat; a motor is fixedly arranged on the motor support; an output shaft of the motor is connected with the worm; the mounting seat is provided with a guide rod which can move up and down; the number of the guide rods is two, and a connecting line between the guide rods is parallel to the length direction of the electroplating chamber; a fixing frame is arranged on the threaded shaft; the fixing frame is provided with internal threads meshed with the threaded shaft; the upper end of the guide rod is fixedly connected to the lower surface of the fixing frame; the lower end of the guide rod is fixedly provided with an installation plate; mounting holes are uniformly formed in the mounting plate; the mounting plate is positioned right below the mounting seat; the mounting plate is connected to the negative pole of the power supply; the bottom of the electroplating chamber is fixedly provided with an annular pipe; the annular pipe is positioned below the liquid level in the electroplating chamber; the annular pipe is positioned right below the mounting plate; a plurality of openings are arranged on the annular pipe; a sealing cover is arranged on the reaction chamber; the reaction chamber is kept in a sealed state; a mesh plate is arranged in the reaction chamber; the mesh plate is positioned below the liquid level in the reaction chamber; blocky manganese carbonate and nickel carbonate are placed on the mesh plate when the electroplating equipment works; a fifth pipe is arranged on the side surface of the reaction chamber; the other end of the pipe V is arranged on the annular pipe; a pressure valve is arranged on the pipe five; compressed gas reaching the critical pressure of the pressure valve is filled in the reaction chamber before the electroplating equipment is used;

when the electroplating device works, firstly, electroplating solution in an electroplating chamber in the electroplating device and sulfuric acid in a reaction chamber are added, then a workpiece is inserted into a mounting hole on a mounting plate, a power supply is switched on to electrify an anode plate and the mounting plate, a motor is started, the motor is operated to drive a worm to rotate, the worm is meshed with a turbine, the turbine is mounted on a threaded shaft, the threaded shaft is driven to operate, after the threaded shaft starts to rotate, a fixing plate mounted on the threaded shaft is driven to move downwards by the aid of internal threads on the fixing plate meshed with threads on the threaded shaft, the fixing plate gradually descends during thread rotation to drive a guide rod mounted on the fixing plate to move downwards, the mounting plate mounted on the guide rod gradually enters the electroplating solution, the workpiece starts to be electroplated, and meanwhile, the up-down movement of the mounting plate has self-locking capability due, the phenomenon that the mounting plate descends too fast or the motor is powered off suddenly to cause the mounting plate to descend rapidly to impact the electroplating chamber is avoided in the descending process, so that the use reliability and safety of equipment are guaranteed, meanwhile, the self-locking performance of the worm gear can also be realized by turning off the motor when a workpiece is electroplated, the load and the power consumption of the motor are reduced, the service life of the motor is prolonged, the cost is reduced, meanwhile, when the workpiece is electroplated, sulfuric acid added in the reaction chamber reacts with blocky manganese carbonate and blocky nickel carbonate on a mesh plate to generate carbon dioxide gas, the generated gas is accumulated continuously, the pressure in the reaction chamber exceeds the critical value of a pressure valve, then the gas in the reaction chamber enters the annular pipe through the pipe five, finally the gas is sprayed out from an opening on the annular pipe, the electroplating solution in the electroplating chamber is stirred through the sprayed gas, and the consistency of the concentration, avoid the area of work piece place because effective component in the electroplating solution of electroplating reaction consumption, lead to the electroplating solution concentration to descend, finally influence the electroplating effect because of the electroplating solution concentration is not enough.

Preferably, a first cylinder is fixedly mounted on the mounting seat; a first piston rod of the first air cylinder is fixedly connected to the lower surface of the fixing plate; a second air cylinder is fixedly arranged on the side wall of the reaction chamber; the two cylinders are respectively positioned at two ends of the reaction chamber in the length direction; a piston rod II of the cylinder II is fixedly connected to the mesh plate; a third pipe is arranged on the first cylinder; a pipe IV is arranged on the cylinder II; the third pipe is communicated with the fourth pipe;

when the electroplating device works, when the mounting plate inserted with the workpiece descends into electroplating liquid in the electroplating chamber, the fixing plate also descends, and the piston rod I of the cylinder I is fixedly connected to the fixing plate; when the fixed plate descends, the gas in the cylinder I is compressed, the pressure in the cylinder I rises, the cylinder I is communicated with the cylinder II through the pipe III and the pipe IV, so that a piston rod II of the cylinder II gradually extends out under the action of high-pressure gas in the cylinder I, the piston rod II is arranged on the mesh plate, the mesh plate slowly descends and enters sulfuric acid in the reaction chamber, manganese carbonate and nickel carbonate on the mesh plate react with the sulfuric acid to generate gas, finally the gas enters the electroplating chamber, the electroplating solution is stirred, when the workpiece is processed and the mounting plate ascends, the fixed plate ascends, so that the pressure in the cylinder I is reduced, the pressure in the cylinder II is reduced, the piston rod of the cylinder II ascends, the mesh plate is driven to ascend, the manganese carbonate and the nickel carbonate on the mesh plate are separated from the sulfuric acid liquid, the reaction is stopped, and under the condition that no workpiece is electroplated, gas is not generated in the reaction chamber to stir the electroplating solution, thereby effectively saving reaction materials and reducing production cost.

