阅读说明：本技术 一种散热膜的制备方法及显示装置 (Preparation method of heat dissipation film and display device ) 是由 查宝 于 2020-03-20 设计创作，主要内容包括：本发明实施例公开了一种散热膜的制备方法及显示装置,散热膜的制备方法包括：制备第一溶液；提供一基板,将所述基板在所述第一溶液中清洗第一预设时长,以在所述基板表面得到一层有机膜；将清洗后的所述基板吹干；在所述有机膜上涂布第二溶液；将涂布有所述第二溶液的所述有机膜在预设温度下烘烤第二预设时长,得到散热膜。本申请实施例通过制备一种散热膜,并将其应用至显示装置中,提高了显示装置基板的导热系数,保证显示装置的正常使用并提高其使用寿命。(The embodiment of the invention discloses a preparation method of a heat dissipation film and a display device, wherein the preparation method of the heat dissipation film comprises the following steps: preparing a first solution; providing a substrate, and cleaning the substrate in the first solution for a first preset time to obtain an organic film on the surface of the substrate; drying the cleaned substrate; coating a second solution on the organic film; and baking the organic film coated with the second solution at a preset temperature for a second preset time to obtain the heat dissipation film. According to the embodiment of the application, the heat dissipation film is prepared and applied to the display device, so that the heat conductivity coefficient of the substrate of the display device is improved, the normal use of the display device is ensured, and the service life of the display device is prolonged.)

1. A method for preparing a heat dissipation film is characterized by comprising the following steps:

preparing a first solution;

providing a substrate, and cleaning the substrate in the first solution for a first preset time to obtain an organic film on the surface of the substrate;

drying the cleaned substrate;

coating a second solution on the organic film;

and baking the organic film coated with the second solution at a preset temperature for a second preset time to obtain the heat dissipation film.

2. The method for preparing a heat dissipating film according to claim 1, wherein the solute of the first solution is ethanol and the solvent is deionized water.

3. The method for manufacturing a heat dissipating film according to claim 1, wherein the substrate in the first solution is further irradiated with extreme ultraviolet light while the substrate is washed in the first solution for a first predetermined time.

4. The method for preparing a heat dissipation film according to claim 1, wherein the solute of the second solution is organic silane, and the solvent is one or more of toluene, xylene, pentane, hexane, octane, cyclohexane, cyclohexanone, diethyl ether, propylene oxide, chlorobenzene, dichlorobenzene, dichloromethane, isopropanol, methyl acetate, ethyl acetate, propyl acetate, acetonitrile, and pyridine.

5. The method for preparing the heat dissipation film according to claim 4, wherein the volume ratio of the solute to the solvent in the second solution is 1:1 to 1: 4.

6. The method for producing a heat dissipating film according to claim 4, wherein the organosilane has a formula of:

wherein n represents carbon chains with different lengths, and R is one of a chain containing ester groups, an F-substituted alkane derivative, a conjugated structure connected through alkoxy and ester groups, and a conjugated structure containing heterocyclic compounds.

7. The method for producing a heat dissipating film according to claim 6, wherein the heterocyclic compound is one of a five-membered heterocyclic compound, a six-membered heterocyclic compound, and a benzo-heterocyclic compound.

8. A display device, comprising:

a substrate;

the heat dissipation film is arranged on the substrate;

a functional layer disposed on the heat dissipation film;

wherein the heat dissipating film is produced by the method for producing a heat dissipating film according to any one of claims 1 to 7.

9. The display device according to claim 8, wherein the functional layer comprises:

the thin film transistor layer is arranged on the heat dissipation film;

a light emitting layer disposed on the thin film transistor layer;

and a plurality of pixel electrodes disposed in the light emitting layer.

10. The display device according to claim 8, wherein the functional layer comprises:

the n-type gallium nitride layer is arranged on the heat dissipation film;

a plurality of light emitting cells disposed on the n-type gallium nitride layer;

a plurality of pixel electrodes disposed on the plurality of light emitting cells; each electrode corresponds to each light-emitting unit one by one.

Technical Field

The invention relates to the technical field of display, in particular to a preparation method of a heat dissipation film and a display device.

Background

With the development of Display technologies, O L ED (Organic light Emitting Diode) and Micro L ED (Micro light Emitting Diode) with excellent color and performance have been considered as next generation Display technologies to replace L CD (L i quick Crystal Display), but both technologies are active light Emitting, and as the resolution increases, the requirement of RGB light Emitting elements per unit area increases, so that the heat generated per unit area increases, and the generated heat needs to be diffused in time in order not to affect the normal use and service life of the Display device, whereas currently, Micro ED 2 387 and O L ED generally use glass as a substrate, and the thermal conductivity of glass is generally less than 1W/(m K), so that the heat resistance of the Display device is poor, and the normal use and service life of the Display device are affected.

