阅读说明：本技术 一种用于hdi板上通孔电镀的装置及其工作方法 (Device for electroplating through hole on HDI board and working method thereof ) 是由 李清华 杨海军 胡志强 牟玉贵 孙洋强 邓岚 于 2021-11-02 设计创作，主要内容包括：本发明公开了一种用于HDI板上通孔电镀的装置及其工作方法,它包括电镀槽(1)、架设于电镀槽(1)上方的龙门架(2)、设置于电镀槽(1)下方的供液装置,所述电镀槽(1)的槽底固设有支撑板(3),支撑板(3)上固设有多根与HDI板上通孔(19)相对应的出液管(4),出液管(4)的外径小于通孔(19)的直径,出液管(4)的柱面上且沿其长度方向开设有多个倾斜向上设置的斜孔(5),斜孔(5)均匀分布于出液管(4)上,出液管(4)的顶端部固设有与其同轴设置的铰刀(6),铰刀(6)的外径与通孔(19)的直径相等。本发明的有益效果是：结构紧凑、提高HDI板电性能、提高HDI板电镀质量、提高电镀效率。(The invention discloses a device for electroplating a through hole on an HDI (high density interconnect) plate and a working method thereof, and the device comprises an electroplating bath (1), a portal frame (2) erected above the electroplating bath (1) and a liquid supply device arranged below the electroplating bath (1), wherein a support plate (3) is fixedly arranged at the bottom of the electroplating bath (1), a plurality of liquid outlet pipes (4) corresponding to the through holes (19) on the HDI plate are fixedly arranged on the support plate (3), the outer diameter of each liquid outlet pipe (4) is smaller than the diameter of the through hole (19), a plurality of inclined holes (5) which are obliquely and upwards arranged are formed in the cylindrical surface of each liquid outlet pipe (4) along the length direction of the cylindrical surface, the inclined holes (5) are uniformly distributed on the liquid outlet pipes (4), a reamer (6) which is coaxially arranged with the top end part of each liquid outlet pipe (4) is fixedly provided, and the outer diameter of each reamer (6) is equal to the diameter of the through hole (19). The invention has the beneficial effects that: compact structure, improvement HDI board electric property, improvement HDI board electroplating quality, improvement electroplate efficiency.)

1. The utility model provides a device that is used for through-hole to electroplate on HDI board which characterized in that: the electroplating bath comprises an electroplating bath (1), a portal frame (2) erected above the electroplating bath (1) and a liquid supply device arranged below the electroplating bath (1), wherein a support plate (3) is fixedly arranged at the bottom of the electroplating bath (1), a plurality of liquid outlet pipes (4) corresponding to through holes (19) in an HDI plate are fixedly arranged on the support plate (3), the outer diameters of the liquid outlet pipes (4) are smaller than the diameters of the through holes (19), a plurality of inclined holes (5) which are inclined upwards are formed in the cylindrical surface of each liquid outlet pipe (4) along the length direction of the liquid outlet pipe, the inclined holes (5) are uniformly distributed on the liquid outlet pipes (4), a reamer (6) coaxially arranged with the liquid outlet pipes is fixedly arranged at the top end parts of the liquid outlet pipes (4), the outer diameter of the reamer (6) is equal to the diameter of the through holes (19), the bottom end parts of the liquid outlet pipes (4) penetrate through the support plate (3) in sequence, the bottom wall of the electroplating bath (1) and extend to the outside of the electroplating bath (1), the extending end of the liquid outlet pipe (4) is connected with the liquid supply device; the portal frame is characterized in that a lifting oil cylinder (7) is fixedly arranged on a cross beam of the portal frame (2), a piston rod of the lifting oil cylinder (7) penetrates through the cross beam and is arranged, a lifting plate (8) is fixedly arranged on an extending end, the lifting plate (8) is arranged above the supporting plate (3) and is located on the front side of the supporting plate (3), two guide columns (9) are fixedly arranged on the top surface of the lifting plate (8), external threads are arranged at the upper end parts of the guide columns (9), and a locking nut (10) is connected to the external threads in a threaded mode.

2. The apparatus of claim 1, wherein the apparatus comprises: an overflow pipe (11) is arranged on the outer wall of the electroplating bath (1), a recovery tank (12) is arranged outside the electroplating bath (1), and the recovery tank (12) is arranged right below the overflow pipe (11).

