阅读说明：本技术 一种基于脉冲电镀的高性能电镀镍方法 (High-performance nickel electroplating method based on pulse electroplating ) 是由 潘弦 乔永亮 蒋义锋 于 2021-08-23 设计创作，主要内容包括：本发明公开了一种基于脉冲电镀的高性能电镀镍方法,包括步骤如下：对基片进行镀前处理后电镀至光亮铜；将经过步骤一处理后的基片活化后进行水洗处理；脉冲电镀镍：将脉冲工艺模式调整为恒压或恒流,双向脉冲模式,其他参数范围为占空比：20％-80％,正向通导时间：40-200ms,反向通导时间20-60ms,正反向周期比：4-12,脉冲工艺调整好后,将基片放入电镀槽中,对基片进行电镀镍处理；镀铬。本发明的脉冲电镀使用脉冲电源,能够降低镀层孔隙率和镀层内应力,减少添加剂的用量,降低镀层中杂质含量,提高了镀层的纯度,从而获得性能优越的镀层。(The invention discloses a high-performance nickel electroplating method based on pulse electroplating, which comprises the following steps: electroplating the substrate to bright copper after the pre-plating treatment; activating the substrate treated in the first step and then washing the substrate with water; pulse electrolytic nickel plating: the pulse process mode is adjusted to be a constant voltage or constant current mode, a bidirectional pulse mode is adopted, and other parameter ranges are duty ratio: 20% -80%, forward conduction time: 40-200ms, reverse conduction time 20-60ms, forward and reverse cycle ratio: 4-12, after the pulse process is adjusted, putting the substrate into an electroplating bath, and carrying out nickel electroplating treatment on the substrate; and (4) chromium plating. The pulse electroplating uses a pulse power supply, can reduce the porosity of a plated layer and the internal stress of the plated layer, reduces the dosage of additives, reduces the impurity content in the plated layer, and improves the purity of the plated layer, thereby obtaining the plated layer with excellent performance.)

1. A high-performance nickel electroplating method based on pulse electroplating is characterized by comprising the following steps:

the method comprises the following steps: electroplating the substrate to bright copper after the pre-plating treatment;

step two: activating the substrate treated in the first step and then washing the substrate with water;

step three: pulse electrolytic nickel plating: the pulse process mode is adjusted to be a constant voltage or constant current mode, a bidirectional pulse mode is adopted, and other parameter ranges are duty ratio: 20% -80%, forward conduction time: 40-200ms, reverse conduction time 20-60ms, forward and reverse cycle ratio: 4-12, after the pulse process is adjusted, putting the substrate into an electroplating bath, and carrying out nickel electroplating treatment on the substrate;

step four: and (3) chromium plating: and continuously carrying out hexavalent chromium electroplating treatment on the electroplated nickel substrate.

2. The method for high-performance nickel electroplating based on pulse electroplating according to claim 1, wherein in the second step, the substrate treated in the first step is activated by a sulfuric acid-ammonium persulfate system, and then is subjected to water washing treatment.

3. The method for high-performance nickel electroplating based on pulse electroplating according to any one of claims 1 or 2, wherein in the third step, the parameter ranges are adjusted as follows: the duty ratio is 60%, the forward conduction time is 80ms, the reverse conduction time is 40ms, and the forward-reverse period ratio is 4.

4. The method of claim 1, wherein in step three, the plating time of the substrate in the plating bath is 20 min.

5. The method for high-performance nickel electroplating based on pulse electroplating according to claim 1, wherein in the third step, a watt nickel system is used as the electroplating solution.

6. The method for high-performance nickel electroplating based on pulse electroplating as claimed in claim 1, wherein in the first step, the substrate is electroplated to bright copper after being subjected to pre-plating treatment steps of ultrasonic dewaxing, ultrasonic degreasing, water washing and coarsening.

7. The method for high-performance nickel electroplating based on pulse electroplating according to claim 1, wherein in the third step, the parameter ranges are adjusted as follows: the duty ratio is 40%, the forward conduction time is 40ms, the reverse conduction time is 40ms, and the forward-reverse period ratio is 12.

8. The method for high-performance nickel electroplating based on pulse electroplating according to claim 1, wherein in the third step, the parameter ranges are adjusted as follows: in the third step, the parameter range is adjusted as follows: the duty ratio is 20%, the forward conduction time is 120ms, the reverse conduction time is 40ms, and the forward-reverse period ratio is 8.

9. The method for high-performance nickel electroplating based on pulse electroplating according to claim 1, wherein in the third step, the parameter ranges are adjusted as follows: the duty ratio is 60%, the forward conduction time is 120ms, the reverse conduction time is 60ms, and the forward-reverse period ratio is 12.

