阅读说明：本技术 一种led封装结构 (LED packaging structure ) 是由 区永超 于 2021-09-17 设计创作，主要内容包括：本申请公开一种LED封装结构,尤其涉及LED封装的领域,其包括基座和设置在所述基座上的LED芯片,还包括导热机构和散热机构,所述导热机构包括第一导热板、第二导热板和导热翅片,所述第一导热板设置于基座靠近LED芯片一侧,所述LED芯片设置在第一导热板上,所述第二导热板设置于基座远离LED芯片一侧,所述导热翅片插设在基座中,且对所述第一导热板和第二导热板进行连接,所述散热机构靠近第二导热板设置,用于对所述第二导热板进行降温。本申请能够为LED芯片提供良好的散热环境,具有提升散热效率的效果。(The application discloses LED packaging structure especially relates to the field of LED encapsulation, and it includes the base and sets up LED chip on the base still includes heat conduction mechanism and heat dissipation mechanism, heat conduction mechanism includes first heat-conducting plate, second heat-conducting plate and heat conduction fin, first heat-conducting plate sets up in the base and is close to LED chip one side, the LED chip sets up on first heat-conducting plate, the second heat-conducting plate sets up in the base and keeps away from LED chip one side, heat conduction fin inserts and establishes in the base, and right first heat-conducting plate and second heat-conducting plate are connected, heat dissipation mechanism is close to the setting of second heat-conducting plate, be used for right the second heat-conducting plate cools down. This application can provide good radiating environment for the LED chip, has the effect that promotes the radiating efficiency.)

1. An LED packaging structure comprises a base (1) and an LED chip (2) arranged on the base (1), and is characterized in that: still include heat conduction mechanism (4) and heat dissipation mechanism (5), heat conduction mechanism (4) include first heat-conducting plate (41), second heat-conducting plate (42) and heat conduction fin (43), first heat-conducting plate (41) set up in base (1) and are close to LED chip (2) one side, LED chip (2) set up on first heat-conducting plate (41), second heat-conducting plate (42) set up and keep away from LED chip (2) one side in base (1), heat conduction fin (43) are inserted and are established in base (1), and are right first heat-conducting plate (41) and second heat-conducting plate (42) are connected, heat dissipation mechanism (5) are close to second heat-conducting plate (42) and set up, are used for right second heat-conducting plate (42) are cooled down.

2. The LED package structure of claim 1, wherein: radiating mechanism (5) are including circulation cooling tube (51), circulation cooling tube (51) set up and are close to second heat-conducting plate (42) one side in base (1), circulation cooling tube (51) comprises heat absorption section (511) and heat dissipation section (512), heat absorption section (511) and second heat-conducting plate (42) butt, just heat absorption section (511) and heat dissipation section (512) end to end intercommunication become closed pipeline, the heat-conducting liquid has been filled in circulation cooling tube (51).

3. The LED package structure of claim 2, wherein: two groups of one-way through-flow assemblies (52) are arranged in the circulating radiating pipe (51) at intervals, the one-way through-flow assemblies (52) are arranged in the heat absorbing section (511), and the through-flow directions of the two one-way through-flow assemblies (52) are the same.

4. The LED package structure of claim 3, wherein: the one-way through-flow assembly (52) comprises a fixing piece (521), a moving piece (522), a guide piece (523) and a limiting piece (524), wherein the fixing piece (521) is fixedly arranged on the inner wall of the circulating heat dissipation pipe (51), the guide piece (523) is fixedly arranged on the fixing piece (521) along the axial direction of the circulating heat dissipation pipe (51), the moving piece (522) is arranged on the guide piece (523) and can slide along the length direction of the guide piece (523), the inner cavity of the circulating heat dissipation pipe (51) is isolated when the moving piece (522) abuts against the fixing piece (521), and the limiting piece (524) is arranged at one end, far away from the fixing piece (521), of the guide piece (523).

5. The LED package structure of claim 3, wherein: the liquid pushing mechanism (53) is arranged on the heat absorption section (511), the liquid pushing mechanism (53) comprises an installation barrel (531), a piston block (532) and a driving part (533), the installation barrel (531) is arranged on the heat absorption section (511) and is communicated with an inner cavity of the heat absorption section (511), the piston block (532) is arranged in the installation barrel (531) in a sliding mode and can slide along the axial direction of the installation barrel (531), and the driving part (533) is arranged on the installation barrel (531) and used for driving the piston block (532) to slide in the installation barrel (531) in a reciprocating mode according to temperature rising and falling.

