阅读说明：本技术 一种提升亮度的MiniLED及其制作方法 (MiniLED for improving brightness and manufacturing method thereof ) 是由 何赟 田起群 于 2021-07-24 设计创作，主要内容包括：本申请涉及MiniLED的技术领域,涉及一种提升亮度的MiniLED,其包括PCB基板、LED芯片和固定层,所述LED芯片设置在所述PCB基板上,所述固定层设置在所述PCB基板上,且所述LED芯片位于所述固定层内；还包括BLT膜和QD膜,所述BLT膜设置在所述固定层上,所述QD膜设置在所述BLT膜远离所述PCB基板的一侧。本申请具有提升亮度的效果。(The application relates to the technical field of MiniLED, in particular to a MiniLED for improving brightness, which comprises a PCB substrate, an LED chip and a fixed layer, wherein the LED chip is arranged on the PCB substrate, the fixed layer is arranged on the PCB substrate, and the LED chip is positioned in the fixed layer; still include BLT membrane and QD membrane, the BLT membrane sets up on the fixed layer, the QD membrane sets up the BLT membrane is kept away from one side of PCB base plate. This application has the effect of promoting luminance.)

1. A MiniLED for improving brightness comprises a PCB (printed circuit board) substrate (1), LED chips (3) and a fixing layer (4), wherein the LED chips (3) are arranged on the PCB substrate (1), the fixing layer (4) is arranged on the PCB substrate (1), and the LED chips (3) are positioned in the fixing layer (4); the PCB is characterized by further comprising a BLT film (5) and a QD film (6), wherein the BLT film (5) is arranged on the fixing layer (4), and the QD film (6) is arranged on one side, far away from the PCB substrate (1), of the BLT film (5).

2. A MiniLED for increased brightness according to claim 1, characterized in that the QD film (6) is provided with a brightness enhancement film (7) on the side away from the BLT film (5).

3. The MiniLED for improving brightness according to claim 2, wherein the brightness enhancement film (7) has two layers, and the side of the brightness enhancement film (7) away from the BLT film (5) is zigzag.

4. A MiniLED for brightness enhancement according to claim 3, wherein a supporting pillar (8) is disposed between two of said brightness enhancement films (7).

5. The MiniLED for improving the brightness according to claim 1, wherein the PCB substrate (1) is provided with a reflective layer (2), and the reflective layer (2) is provided with a mounting hole for the LED chip (3) to pass through.

6. The method of claim 1, wherein the step of manufacturing a MiniLED for brightness enhancement comprises the steps of S1: die bonding, namely mounting the LED chip (3) on the PCB substrate (1);

s2: lighting detection to ensure that the LED chip (3) can be lighted;

s3: cleaning, namely cleaning the PCB substrate (1) subjected to the lighting detection to remove impurities;

s4: installing a reflecting layer (2), a fixing layer (4), a BLT film (5), a QD film (6) and a brightness enhancement film (7) on the cleaned PCB substrate (1) to form a MiniLED;

s5: and carrying out post-treatment such as cutting, lighting test and packaging on the MiniLED.

7. The method of claim 6, wherein the step of S3 includes cleaning with pure water and then plasma cleaning.

8. The method for manufacturing a MiniLED with improved brightness according to claim 6, wherein during the lighting test of S2, when it is detected that the LED chip (3) is abnormal and can not be lighted, the MiniLED is maintained to make the LED chip (3) lighted.

Technical Field

The application relates to the technical field of MiniLED, in particular to a MiniLED for improving brightness and a manufacturing method thereof.

Background

The mini light emitting diode (miniLED) greatly optimizes the performances of the display screen such as resolution, power consumption, service life and the like by reducing the size of the light emitting diode to be below millimeter. How to improve the Miniled brightness on the premise of the same power consumption is a problem to be solved.

Disclosure of Invention

In order to improve the brightness, the application provides a MiniLED for improving the brightness and a manufacturing method thereof.

In a first aspect, the MiniLED for improving brightness provided by the present application adopts the following technical scheme:

a MiniLED for improving brightness comprises a PCB substrate, an LED chip and a fixed layer, wherein the LED chip is arranged on the PCB substrate, the fixed layer is arranged on the PCB substrate, and the LED chip is positioned in the fixed layer; still include BLT membrane and QD membrane, the BLT membrane sets up on the fixed layer, the QD membrane sets up the BLT membrane is kept away from one side of PCB base plate.

