阅读说明：本技术 吸震式晶体振子封装结构 (Shock-absorbing crystal oscillator packaging structure ) 是由 彭子修 罗韋晨 林宗德 于 2021-06-28 设计创作，主要内容包括：本发明公开了一种吸震式晶体振子封装结构,其包括一封装基座、一谐振晶体片与一顶盖。封装基座的顶部具有一凹槽,封装基座的侧壁环绕凹槽。谐振晶体片具有一边框区、至少一个蜿蜒式连接区与一谐振区,蜿蜒式连接区连接谐振区的边缘与边框区之间,边框区设于侧壁上。顶盖设于边框区上,以遮蔽凹槽、蜿蜒式连接区与谐振区。本发明形成蜿蜒式连接区在边框区与谐振区之间,以避免外界机械性震动或瞬间冲击传递至谐振晶体片,并稳定谐振频率。(The invention discloses a shock-absorbing crystal oscillator packaging structure which comprises a packaging base, a resonant crystal wafer and a top cover. The top of the packaging base is provided with a groove, and the side wall of the packaging base surrounds the groove. The resonant crystal piece is provided with a frame area, at least one winding connection area and a resonant area, wherein the winding connection area is connected between the edge of the resonant area and the frame area, and the frame area is arranged on the side wall. The top cover is arranged on the frame area to shield the groove, the winding connection area and the resonance area. The invention forms a winding connection area between the frame area and the resonance area to prevent external mechanical vibration or instant impact from being transmitted to the resonance crystal wafer and stabilize the resonance frequency.)

1. A shock-absorbing type crystal oscillator packaging structure, comprising:

the top of the packaging base is provided with a groove, and the side wall of the packaging base surrounds the groove;

a resonant crystal wafer having a border region, at least one serpentine connecting region and a resonant region, wherein said at least one serpentine connecting region connects between an edge of said resonant region and said border region, said border region being disposed on said sidewall; and

a top cover disposed on the frame region to shield the recess, the at least one serpentine connection region, and the resonance region.

2. The shock absorbing crystal oscillator packaging structure of claim 1, further comprising:

a first electrode layer disposed on the at least one meandering connection region and the bottom surface of the resonance region, the first electrode layer being electrically connected to the resonance region;

a second electrode layer disposed on the top surfaces of the at least one meandering connection region and the resonance region, the second electrode layer being electrically connected to the resonance region;

the first sealing ring is arranged between the side wall of the packaging base and the frame area;

the second sealing ring is arranged between the frame area and the top cover; and

and the conductive pads are arranged on the bottom surface of the packaging base.

3. The shock absorbing crystal oscillator packaging structure of claim 1, wherein the at least one serpentine connection region includes:

a first connecting arm having a first end and a second end, the first end connecting the edge of the resonance region;

the second connecting arm is provided with a third end and a fourth end, the third end is connected with the second end, and the second connecting arm is vertically connected with the first connecting arm; and

and the third connecting arm is provided with a fifth end and a sixth end, the fifth end is connected with the fourth end, the sixth end is connected with the frame area, and the third connecting arm is vertically connected with the second connecting arm.

4. The shock absorbing crystal oscillator packaging structure of claim 3, wherein the at least one serpentine connection region further includes:

the fourth connecting arm is provided with a seventh end and an eighth end, the seventh end is connected with the sixth end, and the fourth connecting arm is vertically connected with the third connecting arm; and

and the fifth connecting arm is provided with a ninth end and a tenth end, the ninth end is connected with the eighth end, the tenth end is connected with the frame area, and the fifth connecting arm is vertically connected with the fourth connecting arm.

5. The shock absorbing crystal oscillator packaging structure of claim 4, wherein the at least one serpentine connection region further includes:

a sixth connecting arm having a tenth end and a twelfth end, the eleventh end being connected to the tenth end, the sixth connecting arm being vertically connected to the fifth connecting arm; and

and the seventh connecting arm is provided with a thirteenth end and a fourteenth end, the thirteenth end is connected with the twelfth end, the fourteenth end is connected with the frame area, and the seventh connecting arm is vertically connected with the sixth connecting arm.

6. The shock absorbing crystal vibrator packaging structure of claim 1, wherein the at least one serpentine connection region comprises a plurality of serpentine connection regions uniformly connected between the edge of the resonance region and the frame region.

