阅读说明：本技术 一种加厚镀层铝铜底板镀镍工艺 (Nickel plating process for thickened coating aluminum-copper base plate ) 是由 郑学军 窦勇 李文军 纪晓黎 肖文鹏 陈祥波 于 2021-09-02 设计创作，主要内容包括：本发明公开了一种加厚镀层铝铜底板镀镍工艺,包括以下步骤：步骤一：准备合适大小的弥散铝铜基板,尺寸为10mm×10mm；步骤二：弥散铝铜基板在电镀镍前进行化学除油,以去除弥散铝铜基板表面的油脂；步骤三：将弥散铝铜基板进行特殊的活化和敏化处理；将底座固定安装在氢氮气氛或真空气氛下,随后将处理完成后的弥散铝铜基板固定在底座内部,在第一次电镀前通过限位槽的内侧壁对弥散铝铜基板的两侧进行固定,使弥散铝铜基板上下表面均不接触限位槽和微型电动推杆的表面,本发明通过在电镀前对弥散铝铜基板采用特殊的活化和敏化处理,能够减少氧化铝颗粒对镀镍的影响,增强镀层结合力。(The invention discloses a nickel plating process for a thickened clad aluminum-copper base plate, which comprises the following steps: the method comprises the following steps: preparing a dispersion aluminum copper substrate with a proper size, wherein the size is 10mm multiplied by 10 mm; step two: chemically removing oil from the dispersed aluminum-copper substrate before electroplating nickel to remove grease on the surface of the dispersed aluminum-copper substrate; step three: carrying out special activation and sensitization treatment on the dispersed aluminum-copper substrate; the base is fixedly arranged in a hydrogen nitrogen atmosphere or a vacuum atmosphere, then the treated dispersed aluminum-copper substrate is fixed in the base, and the two sides of the dispersed aluminum-copper substrate are fixed through the inner side wall of the limiting groove before the first electroplating, so that the upper surface and the lower surface of the dispersed aluminum-copper substrate are not in contact with the surfaces of the limiting groove and the micro electric push rod.)

1. A nickel plating process for a thickened plating aluminum-copper base plate is characterized by comprising the following steps: the method comprises the following steps:

the method comprises the following steps: preparing a dispersed aluminum copper substrate (1) with the size of 10mm multiplied by 10 mm;

step two: chemical degreasing is carried out on the dispersed aluminum-copper substrate (1) before nickel electroplating so as to remove grease on the surface of the dispersed aluminum-copper substrate (1);

step three: carrying out special activation and sensitization treatment on the dispersed aluminum-copper substrate (1);

step four: the base (4) is fixedly arranged in a hydrogen nitrogen atmosphere or a vacuum atmosphere, then the processed dispersed aluminum-copper substrate (1) is fixed inside the base (4), and two sides of the dispersed aluminum-copper substrate (1) are fixed through the inner side wall of the limiting groove (12) before the first electroplating, so that the upper surface and the lower surface of the dispersed aluminum-copper substrate (1) are not in contact with the surfaces of the limiting groove (12) and the micro electric push rod (13);

step five: electroplating the prepared nickel plating layer (2) on the upper surface of the dispersion aluminum-copper substrate (1) for the first time in a hydrogen-nitrogen atmosphere or vacuum environment, wherein water is plated for 3 times, the dispersion aluminum-copper substrate (1) is fixed through the lower surface of a micro electric push rod (13) and the inner upper surface of a limiting groove (12) after the electroplating is finished, so that the inner side wall of the limiting groove (12) is not in contact with the surfaces of the left side and the right side of the dispersion aluminum-copper substrate (1), then, electroplating the nickel plating layer (2) on the dispersion aluminum-copper substrate (1) for the second time, and water is plated for 3 times;

step six: after the second electroplating is finished, a nickel plating layer (2) is electroplated on the surface of the dispersion aluminum copper substrate (1), then the dispersion aluminum copper substrate (1) electroplated with the nickel plating layer (2) is fixed in the same way as the first electroplating, the second electroplating is carried out, an ammonia nickel layer (3) is electroplated in a square decimeter of 1A, and the fourth electroplating is carried out in the same way as the second electroplating;