3. The apparatus of claim 1, wherein the apparatus comprises: a plurality of cushion blocks (13) are fixedly arranged between the bottom wall of the supporting plate (3) and the supporting plate (3).

4. The apparatus of claim 1, wherein the apparatus comprises: the liquid supply device comprises a fresh electroplating liquid storage tank (14) and a pump (15) which are supported on the ground, wherein a liquid pumping port of the pump (15) is connected with the fresh electroplating liquid storage tank (14) through a pipeline, a liquid drainage port of the pump (15) is connected with a main pipeline (16), the other end of the main pipeline (16) is closed, and the main pipeline (16) is connected with a bottom port of each liquid outlet pipe (4).

5. The apparatus of claim 1, wherein the apparatus comprises: and a plurality of supporting legs supported on the ground are fixedly arranged at the bottom of the electroplating bath (1).

6. The apparatus of claim 1, wherein the apparatus comprises: the liquid outlet pipe (4) is welded on the support plate (3), and a sealing piece (17) is arranged between the liquid outlet pipe and the electroplating bath (1).

7. The apparatus of claim 1, wherein the apparatus comprises: a connecting plate (18) is fixedly arranged between the lifting plate (8) and the action end of the piston rod of the lifting oil cylinder (7).

8. An operating method for electroplating a through hole on an HDI board, which adopts the device for electroplating the through hole on the HDI board, as claimed in any one of claims 1 to 7, and is characterized in that: it comprises the following steps:

s1, a worker drills two positioning holes (21) corresponding to the guide columns (9) on the HDI plates (20) in advance to ensure that the diameters of the positioning holes (21) are equal to the outer diameters of the guide columns (9);

s2, positioning tool of HDI board, its concrete operating procedure is:

s21, screwing the locking nuts (10) on the two guide posts (9) out of the guide posts (9) by workers;

s22, after screwing out, respectively sleeving two positioning holes (21) in the HDI plate (20) on two guide columns (9) by a worker, supporting the HDI plate (20) on the top surface of the lifting plate (8), repeating the operation in such a way, namely stacking a plurality of HDI plates (20) on the lifting plate (8), screwing a locking nut (10) on the guide columns (9) again after the stacking is finished, and pressing the locking nut (10) against the top surface of the HDI plate (20) at the topmost layer under the threaded connection force, so that the positioning tool of the HDI plate is realized, at the moment, through holes (19) in all HDI plates (20) are correspondingly communicated and are in an aligned state, and all the through holes (19) are respectively positioned right above all reamers (6);

s3, removing burrs on the inner wall of the through hole in the HDI plate, controlling a piston rod of the lifting oil cylinder (7) to extend downwards by a worker, driving the connecting plate (18) and the lifting plate (8) to synchronously move downwards by the piston rod, thereby driving each HDI plate (20) to synchronously move downwards, and during the downward movement of the HDI plates, the static reamer (6) enters the through hole (19) from bottom to top relative to the moving HDI plate (20), because the outer diameter of the reamer (6) is equal to the diameter of the through hole (19), burrs attached to the inner wall of the through hole (19) are removed by the cutting edge on the circumferential direction of the reamer (6), when the piston rod of the lifting oil cylinder (7) is completely extended out, the burrs on the inner walls of the through holes (19) in the HDI plates (20) of all layers can be removed, at the moment, the reamer (6) is positioned above the HDI plate (20) at the topmost layer, an annular space is formed between the outer wall of the liquid outlet pipe (4) and the wall of the through hole (19);

s4, electroplating through holes of the HDI plates, namely, connecting the HDI plates (20) with negative electricity, connecting electroplating solution with positive electricity, then opening a pump (15) by a worker, pumping out new electroplating solution in a fresh electroplating solution storage tank (14) by the pump (15), a main pipeline (16), a lower port of a liquid outlet pipe (4), the liquid outlet pipe (4) and an inclined hole (5) under the pump pressure, forming a nickel layer on the inner walls of the through holes (19) after spraying the fresh electroplating solution on the inner walls of the through holes (19), enabling waste electroplating solution to flow out of an overflow pipe (11) and enter a recovery tank (12) to be collected along with the rise of the liquid level in the electroplating tank (1), and obtaining a nickel layer on the inner walls of the through holes (19) of the HDI plates (20) after a period of time, so that the electroplating of the HDI plates is realized;

and S5, after electroplating, controlling the piston rod of the lifting oil cylinder (7) to retract upwards, detaching the locking nut (10) from the guide post (9) after retraction, and detaching the finished HDI plate (20) from the guide post (9) so as to take out the product to prepare for next electroplating.

