阅读说明：本技术 半导体照明用热匹配性能高的热沉材料 (Heat sink material with high thermal matching performance for semiconductor illumination ) 是由 刘林峰 于 2019-10-11 设计创作，主要内容包括：本发明公开了半导体照明用热匹配性能高的热沉材料,属于半导体照明技术领域,包括灰土30-40份,阻燃剂8-13份,氧化钠5-10份,渣土2-5份,硬脂酸5-20份,硅镁石粉1-5份,胶粘剂7-9份,去离子水35-40份,白油8-10份；该发明提供的半导体照明用热匹配性能高的热沉材料对于半导体的热匹配性能高,可精确控制半导体照明,增加控制效率,同时该材料方便进行回收,减少后续的环境污染。(The invention discloses a heat sink material with high thermal matching performance for semiconductor illumination, which belongs to the technical field of semiconductor illumination and comprises 30-40 parts of lime soil, 8-13 parts of flame retardant, 5-10 parts of sodium oxide, 2-5 parts of residue soil, 5-20 parts of stearic acid, 1-5 parts of magnesium silicate powder, 7-9 parts of adhesive, 35-40 parts of deionized water and 8-10 parts of white oil; the heat sink material with high heat matching performance for semiconductor illumination provided by the invention has high heat matching performance for semiconductors, can accurately control semiconductor illumination, increases control efficiency, and meanwhile, is convenient to recycle, and reduces subsequent environmental pollution.)

1. The heat sink material with high heat matching performance for semiconductor illumination is characterized by comprising 30-40 parts of lime soil, 8-13 parts of flame retardant, 5-10 parts of sodium oxide, 2-5 parts of residue soil, 5-20 parts of stearic acid, 1-5 parts of magnesium silicate powder, 7-9 parts of adhesive, 35-40 parts of deionized water and 8-10 parts of white oil.

2. The heat sink material with high thermal matching performance for semiconductor lighting according to claim 1, wherein the ash soil is 36 parts, the flame retardant is 11 parts, the sodium oxide is 6 parts, the residue soil is 3 parts, the stearic acid is 17 parts, the silica-magnesia powder is 3 parts, the adhesive is 8 parts, the deionized water is 37 parts, and the white oil is 9 parts.

3. A heat sink material with high thermal matching performance for semiconductor lighting as recited in claim 1, wherein said adhesive comprises propylene glycol butyl ether or propylene glycol methyl ether.

4. A heat sink material with high thermal matching performance for semiconductor lighting as recited in claim 1, wherein said flame retardant comprises an inorganic flame retardant and an organic flame retardant.

5. The heat sink material with high thermal matching performance for semiconductor illumination according to claim 1, wherein the preparation method comprises the following steps:

A. adding and stirring the lime soil, the sodium oxide, the stearic acid, the attapulgite powder and the deionized water uniformly according to the mass parts to obtain a product 1;

B. adding the product 1 and a flame retardant in parts by mass, uniformly mixing, and performing dispersion treatment to obtain a product 2;

C. adding the product 2, an adhesive and white oil according to parts by weight, and uniformly stirring;

D. and D, drying and grinding the product obtained in the step C to obtain a finished product.

Technical Field

The invention belongs to the technical field of semiconductor illumination, and particularly relates to a heat sink material with high heat matching performance for semiconductor illumination.

Background

Light emitting diodes are referred to as LEDs for short. Is made of a compound containing gallium (Ga), arsenic (As), phosphorus (P), nitrogen (N), etc. When electrons and holes are recombined, visible light is radiated, so that the light-emitting diode can be manufactured. In circuits and instruments as indicator lights or to form text or numerical displays. Gallium arsenide diodes emit red light, gallium phosphide diodes emit green light, corundum powder diodes emit yellow light, and gallium nitride diodes emit blue light. Organic light emitting diodes OLED and inorganic light emitting diodes LED are classified by their chemical properties.