Technical Field

The invention relates to a high-performance nickel electroplating method based on pulse electroplating.

Background

Along with the expansion of the market, domestic sanitary products are launched into the market in Europe and America, and occupy a place in foreign sanitary industry. In recent years, with the improvement of living standard of people, the requirement on product quality is gradually improved, the standard of traditional electroplating cannot meet the high-standard formulated by high-end bathroom brands, and in order to continuously improve product competitiveness and reach the high-standard of bathrooms, a high-efficiency and high-performance processing method needs to be developed. The existing bathroom industry mostly adopts a direct current constant voltage or constant current mode to electroplate products, and the formed plating layer has poor effect and can not reach the standard of high-end bathroom brands.

Disclosure of Invention

In order to solve the above technical problems, the present invention aims to provide a high performance nickel electroplating method based on pulse electroplating.

The invention is realized by the following technical scheme: a high-performance nickel electroplating method based on pulse electroplating comprises the following steps:

the method comprises the following steps: electroplating the substrate to bright copper after the pre-plating treatment;

step two: activating the substrate treated in the first step and then washing the substrate with water;

step three: pulse electrolytic nickel plating: the pulse process mode is adjusted to be a constant voltage or constant current mode, a bidirectional pulse mode is adopted, and other parameter ranges are duty ratio: 20% -80%, forward conduction time: 40-200ms, reverse conduction time 20-60ms, forward and reverse cycle ratio: 4-12, after the pulse process is adjusted, putting the substrate into an electroplating bath, and carrying out nickel electroplating treatment on the substrate;

step four: and (3) chromium plating: and continuously carrying out hexavalent chromium electroplating treatment on the electroplated nickel substrate.

Preferably, in the second step, the substrate treated in the first step is activated by a sulfuric acid-ammonium persulfate system, and then is subjected to water washing treatment.

Preferably, in the third step, the parameter range is adjusted as follows: the duty ratio is 60%, the forward conduction time is 80ms, the reverse conduction time is 40ms, and the forward-reverse period ratio is 4.

Preferably, in the third step, the electroplating time of the substrate in the electroplating bath is 20 min.

Preferably, in step three, the electroplating solution uses a watt nickel system.

Preferably, in the first step, the substrate is electroplated to bright copper after being subjected to the pre-plating treatment steps of ultrasonic dewaxing, ultrasonic degreasing, washing and coarsening.

Preferably, in the third step, the parameter range is adjusted as follows: the duty ratio is 40%, the forward conduction time is 40ms, the reverse conduction time is 40ms, and the forward-reverse period ratio is 12.

Preferably, in the third step, the parameter range is adjusted as follows: in the third step, the parameter range is adjusted as follows: the duty ratio is 20%, the forward conduction time is 120ms, the reverse conduction time is 40ms, and the forward-reverse period ratio is 8.

Preferably, in the third step, the parameter range is adjusted as follows: the duty ratio is 60%, the forward conduction time is 120ms, the reverse conduction time is 60ms, and the forward-reverse period ratio is 12.

The pulse plating method has the following characteristic advantages:

(1) the porosity of the plating layer is reduced, and the corrosion resistance is improved;

(2) the internal stress of the plating layer is reduced, and the toughness of the plating layer is improved;

(3) the dosage of the additive is reduced, the impurity content in the plating layer is reduced, and the purity of the plating layer is improved;

(4) the dispersing ability and the deep plating ability are improved.

Drawings

In order to more clearly illustrate the technical solution of the present invention, the drawings needed for the description of the embodiments or the prior art will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and it is obvious for those skilled in the art to obtain other drawings without creative efforts.

FIG. 1 is a flow chart of the present invention.

Detailed Description

The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments of the present invention without any inventive step, are within the scope of the present invention.

Referring to the attached figure 1 of the specification, the high-performance nickel electroplating method based on pulse electroplating can obtain a higher-performance nickel electroplating layer, the plating layer has lower porosity, and the corrosion resistance effect is better than that of the traditional direct-current nickel plating under the condition of the same thickness; the pulse electroplating method adopts the electroplating method of alternating rectangular wave and forward and reverse pulses, and compared with the common electroplating method, the method has the advantages of flat and compact plating layer, good adhesiveness, high current efficiency and the like. The method mainly comprises the following steps:

the method comprises the following steps: electroplating a substrate to bright copper after pre-plating treatment, wherein the substrate is an ABS plastic substrate, and the plastic substrate is electroplated to bright copper after the pre-plating treatment steps of ultrasonic dewaxing, ultrasonic degreasing, water washing and coarsening are carried out on the plastic substrate;

