阅读说明：本技术 一种铝合金高亮光加工的激光打标方法及装置 (Laser marking method and device for aluminum alloy high-brightness light processing ) 是由 王建刚 李凤 纪涛 刘勇 于 2021-06-22 设计创作，主要内容包括：本发明公开提供一种铝合金高亮光加工的激光打标方法及装置,所述方法包括导入打标图档、图档处理、放置工件和对工件进行打标,图档处理包括根据不同的工件表面处理工艺,设置不同的激光打标参数；工件表面处理工艺包括：铝合金-喷砂-预处理-镭雕或铝合金-喷砂-阳极-镭雕-二阳；激光打标参数包括：高亮光镭雕参数和/或破阳参数。本发明针对不同的工件表面处理工艺,设置不同的激光打标参数,使得同一套设备同一产线能够适配不同工艺处理后的工件表面,设备包容性强且工厂成本较低；且能够达到针对不同表面处理工艺处理后的工件表面,通过不同的激光参数设置实现高亮光效果的目的,简化LOGO制标流程,提高全制程良率。(The invention discloses a laser marking method and a device for highlight processing of aluminum alloy, wherein the method comprises the steps of introducing a marking drawing file, processing the drawing file, placing a workpiece and marking the workpiece, wherein the processing of the drawing file comprises the steps of setting different laser marking parameters according to different workpiece surface processing technologies; the workpiece surface treatment process comprises the following steps: aluminum alloy-sand blasting-pretreatment-laser etching or aluminum alloy-sand blasting-anode-laser etching-two-anode; the laser marking parameters include: and (3) high-brightness laser etching parameters and/or sun-breaking parameters. According to the invention, different laser marking parameters are set aiming at different workpiece surface treatment processes, so that the same production line of the same set of equipment can be adapted to the surfaces of workpieces treated by different processes, the equipment containment is strong, and the factory cost is lower; the purpose of realizing the high-brightness effect through different laser parameter settings aiming at the surfaces of the workpieces treated by different surface treatment processes can be achieved, the LOGO marking process is simplified, and the yield of the whole process is improved.)

1. The laser marking method for the high-brightness light processing of the aluminum alloy is characterized by comprising the steps of introducing a marking drawing file, processing the drawing file, placing a workpiece and marking the workpiece, wherein the drawing file processing further comprises the following steps: setting different laser marking parameters according to different workpiece surface treatment processes; the workpiece surface treatment process comprises the following steps: aluminum alloy-sand blasting-pretreatment-laser etching or aluminum alloy-sand blasting-anode-laser etching-two-anode; the laser marking parameters include: and (3) high-brightness laser etching parameters and/or sun-breaking parameters.

2. The laser marking method for aluminum alloy high-brightness processing according to claim 1, wherein when the workpiece surface treatment process is aluminum alloy-sand blasting-pretreatment-laser etching, after sand blasting and pretreatment are performed on the surface of the aluminum alloy workpiece, the high-brightness effect is laser etched in a continuous light mode.

3. The laser marking method for the high light processing of the aluminum alloy according to claim 2, wherein the pretreatment comprises: ultrasonic water washing, chemical reagent soaking, ultrasonic water washing and drying.

4. The laser marking method for aluminum alloy high-brightness processing according to claim 1, wherein when the workpiece surface treatment process is aluminum alloy-sand blasting-anode-laser etching-secondary anode, after sand blasting and anode treatment are performed on the surface of the aluminum alloy workpiece, the surface anode layer is broken by adopting a pulsed light mode, the continuous light mode is adopted to laser etch the high-brightness light effect, and a secondary anode treatment is adopted to increase the surface protection layer.

5. The laser marking method for high-brightness processing of aluminum alloy according to any one of claims 2 to 4, wherein the high-brightness laser etching parameters comprise: the laser power is 60-90%, the marking speed is 1000-2500 mm/s, and the filling density is 0.01-0.03 mm.

6. The laser marking method for highlight processing of aluminum alloy according to claim 4, wherein said sun breaking parameters comprise: the laser pulse width is 50ns to 100ns, the laser power is 50% to 70%, the laser repetition frequency is 80kHz to 150kHz, the marking speed is 1000mm/s to 2500mm/s, and the filling density is 0.01mm to 0.03 mm.

7. The laser marking method for highlight processing of aluminum alloy according to claim 1, wherein laser beam deviates from focus by 1-1.5mm when laser etching highlight effect.

8. The laser marking method for highlight processing of aluminum alloys according to claim 1, further comprising: and after the workpiece is placed, sequentially adsorbing and blowing the workpiece.