7. The shock absorbing crystal oscillator packaging structure of claim 1, wherein the resonance area is rectangular.

8. The shock absorbing crystal oscillator package structure of claim 7, wherein when the at least one meandering connection region is connected to the long side of the rectangle, the distance between the connection position of the at least one meandering connection region and the frame region and the connection position of the at least one meandering connection region and the edge of the resonance region is D1, the width of the rectangle is W, D1 ═ C1 × W, and C1 ═ 0.8 to 1.2.

9. The shock absorbing crystal oscillator package structure of claim 7, wherein when the at least one meandering connection region is connected to a short side of the rectangle, a distance between a connection position of the at least one meandering connection region and the frame region and a connection position of the at least one meandering connection region and the edge of the resonance region is D2, the length of the rectangle is L, D2 ═ C2 × L, and C2 ═ 0.8 to 1.2.

10. The shock absorbing crystal oscillator packaging structure of claim 1, wherein the frame area, the at least one serpentine connection area and the resonance area are integrally formed.

Technical Field

The present invention relates to a package structure, and more particularly, to a shock-absorbing crystal resonator package structure.

Background

The quartz element has stable piezoelectric characteristics, can provide accurate and wide reference frequency, frequency control, timing function, noise filtering function and other functions, and can be used as a sensor for vibration, pressure and the like and an important optical element; therefore, quartz elements play a significant role in electronic products.

Fig. 1 is a schematic view of a prior art quartz vibrator. Referring to fig. 1, a quartz vibrator 1 is constituted by a quartz vibrator element 10 and a first case 11 and a second case 12 as covering the quartz vibrator element 10. The quartz vibrator element 10 is composed of a quartz substrate. The quartz resonator element 10 has excitation electrodes 13 and 14 formed on the upper and lower surfaces thereof, and the quartz resonator element 10 has a main vibrating portion and a support portion surrounding the main vibrating portion. The first case 11 and the second case 12 are made of, for example, general glass such as blue plate glass (blue plate glass). The first housing 11 and the second housing 12 have peripherally formed protrusions at their peripheries, respectively. The first case 11 and the second case 12 are bonded to the supporting portion at the protruding portions so as to sandwich the quartz vibrator element 10 therebetween. Since the supporting portion occupies a high area ratio of the quartz vibrator element 10, external mechanical shock or instantaneous impact is transmitted to the main vibrating portion, resulting in unstable vibration frequency of the quartz vibrator 1.

Disclosure of Invention

The invention provides a shock-absorbing crystal oscillator packaging structure which prevents external mechanical shock or instant impact from being transmitted to a resonant crystal wafer and stabilizes resonant frequency.

In an embodiment of the present invention, a shock-absorbing crystal oscillator package structure is provided, which includes a package base, a resonant crystal wafer and a top cover. The top of the packaging base is provided with a groove, and the side wall of the packaging base surrounds the groove. The resonant crystal plate is provided with a frame area, at least one serpentine (serpentine) connecting area and a resonant area, wherein the serpentine connecting area is connected between the edge of the resonant area and the frame area, and the frame area is arranged on the side wall. The top cover is arranged on the frame area to shield the groove, the winding connection area and the resonance area.

In an embodiment of the invention, the shock-absorbing type crystal oscillator packaging structure further includes a first electrode layer, a second electrode layer, a first sealing ring, a second sealing ring and a plurality of conductive pads. The first electrode layer is arranged on the bottom surfaces of the winding connection area and the resonance area and is electrically connected with the resonance area. The second electrode layer is arranged on the top surfaces of the winding connection area and the resonance area and is electrically connected with the resonance area. The first sealing ring is arranged between the side wall of the packaging base and the frame area, and the second sealing ring is arranged between the frame area and the top cover. All the conductive pads are arranged on the bottom surface of the packaging base.

In one embodiment of the present invention, the serpentine connection region includes a first connection arm, a second connection arm and a third connection arm. The first connecting arm has a first end and a second end, and the first end is connected with the edge of the resonance area. The second connecting arm is provided with a third end and a fourth end, the third end is connected with the second end, and the second connecting arm is vertically connected with the first connecting arm. The third connecting arm is provided with a fifth end and a sixth end, the fifth end is connected with the fourth end, the sixth end is connected with the frame area, and the third connecting arm is vertically connected with the second connecting arm.

