阅读说明：本技术 一种压电晶片主动传感器封装结构 (Piezoelectric wafer active sensor packaging structure ) 是由 孙清超 袁志伟 王瑞强 姜海涛 付雨露 于 2021-07-05 设计创作，主要内容包括：本发明提供了一种压电晶片主动传感器封装结构,属于机电阻抗技术领域。该压电晶片主动传感器封装结构包括柔性电路板、压电晶片主动传感器和射频同轴转接头；以绝缘的柔性薄膜作为基材,通过电镀或沉积方式分别在柔性薄膜的两个表面上形成金属层,制成印刷电路；压电晶片主动传感器和射频同轴转接头安装在柔性电路板上,三者进行电连接；通过对压电晶片主动传感器进行封装,使压电晶片主动传感器表面无需粘贴或焊接测试信号线即可完成测试,实现了压电晶片主动传感器和测试仪器的直接互连,加快了压电晶片主动传感器的安装效率,并因为柔性薄膜的保护,提高压电晶片主动传感器的耐久性。(The invention provides a piezoelectric wafer active sensor packaging structure, and belongs to the technical field of electromechanical impedance. The piezoelectric wafer active sensor packaging structure comprises a flexible circuit board, a piezoelectric wafer active sensor and a radio frequency coaxial adapter; respectively forming metal layers on two surfaces of the flexible film by using the insulated flexible film as a base material in an electroplating or deposition mode to manufacture a printed circuit; the piezoelectric wafer active sensor and the radio frequency coaxial adapter are arranged on the flexible circuit board and are electrically connected; through packaging the piezoelectric wafer active sensor, the surface of the piezoelectric wafer active sensor can be tested without pasting or welding a test signal line, so that the piezoelectric wafer active sensor and a test instrument are directly interconnected, the installation efficiency of the piezoelectric wafer active sensor is accelerated, and the durability of the piezoelectric wafer active sensor is improved due to the protection of the flexible film.)

1. The packaging structure of the piezoelectric wafer active sensor is characterized by comprising a flexible circuit board (2), a piezoelectric wafer active sensor (1) and a radio frequency coaxial adapter (3); the flexible circuit board (2) is divided into A, B two surfaces, wherein the A surface is provided with a printed circuit A (210), the B surface is provided with a printed circuit B (211), and the two printed circuits are different patterns; the printed circuit is a metal layer which is formed on the upper surface and the lower surface of an insulated flexible film (208) by taking the insulated flexible film (208) as a base material and respectively adopting an electroplating or deposition mode; the printed circuit A (210) is provided with three metal points, wherein the No. 2 metal point A (202) and the No. 3 metal point A (203) are positioned on a horizontal axis and have the same radius; the No. 1 metal point A (201) and the No. 2 metal point A (202) are positioned on a vertical axis, and the radius of the No. 1 metal point A (201) is larger than that of the No. 2 metal point A (202); the No. 1 metal point B (204) and the No. 2 metal point B (205) of the printed circuit B (211) are positioned on a horizontal axis, and the radiuses of the metal points B (204) and the No. 2 metal point B (205) are the same; the four square metal points (206) are respectively positioned at four vertexes of a square on one side of the printed circuit B (211); the surfaces of the printed circuit A (210) and the printed circuit B (211) are respectively covered with an A-surface coating film (207) and a B-surface coating film (209) with insulating function; metal dots No. 1 a (201) and metal dots No. 3 a (203) are exposed to the outside; the metal point B (204) No. 1 and the square metal point (206) are exposed outside; the No. 2 metal point A (202) and the No. 1 metal point B (204) are positioned on the same longitudinal axis of the flexible circuit board (2) to realize communication, and the No. 3 metal point A (203) and the No. 2 metal point B (205) are positioned on the same longitudinal axis of the flexible circuit board (2) to realize communication; the piezoelectric wafer (101) is positioned between an electrode A (102) and an electrode B (103) of the piezoelectric wafer active sensor (1); the piezoelectric wafer active sensor (1) and the radio frequency coaxial adapter (3) are arranged on different surfaces of the flexible circuit board (2), an electrode A (102) or an electrode B (103) of the piezoelectric wafer active sensor (1) is firmly adhered to a No. 1 metal point A (201) of a printed circuit A (210), and the radio frequency coaxial adapter (3) is correspondingly welded on a square metal point (206) of a printed circuit B (211) through a radio frequency coaxial adapter welding point (301); a flexible circuit board (2) with a piezoelectric wafer active sensor (1) and a radio frequency coaxial adapter (3) is pasted on the surface of a monitored structure (4).