The LED product is mainly applied to three fields of backlight sources, color screens and indoor illumination. Since backlights are the largest market for LEDs in the present day, the LED industry has been driven to grow at a high rate in recent years. Under the influence of factors such as product price reduction and the rise of a new round of global prohibited incandescent lamp, indoor illumination will replace a backlight source to become the fastest growing subdivision field of LEDs in the future. In addition, in recent years, under the drive of product upgrading factors such as a small-spacing display screen, the speed of an LED product is increased continuously, and the trend of steady increase is presented. Taken together, the overall demand for LEDs will continue to grow in the future.

The application of the heat sink material in semiconductor illumination means that in the prior LED illumination package, because the LED can generate high heat when emitting light, the copper column with high heat conductivity can be used to lead the heat to the outside of the package body. The LED copper column is called a heat sink. The LD also generates more heat and also needs to be mounted on a heat sink to help dissipate the heat to stabilize the operating temperature. The heat sink material with high heat matching performance for semiconductor illumination is provided, so that the defect of insufficient heat matching performance of the existing heat sink material is overcome.

Disclosure of Invention

The present invention is directed to a heat sink material with high thermal matching performance for semiconductor illumination, so as to solve the problems mentioned in the background art.

In order to achieve the purpose, the invention provides the following technical scheme: the heat sink material with high heat matching performance for semiconductor illumination comprises 30-40 parts of lime soil, 8-13 parts of flame retardant, 5-10 parts of sodium oxide, 2-5 parts of residue soil, 5-20 parts of stearic acid, 1-5 parts of silica powder, 7-9 parts of adhesive, 35-40 parts of deionized water and 8-10 parts of white oil.

As a further preferable embodiment of the present invention: 36 parts of lime soil, 11 parts of flame retardant, 6 parts of sodium oxide, 3 parts of slag soil, 17 parts of stearic acid, 3 parts of attapulgite powder, 8 parts of adhesive, 37 parts of deionized water and 9 parts of white oil.

As a further preferable embodiment of the present invention: the adhesive comprises propylene glycol butyl ether and propylene glycol methyl ether.

As a further preferable embodiment of the present invention: the flame retardant includes an inorganic flame retardant and an organic flame retardant.

As a further preferable embodiment of the present invention: the preparation method comprises the following steps:

A. adding and stirring the lime soil, the sodium oxide, the stearic acid, the attapulgite powder and the deionized water uniformly according to the mass parts to obtain a product 1;

B. adding the product 1 and a flame retardant in parts by mass, uniformly mixing, and performing dispersion treatment to obtain a product 2;

C. adding the product 2, an adhesive and white oil according to parts by weight, and uniformly stirring;

D. and D, drying and grinding the product obtained in the step C to obtain a finished product.

Compared with the prior art, the invention has the beneficial effects that: the heat sink material with high heat matching performance for semiconductor illumination provided by the invention has high heat matching performance for semiconductors, can accurately control semiconductor illumination, increases control efficiency, and meanwhile, is convenient to recycle, and reduces subsequent environmental pollution.

Detailed Description

The present invention will be further described with reference to the following examples.

The following examples are intended to illustrate the invention but are not intended to limit the scope of the invention. The conditions in the embodiments can be further adjusted according to specific conditions, and simple modifications of the method of the present invention based on the concept of the present invention are within the scope of the claimed invention.

The invention provides a heat sink material with high heat matching performance for semiconductor illumination, which comprises 36 parts of lime soil, 11 parts of flame retardant, 6 parts of sodium oxide, 3 parts of residue soil, 17 parts of stearic acid, 3 parts of attapulgite powder, 8 parts of adhesive, 37 parts of deionized water and 9 parts of white oil.

Specifically, the preparation method comprises the following steps:

A. adding and stirring the lime soil, the sodium oxide, the stearic acid, the attapulgite powder and the deionized water uniformly according to the mass parts to obtain a product 1;

B. adding the product 1 and a flame retardant in parts by mass, uniformly mixing, and performing dispersion treatment to obtain a product 2;

C. adding the product 2, an adhesive and white oil according to parts by weight, and uniformly stirring;

D. and D, drying and grinding the product obtained in the step C to obtain a finished product.

The heat sink material with high heat matching performance for semiconductor illumination provided by the invention has high heat matching performance for semiconductors, can accurately control semiconductor illumination, increases control efficiency, and meanwhile, is convenient to recycle, and reduces subsequent environmental pollution.

Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.