9. A laser marking device for highlight processing of aluminum alloy is characterized by comprising a laser, a three-dimensional dynamic focusing galvanometer, an air blowing device, an adsorption device, a mechanical device and a control system; the control system is connected with the laser and is used for setting the operating parameters of the laser, including focal length, power, pulse width, repetition frequency, marking speed and filling density; the control system is connected with the three-dimensional dynamic focusing galvanometer and is used for focusing laser emitted by the laser and controlling the position of a laser focus on a workpiece; the control system is connected with the air blowing device and is used for blowing air to the workpiece; the control system is connected with the adsorption device and is used for adsorbing the workpiece; the control system is connected with the mechanical device and used for controlling the movement of the workpiece.

10. The laser marking device for the high-brightness processing of the aluminum alloy as claimed in claim 9, wherein the marking breadth range of the three-dimensional dynamic focusing galvanometer is 0-400 mm.

Technical Field

The invention relates to the technical field of continuous pulse laser marking, in particular to a laser processing device and a laser processing method for LOGO high-brightness laser engraving on the surface of a large-width aluminum alloy pen shell, and specifically relates to a laser marking method and a laser marking device for aluminum alloy high-brightness processing.

Background

The aluminum alloy has higher strength, good casting performance and plastic processing performance, good corrosion resistance and weldability, and can be widely applied to the industries of aerospace, aviation, transportation, construction, electromechanics, lightening, electronics and the like. Due to the characteristics of light weight, high strength and the like, the aluminum alloy material is widely used for manufacturing the pen shell in the 3C industry.

The traditional LOGO labeling manufacturing process of the pen-electricity shell comprises the steps of upstream supplier purchase of LOGO, character opening, stamping, surface mounting, trimming, polishing, film coating and the like, the process is complicated and complex, the whole process for labeling can be calculated for several minutes, the factory investment cost is high, the full manufacturing yield is low, and the industrial application is not facilitated; in addition, the traditional labeling process needs to adopt different production lines for the surfaces of workpieces processed by different processes, for example, two production lines are possibly needed for sandblasting aluminum and anode aluminum, the production line investment is increased, and the production line cost is increased. Moreover, the LOGO manufactured by the traditional process method has few types and small size, and cannot meet the requirement of customizing complex patterns, so that the LOGO of the pen shell is more and more processed by using focused laser beams in industry.

The laser marking is that laser generated by a laser passes through a series of optical conduction, and finally, light beams are focused through an optical lens, and the laser with high energy density is deflected to a designated position on the surface of an object to be processed, so that a surface layer material is subjected to physical change or chemical change, and a permanent mark is left. For example, the chinese patent publication No. CN105543928B, No. 2018, month 1 and day 16, discloses a metal or alloy shell and a manufacturing method thereof, in which a plurality of bright spots are laser-engraved at preset positions on the surface of a metal or alloy shell material by using a laser engraving method, and then the metal or alloy shell material after the laser engraving is colored to obtain the metal or alloy shell. The purpose of this patent is that the metal or the alloy casing that make has the flash point effect, strengthens the fashion nature of product, it only need process out the bright spot can, can not be used for solving the problem that the process of the subsides full processing procedure of LOGO mark is loaded down with trivial details, with high costs and the yield is low.

For another example, chinese publication No. CN110560916A, dedicated to 2019, 12 and 13, discloses an apparatus and a method for marking on the surface of an aluminum alloy anode layer by using laser, which, in this patent application, sets a beam expander and a focusing mirror, where the beam expander diffuses a laser beam to increase the diameter of the beam, and then focuses the beam by the focusing mirror to concentrate the beam, so as to increase the density of the beam and facilitate the damage of the anode layer for marking, but the purpose of this patent application solves the problems of thermal damage and severe thermal diffusion of the laser to the material when marking is performed on the aluminum alloy anode layer by using the apparatus provided by the present application, and also cannot solve the problems of tedious process, high cost and low yield of the whole process of LOGO labeling.

Therefore, the method can solve the problems of complicated process, high cost and low yield of the whole LOGO labeling process, and is necessary to realize efficient processing of complex LOGO patterns and enlarge the mass production size of the LOGO patterns.

Disclosure of Invention

In order to overcome the defects of the prior art, the invention provides a laser marking method and device for aluminum alloy high-brightness processing, which can effectively solve the problems of complicated process, high cost and low yield of the whole LOGO labeling process under the condition of common configuration.