step seven: taking out the electroplated dispersed aluminum-copper substrate (1), and carrying out blow-drying and drying operations;

step eight: after the electroplating is finished, observing the number of peeling and bubbling on the surface of the dispersed aluminum-copper base plate and the corroded area of the nickel plating layer under 10 times of amplification, recording data into a table, wherein the detection modes are respectively as follows: taking 20-50 electroplated dispersion aluminum-copper base plates, and detecting the number of peeling bubbles on the surface of the dispersion aluminum-copper base plate: placing the dispersed aluminum-copper base plate after nickel plating in nitrogen at 450 +/-10 ℃ for 15min, and checking the number of skinning bubbles on the surface of the nickel plating layer; taking 20 dispersion aluminum copper base plates after the electroplating is finished, and detecting the corroded area size of the nickel plating layer of the dispersion aluminum copper base plates: soaking in water for 264 hr, taking out, amplifying by 10 times, and observing whether the corroded area of the nickel-plated layer exceeds 5%.

2. The nickel plating process for the thickened plated aluminum-copper base plate according to claim 1, wherein the nickel plating process comprises the following steps: in the second step, the chemical degreasing mode is to soak the dispersion aluminum copper base plate in a solution with the sodium hydroxide content of 8g/L, the sodium carbonate decahydrate content of 55g/L, the sodium phosphate content of 55g/L and the sodium silicate content of 3g/L for chemical degreasing, wherein the soaking temperature is kept at 70 ℃, and the soaking time is 2-3 min.

3. The nickel plating process for the thickened plated aluminum-copper base plate according to claim 1, wherein the nickel plating process comprises the following steps: in the third step, the activation treatment is to place the dispersed aluminum-copper base plate in the activation solution to be soaked for 60 seconds to dissolve the surface oxide film, and the water cleaning is performed for 3 times, the sensitization treatment is to place the dispersed aluminum-copper base plate in the sensitization solution to perform sensitization treatment on the dispersed aluminum-copper for 5-10 minutes, and the water cleaning is performed for 3 times, so that the influence of aluminum oxide particles on nickel plating can be reduced and the binding force of a plating layer can be enhanced.

4. The nickel plating process for the thickened plated aluminum-copper base plate according to claim 1, wherein the nickel plating process comprises the following steps: in the fifth step, the thickness of the nickel plating layer (2) is 3-3.5 μm.

5. The nickel plating process for the thickened plated aluminum-copper base plate according to claim 1, wherein the nickel plating process comprises the following steps: in the sixth step, the thickness of the nickel ammonia layer (3) is 5-5.5 μm.

6. The nickel plating process for the thickened plated aluminum-copper base plate according to claim 1, wherein the nickel plating process comprises the following steps: in the sixth step, 3 times of water passes in the third electroplating process and the fourth electroplating process.

7. The nickel plating process for the thickened plated aluminum-copper base plate according to claim 1, wherein the nickel plating process comprises the following steps: in the fifth step, the electroplating environment is hydrogen nitrogen atmosphere or vacuum atmosphere, the temperature is kept at 850 ℃ for 15 minutes, and the rotation process is carried out every 15 seconds in the electroplating process.

8. The nickel plating process for the thickened plated aluminum-copper base plate according to claim 1, wherein the nickel plating process comprises the following steps: the dispersion aluminum-copper substrate (1) upper surface is provided with nickel plating layer (2), nickel plating layer (2) upper surface is provided with nickel ammonia layer (3).

9. The nickel plating process for the thickened plated aluminum-copper base plate according to claim 1, wherein the nickel plating process comprises the following steps: electronic slide rail (5) have been seted up to the inside inboard surface of shell (4), electronic slide rail (5) inside sliding connection has electronic slider, and electronic slider is provided with two, the equal fixedly connected with motor case (6) in inboard of two electronic sliders, motor case (6) inside fixedly connected with rotates motor (7), inboard fixedly connected with gag lever post (8) of motor case (6), spout (9) have been seted up to gag lever post (8) inside, spout (9) inside is provided with screw lead screw (10), just the one end transmission of rotating motor (7) is connected with screw lead screw (10), screw lead screw (10) surface threaded connection has telescopic link (11).