In one embodiment of the present invention, the serpentine shaped bond region further comprises a fourth bond arm and a fifth bond arm. The fourth connecting arm is provided with a seventh end and an eighth end, the seventh end is connected with the sixth end, and the fourth connecting arm is vertically connected with the third connecting arm. The fifth connecting arm is provided with a ninth end and a tenth end, the ninth end is connected with the eighth end, the tenth end is connected with the frame area, and the fifth connecting arm is vertically connected with the fourth connecting arm.

In one embodiment of the present invention, the serpentine shaped bond region further comprises a sixth bond arm and a seventh bond arm. The sixth connecting arm is provided with a tenth end and a twelfth end, the eleventh end is connected with the tenth end, and the sixth connecting arm is vertically connected with the fifth connecting arm. The seventh connecting arm is provided with a thirteenth end and a fourteenth end, the thirteenth end is connected with the twelfth end, the fourteenth end is connected with the frame area, and the seventh connecting arm is vertically connected with the sixth connecting arm.

In an embodiment of the present invention, the serpentine connection region includes a plurality of serpentine connection regions, and all of the serpentine connection regions are uniformly connected between the edge of the resonance region and the frame region.

In one embodiment of the present invention, the resonance region is rectangular.

In one embodiment of the present invention, when the meandering connection region is connected to the long side of the rectangle, a distance between a connection position of the meandering connection region and the frame region and a connection position of the meandering connection region and the edge of the resonance region is D1, a width of the rectangle is W, D1 is C1 × W, and C1 is 0.8 to 1.2.

In an embodiment of the present invention, when the meandering connection region is connected to a short side of the rectangle, a distance between a connection position of the meandering connection region and the frame region and a connection position of the meandering connection region and an edge of the resonance region is D2, a length of the rectangle is L, D2 is C2 × L, and C2 is 0.8 to 1.2.

In an embodiment of the present invention, the frame region, the meandering connection region and the resonance region are integrally formed.

Based on the above, the shock-absorbing crystal oscillator packaging structure forms the winding type connection region between the frame region and the resonance region to prevent external mechanical shock or instant impact from being transmitted to the resonance crystal wafer and stabilize the resonance frequency.

Drawings

Fig. 1 is a schematic view of a prior art quartz vibrator.

Fig. 2 is an exploded view of an embodiment of a shock-absorbing crystal oscillator package structure according to the present invention.

Fig. 3 is a cross-sectional view of an embodiment of the shock-absorbing crystal oscillator package structure of the present invention.

Fig. 4 to 18 are top views of structures of various embodiments of the resonant crystal wafer and the first electrode layer of the present invention.

Description of reference numerals: 1-quartz vibrator; 10-quartz vibrator element; 11-a first housing; 12-a second housing; 13-an excitation electrode; 14-an excitation electrode; 2-shock absorption type crystal oscillator packaging structure; 20-a package base; 200-grooves; 21-resonant crystal piece; 210-a border region; 211-a serpentine connection zone; 2111-first connecting arm; 2112-second connecting arm; 2113-third connecting arm; 2114-fourth connecting arm; 2115-fifth connecting arm; 2116-sixth connecting arm; 2117-seventh connecting arm; 212-a resonance region; 22-a top cover; 23-a first electrode layer; 24-a second electrode layer; 25-a first sealing ring; 26-a second sealing ring; 27-conductive pads.

Detailed Description

Embodiments of the invention will be further illustrated by the following description in conjunction with the related drawings. Wherever possible, the same reference numbers will be used throughout the drawings and the description to refer to the same or like parts. In the drawings, the shape and thickness may be exaggerated for simplicity and convenience. It is to be understood that elements not specifically shown in the drawings or described in the specification are of a type well known to those of ordinary skill in the art. Many variations and modifications may be made by one of ordinary skill in the art in light of the teachings of the present invention.

When an element is referred to as being "on …," it can be directly on the other element or intervening elements may be present. In contrast, when an element is referred to as being "directly on" another element, there are no other elements present between the two. As used herein, the term "and/or" includes any combination of one or more of the associated listed items.

