阅读说明：本技术 一种无氰镀金铜合金电镀液及其应用 (Cyanide-free gold-copper alloy electroplating solution and application thereof ) 是由 张修超 郝福来 张世镖 王秀美 李健 赵国惠 于 2019-11-20 设计创作，主要内容包括：本发明涉及一种无氰镀金铜合金电镀液及其应用,涉及轻工、化工材料的技术领域。由如下质量浓度的原料组成的：氯化胆碱500-600g/L,尿素400-500g/L,金的无机盐4-10g/L,铜的无机盐80-120g/L,络合剂5-20g/L,配位剂2-60g/L,镀金铜合金添加剂体系3-40g/L。本发明的优点在于镀液具有较高稳定性、深镀能力良好,电流效率高,镀层光亮、细致,结合牢固,镀层硬度好。能够满足贵金属材料的性能要求,具有一定工业应用前景和较好的经济效益和社会效益。(The invention relates to a cyanide-free gold-plated copper alloy electroplating solution and application thereof, relating to the technical field of light industry and chemical materials. The material consists of the following raw materials in mass concentration: 500-600g/L choline chloride, 400-500g/L urea, 4-10g/L gold inorganic salt, 80-120g/L copper inorganic salt, 5-20g/L complexing agent, 2-60g/L complexing agent and 3-40g/L gold-plated copper alloy additive system. The invention has the advantages of high stability of plating solution, good deep plating capability, high current efficiency, bright and delicate plating layer, firm combination and good hardness of the plating layer. Can meet the performance requirements of noble metal materials, and has certain industrial application prospect and better economic and social benefits.)

1. The cyanide-free gold-copper alloy electroplating solution is characterized by comprising the following raw materials in mass concentration:

500-600g/L choline chloride, 400-500g/L urea, 4-10g/L gold inorganic salt, 80-120g/L copper inorganic salt, 5-20g/L complexing agent, 2-60g/L complexing agent and 3-40g/L gold-plated copper alloy additive system.

2. The cyanide-free gold-plated copper alloy electroplating solution according to claim 1, characterized in that: the inorganic salt of gold is chloroauric acid or chloroauric acid salt.

3. The cyanide-free gold-plated copper alloy electroplating solution according to claim 1, characterized in that: the inorganic salt of copper is copper sulfate.

4. The cyanide-free gold-plated copper alloy electroplating solution according to claim 1, wherein: the complexing agent is one or more of disodium ethylene diamine tetraacetate, sodium succinate and ammonium chloride.

5. The cyanide-free gold-plated copper alloy electroplating solution according to claim 1, wherein: the coordination agent is one or more of xanthine, hypoxanthine, adenine and guanine.

6. The cyanide-free gold-plated copper alloy electroplating solution according to claim 1, wherein: the gold-plated copper alloy additive system is one or more of ascorbic acid, sodium ascorbate, potassium carbonate, potassium citrate, sorbic acid, diethyl triaminepentaacetic acid and ethylene diamine tetramethylene phosphonic acid.

7. Use of the cyanide-free gold-copper alloy plating bath according to any one of claims 1 to 6 for producing a gold-copper alloy plating.

8. The use of a cyanide-free gold-plated copper alloy plating solution according to claim 7, wherein, in the operation of the cyanide-free gold-plated copper alloy plating solution: current density 0.1A/dm²-2.0A/dm²The temperature is 70-90 ℃, and the electroplating time is 40-60 min.

Technical Field

The invention relates to the technical field of light industry and chemical materials, in particular to cyanide-free gold-copper alloy electroplating solution and application thereof.

Background

The copper alloy base material has high melting point and boiling point, and has excellent physical properties such as electrical conductivity, thermal conductivity and ductility, and stable chemical properties such as good weldability and corrosion resistance. The corresponding copper alloy plating material has higher microhardness and lower electrical noise. The copper alloy coating material is prepared, so that the consumption of noble metals can be saved in production, and the cost is reduced. In view of this, copper alloys are often used to plate on some workpieces, such as electronic product circuit boards, electronic components, integrated circuits, etc., to provide special functions, and are used in the fields of electronics, instruments, national defense, aerospace, etc.

At present, electroplating is mainly divided into cyanide electroplating and non-cyanide electroplating. The traditional and currently applied electroplating technology is cyanide electroplating, mainly because the cyanide plating solution has good chemical stability, the gold salt is simple to prepare, the cost is low, and the utilization rate and the recovery rate are higher compared with the cyanide-free plating solution; the plating layer has fine crystallization, good brightness and excellent performance. However, cyanide plating solutions contain highly toxic cyanide, which causes environmental pollution and operator injury, and also dissolves the resist of electronic parts, thereby limiting the application of cyanide plating. The development of cyanide-free electroplating began in the 70 s of the 20 th century, and cyanide-free electroplating systems mainly studied at present include a citrate electroplating system, a sulfite electroplating system, a thiosulfate electroplating system and the like. The typical one is a citrate electroplating system, and gold potassium citrate is used as a main salt in the electroplating solution. During the electroplating process, a certain amount of malononitrile, which is an organic nitrile compound, is liberated, and belongs to a highly toxic chemical. Therefore, the citrate electroplating system does not really realize cyanidation-free electroplating. However, sulfite, thiosulfate and other electroplating systems have the problems of poor stability of the plating solution, high cost of the plating solution, poor applicability, unstable performance of the plating layer and the like, and further technical breakthrough cannot be realized.