10. A nickel plating process for a thickened plated aluminum-copper base plate according to claim 9, wherein: a limiting groove (12) is formed in the surface of one side of the telescopic rod (11), and a miniature electric push rod (13) is fixedly connected to the top end inside the limiting groove (12).

Technical Field

The invention belongs to the technical field of bottom plate nickel plating, and particularly relates to a nickel plating process for a thickened plating aluminum-copper bottom plate.

Background

The dispersion aluminum copper base plate shell is mainly matched with discrete devices, thick film circuits and the like with high power and high requirement on base plate heat conduction. The dispersed aluminum copper has the characteristics of good thermal conductivity and no deformation at high temperature, is a housing which is mainly developed abroad, and the mass production is realized at present at foreign countries, while the domestic housing is in a blank state.

At present, after the traditional process method is used for nickel plating of a dispersion aluminum-copper base plate, due to the fact that the coefficient of linear expansion of nickel is different from that of dispersion aluminum-copper, the surface of the dispersion aluminum-copper base plate is easy to bubble and break when in use, when the nickel plating layer of the dispersion aluminum-copper base plate is thin, the problem of corrosion of AgCu28 solder to the dispersion aluminum-copper in the brazing process is difficult to avoid, and the thickness of nickel plating cannot meet the use requirement, so that the nickel plating process of the thickening plating aluminum-copper base plate is provided, and the problems provided in the background are solved.

Disclosure of Invention

The invention aims to overcome the technical problem of the prior art, and provides a nickel plating process for an aluminum-copper base plate with a thickened plating layer, so as to solve the problems that after the prior art provided by the background art uses a traditional process method to carry out nickel plating on a dispersed aluminum-copper base plate, the surface of the dispersed aluminum-copper base plate is easy to bubble and break when in use due to certain difference between the linear expansion coefficients of nickel and dispersed aluminum-copper, when the nickel plating layer of the dispersed aluminum-copper base plate is thin, the corrosion of AgCu28 solder to the dispersed aluminum-copper in the brazing process is difficult to avoid, and the thickness of nickel plating cannot meet the use requirement.

In order to achieve the purpose, the invention provides the following technical scheme: a nickel plating process for a thickened plating aluminum-copper base plate comprises the following steps:

the method comprises the following steps: preparing a dispersion aluminum copper substrate with a proper size, wherein the size is 10mm multiplied by 10 mm;

step two: chemically removing oil from the dispersed aluminum-copper substrate before electroplating nickel to remove grease on the surface of the dispersed aluminum-copper substrate;

step three: carrying out special activation and sensitization treatment on the dispersed aluminum-copper substrate;

step four: the base is fixedly arranged in a hydrogen nitrogen atmosphere or a vacuum atmosphere, then the treated dispersed aluminum-copper substrate is fixed in the base, and two sides of the dispersed aluminum-copper substrate are fixed through the inner side wall of the limiting groove before the first electroplating, so that the upper surface and the lower surface of the dispersed aluminum-copper substrate are not in contact with the surfaces of the limiting groove and the micro electric push rod;

step five: electroplating the prepared nickel plating layer on the upper surface of the dispersion aluminum-copper substrate for the first time in a hydrogen-nitrogen atmosphere or vacuum environment, performing water 3 times during electroplating, fixing the dispersion aluminum-copper substrate through the lower surface of the miniature electric push rod and the upper surface inside the limiting groove after electroplating is completed, enabling the inner side wall of the limiting groove not to contact with the surfaces of the left side and the right side of the dispersion aluminum-copper substrate, and then starting electroplating the dispersion aluminum-copper substrate for the second time to form the nickel plating layer, wherein the water 3 times during electroplating is performed;

step six: after the second electroplating is finished, electroplating a nickel plating layer on the surface of the dispersed aluminum-copper substrate, fixing the dispersed aluminum-copper substrate electroplated with the nickel plating layer in the same way as the first electroplating, carrying out the second electroplating, electroplating an ammonia nickel layer at the rate of 1A/square decimeter, and carrying out the fourth electroplating in the same way as the second electroplating;

step seven: taking out the electroplated dispersed aluminum-copper substrate, and performing blow-drying and drying operations;