The description below of "one embodiment" or "an embodiment" refers to a particular element, structure, or feature associated with at least one embodiment. Thus, the appearances of the phrase "one embodiment" or "an embodiment" in various places throughout this specification are not necessarily all referring to the same embodiment. Furthermore, the particular features, structures, or characteristics may be combined in any suitable manner in one or more embodiments.

The disclosure has been described with respect to the following examples, which are intended to be illustrative only, since various modifications and changes in light thereof will be suggested to persons skilled in the art and are to be included within the spirit and purview of this disclosure. Throughout the specification and claims, unless the context clearly dictates otherwise, the words "a" and "an" include the word "a" and "an" and "the" include "a or at least one" of the stated elements or components. In addition, as used in this disclosure, the singular articles "a", "an", and "the" include plural referents unless the context clearly dictates otherwise. Also, as used in this description and throughout the claims that follow, the meaning of "in" may include "in" and "on" unless the content clearly dictates otherwise. The term (terms) used throughout the specification and claims, unless otherwise indicated, has the ordinary meaning as commonly understood by one of ordinary skill in the art, in the context of this disclosure, and in the specific context. Certain terms used to describe the present disclosure are discussed below or elsewhere in this specification to provide additional guidance to the practitioner (practitioner) in describing the present disclosure. The use of examples anywhere throughout the specification, including any examples of words discussed herein, is by way of illustration only and certainly does not limit the scope or meaning of the disclosure or any of the exemplary words. Likewise, the present disclosure is not limited to the various embodiments set forth in this specification.

In addition, the terms "electrically coupled" or "electrically connected," if used, include any direct and indirect electrical connection. For example, if a first device is electrically coupled to a second device, that connection may be through a direct connection, or through an indirect connection via other devices and connections. In addition, if transmission and provision of electrical signals are described, persons skilled in the art should understand that attenuation or other non-ideal changes may be accompanied in the transmission process of electrical signals, but the source of electrical signal transmission or provision and the receiving end should be regarded as substantially the same signal unless otherwise stated. For example, if an electrical signal S is transmitted (or provided) from a terminal a of the electronic circuit to a terminal B of the electronic circuit, wherein a voltage drop may occur across a source/drain of a transistor switch and/or a possible stray capacitance, but the purpose of this design is not to deliberately use attenuation or other non-ideal changes that occur during transmission (or provision) to achieve certain specific technical effects, the electrical signal S should be considered to be substantially the same signal at the terminals a and B of the electronic circuit.

It is understood that as used herein, the terms "comprising," "including," "having," "containing," "including," and the like are open-ended, i.e., meaning including but not limited to. Moreover, not all objects, advantages, or features of the disclosure are necessarily to be achieved in any one embodiment or claimed herein. In addition, the abstract and the title of the invention are provided for assisting the search of patent documents and are not intended to limit the scope of the invention.

Fig. 2 is an exploded view of an embodiment of a shock-absorbing crystal oscillator package structure according to the present invention. Fig. 3 is a cross-sectional view of an embodiment of the shock-absorbing crystal oscillator package structure of the present invention. Referring to fig. 2 and 3, a shock-absorbing crystal oscillator package structure 2 according to the present invention is described. The shock-absorbing crystal oscillator packaging structure 2 includes a packaging base 20, a resonant crystal piece 21 and a top cover 22. The top of the package base 20 has a recess 200, and the sidewall of the package base 20 surrounds the recess 200. The resonant crystal slab 21 can be a quartz crystal slab, which has a frame region 210, at least one serpentine (serpentine) connection region 211 and a resonant region 212, wherein the serpentine connection region 211 has a bending shape and a function of absorbing vibration. The meandering connection region 211 connects an edge of the resonance region 212 and the frame region 210, and the frame region 210 is provided on a side wall of the package base 20. The frame region 210, the meandering connection region 211, and the resonance region 212 may be integrally formed. The top cover 22 is disposed on the rim area 210 to shield the groove 200, the meandering connection area 211 and the resonance area 212. Since the serpentine connection region 211 is formed between the bezel region 210 and the resonance region 212, external mechanical shock or instant impact is prevented from being transmitted to the resonance region 212 and the resonance frequency is stabilized.

