阅读说明：本技术 一种led封装器件 (LED packaging device ) 是由 廖春辉 于 2019-11-28 设计创作，主要内容包括：本发明公开了一种LED封装器件,通过设置螺旋状的散热管,能够增加水通过散热管的时间,进而能够提高冷水对基板和芯片进行散热；然后再设置一号分流管和二号分流管,并在一号分流管和二号分流管上均安装泵和电磁阀,能够使一号箱体和二号箱体交错工作,从而能够避免一号泵和二号泵长时间工作,进而能够提高一号泵和二号泵的使用寿命；通过在一号水箱和四号水箱的一侧分别设置一号制冷箱和二号制冷箱,能够通过一号制冷箱和二号制冷箱对一号水箱和四号水箱内的水进行降温,降温的同时,二号水箱和三号水箱内的水工作,能够给降温提供时间,有助于将热水降温到较低的温度,便于使进入散热管内的水始终保持较低的温度,能够起到良好的散热效果。(The invention discloses an LED packaging device, which can increase the time for water to pass through a radiating pipe by arranging a spiral radiating pipe, thereby improving the radiating of cold water on a substrate and a chip; then a first shunt pipe and a second shunt pipe are arranged, and a pump and an electromagnetic valve are arranged on the first shunt pipe and the second shunt pipe, so that the first box body and the second box body can work in a staggered mode, the first pump and the second pump can be prevented from working for a long time, and the service lives of the first pump and the second pump can be prolonged; set up a refrigeration case and No. two refrigeration casees respectively through one side at a water tank and No. four water tanks, can cool down the water in a water tank and No. four water tanks through a refrigeration case and No. two refrigeration casees, in the time of the cooling, the water work in No. two water tanks and No. three water tanks can provide time for the cooling, help cooling hot water to lower temperature, be convenient for make the water that gets into in the radiator pipe remain lower temperature throughout, can play good radiating effect.)

1. An LED packaging device comprises a substrate (1), a packaging piece (2), a chip (3) and a PLC controller, and is characterized in that: the bottom mounting of base plate (1) has copper sheet (4), the below of copper sheet (4) is provided with heat dissipation mechanism, and this heat dissipation mechanism includes spiral helicine cooling tube (5), the lower terminal surface at copper sheet (4) is fixed in cooling tube (5), the both ends of cooling tube (5) are No. one mouth of pipe (8) and No. two mouth of pipe (9) respectively, No. one mouth of pipe (8) and No. two mouth of pipe (9) are connected with a shunt tubes (14) and No. two shunt tubes (15) outward respectively, one side that cooling tube (5) were kept away from to shunt tubes (14) and No. two shunt tubes (15) is connected with No. one box (6) and No. two boxes (7) respectively, No. one box (6) and No. two boxes (7) include No. one water tank (10) and No. two water tank (11) and No. three water tank (12) and No. four water tank (13) respectively, No. one water tank (10) and No. two water tank (11) are connected through a aqueduct, no. three water tank (12) and No. four water tank (13) are connected through No. two aqueducts (19), one side of No. one water tank (10) and No. four water tank (13) is connected with a refrigeration case (21) and No. two refrigeration case (22) respectively.

2. The LED package device of claim 1, wherein: no. one shunt tubes (14) and No. two shunt tubes (15) are gone up the one end that is close to a water tank (10) and No. four water tank (13) and are all installed the solenoid valve, No. one pump (16) and No. two pump (17) are installed respectively to the one end that is close to No. two water tank (11) and No. three water tank (12) on shunt tubes (14) and No. two shunt tubes (15), No. one pump (16), No. two pump (17) and solenoid valve all are connected the PLC controller through data wire electricity.

3. The LED package device of claim 1, wherein: and check valves (20) are respectively arranged on the first water guide pipe (18) and the second water guide pipe (19).

4. The LED package device of claim 1, wherein: all be provided with semiconductor refrigeration piece (23) and a plurality of heat pipe (24) in a refrigeration case (21) and No. two refrigeration case (22), the one end of heat pipe (24) in a refrigeration case (21) all stretches into and sets up in a water tank (10), the one end of heat pipe (24) in No. two refrigeration case (22) all stretches into and sets up in No. four water tank (13).

5. The LED package device of claim 1, wherein: the first refrigeration box (21) and the second refrigeration box (22) are both insulation boxes.

Technical Field

The invention relates to a packaging device, in particular to an LED packaging device.

Background

LED (semiconductor light emitting diode) packages refer to packages of light emitting chips, which are significantly different compared to integrated circuit packages. The encapsulation of LEDs is required not only to protect the wick, but also to be transparent. The encapsulation of LEDs places special requirements on the encapsulation material. Generally, the function of the package is to provide sufficient protection for the chip, so as to prevent the chip from being exposed to air for a long time or from being damaged by mechanical damage to cause failure, thereby improving the stability of the chip; for LED packaging, it is also necessary to have good light extraction efficiency and good heat dissipation, and good packaging can make the LED have better luminous efficiency and heat dissipation environment, thereby improving the life of the LED.