step eight: after the electroplating is finished, observing the number of peeling and bubbling on the surface of the dispersed aluminum-copper base plate and the corroded area of the nickel plating layer under 10 times of amplification, recording data into a table, wherein the detection modes are respectively as follows: taking 20-50 electroplated dispersion aluminum-copper base plates, and detecting the number of peeling bubbles on the surface of the dispersion aluminum-copper base plate: placing the dispersed aluminum-copper base plate after nickel plating in nitrogen at 450 +/-10 ℃ for 15min, and checking the number of skinning bubbles on the surface of the nickel plating layer; taking 20 dispersion aluminum copper base plates after the electroplating is finished, and detecting the corroded area size of the nickel plating layer of the dispersion aluminum copper base plates: soaking in water for 264 hr, taking out, amplifying by 10 times, and observing whether the corroded area of the nickel-plated layer exceeds 5%.

Preferably, in the second step, the chemical degreasing mode is to soak the dispersed aluminum-copper base plate in a solution with the sodium hydroxide content of 8g/L, the sodium carbonate decahydrate content of 55g/L, the sodium phosphate content of 55g/L and the sodium silicate content of 3g/L for chemical degreasing, wherein the soaking temperature is kept at 70 ℃, and the soaking time is 2-3 min.

Preferably, in the third step, the activation treatment is to place the dispersed aluminum-copper base plate in an activation solution to be soaked for 60 seconds to dissolve the surface oxide film, and the water cleaning is performed for 3 times, the sensitization treatment is to place the dispersed aluminum-copper base plate in a sensitization solution to perform sensitization treatment on the dispersed aluminum-copper for 5-10 minutes, and the water cleaning is performed for 3 times, so that the influence of aluminum oxide particles on nickel plating can be reduced and the binding force of a plating layer can be enhanced.

Preferably, in the fifth step, the thickness of the nickel plating layer is 3-3.5 μm.

Preferably, in the sixth step, the thickness of the nickel ammonia layer is 5-5.5 μm.

Preferably, in the sixth step, 3 times of water passes through the third electroplating and the fourth electroplating.

Preferably, in the fifth to sixth steps, the electroplating environment is a hydrogen nitrogen atmosphere or a vacuum atmosphere, the temperature is kept at 850 ℃ for 15 minutes, and the rotation process is carried out every 15 seconds in the electroplating process.

Preferably, a nickel plating layer is arranged on the upper surface of the dispersion aluminum-copper substrate, and an ammonia nickel layer is arranged on the upper surface of the nickel plating layer.

Preferably, electronic slide rail has been seted up to the inside inboard surface of shell, the inside sliding connection of electronic slide rail has electronic slider, and electronic slider is provided with two, the equal fixedly connected with motor case in inboard of two electronic sliders, the inside fixedly connected with of motor case rotates the motor, the inboard fixedly connected with gag lever post of motor case, the inside spout of having seted up of gag lever post, the inside screw lead screw that is provided with of spout, just the one end transmission of rotating the motor is connected with the screw lead screw, screw lead screw surface threaded connection has the telescopic link.

Preferably, a limiting groove is formed in the surface of one side of the telescopic rod, and a miniature electric push rod is fixedly connected to the top end of the inner portion of the limiting groove.

Compared with the prior art, the invention provides a nickel plating process for a thickened plating aluminum-copper base plate, which has the following beneficial effects:

1. according to the invention, the special activation and sensitization treatment is carried out on the dispersion aluminum-copper substrate before electroplating, so that the influence of aluminum oxide particles on nickel plating can be reduced, the binding force of a plating layer is enhanced, impurities on the surface of the dispersion aluminum-copper are removed, the adverse influence of the aluminum oxide particles on the nickel plating is weakened, the deposition of a nickel layer on the surface is promoted, and the peel strength of the nickel layer is not lower than 4.0kgf/mm²The influence of the dispersed alumina with low content in the dispersed aluminum-copper on the binding force of the plating layer is avoided;