In some embodiments of the present invention, the shock-absorbing type crystal oscillator package structure 2 may further include a first electrode layer 23, a second electrode layer 24, a first sealing ring 25, a second sealing ring 26 and a plurality of conductive pads 27. The first electrode layer 23 is disposed on the bottom surfaces of the meandering connection region 211 and the resonance region 212, and the first electrode layer 23 is electrically connected to the resonance region 212. The second electrode layer 24 is disposed on the top surfaces of the meandering connection region 211 and the resonance region 212, and the second electrode layer 24 is electrically connected to the resonance region 212. The first sealing ring 25 is disposed between the sidewall of the package base 20 and the frame region 210, and the second sealing ring 26 is disposed between the frame region 210 and the top cover 22. All the conductive pads 27 are disposed on the bottom surface of the package base 20.

Fig. 4 to 18 are top views of structures of various embodiments of the resonant crystal wafer and the first electrode layer of the present invention. As shown in FIGS. 2 and 4, where the serpentine connection region 211 is one in number, the serpentine connection region 211 may include a first connection arm 2111, a second connection arm 2112, and a third connection arm 2113. First connecting arm 2111 has a first end and a second end, the first end connecting the edge of resonant region 212. The second connection arm 2112 has a third end connected to the second end and a fourth end, and the second connection arm 2112 is perpendicularly connected to the first connection arm 2111. The third connecting arm 2113 has a fifth end connected to the fourth end and a sixth end connected to the frame region 210, and the third connecting arm 2113 is perpendicularly connected to the second connecting arm 2112. The resonance region 212 is illustrated as being rectangular. When the meandering connection region 211 is connected to the long side of the rectangle, the distance between the connection position of the meandering connection region 211 and the frame region 210 and the connection position of the meandering connection region 211 and the edge of the resonance region 212 is D1, the width of the rectangle is W, D1 is C1 × W, and C1 is 0.8 to 1.2.

As shown in FIGS. 2 and 5, serpentine attachment region 211 may also include a fourth attachment arm 2114 and a fifth attachment arm 2115, as compared to the embodiment of FIG. 4. The fourth link arm 2114 has a seventh end connected to the sixth end and an eighth end, and the fourth link arm 2114 is perpendicularly connected to the third link arm 2113. The fifth link arm 2115 has a ninth end and a tenth end, the ninth end is connected to the eighth end, the tenth end is connected to the frame region 212, and the fifth link arm 2115 is vertically connected to the fourth link arm 2114, wherein D1 ═ C1 xw, and C1 ═ 0.8 to 1.2.

As shown in fig. 2 and 6, when the meandering connection region 211 is connected to a short side of a rectangle, as compared with the embodiment of fig. 5, the distance between the connection position of the meandering connection region 211 and the frame region 210 and the connection position of the meandering connection region 211 and the edge of the resonance region 212 is D2, the length of the rectangle is L, D2 is C2 × L, and C2 is 0.8 to 1.2.

As shown in fig. 2 and fig. 7, compared to the embodiment of fig. 6, the number of the meandering connection regions 211 is two, and the two meandering connection regions 211 are opposite to each other, wherein D2 ═ C2 × L, and C2 ═ 0.8 to 1.2.

As shown in fig. 2 and fig. 8, compared to the embodiment of fig. 5, the number of the meandering connection regions 211 is two, and the two meandering connection regions 211 are opposite to each other, wherein D1 ═ C1 × W, and C1 ═ 0.8 to 1.2.

As shown in fig. 2 and 9, compared to the embodiment of fig. 5, the number of the serpentine connection regions 211 is three, and two serpentine connection regions 211 are opposite to each other. When the meandering connection region 211 is connected to a short side of the rectangle, a distance between a connection position of the meandering connection region 211 and the frame region 210 and a connection position of the meandering connection region 211 and an edge of the resonance region 212 is D2, a length of the rectangle is L, D2 ═ C2 × L, C2 ═ C1 × W, and D1 ═ C1 ═ C8 to 1.2.

