阅读说明：本技术 微型发光二极管晶粒及微型发光二极管晶圆 (Micro light-emitting diode crystal grain and micro light-emitting diode wafer ) 是由 陈奕静 李玉柱 于 2019-10-22 设计创作，主要内容包括：本发明提供一种微型发光二极管晶粒及微型发光二极管晶圆。微型发光二极管晶粒,包括发光层、第一型半导体层以及第二型半导体层。发光层包括金属元素以及多个非磊晶介质。非磊晶介质彼此分离以分散金属元素。任两相邻的非磊晶介质之间的水平距离小于100纳米。第一型半导体层配置于发光层的一侧上。第二型半导体层配置于发光层的另一侧上。本发明的微型发光二极管晶粒,其可通过非磊晶介质的配置来控制金属元素的聚集程度。本发明的微型发光二极管晶圆,其同时具有不同色光的发光层,于切割后可具有较佳的产能。(The invention provides a micro light-emitting diode crystal grain and a micro light-emitting diode wafer. The micro light emitting diode grain comprises a light emitting layer, a first type semiconductor layer and a second type semiconductor layer. The light-emitting layer includes a metal element and a plurality of non-epitaxial media. The non-epitaxial media are separated from each other to disperse the metal element. The horizontal distance between any two adjacent non-epitaxial media is less than 100 nanometers. The first type semiconductor layer is disposed on one side of the light emitting layer. The second type semiconductor layer is configured on the other side of the luminous layer. The micro light-emitting diode grain can control the aggregation degree of the metal elements through the configuration of the non-epitaxial medium. The micro light-emitting diode wafer has the light-emitting layers with different colors, and has better productivity after being cut.)

1. A micro light emitting diode die comprising:

a light emitting layer including a metal element and a plurality of non-epitaxial media, wherein the non-epitaxial media are separated from each other to disperse the metal element, and a horizontal distance between any two adjacent non-epitaxial media is less than 100 nm;

a first type semiconductor layer disposed on one side of the light emitting layer; and

and the second type semiconductor layer is configured on the other side of the luminous layer.

2. The micro light emitting diode die of claim 1, wherein the non-epitaxial dielectrics comprise silicon dioxide, silicon nitride or metal oxide, and the non-epitaxial dielectrics are insulating patterns.

3. The micro light emitting diode die of claim 2, wherein the plurality of insulating patterns have a shape comprising a rectangle, a semicircle, a semi-ellipse, a trapezoid, or a combination thereof, in a cross-sectional view.

4. The micro light-emitting diode die of claim 1, wherein the plurality of non-epitaxial media is air.

5. The micro light emitting diode die of claim 4, wherein the first type semiconductor layer is a P-type semiconductor layer, the second type semiconductor layer is an N-type semiconductor layer, and the second type semiconductor layer has a plurality of grooves corresponding to the plurality of non-epitaxial media, respectively.

6. The micro light emitting diode die of claim 5, wherein each of the grooves has a roughened surface.

7. The micro light emitting diode die of claim 1, wherein the metal element is indium.

8. The micro light-emitting diode die of claim 1, wherein the light-emitting layer has a chemical formula In_xGa_1-xN, and x is between 0.23 and 0.31, or alternatively, x is between 0.38 and 0.44.

9. A micro light emitting diode wafer comprises:

a light emitting layer including a metal element and a plurality of non-epitaxial media, wherein the plurality of non-epitaxial media are separated from each other to disperse the metal element, wherein in a first unit area and a second unit area which are adjacent to each other, the plurality of non-epitaxial media in the first unit area are arranged at an equal interval, two adjacent non-epitaxial media have a first pitch in the first unit area, the plurality of non-epitaxial media in the second unit area are arranged at an equal interval, two adjacent non-epitaxial media have a second pitch in the second unit area, the second pitch is larger than the first pitch, and a horizontal distance between any two adjacent non-epitaxial media is smaller than 100 nm;

a first type semiconductor layer disposed on one side of the light emitting layer; and

and the second type semiconductor layer is configured on the other side of the luminous layer.

10. The micro light emitting diode wafer of claim 9, wherein the light emitting layer generates blue light in the first unit area and the light emitting layer generates green light in the second unit area.

11. The micro light-emitting diode wafer of claim 9, wherein the non-epitaxial dielectrics comprise silicon dioxide, silicon nitride or metal oxide, and the non-epitaxial dielectrics are insulating patterns.