2. according to the invention, through the designed sintering process after nickel plating of the dispersed aluminum-copper, the electroplating process adopts a rotating device to rotate the dispersed aluminum-copper base plate, and the rotating process is carried out every 15s in the nickel plating process, so that bubbles on an electroplating interface can be greatly and conveniently removed, through the mutual matching of the miniature electric push rod and the rotating motor, the side surface, the upper surface and the lower surface of the dispersed aluminum-copper base plate can be fully contacted with an electroplating solution in the electroplating process, and the problem that the contact surface is not electroplated due to the contact between the surface of the dispersed aluminum-copper base plate and the inner wall of the miniature electric push rod or the limiting groove after the electroplating is finished can be avoided;

3. the invention realizes the purpose of electric rotation by rotating the dispersed aluminum-copper bottom plate through the arranged rotating device, avoids the problem that the traditional process of rotating the dispersed aluminum-copper bottom plate by using a running water line is troublesome, drives the threaded lead screw to rotate through the arranged rotating motor, thereby realizing the purpose of front and back extension of the telescopic rod in the limiting rod, further realizing the purpose of fixing the dispersed aluminum-copper bottom plates with different lengths and widths, and can realize the purpose of fixing the dispersed aluminum-copper bottom plates with different thicknesses through the arranged limiting groove and the miniature electric push rod, thereby preventing the dispersed aluminum-copper bottom plates from deviating in position during the experiment and bringing troubles to the experimental process.

Drawings

The accompanying drawings, which are included to provide a further understanding of the invention and are incorporated in and constitute a part of this specification, illustrate embodiments of the invention and together with the description serve to explain the principles of the invention without limiting the invention in which:

FIG. 1 is a schematic structural diagram of a plating thickness design in a nickel plating process for a thickened plating aluminum-copper base plate according to the present invention;

FIG. 2 is a schematic structural view of a rotary device in a nickel plating process for a thickened plating aluminum-copper base plate according to the present invention;

FIG. 3 is a cross-sectional view of an electric slider and a limiting rod in a nickel plating process of a thickened plating aluminum-copper base plate according to the invention;

in the figure: 1. a dispersion aluminum copper substrate; 2. nickel layer is plated; 3. a nickel ammonia layer; 4. a base; 5. an electric slide rail; 6. a motor case; 7. rotating the motor; 8. a limiting rod; 9. a chute; 10. a threaded lead screw; 11. a telescopic rod; 12. a limiting groove; 13. a miniature electric push rod.

Detailed Description

The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.

Example one

Referring to fig. 1-3, the present invention provides a technical solution: a nickel plating process for a thickened plating aluminum-copper base plate comprises the following steps:

the method comprises the following steps: preparing a dispersion aluminum copper substrate 1 with a proper size, wherein the size is 10mm multiplied by 10 mm;

step two: chemically removing oil from the dispersed aluminum-copper substrate 1 before electroplating nickel to remove grease on the surface of the dispersed aluminum-copper substrate 1;

step three: carrying out special activation and sensitization treatment on the dispersed aluminum-copper substrate 1;

step four: the base 4 is fixedly arranged in a hydrogen nitrogen atmosphere or a vacuum atmosphere, then the treated dispersed aluminum-copper substrate 1 is fixed inside the base 4, and two sides of the dispersed aluminum-copper substrate 1 are fixed through the inner side wall of the limiting groove 12 before the first electroplating, so that the upper surface and the lower surface of the dispersed aluminum-copper substrate 1 are not in contact with the surfaces of the limiting groove 12 and the micro electric push rod 13;

step five: electroplating the prepared nickel plating layer 2 on the upper surface of the dispersion aluminum-copper substrate 1 for the first time in a hydrogen-nitrogen atmosphere or vacuum environment, performing water 3 times during electroplating, fixing the dispersion aluminum-copper substrate 1 through the lower surface of the miniature electric push rod 13 and the inner upper surface of the limiting groove 12 after electroplating is completed, enabling the inner side wall of the limiting groove 12 not to contact with the surfaces of the left side and the right side of the dispersion aluminum-copper substrate 1, then starting electroplating the nickel plating layer 2 on the dispersion aluminum-copper substrate 1 for the second time, and performing water 3 times during electroplating;

step six: after the second electroplating is finished, a nickel plating layer 2 is electroplated on the surface of the dispersed aluminum copper substrate 1, then the dispersed aluminum copper substrate 1 electroplated with the nickel plating layer 2 is fixed in the same way as the first electroplating, the second electroplating is carried out, an ammonia nickel layer 3 is electroplated in a square decimeter of 1A, and the fourth electroplating is carried out in the same way as the second electroplating;