6. The LED package structure of claim 5, wherein: the driving component (533) comprises a heat conducting wire (5331) and a memory metal (5332), one end of the heat conducting wire (5331) is connected with the heat conducting mechanism (4), the other end of the heat conducting wire penetrates into the mounting cylinder (531) from the bottom wall of the mounting cylinder (531), the memory metal (5332) is arranged in the mounting cylinder (531) and is located between the bottom wall of the mounting cylinder (531) and the piston block (532), one end of the memory metal (5332) is fixedly connected with the piston block (532), the other end of the memory metal is fixedly connected with the heat conducting wire (5331), and the whole length of the memory metal (5332) can be changed along with temperature rise and fall.

7. The LED package structure of claim 5, wherein: the peripheral wall of the piston block (532) is sleeved with a sliding sealing ring, and the outer wall of the sliding sealing ring is attached to the inner wall of the mounting cylinder (531).

8. The LED package structure of claim 1, wherein: and a heat insulation layer (12) is arranged on one side, close to the LED chip (2), of the base (1) and surrounds the first heat conduction plate (41).

Technical Field

The application relates to the field of LED packaging, in particular to an LED packaging structure.

Background

The LED packaging is the packaging of a prefabricated LED light-emitting chip, the LED packaging not only requires the protection of the light-emitting chip, but also needs to be light-transmitting, and simultaneously needs to have good heat dissipation performance, so that the LED light-emitting chip obtains high light-emitting efficiency and a good heat dissipation environment, and the service life of the LED is prolonged.

The utility model discloses a chinese utility model patent of application number 201921905111.1 discloses a LED packaging structure, its structure includes the base plate, base plate upper end fixed mounting has the base, base upper end fixed mounting has the filling layer, fixed surface installs the LED chip in the filling layer lower extreme, base plate outside a week fixed mounting has the casing, casing top end opening is equipped with lens, lens one end with the articulated connection in casing top, the equal fixed mounting in casing outer end both sides has the lead frame, base lateral wall fixed mounting has the heat-conducting plate, heat-conducting plate lower extreme fixed mounting has the heating panel, the heating panel bottom with base plate fixed connection, the equal fixed mounting in the filling layer upper surface left and right sides has the gold thread, the gold thread other end with base plate fixed connection.

To the above-mentioned correlation technique, the inventor thinks that when the LED used, the heat that produces mainly conducts through the heat-conducting plate and dispels the heat on the heating panel, and heat-conducting plate and LED chip all lie in base, casing and lens enclose establish be the cavity for the cavity intracavity temperature is higher, still has great influence to LED chip use, and the radiating efficiency is lower.

Disclosure of Invention

In order to promote the heat dissipation efficiency, the application provides an LED packaging structure.

The application provides a LED packaging structure adopts following technical scheme:

the utility model provides a LED packaging structure, includes the base and sets up LED chip on the base still includes heat conduction mechanism and heat dissipation mechanism, heat conduction mechanism includes first heat-conducting plate, second heat-conducting plate and heat conduction fin, first heat-conducting plate sets up in the base and is close to LED chip one side, the LED chip sets up on first heat-conducting plate, the second heat-conducting plate sets up in the base and keeps away from LED chip one side, heat conduction fin inserts and establishes in the base, and right first heat-conducting plate and second heat-conducting plate connect, heat dissipation mechanism is close to the setting of second heat-conducting plate, it is right to be used for the second heat-conducting plate cools down.

Through adopting above-mentioned technical scheme, when LED used, the LED chip generated heat when luminous, and the heat of production mainly is absorbed by first heat-conducting plate to conduct on the second heat-conducting plate through the heat conduction fin, conduct in the external environment after absorbing the heat of second heat-conducting plate by heat dissipation mechanism again, make the LED chip obtain the radiating environment of preferred, the radiating efficiency can promote.

Optionally, heat dissipation mechanism includes the circulation cooling tube, the setting of circulation cooling tube is close to second heat-conducting plate one side at the base, the circulation cooling tube comprises heat absorption section and heat dissipation section, heat absorption section and second heat-conducting plate butt, just heat absorption section and heat dissipation section end to end communicate into closed pipeline, fill in the circulation cooling tube and have the heat-conducting liquid.

