阅读说明：本技术 积层成型装置 (Lamination forming device ) 是由 川田秀一 村中胜隆 加藤善考 于 2021-05-26 设计创作，主要内容包括：本发明提供积层成型装置,包括：照射装置,对于成型区域,对在将所需的三维成型物以既定高度进行分割而成的多个分割层的每一个上所形成的材料层照射光束而形成固化层；以及温度调整装置,与固化层积层而成的固化体的包含上表面的一部分或全部抵接而加热及冷却至设定温度,温度调整装置包括加热及冷却至设定温度的调温板,且包括在调温板沿着垂直方向的起立状态与沿着水平方向的横卧状态之间使调温板转动的转动部,转动部在不利用温度调整装置来对固化体的包含上表面的一部分或全部进行加热及冷却时,将调温板设定为起立状态,且在利用温度调整装置来对固化体的包含上表面的一部分或全部进行加热及冷却时,将调温板设定为所述横卧状态。(The present invention provides an lamination molding apparatus, including: an irradiation device that irradiates a material layer formed on each of a plurality of divided layers obtained by dividing a desired three-dimensional molded product into a predetermined height, with a light beam, and forms a solidified layer in a molding region; and a temperature adjusting device which is in contact with a part or all of the solidified body including the upper surface formed by laminating the solidified layers and heats and cools the solidified body to a set temperature, wherein the temperature adjusting device comprises a temperature adjusting plate which heats and cools the solidified body to the set temperature, and comprises a rotating part which rotates the temperature adjusting plate between a standing state along the vertical direction and a lying state along the horizontal direction, the rotating part sets the temperature adjusting plate to the standing state when the temperature adjusting device is not used for heating and cooling the part or all of the solidified body including the upper surface, and sets the temperature adjusting plate to the lying state when the temperature adjusting device is used for heating and cooling the part or all of the solidified body including the upper surface.)

1. An additive layer molding apparatus, comprising:

an irradiation device that irradiates a material layer formed on each of a plurality of divided layers obtained by dividing a desired three-dimensional molded product into a predetermined height, with a light beam, and forms a solidified layer in a molding region; and a temperature adjusting device which is contacted with a part or all of the upper surface of the solidified body formed by laminating the solidified layers and is heated and cooled to a set temperature;

the temperature adjustment device includes:

a temperature-adjusting plate which is heated and cooled to the set temperature, and includes:

a rotating unit that rotates the temperature control plate between a standing state in which the temperature control plate is vertically oriented and a lying state in which the temperature control plate is horizontally oriented; and is

The rotating unit sets the temperature control plate to the upright state when heating and cooling a part or all of the upper surface of the solidified body without using the temperature control device, and sets the temperature control plate to the lying state when heating and cooling a part or all of the upper surface of the solidified body using the temperature control device.

2. The overmolding device of claim 1, wherein the temperature-regulating plate includes a thermoelectric element.

3. The build-up molding apparatus according to claim 1, wherein the build-up molding apparatus includes a mounting portion that connects the temperature-adjusting plate with the rotating portion, and

the installation part comprises a ball joint fixed on the back surface of the temperature adjusting plate and a receiving piece connected with the ball joint.

4. The build-up molding apparatus according to claim 1, wherein the temperature adjusting device includes a locking member coupled to a driving device, the locking member being a cylinder, the cylinder being operated to protrude a pin body and fit the pin body to a locking hole of the driving device when the temperature adjusting device is coupled to the driving device; and is

When heating and cooling a part or all of the solidified body including the upper surface, the locking member is connected to the driving device, and is moved by the movement of the driving device from a retracted position separated from the molding region to a processing position adjacent to the molding region where heating and cooling are performed.

5. The build-up molding apparatus according to claim 4, wherein the driving device is a coating head that reciprocates in a horizontal uniaxial direction to supply material powder and planarizes the material powder to form the material layer, and the temperature adjusting device is coupled to the coating head and reciprocates in the horizontal uniaxial direction.

6. The laminating apparatus of claim 1, wherein the temperature adjustment device of the laminating apparatus is fixed to a back surface of the working door.

Technical Field

The present invention relates to a lamination molding apparatus for three-dimensional molded articles.

Background

In the metal build-up molding method, for example, a desired three-dimensional molded product is produced by building up a material powder containing a metal material on a vertically movable molding table in a closed chamber filled with an inert gas, irradiating a predetermined portion of the built-up material layer with laser light or electron beams, melting or sintering the material powder at the irradiation position to form a plurality of solidified layers, and building up the plurality of solidified layers. Here, the solidified layer includes a molten layer and a sintered layer. The laminated cured layer is referred to as a cured body.

In the metal laminate molding as described above, the temperature of the three-dimensional molded article after molding or the cured layer during molding may be adjusted. For example, patent documents 1 and 2 disclose inventions of a build-up molding apparatus and a method for producing a three-dimensional molded product, which are capable of suppressing deformation of a molded product by intentionally performing martensite transformation for each formation of one or more solidified layers, reducing tensile stress caused by contraction of a metal by utilizing compressive stress caused by martensite transformation, and controlling residual stress of the molded product. Here, in order to intentionally perform martensite transformation, a predetermined temperature adjustment is performed for each of the one or more solidified layers formed.

[ Prior art documents ]

[ patent document ]

[ patent document 1] Japanese patent No. 6295001 publication

[ patent document 2] Japanese patent application No. 2018-234241

Disclosure of Invention

[ problems to be solved by the invention ]

However, in the case of the laminate molding method as described in patent document 1, the solidified layer is cooled and heated, but conventionally, the temperature of the solidified layer is adjusted by a temperature adjusting mechanism disposed in the molding stage, and therefore, every time one or more solidified layers are formed, the entire laminated solidified body must be cooled and heated. When the temperature adjustment method as described above is performed, a long time is required for temperature adjustment, and the temperature response time of the upper surface of the solidified body differs depending on the height of the solidified body, so that there arises a problem that the cooling waiting time is not determined.

The problems in the temperature adjustment mechanism disposed in the molding stage can be expected to be solved by the following temperature adjustment method: as described in patent document 2, a temperature adjusting device is provided in the processing head, and a cooling plate is brought into close contact with the upper surface of the stacked solidified body.

However, it is found that the progress of martensite transformation can be further promoted not only by cooling the upper surface of the laminated solidified body but also by heating. Therefore, the following simple mechanism is desired so as not to hinder other steps: the upper surface of the solidified body can be cooled and heated, and the self-heating can be switched to the cooling in a shorter time.

Further, strictly speaking, since the parallelism of the upper surface of the solidified body is different for each layer, if the upper surface of the solidified body is disposed only by rotating the cooling plate from the standing state to the lying state, the upper surface of the solidified body and the cooling plate are not properly brought into contact with each other, and the cooling plate is brought into contact with only a part of the upper surface of the solidified body, and the upper surface of the solidified body may not be uniformly cooled. As described above, even when the parallelism of the solidified body is poor, the upper surface of the solidified body can be heated and cooled more efficiently as long as the upper surface of the solidified body can be uniformly cooled.

The present invention has been made in view of the above circumstances, and an object thereof is to provide a three-dimensional molded product build-up molding apparatus capable of rapidly and uniformly heating and cooling the upper surface of a solidified body without interfering with other steps.