step seven: taking out the electroplated dispersed aluminum-copper substrate 1, and carrying out blow-drying and drying operations;

step eight: after the electroplating is finished, observing the number of peeling and bubbling on the surface of the dispersed aluminum-copper bottom plate under 10 times of amplification, and recording data into a table, wherein the detection mode is as follows: when the number of the skinning bubbles on the surface of the dispersion aluminum-copper base plate after electroplating is detected, three detection batches are respectively set, the detection number of the three detection batches is respectively 20, 20 and 50, the dispersion aluminum-copper base plate after nickel plating is placed in nitrogen at the temperature of 450 +/-10 ℃ for 15min, and then the number of the skinning bubbles on the surface is observed by amplifying 10 times.

In the invention, preferably, in the second step, the chemical degreasing mode is to soak the dispersed aluminum-copper base plate in a solution with the sodium hydroxide content of 8g/L, the sodium carbonate decahydrate content of 55g/L, the sodium phosphate content of 55g/L and the sodium silicate content of 3g/L for chemical degreasing, wherein the soaking temperature is kept at 70 ℃, and the soaking time is 2-3 min.

In the invention, preferably, in the third step, the activation treatment is to place the dispersed aluminum-copper base plate in the activation solution to be soaked for 60 seconds, dissolving a surface oxide film, washing with water for 3 times, performing sensitization treatment, namely placing a dispersed aluminum copper base plate in a sensitization solution to perform sensitization treatment on the dispersed aluminum copper for 5-10 minutes, and washing with water for 3 times, wherein the sensitization treatment can reduce the influence of aluminum oxide particles on nickel plating and enhance the binding force of a plating layer. And the adverse effect of alumina particles on nickel plating is weakened, the deposition of a nickel layer on the surface is promoted, the peel strength of the nickel layer is not lower than 4.0kgf/mm2, and the influence of dispersed alumina with low content in dispersed aluminum copper on the bonding force of a plating layer is avoided.

In the present invention, preferably, in the fifth step, the thickness of the nickel plating layer 2 is 3 to 3.5 μm.

In the present invention, preferably, in the sixth step, the thickness of the nickel ammonium layer 3 is 5 to 5.5 μm.

In the present invention, it is preferable that in the sixth step, 3 times of water pass during the third electroplating and the fourth electroplating.

In the invention, preferably, in the fifth to sixth steps, the electroplating environment is a hydrogen nitrogen atmosphere or a vacuum atmosphere, the temperature is kept at 850 ℃ for 15 minutes, and the rotation process is carried out every 15 seconds in the electroplating process.

In the invention, preferably, a nickel plating layer 2 is arranged on the upper surface of the dispersed aluminum-copper substrate 1, and an ammonia nickel layer 3 is arranged on the upper surface of the nickel plating layer 2.

In the invention, preferably, the inner side surface of the shell 4 is provided with an electric slide rail 5, the electric slide rail 5 is internally connected with two electric slide blocks in a sliding manner, the inner sides of the two electric slide blocks are fixedly connected with a motor box 6, the inner side of the motor box 6 is fixedly connected with a rotating motor 7, the inner side of the motor box 6 is fixedly connected with a limiting rod 8, the inner side of the limiting rod 8 is provided with a chute 9, the inner side of the chute 9 is provided with a threaded lead screw 10, one end of the rotating motor 7 is connected with the threaded lead screw 10 in a transmission manner, and the surface of the threaded lead screw 10 is connected with a telescopic rod 11 in a threaded manner, the invention rotates the dispersed aluminum-copper bottom plate through the arranged rotating device, thereby realizing the purpose of electric rotation, avoiding the problem that the traditional process of rotating the dispersed aluminum-copper bottom plate by using a flowing water is troublesome, and the threaded lead screw 10 is driven to rotate by the rotating motor 7 through the arranged rotating motor 7, thereby realize telescopic link 11 at the inside purpose of stretching out and drawing back around of gag lever post 8 to can realize carrying out the purpose of fixing to the dispersion aluminium copper bottom plate of different length and width, through spacing groove 12 and the miniature electric putter 13 that sets up, can realize carrying out the purpose of fixing to the dispersion aluminium copper bottom plate of different thickness through miniature electric putter 13, prevent to prevent when the experiment that dispersion aluminium copper bottom plate from taking place the skew of position, bring the trouble for the experimentation.