Therefore, a preparation method of a heat dissipation film and a display device are urgently needed to solve the technical problems that the normal use of the display device is influenced and the service life of the display device is low due to the fact that the heat conductivity coefficient of a substrate is not high in the prior art.

Disclosure of Invention

The embodiment of the invention provides a preparation method of a heat dissipation film and a display device.

The application provides a preparation method of a heat dissipation film, which comprises the following steps:

preparing a first solution;

providing a substrate, and cleaning the substrate in the first solution for a first preset time to obtain an organic film on the surface of the substrate;

drying the cleaned substrate;

coating a second solution on the organic film;

and baking the organic film coated with the second solution at a preset temperature for a second preset time to obtain the heat dissipation film.

In some embodiments of the present application, the solute of the first solution is ethanol and the solvent is deionized water.

In some embodiments of the present application, the substrate is further irradiated by extreme ultraviolet light while being washed in the first solution for a first preset time period.

In some embodiments of the present application, the solute of the second solution is an organosilane, and the solvent is one or more of toluene, xylene, pentane, hexane, octane, cyclohexane, cyclohexanone, diethyl ether, propylene oxide, chlorobenzene, dichlorobenzene, dichloromethane, isopropanol, methyl acetate, ethyl acetate, propyl acetate, acetonitrile, pyridine.

In some embodiments of the present application, the volume ratio of the solute to the solvent in the second solution is 1:1 to 1: 4.

In some embodiments of the present application, the organosilane is of the formula:

wherein n represents carbon chains with different lengths, and R is one of a chain containing ester groups, an F-substituted alkane derivative, a conjugated structure connected through alkoxy and ester groups, and a conjugated structure containing heterocyclic compounds.

In some embodiments of the present application, the heterocyclic compound is one of a five-membered heterocyclic compound, a six-membered heterocyclic compound, a benzo-heterocyclic compound.

An embodiment of the present invention further provides a display device, including:

a substrate;

the heat dissipation film is arranged on the substrate;

a functional layer disposed on the heat dissipation film;

wherein, the heat dissipation film is prepared by adopting the preparation method of the heat dissipation film in any embodiment.

In some embodiments of the present application, the functional layer comprises:

the thin film transistor layer is arranged on the heat dissipation film;

a light emitting layer disposed on the thin film transistor layer;

and a plurality of pixel electrodes disposed in the light emitting layer.

In some embodiments of the present application, the functional layer comprises:

the n-type gallium nitride layer is arranged on the heat dissipation film;

a plurality of light emitting cells disposed on the n-type gallium nitride layer;

a plurality of pixel electrodes disposed on the plurality of light emitting cells; each electrode corresponds to each light-emitting unit one by one.

In the embodiment of the invention, the heat dissipation film is prepared and applied to the display device, so that the heat conductivity coefficient of the substrate of the display device is improved, and the technical problems that the normal use of the display device is influenced and the service life of the display device is short due to the fact that the heat conductivity coefficient of the substrate is not high in the prior art are solved.

Drawings

In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the drawings needed to be used in the description of the embodiments will be briefly introduced below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and it is obvious for those skilled in the art to obtain other drawings based on these drawings without creative efforts.

FIG. 1 is a flowchart illustrating a method for fabricating a heat dissipation film according to an embodiment of the present invention;

FIG. 2 is a schematic structural diagram of a heat dissipation film prepared by the method for preparing a heat dissipation film according to an embodiment of the present invention;

fig. 3 is a schematic structural diagram of an O L ED display device according to a second embodiment of the present invention;

fig. 4 is a schematic structural diagram of a Micro L ED display device according to a second embodiment of the present invention.

Detailed Description

The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.

In the description of the present invention, it is to be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc. indicate orientations or positional relationships based on those shown in the drawings, and are only for convenience of description and simplicity of description, but do not indicate or imply that the device or element being referred to must have a particular orientation, be constructed and operated in a particular orientation, and thus, should not be considered as limiting the present invention. Furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, features defined as "first", "second", may explicitly or implicitly include one or more of the described features. In the description of the present invention, "a plurality" means two or more unless specifically defined otherwise.

In this application, the word "exemplary" is used to mean "serving as an example, instance, or illustration. Any embodiment described herein as "exemplary" is not necessarily to be construed as preferred or advantageous over other embodiments. The following description is presented to enable any person skilled in the art to make and use the invention. In the following description, details are set forth for the purpose of explanation. It will be apparent to one of ordinary skill in the art that the present invention may be practiced without these specific details. In other instances, well-known structures and processes are not shown in detail to avoid obscuring the description of the invention with unnecessary detail. Thus, the present invention is not intended to be limited to the embodiments shown, but is to be accorded the widest scope consistent with the principles and features disclosed herein.

The embodiment of the invention provides a preparation method of a heat dissipation film and a display device. The following are detailed below.