[ means for solving problems ]

The lamination molding apparatus of the present invention includes: an irradiation device that irradiates a material layer formed on each of a plurality of divided layers obtained by dividing a desired three-dimensional molded product into a predetermined height, with a light beam, and forms a solidified layer in a molding region; and a temperature adjustment device that is brought into contact with a part or all of the cured body including the upper surface of the cured body formed by laminating the cured layers and heats and cools the cured body to a set temperature, wherein the temperature adjustment device includes a temperature adjustment plate that heats and cools the cured body to the set temperature, and includes a rotation portion that rotates the temperature adjustment plate between a standing state in which the temperature adjustment plate is in a vertical direction and a lying state in a horizontal direction, and the rotation portion sets the temperature adjustment plate to the standing state when the temperature adjustment device is not used to heat and cool the part or all of the cured body including the upper surface, and sets the temperature adjustment plate to the lying state when the temperature adjustment device is used to heat and cool the part or all of the cured body including the upper surface.

The set temperatures are specifically the molding temperature T1 and the cooling temperature T2.

According to the present invention, the temperature control device provided in the build-up molding device can not only cool the upper surface of the solidified body but also heat the upper surface, and can further promote the progress of the martensitic transformation. Further, since a simple mechanism for switching the temperature control plate between the standing state and the lying state is mounted, the temperature control plate is set to the standing state when the temperature of the upper surface of the cured body is not adjusted, and the temperature control plate is set to the lying state when the temperature of the upper surface of the cured body is adjusted, whereby the temperature of the upper surface of the cured body can be appropriately adjusted without hindering other steps.

The lamination molding device of the invention: the temperature-regulating plate includes a thermoelectric element.

According to the present invention, since the temperature control plate includes the thermoelectric element, the temperature control plate can be switched from the heating state to the cooling state in a shorter time, and the solidified layer forming step can be performed quickly.

The lamination molding device of the invention: include will the temperature regulation board with the installation department that the rotation portion is connected, the installation department including be fixed in the ball joint at the temperature regulation board back and with the accepting piece that the ball joint is connected.

According to the present invention, since the rotating portion and the temperature control plate are slidably connected via the mounting portion, even when the parallelism of the solidified body is poor, the temperature control plate reliably comes into contact with the upper surface of the solidified body, and the upper surface of the solidified body can be uniformly cooled.

The lamination molding device of the invention: the temperature adjusting device includes a locking member connected to a driving device, the locking member is a cylinder, when the temperature adjusting device is connected to the driving device, the cylinder is operated to protrude a pin body and fit the pin body into a locking hole of the driving device, when heating and cooling a part or all of the solidified body including an upper surface, the locking member is connected to the driving device, and by movement of the driving device, the locking member is moved from a retreat position separated from the molding region to a processing position adjacent to the molding region where heating and cooling are performed.

Further, the build-up molding apparatus of the present invention: the temperature adjusting device is fixed on the back of the operation door leaf.

According to the present invention, the following structure can be adopted: the temperature adjusting device is disposed at a processing position adjacent to the molding area when the temperature of the upper surface of the cured body is adjusted, and is disposed at a retracted position away from the molding area when the temperature of the upper surface of the cured body is not adjusted. Further, the temperature adjustment device may be fixed to the back surface of the working door.

By adopting the arrangement structure of the temperature adjusting device as described above, the temperature adjusting device does not obstruct other devices and other steps when the cured layer forming step is performed.

The lamination molding device of the invention: the driving device is a coating head that reciprocates in a horizontal uniaxial direction to supply material powder and planarizes the material powder to form the material layer, and the temperature adjusting device is coupled to the coating head and reciprocates in the horizontal uniaxial direction.

According to the present invention, since the driving mechanism for reciprocating the temperature adjusting device also serves as the driving mechanism of the coating head, it is not necessary to provide an additional driving mechanism for the temperature adjusting device, and the function of the temperature adjusting device can be realized with a simpler structure.

[ Effect of the invention ]

According to the build-up molding apparatus of the present invention, when the temperature of the solidified material is adjusted, the temperature control plate heated and cooled is brought into contact with the upper surface of the solidified material while being laid down, so that the temperature of the solidified material can be increased or decreased more quickly, and the progress of the martensite transformation can be promoted.

Further, since the arrangement of the temperature-adjusting plate can be switched from the standing state to the lying state, the cutting step or other steps such as the entrance and exit of the three-dimensional molded object are not hindered.

Further, by connecting the temperature control plate slidably with respect to the rotating portion, when the temperature control plate is in the lying state, the temperature control plate is inclined in accordance with the parallelism of the upper surface of the solidified body, whereby the temperature control plate is firmly brought into contact with the upper surface of the solidified body, and a build-up molding apparatus capable of performing uniform cooling can be provided.

Drawings

Fig. 1 is a schematic front view of an build-up molding apparatus 100 according to a first embodiment of the present invention.

Fig. 2 is a schematic side view of the build-up molding apparatus 100 according to the embodiment of the present invention.

Fig. 3 is a schematic perspective view of the material layer forming apparatus 3 and the irradiation apparatus 13 according to the embodiment of the present invention.

Fig. 4 is a schematic configuration diagram of the molding bed 5 including the bed temperature adjusting device 90 according to the embodiment of the present invention.

Fig. 5 is a front perspective view of the temperature adjustment device 60 according to the embodiment of the present invention.

Fig. 6 is a rear perspective view of the temperature adjustment device 60 according to the embodiment of the present invention.

Fig. 7 is an enlarged front perspective view of the temperature adjustment device 60 according to the embodiment of the present invention.

Fig. 8 is an enlarged rear perspective view of the temperature adjustment device 60 according to the embodiment of the present invention.

Fig. 9 is a side view of the temperature adjustment device 60 in a case where the temperature control plate 61 according to the embodiment of the present invention is set to a standing state.

Fig. 10 is a side view of the temperature adjustment device 60 in a state where the temperature control plate 61 according to the embodiment of the present invention is lying down.

Fig. 11 is an explanatory view (standby state) of a cured layer forming step using the build-up molding apparatus 100 according to the embodiment of the present invention.

Fig. 12 is an explanatory view (pre-rotation state) of a cured layer forming step using the build-up molding apparatus 100 according to the embodiment of the present invention.

Fig. 13 is an explanatory view (post-rotation state) of a cured layer forming step using the build-up molding apparatus 100 according to the embodiment of the present invention.

Fig. 14 is an explanatory view (temperature detection step) of a cured layer forming step using the build-up molding apparatus 100 according to the embodiment of the present invention.

Fig. 15 is a flowchart showing a cured layer forming step using the build-up molding apparatus 100 according to the embodiment of the present invention.

Fig. 16 is a schematic side view of an build-up molding apparatus 200 according to a second embodiment of the present invention.

Fig. 17 is a rear perspective view of temperature adjustment device 260 according to the embodiment of the present invention.

Fig. 18 is a side view of the temperature adjustment device 260 in which the temperature control plate 61 according to the embodiment of the present invention is set to a standing state.