The ionic liquid is a eutectic mixture composed of organic cations and anions, is a general name of a liquid salt system, is in a liquid state at room temperature, is also called room-temperature molten salt, and is a novel green solvent. In the ionic liquid, the volumes of anions and cations are in an asymmetric structure, the two structures have large difference, the electrostatic attraction between the anions and cations is small, and the anions and the cations can move freely, so that the ionic liquid has excellent physicochemical properties, such as lower vapor pressure, higher conductivity, wider electrochemical window and stronger solubility, and in addition, substances forming the ionic liquid are non-toxic and have good chemical stability. The characteristics enable the ionic liquid to have wide application prospects in various fields of material synthesis, catalysis, electrochemistry and the like. The ionic liquid is used as electroplating solution to carry out electroplating between metals, which is a novel electroplating process developed in recent years, and the cyanide-free electroplating solution is prepared by utilizing the excellent physical and chemical properties of the novel electroplating process.

Disclosure of Invention

The invention provides a cyanide-free gold-plated copper alloy electroplating solution and application thereof, aiming at solving the problems of high toxicity of cyanide-containing electroplating solutions, unstable sulfite, thiosulfate and other electroplating solution systems, high cost, poor addition property and the like in the existing electroplating solutions.

The technical scheme adopted by the invention is as follows: the material is composed of the following raw materials by mass concentration:

500-600g/L choline chloride, 400-500g/L urea, 4-10g/L gold inorganic salt, 80-120g/L copper inorganic salt, 5-20g/L complexing agent, 2-60g/L complexing agent and 3-40g/L gold-plated copper alloy additive system.

The inorganic salt of gold is chloroauric acid or chloroauric acid salt.

The inorganic salt of copper is copper sulfate.

The complexing agent is one or more of disodium ethylene diamine tetraacetate, sodium succinate and ammonium chloride.

The coordination agent is one or more of xanthine, hypoxanthine, adenine and guanine.

The gold-plated copper alloy additive system is one or more of ascorbic acid, sodium ascorbate, potassium carbonate, potassium citrate, sorbic acid, diethyl triaminepentaacetic acid and ethylenediamine tetramethylene phosphonic acid.

The invention relates to application of cyanide-free gold-copper alloy plating solution in preparing a gold-copper alloy plating layer.

The invention is characterized in that in the operation of the cyanide-free gold-copper alloy electroplating solution: current density 0.1A/dm²-2.0A/dm²At a temperature of 70 deg.CThe electroplating time is 40-60min at the temperature of minus 90 ℃.

Through specific experimental research and expanded retest, the cyanide-free gold-plated copper alloy electroplating solution prepared by the method disclosed by the invention is simple in components, high in stability, convenient to maintain, easy to store and manage, wide in application range, simple in operation environment in the electroplating process, easy to manage and free of safety and environmental protection problems. Can be used for large-scale industrial production, and the prepared gold-copper alloy coating has good performance in all aspects, can meet the performance requirements of noble metal materials,

the plating solution prepared by the invention has the advantages of higher stability, no toxicity, good dispersing capacity, deep plating capacity and uniform plating capacity, high current efficiency, high deposition speed, few gaps, bright plating layer, fine crystallization, firm combination, good plating layer hardness, strong corrosion resistance, certain industrial application prospect and better economic benefit and social benefit.

The method has the advantages that the raw materials are easy to obtain and cheap, the adopted process flow is simple and practical, a complete cyanide-free electroplating solution system can be established, the production cost is low, the equipment investment is low, and the management is easy; solves the problems of high toxicity of cyanogen-containing plating solution, unstable plating solution systems such as sulfite, thiosulfate and the like, high cost, poor addition property and the like in the existing plating solution. The prepared plating solution has the advantages of high stability, no toxicity, good dispersing capacity, deep plating capacity and uniform plating capacity, high current efficiency, high deposition speed, few gaps, bright plating layer, fine crystallization, firm combination, good plating layer hardness and strong corrosion resistance.

Drawings

FIG. 1 is a SEM test result chart of a gold-copper alloy plating layer prepared by the invention;

FIG. 2 is a SEM-EDS test result chart of the gold-copper alloy plating layer prepared by the invention.

Detailed Description