Through adopting above-mentioned technical scheme, in conducting the heat conduction liquid along with the heat conduction of heat absorption section on with the second heat-conducting plate, heat conduction liquid heaies up gradually, and volume expansion spreads to the heat dissipation section, in conducting the heat conduction liquid of heat dissipation section simultaneously, conducts the external environment by the heat dissipation section again, dispels the heat fast. Especially, when the heat-conducting liquid is selected from low-boiling-point liquid such as alcohol, methanol and the like, the heat-conducting liquid absorbs the temperature and changes the phase, so that the heat on the second heat-conducting plate is rapidly conducted away, and the heat dissipation efficiency is further improved.

Optionally, two sets of one-way through-flow assemblies are arranged in the circulating heat pipe at intervals, the one-way through-flow assemblies are arranged in the heat absorption section, and the through-flow directions of the two one-way through-flow assemblies are the same.

By adopting the technical scheme, the heat-conducting liquid between the two one-way through-flow assemblies expands in volume after being heated, pressure is applied to the two one-way through-flow assemblies, one-way through-flow assembly is pushed to flow after the pressure is increased to a certain degree, then other heat-conducting liquid is pushed to flow, and heat in the heat-conducting liquid is quickly dissipated when the heat-conducting liquid flows through the heat dissipation section, so that quick heat dissipation is realized; the two one-way through-flow assemblies of design through the heat conduction liquid energy storage to between two one-way through-flow assemblies for heat conduction liquid can be in circulation heat dissipation intraductal pulsed flow, has further promoted the radiating rate.

Optionally, one-way through-flow subassembly includes mounting, moving part, guide and locating part, the mounting sets firmly on the circulation cooling tube inner wall, the guide sets firmly on the mounting along circulation cooling tube axial, the moving part sets up on the guide, can follow guide length direction slides, the moving part butt is in when on the mounting, will circulation cooling tube inner chamber cuts off, the locating part set up in mounting one end is kept away from to the guide.

Through adopting above-mentioned technical scheme, heat conduction liquid after the thermal expansion supports and pushes away the movable part, make the movable part to keeping away from the mounting direction motion, one-way through-flow subassembly is in the through-flow state, heat conduction liquid gushes out, promote all the other heat conduction liquid and flow, after heat conduction liquid gushes out to the certain time, the fly leaf is pressed under the pressure effect on the mounting, and another one-way through-flow subassembly's movable part can be pushed open, heat conduction liquid pours into again in the heat absorption section between two one-way through-flow pipes, the heat conduction liquid of newly pouring into absorbs heat again, constantly repeat above-mentioned process, form the pulsed circulation, the one-way through-flow subassembly of adoption, moreover, the steam generator is simple in structure, convenience and practicality.

Optionally, a liquid pushing mechanism is arranged on the heat absorbing section, the liquid pushing mechanism includes an installation cylinder, a piston block and a driving part, the installation cylinder is arranged on the heat absorbing section and is communicated with an inner cavity of the heat absorbing section, the piston block is slidably arranged in the installation cylinder and can slide along the axis direction of the installation cylinder, and the driving part is arranged on the installation cylinder and is used for driving the piston block to slide in the installation cylinder in a reciprocating manner according to temperature rise and fall.

Through adopting above-mentioned technical scheme, drive piston piece reciprocating motion by the driver part according to the temperature goes up and down, with two one-way through-flow subassembly cooperations, further promote the energy storage effect, help promoting heat conduction liquid pulse circulation speed, further promoted the radiating efficiency.

Optionally, the driving component includes a heat conducting wire and a memory metal, one end of the heat conducting wire is connected to the heat conducting mechanism, the other end of the heat conducting wire penetrates into the mounting cylinder from the bottom wall of the mounting cylinder, the memory metal is arranged in the mounting cylinder and located between the bottom wall of the mounting cylinder and the piston block, one end of the memory metal is fixedly connected to the piston block, the other end of the memory metal is fixedly connected to the heat conducting wire, and the overall length of the memory metal can be changed along with the temperature rise and fall.

Through adopting above-mentioned technical scheme, utilize the memory metal to be heated the performance of deformation and cooling back shape for memory metal deformation provides reciprocating motion power for the piston piece, simple structure not only, convenient and practical also can consume partly heat in the memory metal deformation process moreover, helps further promoting rate of heat dissipation.