Fig. 19 is a side view of the temperature adjustment device 260 in which the temperature control plate 61 according to the embodiment of the present invention is placed in a recumbent state.

Fig. 20 is an explanatory view (post-rotation state) of a cured layer forming step using the build-up molding apparatus 200 according to the embodiment of the present invention.

Fig. 21 is a flowchart showing a cured layer forming step using the build-up molding apparatus 200 according to the embodiment of the present invention.

Fig. 22 is an explanatory view showing a cured layer forming step using the build-up molding apparatus 100 according to the embodiment of the present invention.

[ description of symbols ]

1: chamber

1 a: protective window

1 b: opening of the container

1 c: operation door leaf

1 d: peep window

1e, 1t, 65: locking member

3: material layer forming apparatus

4: base station

5: forming platform

5 a: top board

5b, 5c, 5 d: supporting plate

8: material layer

11: coating machine head

11 a: material containing part

11 b: material supply part

11 c: guide mechanism

12: blade

13: irradiation device

14L, 14R: bearing assembly

15: inert gas supply device

16L, 16R, 64 a: guide rail

17: device for preventing pollution of protective window

17 a: basket body

17 b: opening part

17 c: diffusion member

17 d: inert gas supply space

17 e: pores of fine

17 f: clean room

18: locking hole

19: smoke collector

21. 23: conduit box

26: powder holding wall

31: driving mechanism of forming platform

33: base plate

40: control device

42: light source

43: current scanner

43a, 43 b: galvanometer mirror

44: focus control unit

50: cutting device

51: machining head

52: spindle head

60. 260: temperature adjusting device

61: temperature adjusting plate

61 a: heating and cooling plate

61 b: thermoelectric element

61 c: wire connecting part

62: mounting part

621: back surface mounting part

621 a: ball joint

622: lower mounting part

622 a: receiving member

63. 263: rotating part

64 b: slider

65: stop member for conveying (Cylinder)

65 b: pin body

66: hole for fixing position

267: working door leaf mounting part

70: temperature measuring unit

70 a: temperature sensor

70 b: temperature sensor lifting device

81: cured body

81a, 81 b: solidified layer

90: platform temperature adjusting device

92: heating device

93: cooling device

100. 200: lamination forming device

B. C, U: shaft

L: laser light

R: forming area

PE: retreat position

PT: heating and cooling position (treatment position)

S101 to S113, S201, S202: step (ii) of

Detailed Description

< 1. first embodiment >

Hereinafter, embodiments of the present invention will be described with reference to the drawings. Various feature items shown in the embodiments shown below can be combined with each other. In addition, the present invention is constituted independently of each other. In the following description, the directions of the X, Y, and Z axes are defined as shown in fig. 1 and 2. Specifically, the predetermined horizontal uniaxial direction is referred to as an X-axis, the other horizontal uniaxial direction orthogonal to the X-axis is referred to as a Y-axis, and the predetermined vertical uniaxial direction is referred to as a Z-axis.

In the build-up molding apparatus according to the embodiment, the control axis in the horizontal uniaxial direction, which is the moving direction of the coating head 11, is defined as the B axis, the horizontal uniaxial direction orthogonal to the B axis of the coating head 11 is defined as the C axis, and the control axis in the vertical uniaxial direction, which is the moving direction of the molding table 5, is defined as the U axis. Further, in the machine-related apparatus for the build-up molding apparatus, the side of the cavity 1 on which the working door 1c is provided is a front surface or a front surface, and faces the front surface, the right-hand side is a right-hand side, the left-hand side is a left-hand side, and the rear side is a rear surface. The dotted line in the figure indicates an irradiation path or a signal line of the laser light L.

(1.1 build-up molding apparatus 100)

Fig. 1 is a schematic front view of an build-up molding apparatus 100 according to a first embodiment of the present invention, and fig. 2 is a schematic side view of the build-up molding apparatus 100 according to the embodiment of the present invention. Fig. 3 is a schematic perspective view of the material layer forming apparatus 3 and the irradiation apparatus 13 according to the embodiment of the present invention. Fig. 5 is a front perspective view of the temperature adjustment device 60 according to the embodiment of the present invention, and fig. 6 is a rear perspective view of the temperature adjustment device 60 according to the embodiment of the present invention.

The multilayer molding apparatus 100 according to the embodiment of the present invention forms the material layer 8, and repeats the step of melting or sintering by irradiating the irradiation region of the material layer 8 with, for example, a beam of laser light L, thereby laminating a plurality of cured layers to generate a three-dimensional molded product having a desired shape.

The lamination molding apparatus 100 of the present invention includes: a chamber 1, an inert gas supply device 15, a protection window contamination prevention device 17, a mist collector 19, a molding stage 5, an irradiation device 13, a material layer forming device 3, a control device 40, a cutting device 50, a temperature adjustment device 60, a temperature measurement unit 70, and a stage temperature adjustment device 90. The chamber 1 covers a predetermined molding region R and is filled with an inert gas of a predetermined concentration.

The chamber 1 is a housing of the build-up molding apparatus 100, and is internally provided with a material layer forming apparatus 3, and the material layer forming apparatus 3 forms a material layer on each of a plurality of divided layers obtained by dividing a desired three-dimensional molded product at a predetermined height in a molding region R. An opening 1b is formed in the front surface of the chamber 1, and an operation door 1c with a peep window is provided in the opening 1b (fig. 2).

The working door 1c may be of a hinged opening/closing type, may be rotatably provided in the opening 1b, or may be of a sliding type in a left-right or up-down direction. By opening and closing the working door 1c, the three-dimensional molded product can be taken out, and the powder of the unsintered material and the like can be removed.

On the back surface of the working door 1c, a temperature adjusting device 60 (described later) is provided so as to be movable in the B-axis direction along the inner surface of the chamber 1 (fig. 2).

Specifically, a temperature adjustment device guide 64a (fig. 5 and 7) is provided close to the guide 16R of the coating head 11 so as to be parallel to the guide 16R of the coating head 11 described later along the B-axis direction which is the moving direction of the coating head 11. One end of the temperature adjustment device guide 64a is separated from the molding region R and extends to a position (retracted position PE) retracted from the back surface of the working door 1c, and the other end is provided adjacent to the molding region R to a processing position (heating/cooling position PT) for heating and cooling the upper surface of the solidified body 81.

When the temperature adjustment device 60 moves in the B axis direction, the temperature adjustment device 60 is connected to the coating head 11, and the coating head 11 serves as a driving device for the temperature adjustment device 60 and reciprocates in the B axis direction by the driving force of the coating head 11.

Further, at a retreat position PE (fig. 5) of the temperature adjusting device 60 of the chamber 1, a retreat position locking member 1e is provided, and at a heating and cooling position PT (fig. 5), a heating and cooling position locking member 1t is provided.