In the invention, preferably, a limit groove 12 is formed on one side surface of the telescopic rod 11, a micro electric push rod 13 is fixedly connected to the top end inside the limit groove 12, and through the arrangement of the micro electric push rod 13 and the rotating motor 7, and through the mutual matching between the micro electric push rod 13 and the rotating motor 7, the side surface and the upper and lower surfaces of the dispersion aluminum-copper substrate 1 can be fully contacted with an electroplating solution in the electroplating process, so that the problem that the contact surface is not electroplated due to the contact between the surface of the dispersion aluminum-copper substrate 1 and the inner wall of the micro electric push rod 13 or the limit groove 12 after the electroplating is finished can be avoided.

Example two

Referring to fig. 1-3, the present invention provides a technical solution: a nickel plating process for a thickened plating aluminum-copper base plate comprises the following steps:

the method comprises the following steps: preparing a dispersion aluminum copper substrate 1 with a proper size, wherein the size is 10mm multiplied by 10 mm;

step two: chemically removing oil from the dispersed aluminum-copper substrate 1 before electroplating nickel to remove grease on the surface of the dispersed aluminum-copper substrate 1;

step three: carrying out special activation and sensitization treatment on the dispersed aluminum-copper substrate 1;

step four: the base 4 is fixedly arranged in a hydrogen nitrogen atmosphere or a vacuum atmosphere, then the treated dispersed aluminum-copper substrate 1 is fixed inside the base 4, and two sides of the dispersed aluminum-copper substrate 1 are fixed through the inner side wall of the limiting groove 12 before the first electroplating, so that the upper surface and the lower surface of the dispersed aluminum-copper substrate 1 are not in contact with the surfaces of the limiting groove 12 and the micro electric push rod 13;

step five: electroplating the prepared nickel plating layer 2 on the upper surface of the dispersion aluminum-copper substrate 1 for the first time in a hydrogen-nitrogen atmosphere or vacuum environment, performing water 3 times during electroplating, fixing the dispersion aluminum-copper substrate 1 through the lower surface of the miniature electric push rod 13 and the inner upper surface of the limiting groove 12 after electroplating is completed, enabling the inner side wall of the limiting groove 12 not to contact with the surfaces of the left side and the right side of the dispersion aluminum-copper substrate 1, then starting electroplating the nickel plating layer 2 on the dispersion aluminum-copper substrate 1 for the second time, and performing water 3 times during electroplating;

step six: after the second electroplating is finished, a nickel plating layer 2 is electroplated on the surface of the dispersed aluminum copper substrate 1, then the dispersed aluminum copper substrate 1 electroplated with the nickel plating layer 2 is fixed in the same way as the first electroplating, the second electroplating is carried out, an ammonia nickel layer 3 is electroplated in a square decimeter of 1A, and the fourth electroplating is carried out in the same way as the second electroplating;

step seven: taking out the electroplated dispersed aluminum-copper substrate 1, and carrying out blow-drying and drying operations;

step eight: after the electroplating is finished, observing the corroded area of the nickel plating layer under 10 times of amplification, and recording data into a table, wherein the detection mode is as follows: when the detection of the size of the corroded area of the surface of the dispersion aluminum-copper base plate after the electroplating is finished is carried out, three detection batches are respectively arranged, the detection number of each detection batch is 20, the dispersion aluminum-copper base plate is placed into water for soaking for 264 hours during detection, the dispersion aluminum-copper base plate is taken out and amplified by 10 times, and the number of corroded areas of the nickel-plated layer is observed to exceed 5%.

In the invention, preferably, in the second step, the chemical degreasing mode is to soak the dispersed aluminum-copper base plate in a solution with the sodium hydroxide content of 8g/L, the sodium carbonate decahydrate content of 55g/L, the sodium phosphate content of 55g/L and the sodium silicate content of 3g/L for chemical degreasing, wherein the soaking temperature is kept at 70 ℃, and the soaking time is 2-3 min.