Preferably, a liquid storage tank is fixedly arranged on the tank body; the liquid storage tank is positioned at one end of the reaction chamber; a suction cavity is arranged on the side wall in the reaction chamber; a movable rod is arranged in the suction cavity; the tail end of the moving rod is fixedly connected to the mesh plate; a through hole is formed in the movable rod in the resin direction; a first cross rod is arranged in the through hole; the cross rod is positioned at one end, close to the upper surface of the groove body, in the through hole; a first baffle is arranged at the opening of the through hole close to the mesh plate; a first spring is arranged in the through hole; two ends of the first spring are fixedly connected to the first cross rod and the first baffle respectively; the first spring is an extension spring; a second pipe is arranged at the end of the suction cavity; the other end of the second pipe is arranged on the liquid storage tank; the connection part of the upper end of the suction cavity and the second pipe is provided with a hole, so that the suction cavity is communicated with the liquid storage tank through the second pipe; a second cross rod is arranged in a hole formed in the upper end of the suction cavity; the second cross rod is close to the upper surface of the tank body; a baffle plate II is arranged in the suction cavity; the second baffle plate is tightly attached to an opening of the upper opening of the suction cavity; a second spring is arranged in the hole; two ends of the second spring are fixedly connected to the second cross rod and the second baffle respectively; the second spring is an extension spring;

when the suction device works, when the mesh plate moves upwards, the moving rod connected to the mesh plate moves upwards to compress the space in the suction cavity, the baffle plate II is tensioned by the spring II and clings to the opening of the hole at the upper end of the suction cavity, when the moving rod moves upwards, the suction cavity and the pipe II are blocked by the baffle plate II, meanwhile, the baffle plate I is positioned on one side of the moving rod close to the mesh plate, when the pressure in the suction cavity rises to a certain degree in the continuous upward movement process of the moving plate, the gas in the suction cavity is discharged through the through hole after the pressure value is larger than the tensile force of the spring I, the pressure in the suction cavity is ensured to be relatively stable, when the mesh plate descends again, the moving rod moves downwards, the space in the suction cavity increases, because the gas in the suction cavity is discharged in the compression process, at the moment, the suction cavity is in a negative pressure state, when the negative pressure value, sulfuric acid liquid in the liquid storage tank is sucked into the suction cavity through the pipe II, when the mesh plate ascends again and the moving rod compresses the space in the suction cavity, the sulfuric acid liquid in the suction cavity enters the reaction chamber through the through hole to replenish sulfuric acid consumed in the reaction chamber, and the reaction in the reaction chamber is not interrupted, so that enough gas can be generated in the reaction chamber to stir electroplating solution in the electroplating chamber, the concentration of the electroplating solution is consistent, meanwhile, because the replenishment of the sulfuric acid is continuously carried out along with the movement of the mesh plate, the replenishment can be carried out only when the mesh plate is positioned below the liquid level and the reaction is continuously carried out, the sulfuric acid liquid is still replenished after the electroplating equipment is stopped, thereby avoiding waste, reducing the production cost, and simultaneously, realizing the automatic replenishment of the sulfuric acid liquid through the movement of the mesh plate, and ensuring the stable concentration of the sulfuric acid in the reaction chamber, frequent supplement of reaction media in the use process is avoided, and the labor intensity of workers is reduced.

Preferably, a plurality of spray heads are uniformly arranged on the annular pipe; an elastic membrane is arranged at the outlet of the spray head; the elastic film is provided with a crack; the split is normally in a closed state; an included angle is formed between the spray head and the horizontal plane; the projection of the spray head on the plane where the annular pipe is located is tangent to the annular pipe;

the during operation, when not spouting gaseous in the ring pipe, the elastic membrane on the shower nozzle is in the encapsulated situation, prevent that the plating solution from entering into the ring pipe through the shower nozzle, thereby avoid the plating solution to pollute or jam the ring pipe, prevent to make because the influence of plating solution, gas in the ring pipe is difficult to the blowout, can not stir the plating solution, the ion concentration in the region that makes work piece place in the plating solution is lower, influence the performance of the cladding material on work piece surface, and simultaneously, because there is the contained angle between injection pipe and the horizontal plane, and the projection of injection roller is tangent with the ring pipe, form a relative vortex region after the gas blowout, stir the plating solution, make the plating solution take place rotatoryly under spun gas action, thereby better stir the plating solution, guarantee that the ion concentration is unanimous everywhere in plating solution, promote work piece electroplating effect.