The retreat position locking member 1e and the heating/cooling position locking member 1t are members for engaging with the position fixing hole 66 of the temperature adjusting device 60, and the retreat position locking member 1e and the heating/cooling position locking member 1t are, for example, a fluid pressure cylinder and an electric cylinder. The retreat position locking member 1e and the heating/cooling position locking member 1t each include a pin body, and the pin body can be freely advanced and retracted in the position fixing hole 66 of the temperature adjusting device 60 by the operation of the cylinder. When the temperature adjusting device 60 is in a standby state or during a heating and cooling process, the cylinder is operated to protrude the pin body, and the pin body is inserted into the position fixing hole 66 and fitted, thereby fixing the temperature adjusting device 60 to the chamber 1. On the other hand, when the temperature adjusting device 60 is moved, the cylinder is operated to draw in the pin body, and the pin body is pulled out from the position fixing hole 66 to release the connection with the chamber 1.

The material layer forming apparatus 3 includes a base 4 and a coating head 11. In the present embodiment, the material forming the material layer 8 includes material powder. The material powder is, for example, a metal powder, for example, a spherical powder having an average particle diameter of 20 μm.

The base 4 includes a molding region R for forming a desired three-dimensional molded object. The molding region R is provided on the molding stage 5. The forming table 5 is movable in the vertical direction (the direction of the arrow U axis in fig. 1) by a forming table driving mechanism 31. In the present embodiment, when the build-up molding apparatus is used, the base plate 33 is disposed on the molding table 5, and the material layer 8 of the first layer is formed thereon. The irradiation region of the material layer 8 is present in the molding region R and substantially coincides with a region defined by the contour shape of the desired three-dimensional molded product.

A powder holding wall 26 is provided around the molding table 5. The uncured material powder is held in the powder holding space surrounded by the powder holding wall 26 and the molding table 5. A powder discharge unit capable of discharging the material powder in the powder holding space may be provided below the powder holding wall 26.

A platen temperature adjusting device 90 for adjusting the temperature of the molding platen 5 is provided inside the molding platen 5. As shown in fig. 4, the molding stage 5 including the stage temperature adjusting device 90 includes a top plate 5a and three support plates 5b, 5c, 5 d. A heater 92 capable of heating the top plate 5a is disposed between the top plate 5a and the support plate 5b adjacent thereto. A cooler 93 capable of cooling the top plate 5a is disposed between the two support plates 5c and 5d below the support plate 5 b. The molding stage 5 is configured to be temperature-adjustable by a heater 92 and a cooler 93, and the heater 92 and the cooler 93 constitute a stage temperature adjusting device 90. In order to prevent thermal displacement of the platen driving mechanism 31, a constant temperature portion that is maintained at a constant temperature may be provided between the platen temperature adjusting device 90 and the platen driving mechanism 31. By configuring the stage temperature adjusting device 90 in the above manner, the bottom plate 33 and the solidified layer of the lower layer which are in contact with the top plate 5a of the molding stage 5 set to a desired temperature can be adjusted to the desired temperature. In addition, the material layer 8 is desirably preheated to a predetermined temperature at the time of sintering or melting, and the stage temperature adjusting device 90 functions as a preheating device for the material layer 8.

The coating head 11 shown in fig. 3 includes: a material storage section 11a, a material supply section 11b, a material discharge section not shown, and a guide mechanism 11 c. The material storage portion 11a stores material powder. The material supply unit 11b is provided on the upper surface of the material storage unit 11a, and serves as a receiving port for the material powder supplied from a material supply device, not shown, to the material storage unit 11 a. The material discharge unit is provided on the bottom surface of the material storage unit 11a and discharges the material powder in the material storage unit 11 a. The material discharge portion is formed in a slit shape extending in a horizontal uniaxial direction (arrow C axis direction) orthogonal to the moving direction (arrow B axis direction) of the coating head 11. Further, blades 12 are provided on both side surfaces of the coating head 11, respectively. The blade 12 flattens the material powder discharged from the material discharge portion to form the material layer 8.

The guide mechanism 11c includes: a pair of bearings 14R, 14L; guide rails 16R and 16L as a pair of shaft members supported by the bearings 14R and 14L, respectively; and a servo motor not shown. The coating head 11 is reciprocated by a servo motor in the B axis direction on the forming table 5 along the guide rails 16R and 16L of the guide mechanism 11c based on a scanning command from the control device 40.

Further, a side plate of the bearing 14R of the guide mechanism 11c is provided with a locking hole 18 for fixing the temperature adjustment device 60 to the coater head 11. The locking hole 18 may have any shape as long as it is engaged with the conveying locking member 65 provided in the temperature adjustment device 60, and examples thereof include: grooves or non-through holes, etc.

An inert gas of a predetermined concentration is supplied into the chamber 1, and the inert gas containing fumes generated at the time of melting of the material layer 8 is discharged. Preferably, the fumes are removed from the inert gas exhausted from the chamber 1 and returned to the chamber 1. Specifically, in the chamber 1, the mist collector 19 and the inert gas supply device 15 are connected via a conduit box 21 and a conduit box 23. The positions and the number of the inert gas supply ports and the exhaust ports provided in the chamber 1 are not particularly limited. In the present invention, the inert gas means a gas that does not substantially react with the material, and an appropriate gas is selected from nitrogen, argon, helium, and the like, depending on the type of the material.

The inert gas supply device 15 has a function of supplying an inert gas, and is, for example, an inert gas generator that generates an inert gas of a predetermined concentration from the ambient air or a gas bomb that stores an inert gas of a predetermined concentration. The inert gas generator may employ various types of devices such as a membrane separation system and a Pressure Swing Adsorption (PSA) system, depending on the type and concentration of the inert gas to be generated. The inert gas supply device 15 supplies an inert gas from a supply port provided in the chamber 1 to fill the chamber 1 with the inert gas of a predetermined concentration. Here, it is desirable that the inert gas supplied from the inert gas supply device 15 is dried. Specifically, the dew point temperature of the inert gas is desirably lower than the temperature of the temperature adjustment device 60. Since the temperature control plate 61 of the temperature control device 60 described later moves in the chamber 1, condensation on the temperature control plate 61 can be suppressed when the chamber 1 is filled with dry inert gas. That is, when the inert gas supply device 15 is an inert gas generation device, it is preferable to include a drying device for drying air as a raw material for generating an inert gas. In addition, when the inert gas supply device 15 is a gas cylinder, it is desirable to use a gas cylinder in which a sufficiently dry inert gas is stored.

The inert gas containing a large amount of fumes discharged from the exhaust port of the chamber 1 is sent to the fume collector 19, and after the fumes are removed, the fumes are returned to the chamber 1. The smoke collector 19 may be any device having a function of removing smoke, and may be, for example, an electric dust collector or a filter.

The cutting device 50 includes a machining head 51 provided with a spindle head 52, and the machining head 51 moves the spindle head 52 to a desired position by a machining head driving mechanism not shown.

The spindle head 52 is configured to be rotatable by holding a cutting tool such as an end mill, not shown, and is capable of cutting the surface or unnecessary portion of the solidified layer obtained by sintering the material layer 8. The cutting tools are preferably a plurality of types of cutting tools, and the cutting tools used may be replaced during molding by an automatic tool changer not shown. With the above configuration, the machining head 51 can perform cutting on the solidified layer at an arbitrary position in the chamber 1.