12. The micro led wafer of claim 11, wherein the shape of the plurality of insulation patterns comprises a rectangle, a semicircle, a semi-ellipse, a trapezoid, or a combination thereof.

13. The micro light-emitting diode wafer of claim 9, wherein the plurality of non-epitaxial media is air.

14. The micro light emitting diode wafer of claim 13, wherein the first type semiconductor layer is a P-type semiconductor layer, the second type semiconductor layer is an N-type semiconductor layer, and the second type semiconductor layer has a plurality of grooves corresponding to the plurality of non-epitaxial media, respectively.

15. The micro light-emitting diode wafer of claim 14, wherein each of the grooves has a rough surface.

16. The micro light-emitting diode wafer of claim 9, wherein the metal element is indium.

17. The micro light-emitting diode wafer of claim 9, wherein the chemical formula of the light-emitting layer is In_xGa_1-xN, and x is between 0.23 and 0.31 and x is between 0.38 and 0.44.

Technical Field

The present invention relates to light emitting diode structures, and particularly to a micro light emitting diode die and a micro light emitting diode wafer.

Background

In the prior art, the light emitting layer is mostly designed with multiple quantum wells. The material of the quantum well layer in the light emitting layer is typically indium gallium nitride (InGaN), and the material of the barrier layer in the light emitting layer is typically gallium nitride (GaN). When the indium doping concentration of the quantum well layer is higher, the wavelength of light emitted from the light emitting layer is longer. Conversely, the lower the indium doping concentration of the quantum well layer, the shorter the wavelength of light emitted by the light-emitting layer. Therefore, when the light emitting diode is manufactured, the indium doping concentration in the quantum well layer can be regulated and controlled, so that the light emitting layer can emit light rays such as blue light or green light. Therefore, how to control the indium doping concentration in the quantum well layer has become one of the important issues of research.

Disclosure of Invention

The invention provides a micro light-emitting diode grain, which can control the aggregation degree of metal elements through the configuration of a non-epitaxial medium.

The invention provides a micro light-emitting diode wafer which is provided with light-emitting layers with different colors, and has better productivity after being cut.

The micro light-emitting diode grain comprises a light-emitting layer, a first type semiconductor layer and a second type semiconductor layer. The light-emitting layer includes a metal element and a plurality of non-epitaxial media. The non-epitaxial media are separated from each other to disperse the metal element. The horizontal distance between any two adjacent non-epitaxial media is less than 100 nanometers. The first type semiconductor layer is disposed on one side of the light emitting layer. The second type semiconductor layer is configured on the other side of the luminous layer.

In an embodiment of the invention, a material of the non-epitaxial dielectric includes silicon dioxide, silicon nitride or metal oxide, and the non-epitaxial dielectric is a plurality of insulation patterns.

In an embodiment of the invention, the shape of the insulation pattern includes a rectangle, a semicircle, a semi-ellipse, a trapezoid or a combination thereof.

In an embodiment of the invention, the non-epitaxial medium is air.

In an embodiment of the invention, the first type semiconductor layer is a P-type semiconductor layer, and the second type semiconductor layer is an N-type semiconductor layer. The second type semiconductor layer has a plurality of grooves corresponding to the non-epitaxial media respectively.

In an embodiment of the invention, each of the grooves has a rough surface.

In an embodiment of the invention, the metal element is indium.

In an embodiment of the invention, the chemical formula of the light emitting layer is In_xGa_1-xN, and x is between 0.23 and 0.31, or alternatively, x is between 0.38 and 0.44.

The invention relates to a micro light-emitting diode wafer, which comprises a light-emitting layer, a first type semiconductor layer and a second type semiconductor layer. The light-emitting layer includes a metal element and a plurality of non-epitaxial media. The non-epitaxial media are separated from each other to disperse the metal element. In the adjacent first unit area and the second unit area, the non-epitaxial mediums in the first unit area are arranged at equal intervals, and the adjacent two non-epitaxial mediums have a first interval in the first unit area. The non-epitaxial media in the second unit area are arranged at equal intervals, and two adjacent non-epitaxial media have a second interval in the second unit area, and the second interval is larger than the first interval. The horizontal distance between any two adjacent non-epitaxial media is less than 100 nanometers. The first type semiconductor layer is disposed on one side of the light emitting layer. The second type semiconductor layer is configured on the other side of the luminous layer.

