阅读说明：本技术 在产品表面激光标记的方法 (Method for laser marking on surface of product ) 是由 田森 彭云贵 胡述旭 曹洪涛 吕启涛 高云峰 于 2019-09-25 设计创作，主要内容包括：本发明涉及一种在产品表面激光标记的方法,包括以下步骤：将待标记产品定位；开启激光设备并调整激光焦距,使得激光焦点处于待标记产品需标记的位置上；通过激光设备发出的激光以打点的方式对待标记产品的表面镭射,并且因激光在待标记产品的表面作用产生库仑爆炸效应而形成孔阵标记。这种方法能够在产品表面上激光加工出尺寸较小且不易被观察到的标记。(The invention relates to a method for laser marking on the surface of a product, which comprises the following steps: positioning a product to be marked; starting laser equipment and adjusting the laser focal length to enable the laser focal point to be positioned at the position of a product to be marked, which needs to be marked; the laser emitted by the laser equipment irradiates the surface of the product to be marked in a dotting mode, and the coulomb explosion effect is generated due to the action of the laser on the surface of the product to be marked, so that the hole array mark is formed. This method enables laser machining of small and unobservable markings on the surface of the product.)

1. A method of laser marking a surface of a product, comprising the steps of:

positioning a product to be marked;

adjusting the laser focal length to enable the laser focal point to be positioned at the position of a product to be marked, which needs to be marked;

the surface of a product to be marked is subjected to laser by utilizing laser in a dotting mode, the laser dotting speed is 1-100 mm/s, the laser dotting time is 0.01-1 ms, and the repetition frequency is 50-1000 kHz, so that the laser acts on the surface of the product to be marked to form a hole array mark.

2. The method according to claim 1, characterized in that the product to be marked is non-tempered ordinary glass, quartz glass, potassium glass, borate glass, coloured glass containing metal oxides or optical glass containing light-sensitive substances.

3. The method according to claim 1, wherein in the step of laser dotting the product to be marked, an ultrafast laser is used for laser dotting the product to be marked, the ultrafast laser having a wavelength of 355nm and a pulse width of 0.1ps to 25 ps.

4. The method of claim 1, wherein the width of the laser-irradiated hole array mark is 0.05mm to 0.3 mm.

5. The method of claim 1, wherein the laser spot power is 0.1W to 10W.

6. The method according to claim 1, characterized in that the area to be marked of the product to be marked is scanned and positioned by means of a CCD vision positioning system while the product to be marked is laser spotted.

7. The method of claim 1, characterized in that the sides of the product to be marked are laser-marked in a spot-wise manner with a laser.

8. The method of claim 1, wherein the mark is a two-dimensional code, and the step of laser marking the hole array on the product to be marked comprises:

editing the marking pattern according to the content and the size of the two-dimensional code;

aligning a two-dimensional code marking area of a product to be marked;

calling a marking pattern laser program;

and laser is utilized to laser out a two-dimensional code pattern in the two-dimensional code marking area.

9. The method of claim 1 wherein the step of laser marking the hole array on the product to be marked includes controlling the laser marking direction by a laser galvanometer.

10. The method of claim 9, wherein in the step of laser marking the hole array on the product to be marked, the laser is changed into parallel light by a beam expander, the parallel light is changed in irradiation track by a laser galvanometer, and finally the parallel light is imaged on the product to be marked through a focusing lens.

Technical Field

The invention relates to the technical field of laser processing, in particular to a method for laser marking on the surface of a product.

Background

Disclosure of Invention

In view of the above, it is necessary to provide a method for laser processing a mark with a small size and difficult to observe on the surface of a product, aiming at the problem of large size of the laser mark on the surface of the product.

A method of laser marking a surface of a product, comprising the steps of:

positioning a product to be marked;

adjusting the laser focal length to enable the laser focal point to be positioned at the position of a product to be marked, which needs to be marked;

the surface of a product to be marked is subjected to laser by utilizing laser in a dotting mode, the laser dotting speed is 1-100 mm/s, the laser dotting time is 0.01-1 ms, and the repetition frequency is 50-1000 kHz, so that the laser acts on the surface of the product to be marked to form a hole array mark.

According to the method, the surface of the product to be marked is subjected to laser in a laser dotting mode, a small-range hole array mark can be formed, the size of the mark irradiated by the laser is small, the mark is not easy to directly observe, and a certain invisible effect is achieved.

In one embodiment, the product to be marked is ordinary glass, quartz glass, potassium glass, borate glass, colored glass containing metal oxide or optical glass containing photosensitive substance. The marking method can be applied to various glass products, and the effect of forming the mark with smaller size is good, and the appearance is not influenced.

In one embodiment, in the step of laser dotting the product to be marked, an ultrafast laser is adopted for laser dotting the product to be marked, wherein the wavelength of the ultrafast laser is 355nm, and the pulse width of the ultrafast laser is 0.1 ps-25 ps. The ultrafast laser has smaller pulse width, and when the laser mark of the product to be marked is carried out, the damage to the product to be marked is smaller, and the appearance and the original strength of the product to be marked cannot be influenced. The precision of laser processing of a product to be marked by the ultrafast laser is higher, and the processing efficiency is very high.