The irradiation device 13 is disposed above the chamber 1. The irradiation device 13 irradiates a predetermined portion of the material layer 8 formed on the molding region R with a beam of laser light L or the like to melt or sinter the material layer 8 at the irradiation position, thereby forming a solidified layer. As shown in fig. 3, the irradiation device 13 includes a light source 42, a biaxial current scanner 43, and a focus control unit 44. Further, the current scanner 43 includes: the galvanometer mirror 43a and the galvanometer mirror 43b, and actuators not shown that rotate the galvanometer mirror 43a and the galvanometer mirror 43b, respectively.

The light source 42 irradiates laser light L. The laser light L is a laser beam capable of melting the material powder, and is, for example, CO₂Laser, fiber laser, Yttrium Aluminum Garnet (YAG) laser, and the like. Further, the light source 42 may be a light source that irradiates an electron beam.

The focus control unit 44 condenses the laser light L output from the light source 42 and adjusts the condensed light to a desired spot size. The galvanometer mirror 43a and the galvanometer mirror 43b two-dimensionally scan the laser light L output from the light source 42 in a controllable manner. The galvanometer mirror 43a and the galvanometer mirror 43b control the rotation angle in accordance with the magnitude of the rotation angle control signal input from the control device 40. According to the above feature, the laser beam L can be irradiated to a desired position by changing the magnitude of the rotation angle control signal input to each actuator of the current scanner.

The laser light L passing through the galvanometer mirror 43a and the galvanometer mirror 43b is transmitted through a protection window 1a provided in the chamber 1 and is irradiated to the material layer 8 formed in the molding region R. The protection window 1a is made of a material that can transmit the laser light L. For example, when the laser light L is a fiber laser or a YAG laser, the protection window 1a can include quartz glass.

A protection window contamination prevention device 17 is provided on the upper surface of the chamber 1 so as to cover the protection window 1 a. The protection window contamination prevention device 17 includes: a cylindrical housing 17a, and a cylindrical diffusion member 17c disposed in the housing 17 a. An inert gas supply space 17d is provided between the housing 17a and the diffusion member 17 c. Further, an opening 17b is provided on the bottom surface of the housing 17a inside the diffusion member 17 c. The diffusion member 17c is provided with a plurality of fine holes 17e, and the clean inert gas supplied to the inert gas supply space 17d is filled in the clean room 17f through the fine holes 17 e. The clean inert gas filled in the clean room 17f is ejected through the opening 17b to the lower side of the protection window contamination prevention device 17.

The control device 40 performs overall control of the entire lamination molding apparatus 100, and performs numerical control as follows: molding data generated in a Computer Aided Manufacturing (CAM) apparatus (not shown) is received, and control of build-up molding is performed based on the received data. The apparatus also performs drive control of the material layer forming device 3, the molding surface 5, the coating head 11, the irradiation device 13, the inert gas supply device 15, the mist collector 19, the cutting device 50, the temperature adjusting device 60, the temperature measuring unit 70, the surface temperature adjusting device 90, and the like.

The temperature measuring means 70 is a detecting means for measuring the temperature of the solidified material 81, and is used by being attached to the cutting apparatus 50 (fig. 2 and 14). For example, the temperature measuring unit 70 includes: a contact temperature sensor 70a that is in contact with the upper surface of the cured body 81 to measure the temperature; and a temperature sensor elevating device 70b for moving the temperature sensor 70a in a vertical direction. The temperature sensor 70a is, for example, a thermocouple, but another temperature sensor such as a temperature measuring resistor may be used. The temperature sensor elevating device 70b is, for example, an air cylinder, and other driving mechanisms such as a hydraulic cylinder and an electric motor may be used. The temperature measuring unit 70 may be configured by a non-contact temperature sensor, but the temperature of the cured product 81 can be accurately measured by using the contact temperature sensor 70 a. By using the temperature measuring means 70, feedback control according to the temperature of the cured body 81 can be performed. For example, the cooling step or the heating step may be performed by the temperature control plate 61 until the temperature measured by the temperature sensor 70a reaches a predetermined temperature.

The temperature measuring unit 70 is not an essential component and may be omitted.

(1.2 temperature control device 60)

Fig. 7 is an enlarged front perspective view of the temperature adjustment device 60 according to the embodiment of the present invention, and fig. 8 is an enlarged rear perspective view of the temperature adjustment device 60 according to the embodiment of the present invention. In fig. 7 to 9, the constituent elements of the layer forming apparatus 100 such as the working door 1c are partially omitted in consideration of visibility.

The temperature adjusting device 60 according to the embodiment of the present invention is a device for cooling or heating a three-dimensional molded product by bringing a temperature control plate 61 into close contact with the upper surface of a cured layer obtained by sintering the material layer 8, and is provided so as to be capable of reciprocating in the B-axis direction by engaging with the coating head 11, with the back surface of the working door 1c, between the inner wall on the front surface side of the chamber 1 and the coating head 11 (fig. 1 and 7).

The temperature adjustment device 60 includes: a temperature-adjusting plate 61, an installation part 62, a rotating part 63, a conveying locking member 65, and a position fixing hole 66.

The temperature control plate 61 is a flat plate-shaped member that is heated and cooled by being brought into close contact with the upper surface of a cured body 81, the cured body 81 being formed by a cured layer laminate formed by irradiating a material layer 8 with a light beam such as a laser beam L, and the temperature control plate 61 includes: the heating and cooling plate 61a, the thermoelectric element 61b, and the wire connecting portion 61 c. The upper surface of the solidified body 81 is the upper surface of the uppermost solidified layer at the time of heating and cooling by the temperature adjusting device 60.

The heating and cooling plate 61a is a substrate that is in actual contact with the upper surface of the solidified body 81, and functions as a contact surface for heating and cooling the solidified body 81. The heating and cooling plate 61a includes an insulating substrate such as a ceramic material.

The thermoelectric element 61b is an element that converts electric energy into thermal energy, and is provided in a plurality of rows on the back surface of the heating/cooling plate 61 a. The thermoelectric element 61b is a semiconductor thermoelectric element such as a peltier element. When a direct current is passed through the lead wire connecting portion 61c, the thermoelectric element 61b cools (absorbs heat) at one end surface connected to the heating/cooling plate 61a and generates heat (heats) at the other end surface. When the direction of the direct current is changed, the cooling surface and the heating surface are switched, and heating and cooling can be switched in a short time. By cooling and heating one surface of the thermoelectric element 61b as described above, the upper surface of the solidified body 81 can be heated and cooled via the heating/cooling plate 61a, and rapid temperature control can be achieved with high accuracy.

The lead wire connecting portion 61c is a terminal for connecting the thermoelectric element 61b to a lead wire not shown.

Fig. 9 is a side view of the temperature adjustment device 60 in which the temperature control plate 61 according to the embodiment of the present invention is set to the standing state, and fig. 10 is a side view of the temperature adjustment device 60 in which the temperature control plate 61 according to the embodiment of the present invention is set to the lying state.

The rotating unit 63 is a member that rotates the temperature-adjusting plate 61 between a lying state along the horizontal direction (direction parallel to the XY plane) and a standing state along the vertical direction (Z direction). When the temperature adjustment is not performed by the temperature adjustment device 60, the temperature adjustment plate 61 is set to the standing state shown in fig. 9. When the temperature is adjusted by the temperature adjusting device 60, the temperature control plate 61 is set to the lying state shown in fig. 10. In this way, when the solidified layer is formed by the irradiation device 13, when the solidified layer is processed by the cutting device 50, when the material layer 8 is formed on the base plate 33 by the coater head 11, or the like, it is possible to prevent each device of the multilayer molding device 100 from interfering with the temperature-adjusting plate 61.