Optionally, a sliding sealing ring is sleeved on the circumferential wall of the piston block, and the outer wall of the sliding sealing ring is attached to the inner wall of the mounting cylinder.

Through adopting above-mentioned technical scheme, help further promoting the piston block and remove the pushing action to heat-conducting liquid, and then promote the velocity of flow when heat-conducting liquid pulse circulates for heat-conducting liquid circulation, and then promote the radiating efficiency.

Optionally, a heat insulation layer is arranged on one side, close to the LED chip, of the base and surrounds the first heat conduction plate.

Through adopting above-mentioned technical scheme, adopt the insulating layer to carry out the separation to the base for the heat that the LED chip produced mainly leads away through first heat-conducting plate, and reduced the heat of conducting on the base and conducted the possibility of returning LED chip annex again, help reducing the waste heat, make the LED chip get back to the low temperature environment fast after finishing using, help prolonging the life of LED chip.

In summary, the present application includes at least one of the following beneficial technical effects:

the heat conducting mechanism is adopted, so that heat generated by the LED chip is mainly absorbed by the first heat conducting plate and is conducted to the second heat conducting plate through the heat conducting fins, and then the heat of the second heat conducting plate is absorbed by the heat radiating mechanism and is conducted to the external environment, so that the LED chip obtains a better heat radiating environment, and the heat radiating efficiency is improved;

the circulation cooling tube and the heat conduction liquid that adopt heat absorption along with heat conduction liquid heat up gradually, and volume expansion diffuses to the heat dissipation section, in the heat conduction liquid of heat dissipation section is conducted to simultaneously with the heat, in conducting to external environment by the heat dissipation section again, dispels the heat fast. Particularly, when the heat-conducting liquid is low-boiling-point liquid such as alcohol, methanol and the like, the heat-conducting liquid absorbs temperature and undergoes phase change, so that heat on the second heat-conducting plate is quickly conducted away, and the heat dissipation efficiency is further improved;

the two designed one-way through-flow assemblies enable the heat-conducting liquid to flow in a pulse mode in the circulating heat-radiating pipe by storing the heat-conducting liquid between the two one-way through-flow assemblies, so that the heat-radiating speed is further improved;

the memory metal deformation provides reciprocating motion power for the piston block by utilizing the performance of the memory metal after being heated and deformed and cooled, and the structure is simple, the convenience and the practicability are realized, and a part of heat can be consumed in the memory metal deformation process, so that the heat dissipation rate is further promoted.

Drawings

Fig. 1 is a schematic overall structure diagram of a first view angle of an LED package structure according to an embodiment of the present application;

fig. 2 is a schematic overall structure diagram of a second view angle of the LED package structure in the first embodiment of the present application;

FIG. 3 is a schematic cross-sectional view of the LED package structure of FIG. 2;

fig. 4 is a schematic cross-sectional view of an LED package structure in a second embodiment of the present application;

FIG. 5 is a schematic structural view of the one-way flow assembly of FIG. 4;

fig. 6 is a schematic overall structure diagram of an LED package structure in the third embodiment of the present application;

FIG. 7 is a cross-sectional schematic view of the LED package structure of FIG. 6;

fig. 8 is an enlarged schematic view of a portion a in fig. 7.

Reference numerals: 1. a base; 11. a mounting cavity; 12. a thermal insulation layer; 2. an LED chip; 3. an epoxy resin capsule; 4. a heat conducting mechanism; 41. a first heat-conducting plate; 42. a second heat-conducting plate; 43. a heat conductive fin; 5. a heat dissipation mechanism; 51. circulating heat dissipation pipes; 511. a heat absorption section; 512. a heat dissipation section; 52. a one-way through-flow assembly; 521. a fixing member; 522. a movable member; 523. a guide member; 524. a limiting member; 53. a liquid pushing mechanism; 531. mounting the cylinder; 532. a piston block; 533. a drive member; 5331. heat conducting wires; 5332. a memory metal.

Detailed Description

The present application is described in further detail below with reference to figures 1-8.