Preferably, a liquid extractor is arranged on the outer side surface of the reaction chamber; the liquid extractor is vertical to the outer side wall of the reaction chamber; the liquid extractor and the liquid storage tank are positioned on the same side, and the liquid extractor is positioned above the liquid storage tank; one end of the second pipe is connected to the liquid extractor, and the other end of the second pipe is connected to the annular pipe; the bottom of the liquid extractor is provided with a through hole which is communicated with the inside of the reaction chamber; the opening of the through hole in the reaction chamber is positioned above the liquid level; a negative pressure cavity is arranged in the liquid pumping device; a first pipe is arranged on the side wall of the liquid pumping device; the outlet of one end of the tube, which is positioned in the liquid extractor, is close to the center line of the through hole; the other end of the first pipe is arranged on the side wall of the reaction chamber; the connection part of the first pipe and the reaction chamber is positioned below the liquid level;

when the device works, when the gas pressure in the reaction chamber is large enough, the gas starts to be sprayed out, when the gas reaches the negative pressure cavity in the liquid extractor, the pressure in the negative pressure cavity is negative due to the sudden increase of the space, and the opening of the first tube is close to the central line of the through hole, so the opening of the first tube presents negative pressure, thereby the liquid in the reaction chamber is pumped out through the first tube and then enters the electroplating chamber along with the sprayed gas through the pipeline, because manganese carbonate and nickel carbonate in the reaction chamber continuously react, manganese sulfate and nickel sulfate with higher concentration are contained in the liquid in the reaction chamber, after the liquid enters the electroplating solution in the electroplating chamber, manganese ions and nickel ions consumed by the electroplating reaction can be effectively supplemented, thereby the electroplating reaction is continuously and effectively carried out, the quality of the surface coating of the electroplated workpiece is improved, and simultaneously, the copper ions consumed in the electroplating solution are supplemented due to the dissolution of the anode plate, thereby can guarantee the stability of each ion concentration in the plating solution, promote the electroplating effect, simultaneously, through the automatic replenishment of consuming ion, can avoid artifical frequent replenishment plating solution, reduce workman intensity of labour.

A copper-nickel-manganese alloy plating solution which is suitable for the above-mentioned plating method; the copper-nickel-manganese alloy electroplating solution comprises the following components:

80-120 g/L g of copper sulfate, 10-15 g/L g of nickel sulfate, 20-25 g/L g of manganese sulfate, 160-180 g/L g of sulfuric acid, 5-8 g/L g of hydrochloric acid, 5-10 g/L g of sodium lauryl sulfate, 25-30 g/L g of a complexing agent, 2-5 g/L g of a stabilizing agent and the balance of deionized water, wherein the relative density of the sulfuric acid is 1.28, the relative density of the hydrochloric acid is 1.12, the complexing agent is a mixture of ethylenediamine tetraacetic acid (DETA), hydroxyethylidene diphosphonic acid (HEDP) and sodium citrate in equal proportion, and the stabilizing agent is phytic acid;

wherein, the chlorine ion existing in the electroplate liquid can promote the precipitation of copper, nickel and manganese on the surface of a workpiece, inhibit the generation of hydrogen in the electroplate liquid, reduce the possibility of hydrogen adsorption on the surface of the workpiece, avoid the pinhole or pockmark defect of a plating layer caused by the hydrogen, improve the current efficiency and the quality of the electroplate, simultaneously, the chlorine ion can generate a synergistic reaction with a brightening agent to form chlorinated coordination ions, promote the leveling effect of the brightening agent, further improve the brightness and the smoothness of the surface of the workpiece after the electroplate, simultaneously, the content of the chlorine ion in the electroplate liquid is lower, the cost can be effectively saved, the possibility that the chlorine ion loses electrons to generate chlorine gas is reduced, the generation of toxic and harmful gas in the electroplate process is avoided, simultaneously, the lauryl sodium sulfate plays multiple roles in the electroplate liquid due to the self characteristics of the lauryl sodium sulfate, and can play the roles, the production cost of the electroplating solution is effectively reduced, and the surface coating performance of the treated workpiece is good;

the preparation method of the copper-nickel-manganese alloy electroplating solution comprises the following steps:

s1: adding a proper amount of deionized water into a container, then mixing ethylenediamine tetraacetic acid (DETA), hydroxyethylidene diphosphonic acid (HEDP) and sodium citrate in equal proportion, adding into the container, stirring uniformly, keeping the stirring state, and continuously adding phytic acid serving as a stabilizer into the container to prepare a solution;

s2: on the basis of the step S1, stirring, and sequentially adding sulfuric acid and hydrochloric acid into a container;

and SS, sequentially adding copper sulfate, nickel sulfate and manganese sulfate into the container on the basis of the step S2, keeping the stirring state, continuously adding deionized water into the container to supplement the liquid in the container to 1L, and then continuously stirring for 3-5min to obtain the copper-nickel-manganese alloy electroplating solution.

The invention has the following beneficial effects:

1. the copper-nickel-manganese alloy electroplating solution and the electroplating method thereof have the advantages of simple components, convenient use, good stability, high electroplating efficiency, low cost, beautiful appearance and good performance of the electroplated coating.

2. According to the copper-nickel-manganese alloy electroplating solution and the electroplating method thereof, the reaction chamber is arranged, so that gas can be generated in the reaction chamber, the electroplating solution is stirred by using the gas, meanwhile, the reaction product can be supplemented into the electroplating solution, the concentration of each ion in the electroplating solution is maintained to be stable, and the electroplating effect is improved.