Technical Field

The invention relates to the technical field of HDI board electroplating, in particular to a device for electroplating a through hole on an HDI board and a working method thereof.

Background

At present, with the continuous development of electronic products, the electronic products are made more and more delicate, and the indispensable important components in the electronic products are circuit boards, which are further divided into high-order high-density circuit boards, HDI boards, IC circuit boards and the like, wherein the HDI boards are widely applied. The structure of HDI board is shown in fig. 1-2, and the HDI board includes that the multilayer compounds in the base plate of an organic whole, is provided with the conducting layer between the adjacent base plate, is provided with a plurality of through-holes 19 in the HDI board, and the nickel coating has been plated on the inner wall of through-hole 19, and the conducting layer electric conductance between each layer in the HDI board is with the nickel coating. The electroplating quality of the nickel layer on the inner wall of the through hole determines the quality of the whole HDI circuit board.

The production process of the HDI board comprises the steps that workers firstly stack a plurality of HDI boards together and immerse the HDI boards into a plating bath containing a nickel plating solution, negative electricity is connected to the HDI boards, positive electricity is connected to the nickel plating solution, and a layer of nickel layer can be plated in a through hole after a period of electroplating, so that the production of the HDI board is realized. However, although it is possible to electroplate a nickel layer in the through hole in the electroplating workshop, some technicians still have the following technical defects in actual operation: 1. remain on the inner wall of through-hole in the HDI board a large amount of burrs, electroplate the back of taking shape, cause the nickel layer and burr to combine together, the burr uses the electroplating area to diminish, not only lead to nickel layer thickness inhomogeneous, and the electrical property of the whole HDI board of very big reduction, in order to solve this problem, need the manual work again to the through-hole burring, but the quantity of through-hole is many, and the processing batch of HDI board is big, this can increase workman's working strength undoubtedly, the electroplating efficiency of HDI board has still been reduced simultaneously, consequently still not accord with actual production demand very much. 2. Along with the continuous progress of electroplating, the concentration of the nickel plating solution is gradually reduced, so that the thickness of a nickel layer is thinner and cannot meet the requirement, and the electroplating quality is greatly reduced.

Disclosure of Invention

The invention aims to overcome the defects of the prior art and provides a device for electroplating a through hole on an HDI board, which has a compact structure, improves the electrical performance of the HDI board, improves the electroplating quality of the HDI board and improves the electroplating efficiency, and a working method thereof.

The purpose of the invention is realized by the following technical scheme: a device for electroplating a through hole on an HDI plate comprises an electroplating bath, a portal frame erected above the electroplating bath and a liquid supply device arranged below the electroplating bath, wherein a support plate is fixedly arranged at the bottom of the electroplating bath, a plurality of liquid outlet pipes corresponding to the through holes on the HDI plate are fixedly arranged on the support plate, the outer diameter of each liquid outlet pipe is smaller than the diameter of each through hole, a plurality of inclined holes which are obliquely and upwards arranged are formed in the cylindrical surface of each liquid outlet pipe along the length direction of each liquid outlet pipe, the inclined holes are uniformly distributed on the liquid outlet pipes, a reamer coaxially arranged with the liquid outlet pipes is fixedly arranged at the top end parts of the liquid outlet pipes, the outer diameter of each reamer is equal to the diameter of each through hole, the bottom end parts of the liquid outlet pipes sequentially penetrate through the support plate and the bottom wall of the electroplating bath and extend to the outside of the electroplating bath, and the extending ends of the liquid outlet pipes are connected with the liquid supply device; the portal frame is characterized in that a lifting oil cylinder is fixedly arranged on a cross beam of the portal frame, a piston rod of the lifting oil cylinder penetrates through the cross beam and is arranged, a lifting plate is fixedly arranged on the extending end, the lifting plate is arranged above the supporting plate and located on the front side of the supporting plate, two guide columns are fixedly arranged on the top surface of the lifting plate, external threads are arranged at the upper end portions of the guide columns, and locking nuts are in threaded connection with the external threads.