The traditional LED packaging device is not good enough in the aspect of heat dissipation, and after the working time of the LED element is long, more heat can be generated, so that the heat dissipation efficiency cannot keep up with the heat-generating efficiency, the LED element is easy to damage, and the improvement is needed.

Disclosure of Invention

The present invention is directed to an LED package device to solve the above problems.

In order to achieve the purpose, the invention provides the following technical scheme:

an LED packaging device comprises a substrate, a packaging part, a chip and a PLC controller, wherein a copper sheet is fixed at the bottom end of the substrate, a heat dissipation mechanism is arranged below the copper sheet, the heat dissipation mechanism comprises a spiral heat dissipation pipe, the heat dissipation pipe is fixed on the lower end face of a copper sheet, the two ends of the heat dissipation pipe are respectively provided with a first pipe orifice and a second pipe orifice, a first shunt pipe and a second shunt pipe are respectively connected outside the first pipe orifice and the second pipe orifice, one sides of the first shunt pipe and the second shunt pipe, which are far away from the radiating pipe, are respectively connected with a first box body and a second box body, the first tank body and the second tank body respectively comprise a first water tank, a second water tank, a third water tank and a fourth water tank, the first water tank and the second water tank are connected through a first water guide pipe, the third water tank and the fourth water tank are connected through a second water guide pipe, one side of No. one water tank and No. four water tanks is connected with a refrigeration case and No. two refrigeration cases respectively.

As a further scheme of the invention: the one end that is close to a water tank and No. four water tanks on a shunt tubes and No. two shunt tubes all installs the solenoid valve, No. one pump and No. two pumps are installed respectively to the one end that is close to No. two water tanks and No. three water tanks on a shunt tubes and No. two shunt tubes, a pump, No. two pumps and solenoid valve all connect the PLC controller through data wire electricity.

As a further scheme of the invention: and check valves are arranged on the first water guide pipe and the second water guide pipe.

As a further scheme of the invention: a refrigeration case and No. two refrigeration incasements all are provided with semiconductor refrigeration piece and a plurality of heat pipe, the one end of the heat pipe in the refrigeration case all stretches into the water tank in and sets up, the one end of the heat pipe in the refrigeration case No. two all stretches into the No. four water tank in and sets up.

As a further scheme of the invention: the first refrigeration box and the second refrigeration box are both insulation boxes.

Compared with the prior art, the invention has the beneficial effects that:

1. by arranging the spiral radiating pipe, the time for water to pass through the radiating pipe can be prolonged, and further, the radiating of cold water on the substrate and the chip can be improved; then a first shunt pipe and a second shunt pipe are arranged, and a pump and an electromagnetic valve are arranged on the first shunt pipe and the second shunt pipe, so that the first box body and the second box body can work in a staggered mode, the first pump and the second pump can be prevented from working for a long time, and the service lives of the first pump and the second pump can be prolonged;

2. the first water tank, the second water tank, the third water tank and the fourth water tank are arranged in the first tank body and the second tank body respectively, so that water in the first water tank and the fourth water tank can be quickly supplied to the second water tank and the third water tank after water in the second water tank and the third water tank is conveyed, and subsequent continuous work is facilitated;

3. set up a refrigeration case and No. two refrigeration casees respectively through one side at a water tank and No. four water tanks, can cool down the water in a water tank and No. four water tanks through a refrigeration case and No. two refrigeration casees, in the time of the cooling, the water work in No. two water tanks and No. three water tanks can provide time for the cooling, help cooling hot water to lower temperature, be convenient for make the water that gets into in the radiator pipe remain lower temperature throughout, can play good radiating effect.

Drawings

Fig. 1 is a front view of an LED package device of the present invention.

Fig. 2 is a structural diagram of a heat dissipation mechanism of an LED package device according to the present invention.

Detailed Description

The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.

Referring to fig. 1-2, in an embodiment of the present invention, an LED package device includes a substrate 1, a package 2, a chip 3, and a PLC controller, a copper sheet 4 is fixed at a bottom end of the substrate 1, a heat dissipation mechanism is disposed below the copper sheet 4, the heat dissipation mechanism includes a spiral heat dissipation tube 5, the heat dissipation tube 5 is fixed at a lower end surface of the copper sheet 4, two ends of the heat dissipation tube 5 are respectively a first tube opening 8 and a second tube opening 9, a first shunt tube 14 and a second shunt tube 15 are respectively connected outside the first tube opening 8 and the second tube opening 9, one sides of the first shunt tube opening 14 and the second shunt tube 15 away from the heat dissipation tube 5 are respectively connected with a first box 6 and a second box 7, the first box 6 and the second box 7 respectively include a first water tank 10 and a second water tank 11, a third water tank 12 and a fourth water tank 13, the first water tank 10 and the second water tank 11 are connected through a first, no. three water tank 12 and No. four water tank 13 are connected through No. two aqueduct 19, and one side of No. one water tank 10 and No. four water tank 13 is connected with No. one refrigeration case 21 and No. two refrigeration case 22 respectively.