According to an aspect of the present disclosure, there is provided a laser marking method for highlight processing of an aluminum alloy, including introducing a marking drawing, processing the drawing, placing a workpiece, and marking the workpiece, wherein the drawing processing further includes: setting different laser marking parameters according to different workpiece surface treatment processes; the workpiece surface treatment process comprises the following steps: aluminum alloy-sand blasting-pretreatment-laser etching or aluminum alloy-sand blasting-anode-laser etching-two-anode; the laser marking parameters include: and (3) high-brightness laser etching parameters and/or sun-breaking parameters.

According to the technical scheme, when the drawing file to be marked is processed, different laser marking parameters are set for different workpiece surface processing technologies, so that the same production line of the same set of equipment can be adapted to the surfaces of workpieces processed by different technologies, the equipment compatibility is strong, and the factory cost is low; when the surface of a workpiece is sand-blasting aluminum, a continuous light mode laser etching highlight light effect is adopted, when the surface of the workpiece is anode aluminum, a surface anode layer is broken by adopting pulsed light firstly, and then the highlight light effect is realized by adopting a continuous light laser etching mode, so that the aim of realizing the highlight light effect by setting different laser parameters on the surface of the workpiece treated by different surface treatment processes is fulfilled, the LOGO marking process is simplified, and the yield of the whole process is improved.

Further, the step of importing the marking drawing is used for importing the drawing to be marked into a computer system; the step of placing the workpiece is used for placing the workpiece to be processed on the clamp, and the clamp is placed horizontally; in the step of marking the workpiece, the computer system marks a corresponding marking drawing file on the corresponding position of the workpiece by controlling the vibrating mirror and the focusing mirror group. The galvanometer is a front-focusing three-dimensional dynamic focusing galvanometer, and the laser is a continuous pulse laser.

Further, the drawing file comprises graphics, texts or a combination of the graphics and the texts.

As a further technical scheme, when the surface treatment process of the workpiece is aluminum alloy-sand blasting-pretreatment-laser etching, after sand blasting and pretreatment are carried out on the surface of the aluminum alloy workpiece, a continuous light mode laser etching highlight light effect is adopted.

As a further technical solution, the preprocessing includes: ultrasonic water washing, chemical reagent soaking, ultrasonic water washing and drying. And after the workpiece is subjected to sand blasting, a pretreatment process is adopted to enhance the surface smoothness and smoothness of the workpiece.

As a further technical scheme, when the surface treatment process of the workpiece is aluminum alloy-sand blasting-anode-laser etching-secondary anode, after sand blasting and anode treatment are carried out on the surface of the aluminum alloy workpiece, a surface anode layer is broken by adopting a pulsed light mode, a continuous light mode laser etching highlight light effect is adopted, and a secondary anode treatment is adopted to increase a surface protection layer.

As a further technical solution, the parameters of the high-brightness laser etching include: the laser power is 60-90%, the marking speed is 1000-2500 mm/s, and the filling density is 0.01-0.03 mm.

As a further technical solution, the yang-breaking parameters include: the laser pulse width is 50ns to 100ns, the laser power is 50% to 70%, the laser repetition frequency is 80kHz to 150kHz, the marking speed is 1000mm/s to 2500mm/s, and the filling density is 0.01mm to 0.03 mm.

As a further technical scheme, when laser etching is carried out on the high-brightness light effect, the laser beam deviates from the focus by 1-1.5 mm.

As a further technical solution, the method further comprises: and after the workpiece is placed, sequentially adsorbing and blowing the workpiece.

Further, the adsorption device is resistant to a high temperature of at least 250 ℃. The air pressure of the blowing device is about 0.1-0.4 MPa. The adsorption of the workpiece is realized by opening the adsorption device control switch, and the air blowing of the workpiece is realized by opening the air blowing device control switch.

According to one aspect of the present disclosure, a laser marking device for highlighting aluminum alloy is provided, which includes a laser, a three-dimensional dynamic focusing galvanometer, a blowing device, an adsorption device, a mechanical device and a control system; the control system is connected with the laser and is used for setting the operating parameters of the laser, including focal length, power, pulse width, repetition frequency, marking speed and filling density; the control system is connected with the three-dimensional dynamic focusing galvanometer and is used for focusing laser emitted by the laser and controlling the position of a laser focus on a workpiece; the control system is connected with the air blowing device and is used for blowing air to the workpiece; the control system is connected with the adsorption device and is used for adsorbing the workpiece; the control system is connected with the mechanical device and used for controlling the movement of the workpiece.

As a further technical scheme, the marking breadth range of the three-dimensional dynamic focusing galvanometer is 0-400 mm.