Drawings

The invention will be further explained with reference to the drawings.

FIG. 1 is a front view of an electroplating apparatus according to the present invention;

FIG. 2 is a partial cross-sectional view of an electroplating apparatus according to the present invention;

figure 3 is a cross-sectional view of the liquid extractor;

FIG. 4 is an enlarged view of a portion of FIG. 1 at A;

FIG. 5 is an enlarged view of a portion of FIG. 2 at B;

FIG. 6 is a flow chart of a method of preparing an electroplating bath according to the present invention;

FIG. 7 is a flow chart of the steps of the electroplating method of the present invention;

in the figure: the device comprises a tank body 1, an electroplating chamber 11, a reaction chamber 12, a sealing cover 121, a mounting seat 13, a first support 14, an insulating rope 141, an anode plate 2, a mounting plate 3, a guide rod 31, a worm 32, a turbine 33, a motor 34, a motor support 35, a first air cylinder 36, a threaded shaft 37, a fixing frame 38, a ring-shaped pipe 4, a spray head 41, an elastic membrane 411, a second air cylinder 5, a second piston rod 51, a mesh plate 52, a first pipe 53, a suction cavity 54, a moving rod 541, a first baffle 55, a first spring 551, a first cross rod 552, a second baffle 56, a second spring 561, a second cross rod 562, a liquid storage tank 6, a second pipe 61, a third pipe 7, a fourth pipe 71, a liquid extractor 8, a fifth pipe 81, a through hole.

Detailed Description

In order to make the technical means, the creation characteristics, the achievement purposes and the effects of the invention easy to understand, the invention is further described with the specific embodiments.

As shown in fig. 1 to 7, the electroplating method of the present invention includes the following steps:

a1: adding a proper amount of copper-nickel-manganese alloy electroplating solution into the electroplating device, and inserting the workpiece to be processed into a mounting hole on a mounting plate 3 in the electroplating device;

a2: starting a power supply of electroplating equipment, controlling the mounting plate 3 inserted with the workpiece to sink to enable the workpiece to be completely immersed in electroplating solution, electroplating the workpiece, controlling the mounting plate 3 to ascend after the electroplating is finished, enabling the workpiece to be separated from the electroplating solution, and turning off the power supply of the electroplating equipment to finish the electroplating of the workpiece;

the electroplating equipment in A2 comprises a tank body 1; the tank body 1 is provided with an electroplating chamber 11 and a reaction chamber 12; the electroplating chamber 11 and the reaction chamber 12 are separated by the side wall of the tank body 1; the plating chamber 11 is filled with the copper-nickel-manganese alloy plating solution; the reaction chamber 12 is filled with sulfuric acid liquid; the side walls at two ends of the electroplating chamber 11 in the length direction are fixedly provided with a first bracket 14; an insulating rope 141 is fixedly connected to the first support 14; the tail end of the insulating rope 141 is connected with an anode plate 2; the anode plate 2 is made of copper metal; the anode plate 2 is connected to the positive pole of a power supply; the mounting seat 13 is fixedly arranged on the tank body 1; the mounting seat 13 is positioned right above the electroplating chamber 11; a threaded shaft 37 is rotatably mounted on the mounting seat 13; the worm wheel 33 is fixedly arranged on the threaded shaft 37; a worm 32 is fixedly arranged on the mounting seat 13; the worm wheel 33 and the worm 32 are mutually meshed; a motor support 35 is fixedly arranged on the mounting seat 13; the motor support 35 is fixedly provided with a motor 34; the output shaft of the motor 34 is connected with the worm 32; the installation seat 13 is provided with a guide rod 31, and the guide rod 31 can move up and down; the number of the guide rods 31 is two, and the connecting line between the guide rods 31 is parallel to the length direction of the electroplating chamber 11; a fixing frame 38 is arranged on the threaded shaft 37; the fixing frame 38 is provided with internal threads which are mutually meshed with the threaded shaft 37; the upper end of the guide rod 31 is fixedly connected to the lower surface of the fixing frame 38; the lower end of the guide rod 31 is fixedly provided with an installation plate 3; mounting holes are uniformly formed in the mounting plate 3; the mounting plate 3 is positioned under the mounting seat 13; the mounting plate 3 is connected to the negative pole of the power supply; the bottom of the electroplating chamber 11 is fixedly provided with an annular pipe 4; the annular pipe 4 is positioned below the liquid level in the electroplating chamber 11; the annular pipe 4 is positioned right below the mounting plate 3; a plurality of openings are arranged on the annular pipe 4; a sealing cover 121 is arranged on the reaction chamber 12; the reaction chamber 12 is kept in a sealed state; a mesh plate 52 is arranged in the reaction chamber 12; the mesh plate 52 is positioned below the liquid level in the reaction chamber 12; blocky manganese carbonate and nickel carbonate are placed on the mesh plate 52 when the electroplating equipment works; a fifth pipe 81 is arranged on the side surface of the reaction chamber 12; the other end of the pipe five 81 is arranged on the annular pipe 4; a pressure valve is arranged on the pipe five 81; the reaction chamber 12 is filled with compressed gas reaching the critical pressure of the pressure valve before the electroplating equipment is used;