2. The package of claim 1, wherein the thickness of the flexible circuit board (2) is less than 0.15 mm.

Technical Field

The invention belongs to the technical field of electromechanical impedance, and relates to a piezoelectric wafer active sensor packaging structure.

Background

At present, the electromechanical impedance technology belongs to a better detection method for detecting with higher measurement precision, without destroying the integrity of a monitored structure and damaging or influencing the future use performance or purpose of the monitored structure. The electromechanical impedance technology is a technology for detecting or monitoring a detected structure by sticking a piezoelectric wafer active sensor on the surface of the detected structure by using epoxy resin glue, namely, the mechanical impedance information of the detected structure is obtained by using the positive and negative piezoelectric effect and the electromechanical coupling characteristic of the piezoelectric wafer. In the process of electromechanical impedance testing, a test signal wire is led out from the surface of an electrode of a piezoelectric wafer active sensor by adopting a sticking or welding mode at present. However, this method has the following problems:

1) due to improper operation in the installation process, the piezoelectric wafer active sensor can be damaged, so that the performance defect is caused;

2) the pasting operation needs to be carried out on site by experienced operators, pressure needs to be kept for a long time to ensure the conductivity, and the waiting time is long;

3) the welding operation needs to be carried out on site by an experienced operator, and the welding temperature and the contact time of the electric soldering iron and the piezoelectric wafer active sensor need to be controlled;

4) the performance of the adhesive layer is greatly influenced by environmental factors (temperature and humidity), and the adhesion quality is difficult to ensure;

5) the quality of welding spots is difficult to ensure to be consistent, and the welding quality is difficult to ensure;

6) the piezoelectric wafer active sensor is exposed in a severe environment in the use process, and is easily damaged;

therefore, a package structure of a piezoelectric wafer active sensor is needed to increase the mounting efficiency and durability of the piezoelectric wafer active sensor.

Disclosure of Invention

Therefore, the invention aims to solve the problem that the test signal wire is led out from the surface of the active sensor electrode of the piezoelectric wafer in a sticking or welding mode at present. The packaging structure of the piezoelectric wafer active sensor is provided, and the packaging structure of the piezoelectric wafer active sensor is capable of accelerating the installation efficiency of the piezoelectric wafer active sensor and improving the durability of the piezoelectric wafer active sensor.

The technical scheme of the invention is as follows:

a piezoelectric wafer active sensor packaging structure comprises a flexible circuit board 2, a piezoelectric wafer active sensor 1 and a radio frequency coaxial adapter 3; the flexible circuit board 2 is divided into A, B two sides, wherein the A side is provided with a printed circuit A210, the B side is provided with a printed circuit B211, and the two printed circuits are different patterns; the printed circuit is a metal layer which is formed on the upper surface and the lower surface of the flexible film 208 respectively by taking the insulated flexible film 208 as a base material through electroplating or deposition; the printed circuit A210 is provided with three metal points, wherein the No. 2 metal point A202 and the No. 3 metal point A203 are positioned on a horizontal axis and have the same radius; the No. 1 metal point A201 and the No. 2 metal point A202 are positioned on a longitudinal axis, and the radius of the No. 1 metal point A201 is larger than that of the No. 2 metal point A202; the metal point No. 1B 204 and the metal point No. 2B 205 of the printed circuit B211 are located on the horizontal axis, and the radii thereof are the same; the four square metal points 206 are respectively positioned at four vertexes of a square on one side of the printed circuit B211; the surfaces of the printed circuit A210 and the printed circuit B211 are respectively covered with an A-side coating film 207 and a B-side coating film 209 with insulating function; the metal spot a201 No. 1 and the metal spot a203 No. 3 are exposed to the outside; the metal dot No. 1B 204 and the square metal dot 206 are exposed to the outside; the No. 2 metal point A202 and the No. 1 metal point B204 are positioned on the same longitudinal axis of the flexible circuit board 2 to realize communication, and the No. 3 metal point A203 and the No. 2 metal point B205 are positioned on the same longitudinal axis of the flexible circuit board 2 to realize communication; the piezoelectric wafer 101 is located between the electrode a102 and the electrode B103 of the piezoelectric wafer active sensor 1; the piezoelectric wafer active sensor 1 and the radio frequency coaxial adapter 3 are installed on different surfaces of the flexible circuit board 2, an electrode A102 or an electrode B103 of the piezoelectric wafer active sensor 1 is firmly adhered to a No. 1 metal point A201 of a printed circuit A210, and the radio frequency coaxial adapter 3 is correspondingly welded on a square metal point 206 of a printed circuit B211 through a radio frequency coaxial adapter welding point 301; the flexible circuit board 2 with the piezoelectric chip active sensor 1 and the radio frequency coaxial adapter 3 is pasted on the surface of the monitored structure 4.