In an embodiment of the invention, the light emitting layer generates blue light in a first unit area, and the light emitting layer generates green light in a second unit area.

In an embodiment of the invention, a material of the non-epitaxial dielectric includes silicon dioxide, silicon nitride or metal oxide, and the non-epitaxial dielectric is a plurality of insulation patterns.

In an embodiment of the invention, the shape of the insulation pattern includes a rectangle, a semicircle, a semi-ellipse, a trapezoid or a combination thereof.

In an embodiment of the invention, the non-epitaxial medium is air.

In an embodiment of the invention, the first type semiconductor layer is a P-type semiconductor layer, and the second type semiconductor layer is an N-type semiconductor layer. The second type semiconductor layer has a plurality of grooves corresponding to the non-epitaxial media respectively.

In an embodiment of the invention, each of the grooves has a rough surface.

In an embodiment of the invention, the metal element is indium.

In an embodiment of the invention, the chemical formula of the light emitting layer is In_xGa_1-xN, and x is between 0.23 and 0.31 and x is between 0.38 and 0.44.

In view of the above, in the design of the micro light emitting diode die of the present invention, the light emitting layer includes the metal element and the non-epitaxial medium, wherein the non-epitaxial medium is separated from each other to disperse the metal element, and a horizontal distance between any two adjacent non-epitaxial media is less than 100 nm. The concentration degree of the metal elements is controlled by the non-epitaxial medium, so as to modulate the color light emitted by the light-emitting layer. In addition, in the micro light-emitting diode wafer, the non-epitaxial mediums have different pitches in different areas, so that the light-emitting layer can have different color lights at the same time. Therefore, after the micro light-emitting diode wafer is cut, micro light-emitting diode crystal grains with different colors can be obtained at the same time, and better productivity can be achieved.

In order to make the aforementioned and other features and advantages of the invention more comprehensible, embodiments accompanied with figures are described in detail below.

Drawings

Fig. 1A is a schematic top view of a portion of a micro light emitting diode die according to an embodiment of the invention;

FIG. 1B is a schematic cross-sectional view of the micro light emitting diode die of FIG. 1A;

fig. 2A is a schematic cross-sectional view of a micro light emitting diode die according to an embodiment of the invention;

fig. 2B is a schematic cross-sectional view of a micro light emitting diode die according to another embodiment of the invention;

fig. 2C is a schematic cross-sectional view of a micro light emitting diode die according to yet another embodiment of the invention;

fig. 3A is a schematic top view of a micro light emitting diode wafer according to an embodiment of the invention;

fig. 3B is a cross-sectional view of the micro led wafer of fig. 3A.

Description of the reference numerals

10: wafer

100a, 100b, 100c, 100d, 100e1, 100e 2: micro light-emitting diode crystal grain

110a, 110b, 110c, 110d, 110 e: luminescent layer

111: one side of

112: quantum well layer

113: the other side

114a, 114b, 114c, 114d, 114 e: non-epitaxial medium

115a, 115b, 115c, 115 e: insulating pattern

120: first type semiconductor layer

130. 130 d: second type semiconductor layer

132: groove

133: rough surface

140: first type electrode

150: second type electrode

160: insulating protective layer

A1: first unit area

A2: second unit area

H: horizontal distance

P1: first interval

P2: second pitch

Detailed Description

Fig. 1A is a schematic top view of a micro light emitting diode die according to an embodiment of the invention. Fig. 1B is a schematic cross-sectional view of the micro led die of fig. 1A. Referring to fig. 1A and fig. 1B, the micro light emitting diode die 100a includes a light emitting layer 110a, a first type semiconductor layer 120, and a second type semiconductor layer 130. The first-type semiconductor layer 120 is disposed on one side 111 of the light emitting layer 110a, and the second-type semiconductor layer 130 is disposed on the other side 113 of the light emitting layer 110 a. That is, the first type semiconductor layer 120 and the second type semiconductor layer 130 are respectively disposed on two opposite sides of the light emitting layer 110 a. Here, the first type semiconductor layer 120 is, for example, a P-type semiconductor layer, and the second type semiconductor layer 130 is, for example, an N-type semiconductor layer.