when the electroplating device works, firstly, the electroplating solution in the electroplating chamber 11 and the sulfuric acid in the reaction chamber 12 in the electroplating device are added, then a workpiece is inserted into the mounting hole on the mounting plate 3, the power supply is switched on, the anode plate 2 and the mounting plate 3 are electrified, the motor 34 is started, the motor 34 runs to drive the worm 32 to rotate, the worm 32 is meshed with the worm wheel 33, the worm wheel 33 is mounted on the threaded shaft 37, the threaded shaft 37 is driven to run, after the threaded shaft 37 starts to rotate, the fixing plate mounted on the threaded shaft 37 descends gradually during the rotation of the thread due to the fact that the internal thread on the fixing plate is meshed with the thread on the threaded shaft 37, the guide rod 31 mounted on the fixing plate is driven to move downwards, the mounting plate 3 mounted on the guide rod 31 moves downwards and gradually enters the electroplating solution, the workpiece starts to be electroplated, and simultaneously, the worm 32 is used for, make the up and down movement of the mounting plate 3 have the self-locking ability, avoid the mounting plate 3 to appear the falling speed too fast or the motor 34 cuts off the power supply suddenly and causes the mounting plate 3 to descend rapidly and strike the electroplating chamber 11 in the course of falling, thus guarantee reliability and security of the apparatus use, meanwhile, the self-locking of the worm 32 of the turbine 33 can also close the motor 34 when the work piece is electroplated, reduce load and power consumption of the motor 34, promote the service life of the motor 34, lower costs, meanwhile, when the work piece is electroplated, the sulfuric acid added in the reaction chamber 12 reacts with blocky manganese carbonate and blocky nickel carbonate on the mesh plate 52, produce carbon dioxide gas, the gas produced is accumulated continuously, make the pressure in the reaction chamber 12 exceed the critical value of the pressure valve, afterwards, the gas in the reaction chamber 12 enters the circular tube 4 through the pipe five 81, finally squirts from the opening on the circular tube, the electroplating solution in the electroplating chamber 11 is stirred by the sprayed gas, so that the consistency of the concentration of the electroplating solution at each position is ensured, the condition that the concentration of the electroplating solution is reduced because the effective components in the electroplating solution are consumed by the electroplating reaction in the area where the workpiece is positioned is avoided, and finally the electroplating effect is influenced because the concentration of the electroplating solution is insufficient.

As an embodiment of the present invention, a first cylinder 36 is fixedly mounted on the mounting seat 13; a first piston rod of the first cylinder 36 is fixedly connected to the lower surface of the fixing plate; a second air cylinder 5 is fixedly arranged on the side wall of the reaction chamber 12; the two cylinders 5 are respectively positioned at two ends of the reaction chamber 12 in the length direction; a second piston rod 51 of the second air cylinder 5 is fixedly connected to the mesh plate 52; a third pipe 7 is arranged on the first cylinder 36; a pipe IV 71 is arranged on the cylinder II 5; the third pipe 7 is communicated with the fourth pipe 71;

when the electroplating device works, when the mounting plate 3 inserted with the workpiece descends into electroplating liquid in the electroplating chamber 11, the fixing plate also descends, and the piston rod I of the cylinder I36 is fixedly connected to the fixing plate; when the fixing plate descends, the gas in the cylinder I36 is compressed, the pressure in the cylinder I36 rises, the cylinder I36 is communicated with the cylinder II 5 through the pipe III 7 and the pipe IV 71, therefore, under the action of high-pressure gas in the cylinder I36, the piston rod II 51 of the cylinder II 5 gradually extends out, as the piston rod II 51 is installed on the mesh plate 52, the mesh plate 52 slowly descends and enters sulfuric acid in the reaction chamber 12, manganese carbonate and nickel carbonate on the mesh plate 52 react with the sulfuric acid to generate gas, finally the gas enters the electroplating chamber 11 to stir electroplating solution, when the workpiece is processed and the mounting plate 3 rises, the fixing plate rises upwards, so that the pressure in the cylinder I36 is reduced, the pressure in the cylinder II 5 is reduced, the piston rod of the cylinder II 5 rises upwards, the mesh plate 52 is driven to rise upwards, and the manganese carbonate and nickel carbonate on the mesh plate 52 are separated from the sulfuric acid liquid, the reaction is terminated, so that no gas is generated in the reaction chamber 12 to stir the electroplating solution under the condition of no workpiece electroplating, thereby effectively saving reaction materials and reducing production cost.