The thickness of the flexible circuit board 2 is less than 0.15 mm.

The invention has the beneficial effects that: through packaging the piezoelectric wafer active sensor, the surface of the piezoelectric wafer active sensor can be tested without pasting or welding a test signal line, so that the piezoelectric wafer active sensor and a test instrument are directly interconnected, the installation efficiency of the piezoelectric wafer active sensor is accelerated, and the durability of the piezoelectric wafer active sensor is improved due to the protection of the flexible film.

Drawings

Fig. 1 is a schematic view of the present invention installed on the surface of a structure to be monitored.

Fig. 2 is a schematic diagram of a packaged piezoelectric wafer active sensor of the present invention.

FIG. 3 is a schematic A-side layout of a printed circuit of the present invention.

FIG. 4 is a B-side layout diagram of a printed circuit of the present invention.

FIG. 5 is a schematic view of the A-side insulating coating of the flexible circuit board of the present invention.

Fig. 6 is a schematic view of the B-side insulating coating of the flexible circuit board of the present invention.

FIG. 7 is a schematic diagram of a flexible circuit board structure according to the present invention

Fig. 8 is a schematic diagram of a welding point of the rf coaxial adapter according to the present invention.

Fig. 9 is a schematic view of a piezoelectric wafer active sensor of the present invention.

In the figure: 1 piezoelectric wafer active sensor; 2 a flexible circuit board; 3, radio frequency coaxial adapter; 4 monitoring the structure; 101 a piezoelectric wafer; 102 an electrode A; 103 electrode B; 2011 metal dot a; metal dot No. 2022A; 2033 metal dot A; metal dot No. 2041B; metal point No. 2052B; 206 square metal dots; 207A side coating, 208 flexible film, 209B side coating, 210 printed circuit a, 211 printed circuit B, 301 rf coaxial adapter solder joint.

Detailed Description

The following further describes a specific embodiment of the present invention with reference to the drawings and technical solutions.

The present invention uses a Flexible Printed Circuit (FPC) in which an insulating Flexible film 208 is used as a base material, and metal layers are formed on both surfaces of the Flexible film by plating or deposition to form a Printed Circuit a210 and a Printed Circuit B211, respectively. The thickness of the flexible circuit board 2 is less than 0.15 mm. The invention comprises a flexible circuit board 2 with a printed circuit, a piezoelectric wafer active sensor 1 and a radio frequency coaxial adapter 3.

The present invention will be described in further detail with reference to the accompanying drawings.

Referring to fig. 3, 4, different printed circuits a210 and B211 are plated or deposited on both sides a and B of the flexible circuit board 2, respectively. Metal No. 2 a202 communicates with metal No. 1B 204. Metal point No. 3 a203 communicates with metal point No. 2B 205.

Referring to fig. 5, 6, and 7, the surface of the flexible circuit board 2 is covered with an insulating film. The coating patterns on the two surfaces A and B are different, so that different metal points can be exposed. The metal spot a201 No. 1 and the metal spot a203 No. 3 are exposed to the outside. The metal dot No. 1B 204 and the square metal dot 206 are exposed to the outside.

Referring to fig. 2, 3, 4, 7, and 9, before packaging, acetone or other organic solvent is used to remove oil or other organic contaminants from the surfaces of the piezoelectric wafer 101, the flexible film 208 circuitry, and the rf coax pads 301. The flexible circuit board 2 is fixed, and the electrode a102 or the electrode B103 of the piezoelectric wafer active sensor 1 is firmly adhered to the metal point a201 No. 1 of the printed circuit a210 by using epoxy resin glue. And then, firmly welding the welding point 301 of the radio frequency coaxial adapter with the square metal point 206 of the printed circuit B211.

Referring to fig. 1, the piezoelectric wafer active sensor 1 after being packaged is installed on the surface of a monitored structure, and after paint, debris and oxide on the surface of the monitored structure are removed, the piezoelectric wafer active sensor after being packaged can be adhered to the surface of the monitored structure without leading out a test signal wire from the electrode surface of the piezoelectric wafer active sensor.

And (3) carrying out welding and bonding quality inspection on the No. 1 metal point B204 and the No. 2 metal point B205 by using a multimeter, confirming that the connection of each part is good and the operation is normal, and then starting the test.