An overflow pipe is arranged on the outer wall of the electroplating bath, a recovery tank is arranged outside the electroplating bath, and the recovery tank is arranged under the overflow pipe.

And a plurality of cushion blocks are fixedly arranged between the bottom wall of the supporting plate and the supporting plate.

The liquid supply device comprises a fresh electroplating liquid storage tank and a pump which are supported on the ground, a liquid pumping port of the pump is connected with the fresh electroplating liquid storage tank through a pipeline, a main pipeline is connected to a liquid discharge port of the pump, the other end of the main pipeline is sealed, and the main pipeline is connected with the bottom ports of the liquid discharge pipes.

And a plurality of supporting legs supported on the ground are fixedly arranged at the bottom of the electroplating bath.

The drain pipe is welded on the supporting plate, and a sealing element is arranged between the drain pipe and the electroplating bath.

And a connecting plate is fixedly arranged between the lifting plate and the action end of the piston rod of the lifting oil cylinder.

A working method for electroplating a through hole on an HDI board comprises the following steps:

s1, a worker drills two positioning holes corresponding to the guide columns on the HDI boards in advance to ensure that the diameters of the positioning holes are equal to the outer diameters of the guide columns;

s2, positioning tool of HDI board, its concrete operating procedure is:

s21, screwing the locking nuts on the two guide posts out of the guide posts by workers;

s22, after screwing out, respectively sleeving two positioning holes in the HDI plate on two guide columns by a worker, supporting the HDI plate on the top surface of the lifting plate, repeating the operation, stacking a plurality of HDI plates on the lifting plate, screwing a locking nut on the guide columns again after the stacking is finished, and pressing the locking nut against the top surface of the top HDI plate under the threaded connection force, so that the positioning tool of the HDI plate is realized, at the moment, through holes in all the HDI plates are correspondingly communicated and are in an aligned state, and all the through holes are respectively positioned right above all the reamers;

s3, removing burrs on the inner wall of the through hole in the HDI plate, controlling a piston rod of a lifting oil cylinder to extend downwards by a worker, driving a connecting plate and the lifting plate to move downwards synchronously by the piston rod, further driving all the HDI plates to move downwards synchronously, wherein in the downward movement process of the HDI plates, a static reamer enters the through hole from bottom to top relative to the moving HDI plates, and the burrs attached to the inner wall of the through hole are removed by blades on the circumferential direction of the reamer due to the fact that the outer diameter of the reamer is equal to the diameter of the through hole;

s4, electroplating the HDI board through hole, connecting the HDI board with negative electricity, connecting the electroplating solution with positive electricity, then opening a pump by a worker, pumping out the new electroplating solution in a fresh electroplating solution storage tank by the pump, sequentially pumping out the electroplating solution through the pump, a main pipeline, a lower port of a liquid outlet pipe, the liquid outlet pipe and an inclined hole under the pump pressure, and finally entering the annular gap, wherein a nickel layer is formed on the inner wall of the through hole after the fresh electroplating solution is sprayed on the inner wall of the through hole, and the waste electroplating solution flows out of an overflow pipe and enters a recovery tank to be collected along with the rise of the liquid level in the electroplating tank, and after a period of time, a nickel layer can be obtained on the inner wall of each through hole of each HDI board, so that the electroplating of the HDI board is realized;

and S5, after electroplating, controlling the piston rod of the lifting oil cylinder to retract upwards, detaching the locking nut from the guide post after retraction, and detaching the finished HDI plate from the guide post, so as to take out the product to prepare for next electroplating.

The invention has the following advantages: compact structure, improvement HDI board electric property, improvement HDI board electroplating quality, improvement electroplate efficiency.