As an embodiment of the invention, a liquid storage tank 6 is fixedly mounted on the tank body 1; the liquid storage box 6 is positioned at one end of the reaction chamber 12; a suction cavity 54 is arranged on the side wall in the reaction chamber 12; a moving rod 541 is installed in the suction chamber 54; the tail end of the movable rod 541 is fixedly connected to the mesh plate 52; a through hole is formed in the movable rod 541 in the resin direction; a first cross rod 552 is arranged in the through hole; the first cross rod 552 is positioned at one end, close to the upper surface of the tank body 1, in the through hole; a first baffle 55 is arranged at the opening of the through hole close to the mesh plate 52; a first spring 551 is installed in the through hole; two ends of the first spring 551 are fixedly connected to the first cross rod 552 and the first baffle 55 respectively; the first spring 551 is an extension spring; a second pipe 61 is arranged at the end of the suction cavity 54; the other end of the second pipe 61 is arranged on the liquid storage tank 6; the connection part of the upper end of the suction cavity 54 and the second pipe 61 is provided with a hole, so that the suction cavity 54 is communicated with the liquid storage tank 6 through the second pipe 61; a second cross rod 562 is arranged in a hole formed in the upper end of the suction cavity 54; the second cross rod 562 is close to the upper surface of the tank body 1; a second baffle plate 56 is arranged in the suction cavity 54; the second baffle 56 is tightly attached to the opening of the upper end opening of the suction cavity 54; a second spring 561 is arranged in the hole; two ends of the second spring 561 are fixedly connected to the second cross rod 562 and the second baffle 56 respectively; the second spring 561 is an extension spring;

in operation, when the mesh plate 52 moves upwards, the moving rod 541 connected to the mesh plate 52 moves upwards to compress the space in the suction chamber 54, the baffle plate two 56 is tensioned by the spring two 561 and is tightly attached to the opening of the upper end opening of the suction chamber 54, when the moving rod 541 moves upwards, the space between the suction chamber 54 and the tube two 61 is blocked by the baffle plate two 56, meanwhile, because the baffle plate one 55 is positioned on one side of the moving rod 541 close to the mesh plate 52, when the pressure in the suction chamber 54 rises to a certain degree in the continuous upward movement process of the moving plate, the gas in the suction chamber 54 is discharged through the through hole after the pressure value is larger than the tension of the spring one 551, it is ensured that the pressure in the suction chamber 54 is relatively stable, when the mesh plate 52 descends again, the moving rod 541 moves downwards, the space in the suction chamber 54 increases, because the gas in the suction chamber 54 is discharged in the compression process, at this time, the suction chamber 54 is in a negative pressure state, when the negative pressure value exceeds the pulling force of the second spring 561, the sulfuric acid liquid in the liquid storage tank 6 is sucked into the suction cavity 54 through the second pipe 61, when the mesh plate 52 rises again, the moving rod 541 compresses the space in the suction cavity 54, the sulfuric acid liquid in the suction cavity 54 enters the reaction chamber 12 through the through hole to replenish the sulfuric acid consumed in the reaction chamber 12, the reaction in the reaction chamber 12 is not interrupted, enough gas can be generated in the reaction chamber 12 to stir the electroplating solution in the electroplating chamber 11, the concentration of the electroplating solution is consistent, meanwhile, because the replenishment of the sulfuric acid is continuously carried out along with the movement of the mesh plate 52, the replenishment can be carried out only when the mesh plate 52 is positioned below the liquid level, the reaction is continuously carried out, the sulfuric acid liquid is still replenished after the electroplating equipment is stopped, the waste is avoided, the production cost is reduced, and meanwhile, the automatic replenishment of the sulfuric acid liquid is realized through the movement of the mesh plate 52, the concentration of sulfuric acid in the reaction chamber 12 is stable, frequent supplement of reaction media in the use process is avoided, and the labor intensity of workers is reduced.

As an embodiment of the present invention, a plurality of nozzles 41 are uniformly arranged on the annular pipe 4; an elastic film 411 is arranged at the outlet of the spray head 41; the elastic film 411 is provided with a crack; the split is normally in a closed state; an included angle is formed between the spray head 41 and the horizontal plane; the projection of the spray head 41 on the plane where the annular pipe 4 is located is tangent to the annular pipe 4;

in operation, when not spouting gaseous in the ring pipe 4, elastic membrane 411 on the shower nozzle 41 is in the encapsulated situation, prevent that the plating solution from entering into ring pipe 4 through shower nozzle 41, thereby avoid the plating solution to pollute or jam ring pipe 4, prevent to make because the influence of plating solution, the gas in the ring pipe 4 is difficult to the blowout, can not stir the plating solution, the ion concentration that makes the work piece locate region in the plating solution is lower, influence the performance of the cladding material on work piece surface, simultaneously, because there is the contained angle between injection pipe and the horizontal plane, and the projection of injection roller is tangent with ring pipe 4, form a relative vortex district after the gas blowout, stir the plating solution, make the plating solution take place the rotation under spun gas effect, thereby better stir the plating solution, guarantee that the plating solution ion concentration is unanimous everywhere, promote work piece electroplating effect.