By adopting the technical scheme, the blue light is transmitted out by the BLT film, the QD film is deenergized to emit white light, and the light in other wave bands is reflected back, so that the brightness is increased; the QD film can accurately and efficiently convert high-energy blue light into white light; the QD film can form a film on the LED backlight of the LCD display screen, the blue LED can emit full-spectrum light by irradiation, and the color gamut expression is greatly improved by finely adjusting the backlight, so that the color is more vivid; the brightness is improved and the cost is reduced under the condition of not increasing the power consumption.

Optionally, a side of the QD film away from the BLT film is provided with a brightness enhancement film.

Through adopting above-mentioned technical scheme, the membrane that adds lustre to of setting can promote luminance.

Optionally, the brightness enhancement film is provided with two layers, and one side of the brightness enhancement film, which is far away from the BLT film, is in a zigzag shape.

Through adopting above-mentioned technical scheme, the distribution angle of light can be improved to two-layer membrane of adding lustre to, will follow QD membrane and diverge even light and assemble the axial angle, on the angle of looking ahead promptly, increase axial luminance on the prerequisite that does not increase total luminous flux.

Optionally, a supporting column is arranged between the two layers of brightness enhancement films.

Through adopting above-mentioned technical scheme, the support column of setting can improve the stability of two membrane that add lustre to.

Optionally, a reflective layer is arranged on the PCB substrate, and a mounting hole for the LED chip to pass through is formed in the reflective layer.

Through adopting above-mentioned technical scheme, the reflector layer that sets up can reflect the light that the LED chip sent, makes better the passing BLT membrane of light.

In a second aspect, the present application provides a method for manufacturing a MiniLED with improved brightness, which adopts the following technical scheme:

a method for manufacturing a MiniLED with improved brightness comprises the following steps of S1: die bonding, namely mounting the LED chip on the PCB substrate; s2: lighting detection is carried out to ensure that the LED chip can be lighted; s3: cleaning, namely cleaning the light source plate subjected to the lightening detection to remove impurities; s4: installing the reflecting layer, the fixing layer, the BLT film, the QD film and the brightness enhancement film on the cleaned PCB substrate to form a MiniLED; s5: and carrying out post-treatment such as cutting, lighting test and packaging on the MiniLED.

By adopting the technical scheme, the LED chip is firstly installed on the PCB substrate, and then the lighting test is carried out, so that the normal light emission enters the next step for cleaning; after cleaning, the reflecting layer, the fixing layer, the BLT film, the QD film and the brightness enhancement film are arranged on the PCB substrate to form a MiniLED; finally, the MiniLED is cut, and then the MiniLED is lighted again, so that the MiniLED of the subsequent package can be normally used.

Optionally, in the step S3, the cleaning step includes two cleaning processes, i.e., cleaning with pure water and then plasma cleaning.

Through adopting above-mentioned technical scheme, wash earlier with pure water and clear away the impurity of easy clearance, then reuse plasma cleaning makes the cleaning performance more.

Optionally, during the lighting test of S2, when it is detected that the LED chip is abnormal and cannot be lit, the LED chip is maintained to be lit.

By adopting the technical scheme, the LED chip and the PCB substrate which cannot be lightened are maintained, so that the LED chip can be normally lightened, the discarding of materials can be reduced, and the purpose of saving resources is achieved.

To sum up, the application comprises the following beneficial technical effects:

1. the BLT film is arranged to transmit the blue light, the QD film is de-excited to emit white light, and the light in other wave bands is reflected back, so that the brightness is increased;

2. the light that the LED chip sent can be reflected to the reflector layer that sets up, makes better the passing BLT membrane of light.

Drawings

Fig. 1 is a schematic structural diagram of a MiniLED for improving brightness in an embodiment of the present application;

fig. 2 is an exploded view of a MiniLED with enhanced brightness according to an embodiment of the present disclosure.

Reference numerals: 1. a PCB substrate; 2. a light-reflecting layer; 3. an LED chip; 4. a fixed layer; 5. a BLT film; 6. a QD film; 7. a brightness enhancement film; 8. and (4) a support column.

Detailed Description

The present application is described in further detail below with reference to figures 1-2.

The embodiment of the application discloses a MiniLED for improving brightness.