In detail, the light emitting layer 110a of the present embodiment includes a quantum well layer 112 and a plurality of non-epitaxial media 114a, wherein the quantum well layer has a metal element. The non-epitaxial media 114a are separated from each other to disperse the metal elements and control the aggregation degree of the metal elements. Preferably, the horizontal distance H between any two adjacent non-epitaxial media 114a is less than 100 nm. Here, the chemical formula of the light emitting layer 110a is In_xGa_1-xN, wherein x represents the molar discipline of the element and x is between 0.23 and 0.31, or alternatively, x is between 0.38 and 0.44 and the metal element is indium. When x is between 0.23 and 0.31, the light emitting layer 110a can emit blue light; when x is between 0.38 and 0.44, the light emitting layer 110a can emit green light.

In particular, the material of the non-epitaxial dielectric 114a of the present embodiment is, for example, silicon dioxide, silicon nitride or metal oxide, and the non-epitaxial dielectric 114a is a plurality of insulating patterns 115 a. As shown in fig. 1A, the insulating patterns 115a are in the form of stripes and are arranged in a lattice shape in a top view, but not limited thereto. On the other hand, as shown in fig. 1B, the insulating patterns 115a are arranged at equal intervals (i.e., horizontal distance H) in a cross-sectional view, and the shape of the insulating patterns 115a is, for example, a rectangle. The insulating patterns 115a are disposed to disperse the metal element to control the concentration degree of the metal element, which affects the wavelength of light emitted from the light emitting layer 110 a.

For example, when the distance between any two adjacent insulating patterns 115a is larger, the metal elements in the light-emitting layer 110a are more concentrated (i.e., occupy a larger range), and the light-emitting layer 110a can emit green light. On the contrary, when the distance between any two adjacent insulating patterns 115a is smaller, the metal element in the light emitting layer 110a is less concentrated (i.e., occupies a smaller range), and the light emitting layer 110a can emit blue light. That is, the insulating pattern 115a is disposed to control the wavelength uniformity on the wafer, and even to adjust the concentration of the metal elements in the light-emitting layer 340, thereby extending the micro led die 100a with at least one color light.

In detail, in the present embodiment, after the second type semiconductor layer 130 is first epitaxially grown, the insulation pattern 115a is formed on the second type semiconductor layer 130. Then, the light emitting layer 110a and the first type semiconductor layer 120 are epitaxial to form a relatively flat surface of the first type semiconductor layer 120. Then, an insulating layer (passivation layer)160 and an electrode layer (electrode) (including the first-type electrode 140 and the second-type electrode 150) are formed.

In short, in the design of the micro light emitting diode die 100a of the present embodiment, the light emitting layer 110a includes the metal element and the non-epitaxial dielectrics 114a, wherein the non-epitaxial dielectrics 114a are separated from each other to disperse the metal element, and the horizontal distance H between any two adjacent non-epitaxial dielectrics 114a is less than 100 nm. The concentration of the metal element is controlled by the non-epitaxial medium 114a, so as to modulate the color light emitted by the light-emitting layer 110 a.

It should be noted that the following embodiments follow the reference numerals and parts of the contents of the foregoing embodiments, wherein the same reference numerals are used to indicate the same or similar elements, and the description of the same technical contents is omitted. For the description of the omitted parts, reference may be made to the foregoing embodiments, and the following embodiments will not be repeated.

Fig. 2A is a schematic cross-sectional view of a micro light emitting diode die according to an embodiment of the invention. Referring to fig. 1B and fig. 2A, the micro led die 100B of the present embodiment is similar to the micro led die 100a of fig. 1B, and the difference between the two is: the non-epitaxial medium 114b of the light-emitting layer 110b of the present embodiment includes a plurality of insulating patterns 115b, and the insulating patterns 115b are shaped as a regular trapezoid in cross-section.

Fig. 2B is a schematic cross-sectional view of a micro light emitting diode die according to another embodiment of the invention. Referring to fig. 1B and fig. 2B, the micro led die 100c of the present embodiment is similar to the micro led die 100a of fig. 1B, and the difference between the two is: the non-epitaxial medium 114c of the light emitting layer 110c of the present embodiment includes a plurality of insulating patterns 115c, and the shape of the insulating patterns 115c is embodied as a semi-elliptical shape in a cross-sectional view.

It should be noted that, in other embodiments not shown, the shape of the insulation pattern may also be a semi-circle, or a combination of any two shapes of a rectangle, a semi-circle, a semi-ellipse or a trapezoid in cross section, and still fall within the protection scope of the present invention.