In one embodiment of the present invention, a liquid extractor 8 is installed on the outer side surface of the reaction chamber 12; the liquid extractor 8 is vertical to the outer side wall of the reaction chamber 12; the liquid extractor 8 and the liquid storage tank 6 are positioned on the same side, and the liquid extractor 8 is positioned above the liquid storage tank 6; one end of the second pipe 61 is connected to the liquid extractor 8, and the other end of the second pipe is connected to the annular pipe 4; a through hole 82 is formed in the bottom of the liquid extractor 8, and the through hole 82 is communicated with the inside of the reaction chamber 12; the opening of the through hole 82 in the reaction chamber 12 is above the liquid level; a negative pressure cavity 83 is arranged in the liquid pumping device 8; a first pipe 53 is arranged on the side wall of the liquid pumping device 8; the outlet of the first pipe 53 at one end in the liquid extractor 8 is close to the center line of the through hole 82; the other end of the first pipe 53 is arranged on the side wall of the reaction chamber 12; the joint of the first pipe 53 and the reaction chamber 12 is positioned below the liquid level;

when the electroplating device works, when the gas pressure in the reaction chamber 12 is high enough, the gas starts to be sprayed out, when the gas reaches the negative pressure cavity 83 in the liquid extractor 8, the space is suddenly increased, the pressure in the negative pressure cavity 83 is negative, because the opening of the first pipe 53 is close to the central line of the through hole 82, the opening of the first pipe 53 is under negative pressure, so that the liquid in the reaction chamber 12 is pumped out through the first pipe 53 and then enters the electroplating chamber 11 along with the sprayed gas through the pipeline, because manganese carbonate and nickel carbonate in the reaction chamber 12 continuously react, manganese sulfate and nickel sulfate with higher concentration are contained in the liquid in the reaction chamber 12, when the liquid enters the electroplating solution in the electroplating chamber 11, manganese ions and nickel ions consumed by the electroplating reaction can be effectively supplemented, thereby ensuring the continuous and effective proceeding of the electroplating reaction, improving the quality of the surface coating of the electroplated workpiece, and simultaneously, the copper ions consumed in the electroplating solution are supplemented due to the dissolution of the anode plate 2, thereby can guarantee the stability of each ion concentration in the plating solution, promote the electroplating effect, simultaneously, through the automatic replenishment of consuming ion, can avoid artifical frequent replenishment plating solution, reduce workman intensity of labour.

A copper-nickel-manganese alloy plating solution which is suitable for the above-mentioned plating method; the copper-nickel-manganese alloy electroplating solution comprises the following components:

80-120 g/L g of copper sulfate, 10-15 g/L g of nickel sulfate, 20-25 g/L g of manganese sulfate, 160-180 g/L g of sulfuric acid, 5-8 g/L g of hydrochloric acid, 5-10 g/L g of sodium lauryl sulfate, 25-30 g/L g of a complexing agent, 2-5 g/L g of a stabilizing agent and the balance of deionized water, wherein the relative density of the sulfuric acid is 1.28, the relative density of the hydrochloric acid is 1.12, the complexing agent is a mixture of ethylenediamine tetraacetic acid (DETA), hydroxyethylidene diphosphonic acid (HEDP) and sodium citrate in equal proportion, and the stabilizing agent is phytic acid;

wherein, the chlorine ion existing in the electroplate liquid can promote the precipitation of copper, nickel and manganese on the surface of a workpiece, inhibit the generation of hydrogen in the electroplate liquid, reduce the possibility of hydrogen adsorption on the surface of the workpiece, avoid the pinhole or pockmark defect of a plating layer caused by the hydrogen, improve the current efficiency and the quality of the electroplate, simultaneously, the chlorine ion can generate a synergistic reaction with a brightening agent to form chlorinated coordination ions, promote the leveling effect of the brightening agent, further improve the brightness and the smoothness of the surface of the workpiece after the electroplate, simultaneously, the content of the chlorine ion in the electroplate liquid is lower, the cost can be effectively saved, the possibility that the chlorine ion loses electrons to generate chlorine gas is reduced, the generation of toxic and harmful gas in the electroplate process is avoided, simultaneously, the lauryl sodium sulfate plays multiple roles in the electroplate liquid due to the self characteristics of the lauryl sodium sulfate, and can play the roles, the production cost of the electroplating solution is effectively reduced, and the surface coating performance of the treated workpiece is good;

the preparation method of the copper-nickel-manganese alloy electroplating solution comprises the following steps:

s1: adding a proper amount of deionized water into a container, then mixing ethylenediamine tetraacetic acid (DETA), hydroxyethylidene diphosphonic acid (HEDP) and sodium citrate in equal proportion, adding into the container, stirring uniformly, keeping the stirring state, and continuously adding phytic acid serving as a stabilizer into the container to prepare a solution;

s2: on the basis of the step S1, stirring, and sequentially adding sulfuric acid and hydrochloric acid into a container;

and SS, sequentially adding copper sulfate, nickel sulfate and manganese sulfate into the container on the basis of the step S2, keeping the stirring state, continuously adding deionized water into the container to supplement the liquid in the container to 1L, and then continuously stirring for 3-5min to obtain the copper-nickel-manganese alloy electroplating solution.