Referring to fig. 1-2, electromagnetic valves are respectively installed at one ends of the first shunt tube 14 and the second shunt tube 15 close to the first water tank 10 and the fourth water tank 13, a first pump 16 and a second pump 17 are respectively installed at one ends of the first shunt tube 14 and the second shunt tube 15 close to the second water tank 11 and the third water tank 12, and the electromagnetic valves, the first pump 16 and the second pump 17 are electrically connected with a PLC controller through data wires; check valves 20 are arranged on the first water guide pipe 18 and the second water guide pipe 19; semiconductor refrigerating sheets 23 and a plurality of heat conduction pipes 24 are arranged in the first refrigerating box 21 and the second refrigerating box 22, one ends of the heat conduction pipes 24 in the first refrigerating box 21 extend into the first water tank 10 to be arranged, and one ends of the heat conduction pipes 24 in the second refrigerating box 22 extend into the fourth water tank 13 to be arranged; the first refrigeration box 21 and the second refrigeration box 22 are both insulation boxes; the heat dissipation mechanism can play a good heat dissipation effect and can quickly dissipate heat of the chip 3.

The working principle is as follows: when the LED element in the LED packaging device works, a large amount of heat can be generated, the PLC controller controls the first pump 16 to work first, meanwhile, the electromagnetic valve in front of the fourth water tank 13 is controlled to be opened, the first pump 16 works to convey water in the second water tank 11 to the first shunt pipe 14, then the water is conveyed to the spiral radiating pipe 5 through the first pipe orifice 8, then the water is conveyed to the second shunt pipe 15 through the second pipe orifice 9, then the water enters the fourth water tank 13 through the electromagnetic valve, when the water in the second water tank 11 is conveyed, the check valve 20 in the first water guide pipe 18 is opened after being subjected to suction, the water in the first water tank 10 enters the second water tank 11 through the first water guide pipe 18, cold water is conveyed to the second water tank 11, the follow-up continuation of the heat dissipation through the spiral radiating pipe 5 is facilitated, and the heat of the chip 3 can be radiated. When the first pump 16 works for a certain time, the PLC controller closes the first pump 16, controls the electromagnetic valve in the first shunt pipe 14 to be closed, controls the second pump 17 to work, meanwhile, the electromagnetic valve close to the first water tank 10 is controlled to be opened, so that the second pump 17 works to convey the water in the third water tank 12 to the second shunt pipe 15, then the substrate is conveyed into the spiral radiating pipe 5 through the second pipe orifice 9, so that the substrate 1 and the chip 3 can be radiated and cooled, then the water enters the first shunt pipe 14 through the first pipe orifice 8 and then enters the first water tank 10, when the water in the third water tank 12 is conveyed, the check valve 20 in the second water guiding pipe 19 is opened by suction force, so that the cold water in the fourth water tank 13 enters the third water tank 12 through the second water guiding pipe 19, and the heat dissipation of the heat dissipation pipe 5 is further facilitated subsequently. Through the temperature increase of water at the radiating pipe 5, part of water enters the first water tank 10 and the fourth water tank 13, the semiconductor refrigerating sheets 23 in the first refrigerating box 21 and the second refrigerating box 22 work to reduce the temperature in the first refrigerating box 21 and the second refrigerating box 22, the first refrigerating box 21 and the second refrigerating box 22 are respectively contacted with the first water tank 10 and the fourth water tank 13, the heat in the first water tank 10 and the fourth water tank 13 can be transferred to the first refrigerating box 21 and the second refrigerating box 22, and the radiating effect can be achieved; meanwhile, the heat in the first water tank 10 and the fourth water tank 13 can be further transferred to the first refrigeration box 21 and the second refrigeration box 22 through the heat conduction pipe 24, so that further cooling can be realized, cold water can be conveniently conveyed to the radiating pipe 5 in the follow-up process, and a good radiating effect can be achieved on the chip 3.

It will be evident to those skilled in the art that the invention is not limited to the details of the foregoing illustrative embodiments, and that the present invention may be embodied in other specific forms without departing from the spirit or essential attributes thereof. The present embodiments are therefore to be considered in all respects as illustrative and not restrictive, the scope of the invention being indicated by the appended claims rather than by the foregoing description, and all changes which come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein. Any reference sign in a claim should not be construed as limiting the claim concerned.

Furthermore, it should be understood that although the present description refers to embodiments, not every embodiment may contain only a single embodiment, and such description is for clarity only, and those skilled in the art should integrate the description, and the embodiments may be combined as appropriate to form other embodiments understood by those skilled in the art.