Drawings

FIG. 1 is a schematic structural diagram of an HDI plate;

FIG. 2 is a top view of FIG. 1;

FIG. 3 is a schematic structural view of the present invention;

FIG. 4 is a cross-sectional view A-A of FIG. 3;

FIG. 5 is a schematic view of the connection of the liquid outlet pipe and the reamer;

FIG. 6 is a schematic main section view of FIG. 5;

FIG. 7 is a schematic view after a positioning hole is drilled in the HDI plate;

FIG. 8 is a schematic view of a positioning tool with multiple HDI plates;

FIG. 9 is a schematic view of the present invention in an electroplating station;

FIG. 10 is an enlarged view of a portion I of FIG. 9;

in the figure, 1-plating bath, 2-gantry, 3-support plate, 4-liquid outlet pipe, 5-inclined hole, 6-reamer, 7-lift cylinder, 8-lift plate, 9-guide column, 10-locking nut, 11-overflow pipe, 12-recovery tank, 13-cushion block, 14-fresh plating solution storage tank, 15-pump, 16-main pipe, 17-sealing element, 18-connecting plate, 19-through hole, 20-HDI plate, 21-locating hole.

Detailed Description

The invention will be further described with reference to the accompanying drawings, without limiting the scope of the invention to the following:

as shown in figures 3-6, a device for electroplating a through hole on an HDI plate comprises an electroplating bath 1, a portal frame 2 erected above the electroplating bath 1, and a liquid supply device arranged below the electroplating bath 1, wherein a plurality of support legs supported on the ground are fixedly arranged at the bottom of the electroplating bath 1, a support plate 3 is fixedly arranged at the bottom of the electroplating bath 1, a plurality of liquid outlet pipes 4 corresponding to the through holes 19 on the HDI plate are fixedly arranged on the support plate 3, the outer diameter of the liquid outlet pipes 4 is smaller than the diameter of the through holes 19, a plurality of inclined holes 5 which are obliquely and upwardly arranged are arranged on the cylindrical surface of the liquid outlet pipes 4 along the length direction of the liquid outlet pipes 4, the inclined holes 5 are uniformly distributed on the liquid outlet pipes 4, a reamer 6 which is coaxially arranged with the liquid outlet pipes 4 is fixedly arranged at the top of the liquid outlet pipes 4, the outer diameter of the reamer 6 is equal to the diameter of the through holes 19, the bottom end of the liquid outlet pipes 4 penetrates through the support plate 3 and the bottom wall of the electroplating bath 1 in sequence and extends to the outside of the electroplating bath 1, the extending end of the liquid outlet pipe 4 is connected with the liquid supply device; the portal frame 2 is characterized in that a lifting oil cylinder 7 is fixedly arranged on a cross beam of the portal frame 2, a piston rod of the lifting oil cylinder 7 penetrates through the cross beam, a lifting plate 8 is fixedly arranged on an extending end, the lifting plate 8 is arranged above the supporting plate 3 and located on the front side of the supporting plate 3, two guide posts 9 are fixedly arranged on the top surface of the lifting plate 8, external threads are arranged at the upper end portions of the guide posts 9, and locking nuts 10 are in threaded connection with the external threads. An overflow pipe 11 is arranged on the outer wall of the electroplating bath 1, a recovery tank 12 is arranged outside the electroplating bath 1, and the recovery tank 12 is arranged right below the overflow pipe 11. And a plurality of cushion blocks 13 are fixedly arranged between the bottom wall of the supporting plate 3 and the supporting plate 3.

The liquid supply device comprises a fresh electroplating liquid storage tank 14 and a pump 15 which are supported on the ground, a liquid pumping port of the pump 15 is connected with the fresh electroplating liquid storage tank 14 through a pipeline, a main pipeline 16 is connected at a liquid discharge port of the pump 15, the other end of the main pipeline 16 is closed, and the main pipeline 16 is connected with the bottom port of each liquid outlet pipe 4. The liquid outlet pipe 4 is welded on the support plate 3, and a sealing piece 17 is arranged between the liquid outlet pipe and the electroplating bath 1. And a connecting plate 18 is fixedly arranged between the lifting plate 8 and the action end of the piston rod of the lifting oil cylinder 7.