Referring to fig. 1 and 2, the MiniLED includes a PCB substrate 1, a light reflecting layer 2, an LED chip 3, a BLT film 5, a QD film 6, and two brightness enhancement films 7, which are sequentially disposed from bottom to top.

Referring to fig. 2, the QD film 6 is a quantum dot film; the brightness enhancement film 7 is a BEF film.

The reflecting layer 2 is provided with a mounting hole for the LED chip 3 to pass through.

A fixing layer 4 is laid on the reflective layer 2, and the fixing layer 4 is formed by glue; and one side of the LED chip 3, which is far away from the PCB substrate 1, is positioned in the fixed layer 4.

The BLT film 5 is adhered to the fixing layer 4 at a side away from the PCB substrate 1.

The two layers of the brightness enhancement films 7 have the same structure, and one sides of the brightness enhancement films 7, which are far away from the PCB substrate 1, are provided with saw-toothed bulges; a supporting column 8 is adhered between the two layers of brightness enhancement films 7.

The implementation principle of the MiniLED for improving the brightness in the embodiment of the application is as follows: firstly, the reflecting layer 2 is bonded on the PCB substrate 1, and then the LED chip 3 penetrates through the mounting hole on the reflecting layer 2 and is bonded on the PCB substrate 1; subsequently, the fixing layer 4 is applied to the LED chip 3 to seal the LED chip 3. The BLT film 5 is then bonded to the fixing layer 4, followed by the QD film 6. Finally, the two light enhancement films 7 bonded together are bonded to the QD film 6.

The main function of the BLT film 5 is to allow 180 nm to 540 nm blue light to pass through the QD film 6, and this part of the blue light can excite the QD film 6 to emit white light.

The light reflecting layer 2 can efficiently reflect the light reflected from the BLT film 5.

The MiniLED with BLT film 5 was tested to emit more significantly.

NO.	Scheme(s)	Backlight brightness (cd/m 2)
			1	Without BLT film	14719
2	With BLT film	20741
			3	Paste BLT membrane	20826
4	Paste BLT membrane	20535
			5	Paste BLT membrane	21057
6	Paste BLT membrane	20866

The luminance is 40% higher with the BLT film 5 than without.

The embodiment of the application also discloses a manufacturing method of the MiniLED for improving the brightness.

A manufacturing method of a MiniLED for improving brightness comprises the following steps: s1: die bonding, namely mounting the LED chip 3 on the PCB substrate 1;

s2: lighting detection, namely detecting whether the LED chip 3 on the PCB substrate 1 can be normally lighted; when the LED chip 3 is detected to be abnormal and can not be lightened, the maintenance is firstly carried out, so that the LED chip 3 can be lightened; discarding the lamp which cannot be lighted after maintenance;

s3: cleaning, namely cleaning the PCB substrate 1 capable of lighting the LED chip 3 by using pure water, and then dehumidifying; then, carrying out plasma cleaning to remove impurities;

s4: installing the reflecting layer 2, the fixing layer 4, the BLT film 5, the QD film 6 and the brightness enhancement film 7 on the cleaned PCB substrate 1 to form a MiniLED;

s5: cutting the MiniLED, and cleaning and dehumidifying after cutting; and lighting the cut and dehumidified MiniLED again to ensure that the MiniLED can be normally used, and finally packaging.

The implementation principle of the MiniLED for improving brightness and the manufacturing method thereof in the embodiment of the application is as follows: the LED chip 3 is first mounted on the PCB substrate 1.

Then, the LED chip 3 installed on the PCB substrate 1 is subjected to a lighting test, and when the LED chip 3 is detected to be abnormal and can not be lighted, the LED chip 3 is maintained to be lighted, so that the PCB substrate 1 entering the next step can work normally.

Then, carrying out pure water cleaning on the PCB substrate 1 capable of lighting the LED chip 3, and then dehumidifying; and then carrying out plasma cleaning to remove impurities.

And then the light reflecting layer, the fixed layer 4, the BLT film 5, the QD film 6 and the brightness enhancement film 7 are arranged on the cleaned PCB substrate 1 to form the MiniLED.

Finally, cutting the MiniLED, and cleaning and dehumidifying after cutting; and lighting the cut and dehumidified MiniLED again to ensure that the MiniLED can be normally used, and finally packaging.

The above embodiments are preferred embodiments of the present application, and the protection scope of the present application is not limited by the above embodiments, so: all equivalent changes made according to the structure, shape and principle of the present application shall be covered by the protection scope of the present application.