The specific working process is as follows:

when the electroplating device works, firstly, the electroplating solution in the electroplating chamber 11 and the sulfuric acid in the reaction chamber 12 in the electroplating device are added, then a workpiece is inserted into the mounting hole on the mounting plate 3, the power supply is switched on, the anode plate 2 and the mounting plate 3 are electrified, the motor 34 is started, the motor 34 operates to drive the worm 32 to rotate, the worm 32 is meshed with the worm wheel 33, the worm wheel 33 is mounted on the threaded shaft 37, the threaded shaft 37 is driven to operate, after the threaded shaft 37 starts to rotate, the fixing plate mounted on the threaded shaft 37 descends gradually when the threads rotate, the guide rod 31 mounted on the fixing plate is driven to move downwards, the mounting plate 3 mounted on the guide rod 31 moves downwards and gradually enters the electroplating solution, so that the workpiece starts to be electroplated, and simultaneously, when the workpiece is electroplated, sulfuric acid added into the reaction chamber 12 reacts with the blocky manganese carbonate and the blocky nickel carbonate on the mesh plate 52 to generate carbon dioxide gas, the generated gas is accumulated continuously, the pressure in the reaction chamber 12 exceeds the critical value of the pressure valve, then the gas in the reaction chamber 12 enters the annular pipe 4 through the pipe five 81, and is finally sprayed out from the opening on the annular pipe 4, and the electroplating solution in the electroplating chamber 11 is stirred through the sprayed gas; when the mounting plate 3 inserted with the workpiece descends into the electroplating solution in the electroplating chamber 11, the fixing plate also descends, and the piston rod I of the cylinder I36 is fixedly connected to the fixing plate; when the fixing plate descends, the gas in the cylinder I36 is compressed, the pressure in the cylinder I36 rises, the cylinder I36 is communicated with the cylinder II 5 through the pipe III 7 and the pipe IV 71, therefore, under the action of high-pressure gas in the cylinder I36, the piston rod II 51 of the cylinder II 5 gradually extends out, as the piston rod II 51 is installed on the mesh plate 52, the mesh plate 52 slowly descends and enters sulfuric acid in the reaction chamber 12, manganese carbonate and nickel carbonate on the mesh plate 52 react with the sulfuric acid to generate gas, finally the gas enters the electroplating chamber 11 to stir electroplating solution, when the workpiece is processed and the mounting plate 3 rises, the fixing plate rises upwards, so that the pressure in the cylinder I36 is reduced, the pressure in the cylinder II 5 is reduced, the piston rod of the cylinder II 5 rises upwards, the mesh plate 52 is driven to rise upwards, and the manganese carbonate and nickel carbonate on the mesh plate 52 are separated from the sulfuric acid liquid, terminating the reaction; when the mesh plate 52 moves upwards, the moving rod 541 connected with the mesh plate 52 moves upwards to compress the space in the suction cavity 54, the baffle plate two 56 is tensioned by the spring two 561 and is tightly attached to the opening of the upper end opening of the suction cavity 54, when the moving rod 541 moves upwards, the space between the suction cavity 54 and the pipe two 61 is blocked by the baffle plate two 56, meanwhile, because the baffle plate one 55 is positioned on one side of the moving rod 541 close to the mesh plate 52, when the pressure in the suction cavity 54 is increased to a certain degree in the continuous upward movement process of the moving plate, the gas in the suction cavity 54 is discharged through the through hole after the pressure value is larger than the tension of the spring one 551, when the mesh plate 52 descends again, the moving rod 541 moves downwards, the space in the suction cavity 54 is increased, because the gas in the suction cavity 54 is discharged in the compression process, at the moment, the suction cavity 54 is in a negative pressure state, when the negative pressure value exceeds the tension of the spring two 561, sulfuric acid liquid in the liquid storage tank 6 is sucked into the suction cavity 54 through the second pipe 61, and when the mesh plate 52 ascends again and the moving rod 541 compresses the space in the suction cavity 54, the sulfuric acid liquid in the suction cavity 54 enters the reaction chamber 12 through the through hole; when gas is not sprayed out of the annular tube 4, the elastic membrane 411 on the spray head 41 is in a closed state, meanwhile, because an included angle exists between the spray tube and the horizontal plane and the projection of the spray roller is tangent to the annular tube 4, a relative vortex area is formed after the gas is sprayed out, and the electroplating solution is stirred to rotate under the action of the sprayed gas; when the gas pressure in the reaction chamber 12 is sufficiently high, the gas starts to be sprayed out, when the gas reaches the negative pressure cavity 83 in the liquid extractor 8, the pressure in the negative pressure cavity 83 is negative due to sudden increase of the space, and the opening of the first pipe 53 is close to the center line of the through hole 82, so that the negative pressure is presented at the opening of the first pipe 53, the liquid in the reaction chamber 12 is extracted through the first pipe 53, and then the liquid enters the electroplating chamber 11 through the pipeline along with the sprayed gas.

The foregoing illustrates and describes the principles, general features, and advantages of the present invention. It will be understood by those skilled in the art that the present invention is not limited to the embodiments described above, which are described in the specification and illustrated only to illustrate the principle of the present invention, but that various changes and modifications may be made therein without departing from the spirit and scope of the present invention, which fall within the scope of the invention as claimed. The scope of the invention is defined by the appended claims and equivalents thereof.