The first embodiment is as follows:

the embodiment discloses an LED packaging structure. Referring to fig. 1 and 2, the LED package structure includes a base 1, an LED chip 2, an epoxy encapsulant 3, and a heat conducting mechanism 4 and a heat dissipating mechanism 5. The heat conducting mechanism 4, the heat dissipation mechanism 5 and the lead frame are all arranged on the base 1, wherein the bottom of the base 1 is provided with an installation cavity 11, and the heat dissipation mechanism 5 is installed in the installation cavity 11; the LED chip 2 is arranged on the heat conduction mechanism 4, and the LED chip 2 and the base 1 are packaged and fixed by the epoxy resin sealing shell 3.

Referring to fig. 3, the heat conducting mechanism 4 includes a first heat conducting plate 41, a second heat conducting plate 42 and heat conducting fins 43, the first heat conducting plate 41 is clamped on one side of the base 1 close to the LED chip 2, the LED chip 2 is adhered on one side of the first heat conducting plate 41 away from the base 1, and a heat insulating layer 12 is also adhered around the first heat conducting plate 41 on one side of the base 1 close to the LED chip 2; second heat-conducting plate 42 glues and locates base 1 and keep away from LED chip 2 one side, heat-conducting fin 43 is provided with the polylith, polylith heat-conducting fin 43 all inserts and establishes in base 1, and the homogeneous end welds with first heat-conducting plate 41, the other end welds with second heat-conducting plate 42, so that first heat-conducting plate 41 and second heat-conducting plate 42 intercommunication, can realize quick heat conduction, first heat-conducting plate 41 in this embodiment, second heat-conducting plate 42 and heat-conducting fin 43 all adopt copper, have stronger heat conduction efficiency.

Referring to fig. 2 and 3, the heat dissipating mechanism 5 includes a circulating heat dissipating pipe 51, the circulating heat dissipating pipe 51 is adhered to a wall of the mounting cavity 11 on a side close to the second heat conducting plate 42, the circulating heat dissipating pipe 51 is composed of a heat absorbing section 511 and a heat dissipating section 512, the heat absorbing section 511 is abutted to the second heat conducting plate 42, the heat absorbing section 511 and the heat dissipating section 512 are communicated end to form a closed pipeline, and the circulating heat dissipating pipe 51 is filled with a heat conducting liquid. In this embodiment, the circulation cooling tube 51 adopts the copper pipe, and the heat conduction liquid adopts alcohol, and in other embodiments, the heat conduction liquid also can preferably adopt all the other low boiling point liquids such as methyl alcohol or acetone to make the heat conduction liquid can absorb the temperature and take place the phase transition, lead away the heat on the second heat-conducting plate 42 fast, further promote the radiating efficiency.

The implementation principle of the LED package structure in the first embodiment is as follows: when the LED is used, the LED chip 2 emits light and generates heat, the generated heat is mainly absorbed by the first heat conducting plate 41 and is conducted to the second heat conducting plate 42 through the heat conducting fins 43, then the heat on the second heat conducting plate 42 is conducted to the heat conducting liquid through the heat absorbing section 511, the heat conducting liquid is gradually heated up, the volume of the heat conducting liquid is expanded, the heat conducting liquid diffuses to the heat radiating section 512, meanwhile, the heat is conducted to the heat conducting liquid of the heat radiating section 512, and then the heat is conducted to the external environment through the heat radiating section 512, so that the heat is quickly radiated.

Example two:

the present embodiment also discloses an LED package structure, which is different from the first embodiment in that: referring to fig. 4 and 5, two sets of unidirectional through-flow assemblies 52 are arranged at intervals in the heat absorption section 511, and the through-flow directions of the two unidirectional through-flow assemblies 52 are the same. Taking a set of one-way through-flow components 52 as an example for explanation, the one-way through-flow component 52 includes a fixed component 521, a movable component 522, a guide component 523 and a limiting component 524, the fixed component 521 is welded on an inner wall of the heating section, the guide component 523 is welded on the fixed component 521 along an axial direction of the circulating heat pipe 51, the movable component 522 is sleeved on the guide component 523 and can slide along a length direction of the guide component 523, when the movable component 522 abuts against the fixed component 521, an inner cavity of the circulating heat pipe 51 is blocked, and the limiting component 524 is welded at one end of the guide component 523 away from the fixed component 521. In this embodiment, the fixing member 521 is a fixing ring, and may be a fixing block in other embodiments; the guide piece 523 is arranged as a guide rod, the movable piece 522 is arranged as a plug, the plug and the fixed ring are coaxially arranged, the diameter of the plug is larger than the inner diameter of the fixed ring, and the guide rod penetrates through the plug and is welded with the side wall of the fixed ring; the limiting member 524 is a limiting member for preventing the plug from separating from the guide rod, in other embodiments, the limiting member 524 may also be a compression spring, one end of the compression spring is welded to the end of the guide rod away from the fixing member 521, the other end of the compression spring abuts against the plug, and the compression spring is in a compressed state, so that the plug tends to abut against the fixing member 521, thereby further enhancing the energy storage effect.