step two: putting the substrate treated in the first step into a sulfuric acid-ammonium persulfate system for activation, and then carrying out water washing treatment on the substrate;

step three: pulse electrolytic nickel plating: the electroplating solution can adopt a watt nickel system, the anode uses a nickel block, firstly, the pulse process mode is adjusted to be constant voltage or constant current, the bidirectional pulse mode and rectangular wave, and other parameter ranges are duty ratio: 20% -80%, forward conduction time: 40-200ms, reverse conduction time 20-60ms, forward and reverse cycle ratio: 4-12, after the pulse process is adjusted, hanging a substrate hanger for activation, washing, putting the substrate hanger into an electroplating bath, starting a power supply of a rectifier, and after the substrate hanger is softly started for 5s, electrifying the electroplating bath to electroplate nickel on the substrate for 20 min;

step four: and (3) chromium plating: and activating the electroplated nickel substrate, and then continuing to carry out conventional hexavalent chromium electroplating.

The pulse electroplating uses a pulse power supply, and the electrodeposition process can be changed in a wide range by controlling parameters such as waveform, frequency, on-off ratio, peak current density and the like, so that a plating layer with certain characteristics is obtained in certain plating solution, and higher standard requirements are met; in addition, the invention uses the frequency pulse power supply to replace a direct current power supply, changes the structure of the coating, has small grain size, and can obtain compact, bright and uniform coating. The invention adopts the mode of pulse nickel plating, realizes better corrosion resistance of the plating layer under the same thickness of the nickel layer, forms the plating layer with better effect, and meets the high standard requirement.

Designing an experimental scheme 1-9, using a plastic substrate plated to bright copper under the same condition, carrying out pulse nickel plating after deoiling and activating, selectively setting different peak currents according to duty ratios under different conditions, and controlling the average current density to be about 5-7A/dm²And setting the time of the groove to be 20min, and continuously electroplating chromium on the obtained nickel substrate. Preparing corrosion paste: taking 5g/L of copper nitrate, 5g/L of ferric trichloride and L00g/L of ammonium chloride, then taking 7ml of solution, taking 33ml of solution, taking 0ml of solution and 50ml of three solutions, then adding 30g of kaolin, fully stirring uniformly, blending into paste, uniformly coating on the surface of a substrate after electroplating, taking 24H as a cycle in a constant temperature and humidity chamber, testing three cycles in total, and finally obtaining the following experimental data according to the corrosion grade (the lower the grade is, the better the effect is) of the experiment:

from the above table, it can be seen that the corrosion grade in the test scheme 6 is the lowest, and the best effect is obtained, that is, the present invention can obtain the best electroplating effect under the pulse electroplating with the duty ratio of 60%, the forward conduction time of 80ms, the reverse conduction time of 40ms, and the forward and reverse cycle ratio of 4.

Further, the performance of the semi-gloss nickel layer according to the test scheme 6 is compared with the performance of the existing plating lines b, c, d and e adopting a direct current rectifier as follows:

1. porosity test of nickel layer

The experiment adopts a plastic substrate as a blank, and the plating layer structure is a plastic substrate-chemical nickel-impact nickel-acid copper-nickel;

the components: NaOH 20g/L, potassium ferricyanide 10 g/L;

time: 10 min;

spot characteristics: reddish-brown spots (pores to copper matrix) appeared on the filter paper;

porosity n/S (units/cm)²)；

In the formula: n is the total number of pore spots (ones); s is the area (cm) of the sample to be tested²)。

And (4) conclusion: the pulse electroplated nickel layer has lower porosity at the similar coating thickness.

2. Salt spray experiment

The results of different salt spray experiments compared with the traditional electroplating line products are as follows:

as can be seen from the comparison of tables, firstly, the corrosion paste experiment can pass through the traditional electroplating process only when the film thickness of the nickel layer is 18 μm, and the experiment can pass through the nickel layer about 10 μm by adopting the pulse nickel plating method; secondly, Cass8H and AASS48H need to meet the requirement that a nickel layer with the thickness of 10 mu m can have a certain passing rate in the traditional electroplating, and the pulse electroplating nickel with the thickness of about 6 mu m can meet the requirement.

While the foregoing description shows and describes the preferred embodiments of the present invention, it is to be understood that the invention is not limited to the forms disclosed herein, but is not to be construed as excluding other embodiments and is capable of use in various other combinations, modifications, and environments and is capable of changes within the scope of the inventive concept as described herein, commensurate with the above teachings, or the skill or knowledge of the relevant art. And that modifications and variations may be effected by those skilled in the art without departing from the spirit and scope of the invention as defined by the appended claims.