The turning portion 63 is, for example, a pneumatic rotary actuator. The turning unit 63 may use another turning mechanism such as a hydraulic turning actuator or an electric turning actuator.

The mounting portion 62 is a member for connecting the temperature-adjusting plate 61 and the rotating portion 63, and includes a back mounting portion 621 and a lower mounting portion 622.

The back surface mounting portion 621 is fixed to the back surface of the thermoelectric element 61b, and a ball joint 621a is provided at the center of the thermoelectric element 61 b. The lower mounting portion 622 is vertically erected with its lower end fixed to the rotation shaft of the rotating portion 63, and has a receiving piece 622a connected to the ball joint 621a at its upper end.

The contact surface between the ball joint 621a and the receiving tool 622a is formed to be slidable, and the rotating portion 63 and the temperature control plate 61 are slidably connected via the mounting portion 62.

By using the above-described connection structure of the rotating portion 63 and the temperature-adjusting plate 61, even when the parallelism of the upper surface of the cured body 81 is poor, the temperature-adjusting plate 61 can be appropriately brought into contact with the upper surface of the cured body 81, and it is possible to avoid applying an undue force to either the temperature-adjusting plate 61 or the upper surface of the cured body 81.

Further, a slider 64b is fixed to the bottom surface of the rotating portion 63, and the slider 64b slides along the temperature adjustment device guide 64 a. In addition, a known slider can be suitably used as the slider 64B, and the temperature adjustment device 60 reciprocates in the B-axis direction by being connected to the coating head 11.

The conveyance locking member 65 is a member for engaging with the locking hole 18 of the coating head 11, and for example, a known fluid pressure cylinder or a known electric cylinder is used. The conveyance locking member 65 is provided at a position which is lower than the temperature adjustment device 60 when the temperature adjustment plate 61 is set to the upright state and which can be engaged with the locking hole 18 of the coater head 11.

The air cylinder 65 as the conveyance locking member 65 includes a pin body 65b, and the pin body 65b is movable forward and backward in the locking hole 18 of the coater head 11 by the operation of the air cylinder 65. When the temperature adjustment device 60 is connected to the coating head 11, the air cylinder 65 is operated to project the pin body 65b, and the pin body 65b is inserted into the locking hole 18 of the coating head 11 and fitted. When the connection between the temperature adjustment device 60 and the coating head 11 is released, the air cylinder 65 is operated to draw in the pin body 65b, and the pin body 65b is pulled out from the locking hole 18 of the coating head 11.

The position fixing hole 66 is a hole for fixing the temperature adjustment device 60 to the retracted position PE and the processing position PT where heating and cooling are performed, and is provided below the temperature adjustment device 60 (fig. 8). The position fixing hole 66 may have any shape as long as it is engaged with the retreat position locking member 1e and the heating and cooling position locking member 1t, and examples thereof include a groove, a non-through hole, and a through hole.

(1.3 method of producing three-dimensional shaped article)

Fig. 11 is an explanatory view (standby state) of a cured layer forming step using the build-up molding apparatus 100 according to the embodiment of the present invention. Fig. 12 is an explanatory view (pre-rotation state) of a cured layer forming step using the build-up molding apparatus 100 according to the embodiment of the present invention, and fig. 13 is an explanatory view (post-rotation state) of a cured layer forming step using the build-up molding apparatus 100 according to the embodiment of the present invention. Fig. 14 is an explanatory view (temperature detection step) of a cured layer forming step using the build-up molding apparatus 100 according to the embodiment of the present invention, and fig. 15 is a flowchart showing the cured layer forming step using the build-up molding apparatus 100 according to the embodiment of the present invention. A method for producing a three-dimensional molded article using the build-up molding apparatus 100 will be described with reference to fig. 11 to 15. Here, although the solidified body 81 is omitted for convenience of explanation with respect to the explanatory drawings of fig. 11 to 14, the solidified body 81 is formed in the molding region R in the actual solidified layer forming step.

The build-up molding apparatus 100 of the present embodiment is particularly effective for a method of producing a three-dimensional molded product in which the temperature of the solidified layer is adjusted during molding. The following molding method can be exemplified as a method for producing a three-dimensional molded article in which the temperature of the cured layer is adjusted during molding: a martensitic metal is used as a material for forming the material layer 8, and the temperature of the solidified layer is adjusted for each formation of one or more solidified layers, thereby intentionally causing martensitic transformation. More specifically, each time one or more cured layers are newly molded, the temperature of the newly molded cured layer is adjusted in the order of molding temperature T1, cooling temperature T2, and molding temperature T1. Note that, assuming that the martensite start temperature of the solidified layer is Ms and the martensite finish temperature of the solidified layer is Mf, all of the relationships of the following equations (1) to (3) are satisfied.

T1≧Mf (1)

T1＞T2 (2)

T2≦Ms (3)

The present invention is also effective for other methods for producing three-dimensional molded articles in which the temperature of the solidified layer is adjusted during molding.

Hereinafter, the solidified layer or layers cooled by the temperature adjustment device 60 will be referred to as an upper surface layer. The upper surface layer includes at least the uppermost solidified layer of the solidified body 81 at each cooling time. After sintering, the upper surface layer before cooling in the cooling step is in a state including an austenite phase, and a part or all of the austenite phase is transformed into a martensite phase by cooling to the cooling temperature T2.

First, the height of the forming table 5 is adjusted to an appropriate position with the base plate 33 placed on the forming table 5 (S101).

After the height of the molding stage 5 is adjusted, a cured layer forming step is performed. In the solidified layer forming step, the heater 92 of the stage temperature adjusting device 90 provided on the molding stage 5 is driven to heat the molding stage 5 to the molding temperature T1(S102), and the thermoelectric element 61b of the temperature adjusting device 60 is applied to heat the heating and cooling plate 61a to the molding temperature T1 (S103). Here, as shown in fig. 11, the temperature control device 60 is set to the standing state and is stopped at the retracted position PE, the locking member 1e for the retracted position is engaged with the position fixing hole 66 of the temperature control device 60, and the temperature control device 60 is fixed to the chamber 1.

Next, the recoating step and the curing step shown below were repeated one or more times.

In the recoating step, the coating head 11 filled with the material powder in the material containing section 11a is moved from the left side to the right side of the drawing in the arrow B axis direction (fig. 1). Thereby, the material layer 8 is formed on the base plate 33 (S104).

Next, in the solidification step, the irradiation region of the material layer 8 is irradiated with the laser beam L to melt or sinter the irradiation region, thereby forming the first solidified layer 81a on the base plate 33 (S105).

When the temperature of the plurality of cured layers is adjusted in a lump, the height of the forming table 5 is then lowered by the thickness of the material layer 8, and the recoating step and the curing step are performed again. Specifically, the coating head 11 is moved from the right side to the left side of the molding region R, and the material layer 8 is formed on the molding region. Next, the laser light L is irradiated to the irradiation region of the material layer 8 and melted or sintered, thereby forming the second solidified layer 81b on the base plate 33.