In the invention, preferably, in the third step, the activation treatment is to place the dispersed aluminum-copper base plate in the activation solution to be soaked for 60 seconds, dissolving a surface oxide film, washing with water for 3 times, performing sensitization treatment, namely placing a dispersed aluminum copper base plate in a sensitization solution to perform sensitization treatment on the dispersed aluminum copper for 5-10 minutes, and washing with water for 3 times, wherein the sensitization treatment can reduce the influence of aluminum oxide particles on nickel plating and enhance the binding force of a plating layer. And the adverse effect of alumina particles on nickel plating is weakened, the deposition of a nickel layer on the surface is promoted, the peel strength of the nickel layer is not lower than 4.0kgf/mm2, and the influence of dispersed alumina with low content in dispersed aluminum copper on the bonding force of a plating layer is avoided.

In the invention, preferably, in the fifth step, the thickness of the nickel plating layer 2 is 3.5-3.5 μm, in the sixth step, the thickness of the nickel-ammonia layer 3 is 5-5.5 μm, in the sixth step, 3 times of water are used in the third electroplating and fourth electroplating processes, in the fifth step, the electroplating environment is hydrogen nitrogen atmosphere or vacuum atmosphere, the temperature is kept at 850 ℃ for 15 minutes, and the rotation process is carried out every 15s in the electroplating process.

In the invention, preferably, a nickel plating layer 2 is arranged on the upper surface of a dispersed aluminum-copper substrate 1, an ammonia nickel layer 3 is arranged on the upper surface of the nickel plating layer 2, an electric slide rail 5 is arranged on the inner side surface of a shell 4, electric slide blocks are slidably connected inside the electric slide rail 5, two electric slide blocks are arranged, the inner sides of the two electric slide blocks are fixedly connected with a motor box 6, a rotating motor 7 is fixedly connected inside the motor box 6, a limiting rod 8 is fixedly connected inside the motor box 6, a sliding groove 9 is arranged inside the limiting rod 8, a threaded lead screw 10 is arranged inside the sliding groove 9, one end of the rotating motor 7 is in transmission connection with the threaded lead screw 10, and the surface of the threaded lead screw 10 is in threaded connection with a telescopic rod 11. Through the rotation motor 7 that sets up, it rotates to drive screw lead screw 10 through rotating motor 7, thereby realize telescopic link 11 at the inside front and back flexible purpose of gag lever post 8, thereby can realize carrying out the purpose of fixing to the dispersion aluminium copper bottom plate of different length and width, spacing groove 12 and the miniature electric putter 13 through setting up, can realize carrying out the purpose of fixing to the dispersion aluminium copper bottom plate of different thickness through miniature electric putter 13, prevent to prevent that dispersion aluminium copper bottom plate from taking place the skew of position when the experiment, it is troublesome to bring for the experimentation.

In the invention, preferably, a limit groove 12 is formed on one side surface of the telescopic rod 11, a micro electric push rod 13 is fixedly connected to the top end inside the limit groove 12, and through the arrangement of the micro electric push rod 13 and the rotating motor 7, and through the mutual matching between the micro electric push rod 13 and the rotating motor 7, the side surface and the upper and lower surfaces of the dispersion aluminum-copper substrate 1 can be fully contacted with an electroplating solution in the electroplating process, so that the problem that the contact surface is not electroplated due to the contact between the surface of the dispersion aluminum-copper substrate 1 and the inner wall of the micro electric push rod 13 or the limit groove 12 after the electroplating is finished can be avoided.

Test batches	Detecting the amount	Number of surface skinning bubbles	Percent of pass
				1	20	1	95%
2	20	0	100%
				3	50	1	98%
		The corroded area of the coating is more than 5 percent	Percent of pass
				1	20	0	100%
2	20	0	100%
				3	20	0	100%

In conclusion, in a high-temperature examination plating layer quality test, the peeling bubbling rate of the surface of the nickel plating layer is lower than 5%, the quality qualification rate is higher than 95%, and in a moisture-proof 264-hour test, the qualification rate that the corroded area of the nickel plating layer is not more than 5% is 100%.

Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.