In one embodiment, the width of the laser-irradiated hole array mark is 0.05mm to 0.3 mm. The processed mark is more miniaturized, the size of the mark is smaller, the mark is more difficult to observe, and the attractiveness of a product to be marked is not influenced.

In one embodiment, the laser dotting power is 0.1W to 10W. The laser dotting forming mark has the advantages of higher speed, higher processing precision and capability of better forming a mark with a smaller size.

In one embodiment, when a product to be marked is subjected to laser dotting, a CCD visual positioning system is used for scanning and positioning an area to be marked of the product to be marked. The laser dotting position can be more accurate.

In one embodiment, the side of the product to be marked is laser-marked in a dotting manner by using a laser. The mark is laser-marked on the product to be marked, so that the product can be more concealed, and the mark is more difficult to observe when the product is used, thereby better ensuring the attractiveness of the product.

In one embodiment, the mark is a two-dimensional code, and the specific steps of laser-forming the hole array mark on the product to be marked are as follows: editing the marking pattern according to the content and the size of the two-dimensional code; aligning a two-dimensional code marking area of a product to be marked; calling a marking pattern laser program; and laser is utilized to laser out a two-dimensional code pattern in the two-dimensional code marking area. The laser marking operation is more accurate, and the two-dimensional code mark can be correctly formed.

In one embodiment, in the step of laser marking the hole array on the product to be marked, the laser marking trend is controlled by the laser galvanometer. The laser galvanometer can effectively control the laser marking trend, and ensure quick and effective dotting to form marks.

In one embodiment, in the step of laser marking the hole array on the product to be marked, laser is changed into parallel light through a beam expander, the irradiation track of the parallel light is changed through a laser galvanometer, and finally the parallel light is imaged on the product to be marked through a focusing lens. The beam expander can effectively change laser into parallel light, the laser galvanometer can effectively control the irradiation track of the parallel light, and the focusing lens can effectively focus the parallel light to a product to be marked to form a dotting mark. The beam expander, the laser galvanometer and the focusing lens form an effective optical system, so that the laser can effectively mark a product to be marked.

Drawings

FIG. 1 is a schematic flow chart illustrating the operation of one embodiment of the method of the present invention;

FIG. 2 is a schematic diagram illustrating the effect of two-dimensional codes marked by the method of the present invention;

fig. 3 is a reference schematic of the structure marked according to the method of the present invention.

In the drawings, the components represented by the respective reference numerals are listed below:

10. a product to be marked; 20. and (4) marking.

Detailed Description

In order to make the aforementioned objects, features and advantages of the present invention comprehensible, embodiments accompanied with figures are described in detail below. In the following description, numerous specific details are set forth in order to provide a thorough understanding of the present invention. This invention may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein, but rather should be construed as broadly as the present invention is capable of modification in various respects, all without departing from the spirit and scope of the present invention.

It will be understood that when an element is referred to as being "secured to" another element, it can be directly on the other element or intervening elements may also be present. When an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements may also be present. The terms "vertical," "horizontal," "left," "right," and the like as used herein are for illustrative purposes only and do not represent the only embodiments.

Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. The terminology used in the description of the invention herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. The technical features of the embodiments described above may be arbitrarily combined, and for the sake of brevity, all possible combinations of the technical features in the embodiments described above are not described, but should be considered as being within the scope of the present specification as long as there is no contradiction between the combinations of the technical features.

Referring to fig. 1, in one embodiment, a method for laser marking a surface of quartz glass includes the following steps:

putting quartz glass into a jig for positioning;

selecting an ultrafast laser with the wavelength of 355nm and the pulse width of 0.3ps, and editing a marking pattern according to the content and the size of the two-dimensional code to be marked;

keeping the side surface of the quartz glass horizontal to a lens of an ultrafast laser, and aligning a two-dimensional code marking area of the quartz glass by the ultrafast laser;

calling a marking pattern laser program in an ultrafast laser, and adjusting marking parameters;

laser that the ultrafast laser sent becomes the parallel light through the beam expanding lens, and the parallel light passes through the laser galvanometer and changes the irradiation orbit, at last through focusing lens formation of image on quartz glass's side, and laser is radium-shine to quartz glass's side with the mode of dotting, and the speed of dotting is 5mm/s, and repetition frequency is 75kHz, and the time of dotting is 0.15ms, and laser power is 1.2W, and radium-emitted two-dimensional code width is 0.1mm, and length is 0.4 mm.

The laser marking method can form the small-sized two-dimensional code on the side surface of the quartz glass, and the two-dimensional code is on the side surface of the quartz glass, has small color difference after marking, is difficult to observe and has certain invisible effect. Under the specific illumination environment of shining inwards on the plane of quartz glass, the two-dimensional code positioned on the side surface can read information quickly through a special CCD device.