As described above, in the solidified layer forming step, the solidified body 81 is formed by repeating the formation of the plurality of solidified layers 81a, 81b … …. The cured layers laminated in this order are firmly fixed to each other (fig. 22).

After repeating the above steps to form one or more solidified layers determined in advance, the heating step and the cooling step are performed by the temperature adjusting device 60. In the heating step, after the temperature of the upper surface layer of the solidified body 81 is heated to the molding temperature T1, the temperature of the upper surface layer of the solidified body 81 is cooled to the cooling temperature T2 in the cooling step.

In the heating step, first, the retracted position locking member 1e is operated to release the connection between the chamber 1 and the temperature adjustment device 60, and the conveyance locking member 65 is operated to connect the temperature adjustment device 60 to the coater head 11. Then, the coupled temperature adjusting device 60 is moved from the retreat position PE to the heating and cooling position PT in a state where the temperature control plate 61 is in the standing state by moving the coating head 11 to the heating and cooling position PT along the B-axis direction (S106).

Then, the temperature adjustment device 60 is fixed to the chamber 1 by operating the heating/cooling position locking member 1t, and the connection between the temperature adjustment device 60 and the coating head 11 is released by operating the conveyance locking member 65, so that the coating head 11 is retracted from the molding region R along the B-axis direction (fig. 12).

Then, as shown in fig. 13, the temperature control plate 61 is rotated to the lying state by driving the rotating portion 63, the heating and cooling plate 61a is brought into contact with the upper surface of the solidified body 81, and the upper surface of the solidified body 81 is heated to the molding temperature T1 (S107). By using the ball joint 621a as the connection structure between the rotating portion 63 and the temperature control plate 61, the contact surface between the ball joint 621a and the receiving member 622a slides, and the heating/cooling plate 61a can be brought into close contact with the entire upper surface of the solidification body 81.

As shown in fig. 14, feedback control may also be performed: the temperature measuring means 70 is moved to above the cured body 81, the temperature of the upper surface of the cured body 81 is measured, and the cured body 81 is heated until the temperature of the upper surface of the cured body 81 reaches the molding temperature T1 (S108).

When the temperature of the upper surface of the solidified body 81 reaches the molding temperature T1, the process proceeds to the cooling step.

In the cooling step, the heater 92 of the stage temperature adjusting device 90 provided on the molding stage 5 is stopped, the cooler 93 of the stage temperature adjusting device 90 is driven, and the bottom plate 33 and the solidified layer of the lower layer which are in contact with the top plate 5a of the molding stage 5 are cooled (S109). At this time, the molding surface plate 5 is cooled to such an extent that excessive heat transfer to the solidified body 81 can be suppressed, and does not need to be cooled to the cooling temperature T2.

Further, the heating and cooling plate 61a is cooled to the cooling temperature T2 by the thermoelectric element 61b of the temperature adjusting device 60, and the upper surface layer of the solidified body 81 is cooled to the cooling temperature T2 by the temperature adjusting plate 61 (S110).

As described above, the cooling temperature T2 is equal to or lower than the martensite start temperature Ms. The cooling temperature T2 is preferably equal to or lower than the martensite finish temperature Mf. In this case, the three-dimensional molded article can be prevented from undergoing martensitic transformation after molding. The martensite start temperature Ms and the martensite finish temperature Mf vary depending on the composition of the material. Therefore, depending on the material, the cooling temperature T2 must be set to a low temperature such as-20 ℃. In the build-up molding apparatus 100 of the present embodiment, since only a part of the solidified body 81 including the upper surface layer needs to be cooled, even if the cooling temperature T2 is low, the upper surface layer can be rapidly cooled, and after the cooling step, reheating to the molding temperature T1 can be rapidly performed.

In addition, feedback control may be performed in the same manner as in the heating step, that is, the temperature of the upper surface of the solidified body 81 is measured by the temperature measuring unit 70, and the solidified body 81 is cooled until the temperature of the upper surface of the solidified body 81 reaches the cooling temperature T2 (S111).

When the cooling step is completed, the temperature control plate 61 of the temperature adjustment device 60 is rotated from the horizontal state to the upright state by the rotating portion 63 (S112). Then, the coating head 11 is driven to move in the B-axis direction to the heating and cooling position PT, the locking member 1t for the heating and cooling position is operated to release the connection between the chamber 1 and the temperature adjusting device 60, and the conveying locking member 65 is operated to connect the temperature adjusting device 60 and the coating head 11. By moving the coating head 11 to the retracted position PE in the B-axis direction, the connected temperature adjustment device 60 is moved from the heating/cooling position PT to the retracted position PE in a state where the temperature control plate 61 is in the standing state (S113).

Then, the retracted position locking member 1e is operated to fix the temperature adjustment device 60 in the chamber 1, and the conveyance locking member 65 is operated to release the connection between the temperature adjustment device 60 and the coater head 11.

Then, the molding temperature T1 is set again to perform the solidified layer forming step. At least before the next curing step, the temperature of the molding platen 5 is adjusted to the molding temperature T1 by the platen temperature adjusting device 90 provided in the molding platen 5, and the thermoelectric element 61b of the temperature adjusting device 60 is further applied to heat the heating/cooling plate 61a to the molding temperature T1. The temperature of the material layer 8 is then reheated to the forming temperature T1.

As described above, in the present embodiment, the thermoelectric element 61b of the temperature adjustment device 60 is applied in the heating step, the heating/cooling plate 61a is heated to the molding temperature T1, the temperature control plate 61 is switched from heating to cooling in a short time in the cooling step and is adjusted to the cooling temperature T2, and the temperature control plate 61 is brought into contact with the upper surface of the solidified body 81, thereby heating and cooling the upper surface layer of the solidified body 81. As described above, the temperature of the upper surface layer can be adjusted more quickly and the molding time of the three-dimensional molded product can be shortened as compared with the case where heating and cooling are performed only by using the temperature adjustment mechanism provided in the molding stage 5.

< 2. second embodiment >

(2.1 build-up molding apparatus 200)

Fig. 16 is a schematic side view of an build-up molding apparatus 200 according to a second embodiment of the present invention. Fig. 17 is a rear perspective view of temperature adjustment device 260 according to the embodiment of the present invention.

The temperature adjustment device 60 of the first embodiment is provided so as to be movable forward and backward in the B-axis direction along the inner side surface of the chamber 1, but the temperature adjustment device 260 of the second embodiment of the present invention is different in that it is integrally attached to the back surface of the working door 1c, and other configurations and operations are the same as those of the second embodiment, and therefore the same configurations and operations are denoted by the same reference numerals, and detailed description thereof is omitted.

The lamination molding apparatus 200 according to the embodiment of the present invention repeats the steps of forming the material layer 8 in the molding region R where the three-dimensional molded product is formed, and irradiating the irradiation region of the material layer 8 with a light beam, for example, as the laser light L to melt or sinter the material layer, thereby laminating a plurality of cured layers to generate the three-dimensional molded product having a desired shape.