The implementation principle of the LED package structure in the second embodiment is different from that in the first embodiment in that: the heat-conducting liquid between the two one-way through-flow components 52 expands in volume after being heated, pressure is applied to the two one-way through-flow components 52, when the pressure is increased to a certain degree, the heat-conducting liquid expanded by heating pushes against the movable component 522, so that the movable component 522 moves in the direction away from the fixed component 521, the one-way through-flow components 52 are in a through-flow state, the heat-conducting liquid rushes out and pushes the rest of the heat-conducting liquid to flow, when the heat-conducting liquid rushes out for a certain time, the movable component is pressed against the fixed component 521 under the action of the pressure, the movable component 522 of the other one-way through-flow component 52 can be pushed away, the heat-conducting liquid is poured into the heat absorption section 511 between the two one-way through-flow pipes again, the newly poured heat-conducting liquid absorbs heat again, the process is repeated continuously, pulse type circulation is formed, heat is dissipated rapidly when the heat-conducting liquid flows through the heat dissipation section 512 in the circulation process, and rapid heat dissipation is achieved.

Example three:

the present embodiment also discloses an LED package structure, which is different from the second embodiment in that: referring to fig. 6 and 7, the liquid pushing mechanism 53 is further disposed on the heat absorbing section 511, the liquid pushing mechanism 53 includes an installation cylinder 531, a piston block 532 and a driving component 533, the installation cylinder 531 is welded on the heat absorbing section 511 and is communicated with the inner cavity of the heat absorbing section 511, the piston block 532 is slidably disposed in the installation cylinder 531, a sliding seal ring is sleeved on the circumferential wall of the piston block 532, the outer wall of the sliding seal ring is attached to the inner wall of the installation cylinder 531, the piston block 532 and the sliding seal ring can slide along the axial direction of the installation cylinder 531 together, the sliding seal ring is not shown, and the driving component 533 is disposed on the installation cylinder 531. Referring to fig. 8, the driving member 533 includes a heat conducting wire 5331 and a memory metal 5332, one end of the heat conducting wire 5331 is welded to the second heat conducting plate 42, the other end of the heat conducting wire 5331 penetrates into the mounting cylinder 531 from the bottom wall of the mounting cylinder 531 and is welded to the bottom wall of the mounting cylinder 531, the memory metal 5332 is disposed in the mounting cylinder 531 and is located between the bottom wall of the mounting cylinder 531 and the piston block 532, one end of the memory metal 5332 is welded to the piston block 532, and the other end of the memory metal 5332 is welded to the heat conducting wire 5331. In other embodiments, the driving member 533 may also be a telescopic rod controlled and adjusted by a thermistor.

The implementation principle of the LED package structure in the third embodiment is different from that in the first embodiment in that: the heat conducting wire 5331 conducts heat on the second heat conducting plate 42 to the memory metal 5332, so that the temperature of the memory metal 5332 rises, after the temperature rises to the deformation temperature, the memory metal 5332 deforms to drive the piston block 532 to move towards the direction close to the inner cavity of the heat absorbing section 511, the heat conducting liquid is pushed to move or the heat conducting liquid is compressed to store energy, then the heat conducting liquid circulates along with the pulse of the heat conducting liquid, the temperature of the memory metal 5332 falls below the deformation temperature and is reshaped, the heat conducting liquid circulates continuously through the process and is matched with the two one-way through-flow assemblies 52, the energy storage effect is further improved, the pulse circulation speed of the heat conducting liquid is favorably improved, and the heat dissipation efficiency is further improved.

The above embodiments are preferred embodiments of the present application, and the protection scope of the present application is not limited by the above embodiments, so: all equivalent changes made according to the structure, shape and principle of the present application shall be covered by the protection scope of the present application.