As shown in fig. 2 and 10, compared to the embodiment of fig. 5, the number of the serpentine connection regions 211 is two, and they are connected to the short side and the long side of the rectangle, respectively. When the meandering connection region 211 is connected to a short side of the rectangle, a distance between a connection position of the meandering connection region 211 and the frame region 210 and a connection position of the meandering connection region 211 and an edge of the resonance region 212 is D2, a length of the rectangle is L, D2 ═ C2 × L, C2 ═ C1 × W, and C1 ═ C8 to 1.2.

As shown in fig. 2 and fig. 11, compared to the embodiment of fig. 9, the number of the meandering connection regions 211 is plural, for example, four, and all the meandering connection regions 211 are uniformly connected between the edge of the resonance region 212 and the frame region 210, where D2 ═ C2 × L, C2 ═ 0.8 to 1.2, D1 ═ C1 × W, and C1 ═ 0.8 to 1.2.

As shown in FIGS. 2 and 12, serpentine attachment region 211 may also include a sixth attachment arm 2116 and a seventh attachment arm 2117, as compared to the embodiment of FIG. 5. The sixth link arm 2116 has an eleventh end connected to the tenth end and a twelfth end, the sixth link arm 2116 being perpendicularly connected to the fifth link arm 2115. The seventh link arm 2117 has a thirteenth end and a fourteenth end, the thirteenth end is connected to the twelfth end, the fourteenth end is connected to the frame region 210, the seventh link arm 2117 is vertically connected to the sixth link arm 2116, wherein D1 ═ C1 xw, and C1 ═ 0.8-1.2.

As shown in fig. 2 and 13, when the meandering connection region 211 is connected to a short side of a rectangle, the distance between the connection position of the meandering connection region 211 and the frame region 210 and the connection position of the meandering connection region 211 and the edge of the resonance region 212 is D2, the length of the rectangle is L, D2 is C2 × L, and C2 is 0.8 to 1.2, as compared with the embodiment of fig. 12.

As shown in fig. 2 and fig. 14, compared to the embodiment of fig. 13, the number of the meandering connection regions 211 is two, and the two meandering connection regions 211 are opposite to each other, wherein D2 ═ C2 × L, and C2 ═ 0.8 to 1.2.

As shown in fig. 2 and fig. 15, compared to the embodiment of fig. 12, the number of the meandering connection regions 211 is two, and the two meandering connection regions 211 are opposite to each other, wherein D1 ═ C1 × W, and C1 ═ 0.8 to 1.2.

As shown in fig. 2 and 16, compared to the embodiment of fig. 12, the number of the serpentine connection regions 211 is three, and two serpentine connection regions 211 are opposite to each other. When the meandering connection region 211 is connected to a short side of the rectangle, a distance between a connection position of the meandering connection region 211 and the frame region 210 and a connection position of the meandering connection region 211 and an edge of the resonance region 212 is D2, a length of the rectangle is L, D2 ═ C2 × L, C2 ═ 0.8 to 1.2, where D1 ═ C1 × W, and C1 ═ 0.8 to 1.2.

As shown in fig. 2 and 17, compared to the embodiment of fig. 12, the number of the serpentine connection regions 211 is two, and they are connected to the short side and the long side of the rectangle, respectively. When the meandering connection region 211 is connected to a short side of the rectangle, a distance between a connection position of the meandering connection region 211 and the frame region 210 and a connection position of the meandering connection region 211 and an edge of the resonance region 212 is D2, a length of the rectangle is L, D2 ═ C2 × L, C2 ═ C1 × W, and D1 ═ C1 ═ C8 to 1.2.

As shown in fig. 2 and fig. 18, compared to the embodiment of fig. 16, the number of the meandering connection regions 211 is plural, for example, four, and all the meandering connection regions 211 are uniformly connected between the edge of the resonance region 212 and the frame region 210, where D2 ═ C2 × L, C2 ═ 0.8 to 1.2, D1 ═ C1 × W, and C1 ═ 0.8 to 1.2.

According to the above embodiments, the shock-absorbing type crystal oscillator package structure forms the winding connection region between the frame region and the resonance region to prevent external mechanical shock or instant impact from being transmitted to the resonance region and stabilize the resonance frequency.

The above description is only a preferred embodiment of the present invention, and is not intended to limit the scope of the present invention, so that equivalent variations and modifications in the shape, structure, characteristics and spirit of the present invention as described in the claims should be included in the scope of the present invention.