The lamination molding apparatus 200 of the present invention includes: a chamber 1, an inert gas supply device 15, a protection window contamination prevention device 17, a mist collector 19, a molding stage 5, an irradiation device 13, a material layer forming device 3, a control device 40, a cutting device 50, a temperature adjustment device 260, a temperature measurement unit 70, and a stage temperature adjustment device 90.

The chamber 1 is a housing of the stack molding apparatus 200, and is provided with an opening 1b formed in the front surface of the chamber 1, and an operation door 1c provided with a peep window 1d is provided in the opening 1b (fig. 16, 17, and 20).

The working door 1c is of a hinged opening/closing type and is rotatably provided in the opening 1b, and is fixed to the back surface of the working door 1c so that a temperature adjusting device 260 described later can be changed from an upright state (fig. 18) to a lying state (fig. 19) and from the lying state to the upright state.

The temperature adjustment device 260 is provided so as to be housed on the back surface of the working door 1c (fig. 17), and when the working door 1c is opened and closed, problems such as the temperature adjustment device 260 becoming an obstacle do not occur.

(2.2 temperature adjusting device 260)

Fig. 18 is a side view of the temperature adjustment device 260 in which the temperature control plate 61 according to the embodiment of the present invention is set to a standing state. Fig. 19 is a side view of the temperature adjustment device 260 in which the temperature control plate 61 according to the embodiment of the present invention is placed in a recumbent state.

The temperature adjustment device 260 according to the embodiment of the present invention is a device for heating or cooling a three-dimensional molded product by bringing the temperature control plate 61 into close contact with the upper surface of the solidified layer obtained by sintering the material layer 8, and is fixed to the back surface of the working door 1c (fig. 16 and 17).

The temperature adjusting device 260 includes: temperature control plate 61, mounting portion 62, rotating portion 263 and working door mounting portion 267.

The temperature control plate 61 is a flat plate-shaped member that is heated and cooled by being brought into close contact with the upper surface of a cured body 81 in which cured layers formed by irradiating the material layer 8 with a light beam such as laser light L are laminated.

The rotating portion 263 is a member that rotates the temperature-adjusting plate 61 between a lying state along the horizontal direction (direction parallel to the XY plane) and a standing state along the vertical direction (Z direction). When the temperature adjustment is not performed by the temperature adjustment device 260, the temperature adjustment plate 61 is set to the standing state shown in fig. 18. When the temperature adjustment is performed, the temperature control plate 61 is set to the lying state shown in fig. 19.

The rotating portion 263 is, for example, an air cylinder. The rotary portion 263 may be configured by using another rotary mechanism such as a hydraulic cylinder or an electric actuator.

The mounting portion 62 is a member for connecting the temperature-adjusting plate 61 and the rotating portion 263, and includes a rear mounting portion 621 and a lower mounting portion 622. The back surface mounting portion 621 is fixed to the back surface of the thermoelectric element 61b, and a ball joint 621a is provided at the center of the thermoelectric element 61 b. The lower mounting portion 622 is fixed at its lower end to the rotation shaft of the rotating portion 263 and stands in the vertical direction, and is provided at its upper end with a receiving piece 622a connected to the ball joint 621 a. The contact surfaces of the ball joint 621a and the receiving tool 622a are slidably formed, and the rotating portion 263 and the temperature control plate 61 are slidably connected via the mounting portion 62.

An operation door attachment portion 267 (fig. 16 and 17) for fixing to the operation door 1c is fixed to the bottom surface of the turning portion 263, and the operation door attachment portion 267 is fixed to the back surface of the operation door 1 c.

(2.3 method of producing three-dimensional shaped article)

Fig. 20 is an explanatory view (a state after rotation) of a cured layer forming step using the build-up molding apparatus 200 according to the embodiment of the present invention, and fig. 21 is a flowchart showing the cured layer forming step using the build-up molding apparatus 200 according to the embodiment of the present invention.

In the explanation drawing of fig. 20, the cured body 81 is omitted, but in the actual cured layer forming step, the cured body 81 is formed in the molding region R.

The build-up molding apparatus 200 of the present embodiment uses the following molding method, as in the build-up molding apparatus 100 of the first embodiment: a martensitic metal is used as a material for forming the material layer 8, and the temperature of the solidified layer is adjusted for each formation of one or more solidified layers, thereby intentionally causing martensitic transformation. More specifically, each time one or more cured layers are newly molded, the temperature of the newly molded cured layer is adjusted in the order of molding temperature T1, cooling temperature T2, and molding temperature T1.

First, the height of the molding bed 5 is adjusted (S101), the heater 92 of the bed temperature adjusting device 90 is heated to the molding temperature T1(S102), the thermoelectric element 61b of the temperature adjusting device 260 is applied, and the heating/cooling plate 61a is heated to the molding temperature T1 (S103). Here, as shown in fig. 16, the temperature adjustment device 260 is fixed to the back surface of the working door 1c in a state where the temperature adjustment plate 61 is in a standing state.

Then, the recoating step (S104) and the curing step (S105) are repeated one or more times.

After the one or more solidified layers are formed, the heating step and the cooling step are performed by the temperature adjusting device 260. In the heating step, after the temperature of the upper surface layer of the solidified body 81 is heated to the molding temperature T1, the temperature of the upper surface layer of the solidified body 81 is cooled to the cooling temperature T2 in the cooling step.

In the heating step, as shown in fig. 20, the temperature control plate 61 is rotated to the lying state by driving the rotating portion 263, the heating/cooling plate 61a is brought into contact with the upper surface of the solidified body 81, and the upper surface of the solidified body 81 is heated to the molding temperature T1 (S201). By using the ball joint 621a as the connection structure of the rotating portion 263 and the temperature control plate 61, the contact surface between the ball joint 621a and the receiving member 622a slides, and the heating/cooling plate 61a can be brought into close contact with the entire upper surface of the solidification body 81.

The temperature of the upper surface of the cured body 81 may be measured by the temperature measuring means 70 to perform feedback control (S108).

When the temperature of the upper surface of the solidified body 81 reaches the molding temperature T1, the process proceeds to the cooling step.

In the cooling step, the cooler 93 of the stage temperature adjusting device 90 is driven to cool the solidified layer of the lower layer (S109), the thermoelectric element 61b of the temperature adjusting device 260 is applied to cool the heating and cooling plate 61a to the cooling temperature T2, and the temperature-controlled plate 61 cools the upper surface layer of the solidified body 81 to the cooling temperature T2 (S110).

In addition, feedback control may be performed in the same manner as in the heating step, that is, the temperature of the upper surface of the solidified body 81 is measured by the temperature measuring unit 70, and the solidified body 81 is cooled until the temperature of the upper surface of the solidified body 81 reaches the cooling temperature T2 (S111).

When the cooling step is finished, the temperature control plate 61 of the temperature control device 260 is rotated from the horizontal state to the vertical state by the rotating portion 263 (S202). Then, the molding temperature T1 is set, and the solidified layer forming step is further performed.

As described above, since the temperature adjustment device 260 is fixed to the back surface of the working door 1c, it is not necessary to drive the temperature adjustment device 260 by a drive mechanism when heating and cooling the solidified body 81, and functions can be realized with a simple configuration without hindering other steps.