Fig. 2C is a schematic cross-sectional view of a micro light emitting diode die according to another embodiment of the invention. Referring to fig. 1B and fig. 2C, the micro led die 100d of the present embodiment is similar to the micro led die 100a of fig. 1B, and the difference between the two is: the non-epitaxial medium 114d of the light-emitting layer 110d in this embodiment is embodied as air. In detail, the second-type semiconductor layer 130d of the present embodiment has a plurality of grooves 132, and the grooves 132 are respectively corresponding to the non-epitaxial medium 114 d. Here, each groove 132 has a rough surface 133, and the grooves 132 are formed by, for example, laser ablation, so that the subsequent light emitting layer cannot be successfully formed at this position due to the lattice damage caused by the surface of the epitaxial layer, but not limited thereto.

Since the second type conductor layer 130d of the present embodiment has the design of the groove 132, in the epitaxy process, the light emitting layer 110d is not easy to be epitaxially formed at the groove 132, so that an air gap (i.e., the non-epitaxy medium 114d) is formed at the position of the light emitting layer 110d corresponding to the groove. In other words, the concentration of the metal elements can be controlled by the arrangement of the grooves 132, so as to modulate the color light emitted by the light emitting layer 110 d.

Fig. 3A is a schematic top view of a micro light emitting diode wafer according to an embodiment of the invention. Fig. 3B is a cross-sectional view of the micro led wafer of fig. 3A. Referring to fig. 3A and fig. 3B, the non-epitaxial medium 114e of the light-emitting layer 110e of the micro light-emitting diode wafer 10 of the present embodiment includes a plurality of insulating patterns 115e with unequal pitches, and the shape of the insulating patterns 115e is embodied as a rectangle in a cross-sectional view. Further, in the adjacent first unit area a1 and second unit area a2, the non-epitaxial dielectrics 114e in the first unit area a1 are arranged at an equal pitch, and the adjacent two non-epitaxial dielectrics 114e have a first pitch P1 in the first unit area a 1. The non-epitaxial dielectrics 114e in the second unit area a2 are arranged at an equal distance, and two adjacent non-epitaxial dielectrics 114e have a second distance P2 in the second unit area a 2. In particular, the second pitch P2 is greater than the first pitch P1.

Here, the chemical formula of the light emitting layer 110e is In_xGa_1-xN, wherein x represents the molar discipline of the element, and x is between 0.23 and 0.31 and x is between 0.38 and 0.44, and the metal element is indium. In the first unit area a1, x is between 0.23 and 0.31, so the light emitting layer 110e can generate blue light in the first unit area a 1. In the second unit area a2, x is between 0.38 and 0.44, so the light emitting layer 110e can generate green light in the second unit area a 2. Of course, In other embodiments not shown, the chemical formula of the light emitting layer is In_xGa_1-xN, where x represents the molar discipline of the elements and x may be between 0.23 and 0.31, or alternatively, x may be between 0.38 and 0.44, while remaining within the intended scope of the present invention.

In this embodiment, the entire light emitting layer 110e is first fabricated. Next, the quantum well layers 112 with different pitches are defined by patterning. Then, the indium element has different concentrations and aggregation levels in the first unit area a1 and the second unit area a2 by an annealing process, so as to form the light-emitting layer 110e with different light-emitting wavelengths.

In short, the micro led wafer 10 of the present embodiment can simultaneously form the blue and green light emitting layers 110e, so that the blue led die 100e1 and the green led die 100e2 can be cut after the subsequent cutting process, thereby providing better productivity.

In summary, in the design of the micro light emitting diode die of the present invention, the light emitting layer includes the metal element and the non-epitaxial medium, wherein the non-epitaxial medium is separated from each other to disperse the metal element, and a horizontal distance between any two adjacent non-epitaxial media is less than 100 nm. The concentration degree of the metal elements is controlled by the arrangement of a non-epitaxial medium (such as an insulating block of silicon dioxide or air), so as to modulate the color light emitted by the light-emitting layer. In addition, in the micro light-emitting diode wafer, the non-epitaxial mediums have different pitches in different areas, so that the light-emitting layer can have different color lights at the same time. Therefore, after the micro light-emitting diode wafer is cut, micro light-emitting diode crystal grains with different colors can be obtained at the same time, and better productivity can be achieved.

Although the present invention has been described with reference to the above embodiments, it should be understood that various changes and modifications can be made therein by those skilled in the art without departing from the spirit and scope of the invention.