A working method for electroplating a through hole on an HDI board comprises the following steps:

s1, a worker drills two positioning holes 21 corresponding to the guide columns 9 on the HDI plates 20 in advance, and the structure of the HDI plates 20 after drilling is as shown in FIG. 7, so that the diameter of the positioning holes 21 is equal to the outer diameter of the guide columns 9;

s2, positioning tool of HDI board, its concrete operating procedure is:

s21, screwing the locking nuts 10 on the two guide posts 9 out of the guide posts 9 by a worker;

s22, after screwing out, respectively sleeving two positioning holes 21 in the HDI plate 20 on two guide posts 9 by a worker, supporting the HDI plate 20 on the top surface of the lifting plate 8, repeating the operation, namely stacking a plurality of HDI plates 20 on the lifting plate 8, screwing locking nuts 10 on the guide posts 9 again after the stacking is finished, and abutting the locking nuts 10 against the top surface of the top HDI plate 20 under the threaded connection force, so that the HDI plate positioning tool is realized as shown in FIG. 8, at the moment, the through holes 19 in the HDI plates 20 on all layers are correspondingly communicated and are in an aligned state, and the through holes 19 are respectively positioned right above the reamers 6;

s3, removing burrs on the inner wall of the through hole in the HDI plate, controlling a piston rod of a lifting oil cylinder 7 to extend downwards, driving a connecting plate 18 and a lifting plate 8 to move downwards synchronously by the piston rod, further driving all the HDI plates 20 to move downwards synchronously, wherein in the downward movement process of the HDI plates, a static reamer 6 enters the through hole 19 from bottom to top relative to the moving HDI plates 20, and the burrs attached to the inner wall of the through hole 19 are removed by blades on the circumferential direction of the reamer 6 due to the fact that the outer diameter of the reamer 6 is equal to the diameter of the through hole 19, and after the piston rod of the lifting oil cylinder 7 extends completely, the burrs on the inner wall of each through hole 19 in each HDI plate 20 can be removed, at the moment, the reamer 6 is located above the top HDI plate 20, and an annular space gap is formed between the outer wall of a liquid outlet pipe 4 and the wall of the through hole 19 as shown in fig. 9;

s4, electroplating through holes of the HDI plates, namely, connecting the HDI plates 20 with negative electricity, connecting electroplating solution with positive electricity, then opening a pump 15 by a worker, pumping out new electroplating solution in a fresh electroplating solution storage tank 14 by the pump 15, sequentially pumping out the electroplating solution through the pump 15, a main pipeline 16, a lower port of a liquid outlet pipe 4, the liquid outlet pipe 4 and an inclined hole 5 under the pump pressure, and finally entering an annular gap, wherein a nickel layer is formed on the inner wall of each through hole 19 after the fresh electroplating solution is sprayed on the inner wall of the through hole 19, the waste electroplating solution flows out from an overflow pipe 11 and enters a recovery tank 12 to be collected along with the rise of the liquid level in the electroplating tank 1, and after a period of time, a nickel layer can be obtained on the inner wall of each through hole 19 of each HDI plate 20, so that the electroplating of the HDI plates is realized;

and S5, after electroplating, controlling the piston rod of the lifting oil cylinder 7 to retract upwards, detaching the locking nut 10 from the guide post 9 after retraction, and detaching the finished HDI plate 20 from the guide post 9 so as to take out the product to prepare for next electroplating. Therefore, the device has realized the continuous electroplating to a plurality of HDI boards, very big improvement the uniformity of electroplating, simultaneously very big improvement electroplating quality and electroplating efficiency.

Since the burrs on the inner walls of the through holes 19 in the HDI boards 20 of the respective layers have been removed in advance in step S3, the plated layers do not combine with the burrs, the nickel layer is made more uniform, and the electrical properties of the HDI boards are greatly improved. In addition, in step S4, continuously replenishing the fresh electroplating solution into each through hole 19 of each HDI board 20 by the solution supply device, so as to ensure the consistency of the concentration of the electroplating solution in each through hole 19 and ensure that the concentration of the electroplating solution in each through hole 19 does not decrease, thereby greatly increasing the thickness of the nickel layer and further improving the electroplating quality of the HDI board compared with the conventional replenishment method.

Finally, it should be noted that: although the present invention has been described in detail with reference to the foregoing embodiments, it will be apparent to those skilled in the art that changes may be made in the embodiments and/or equivalents thereof without departing from the spirit and scope of the invention. Any modification, equivalent replacement, or improvement made within the spirit and principle of the present invention should be included in the protection scope of the present invention.