Compared with the prior art, the invention has the beneficial effects that:

(1) the invention provides a method, when processing a picture file to be marked, different laser marking parameters are set aiming at different workpiece surface processing technologies, so that the same production line of the same set of equipment can be adapted to the surfaces of workpieces processed by different technologies, the equipment inclusion is strong, and the factory cost is lower; when the surface of a workpiece is sand-blasting aluminum, a continuous light mode laser etching highlight light effect is adopted, when the surface of the workpiece is anode aluminum, a surface anode layer is broken by adopting pulsed light firstly, and then the highlight light effect is realized by adopting a continuous light laser etching mode, so that the aim of realizing the highlight light effect by setting different laser parameters on the surface of the workpiece treated by different surface treatment processes is fulfilled, the LOGO marking process is simplified, and the yield of the whole process is improved.

(2) The invention provides a device, which comprises a laser, a three-dimensional dynamic focusing galvanometer, an air blowing device, an adsorption device, a mechanical device and a control system, wherein the air blowing device is arranged on the laser; the control system is connected with the laser and is used for setting the operating parameters of the laser, including focal length, power, pulse width, repetition frequency, marking speed and filling density; the control system is connected with the three-dimensional dynamic focusing galvanometer and is used for focusing laser emitted by the laser and controlling the position of a laser focus on a workpiece; the control system is connected with the air blowing device and is used for blowing air to the workpiece; the control system is connected with the adsorption device and is used for adsorbing the workpiece; the control system is connected with the mechanical device and used for controlling the movement of the workpiece. The device is low in cost, can be used for LOGO marking of workpieces processed by different surface processes by matching with the method, is suitable for production line application, and reduces factory cost.

Drawings

Fig. 1 is a schematic flow chart of a laser marking method for highlight processing of an aluminum alloy according to an embodiment of the present invention.

Fig. 2 is a diagram illustrating the positive-breaking effect of the pulsed laser according to the embodiment of the present invention.

Fig. 3 is a diagram illustrating the effect of continuous laser sun-breaking according to an embodiment of the present invention.

Fig. 4 is a diagram of a continuous laser highlighting effect according to an embodiment of the present invention.

Fig. 5 is a schematic diagram illustrating comparison of the high-brightness laser etching effect according to an embodiment of the invention.

Fig. 6 is a schematic structural diagram of a laser marking device for highlight processing of aluminum alloy according to an embodiment of the present invention.

Fig. 7 is a schematic diagram of an internal structure of a three-dimensional dynamic focusing galvanometer according to an embodiment of the invention.

In the figure: the device comprises a laser 1, a three-dimensional dynamic focusing galvanometer 2, an air blowing device 3, an adsorption device 4, a mechanical device 5, a beam expanding lens 21, a concave lens 22, a focusing front mirror 23, a focusing rear mirror 24, a first reflecting mirror 25, a second reflecting mirror 26, a first high-speed motor 27, a second high-speed motor 28 and a third high-speed motor 29.

Detailed Description

The technical solutions of the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings, and it is to be understood that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments of the present invention without any inventive step, are within the scope of the present invention.

In the description of the present invention, it is to be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", and the like, indicate orientations and positional relationships based on those shown in the drawings, and are used only for convenience of description and simplicity of description, and do not indicate or imply that the device or element being referred to must have a particular orientation, be constructed and operated in a particular orientation, and thus, should not be considered as limiting the present invention. Furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, features defined as "first", "second", may explicitly or implicitly include one or more of the described features. In the description of the present invention, "a plurality" means two or more unless specifically defined otherwise.

In the description of the present invention, it should be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "connected," and "connected" are to be construed broadly, e.g., as meaning either a fixed connection, a removable connection, or an integral connection; may be mechanically connected, may be electrically connected or may be in communication with each other; either directly or indirectly through intervening media, either internally or in any other relationship. The specific meanings of the above terms in the present invention can be understood by those skilled in the art according to specific situations.

In the present invention, unless otherwise expressly stated or limited, "above" or "below" a first feature means that the first and second features are in direct contact, or that the first and second features are not in direct contact but are in contact with each other via another feature therebetween. Also, the first feature being "on," "above" and "over" the second feature includes the first feature being directly on and obliquely above the second feature, or merely indicating that the first feature is at a higher level than the second feature. A first feature being "under," "below," and "beneath" a second feature includes the first feature being directly under and obliquely below the second feature, or simply meaning that the first feature is at a lesser elevation than the second feature.

Example 1

As shown in fig. 1, the present embodiment provides a laser marking method for highlight processing of aluminum alloy, including:

s1: leading in a marking drawing file: and importing the drawing to be marked into the computer system. The drawing file comprises graphics, texts or a combination of the graphics and the texts.

S2: processing the drawing file: and setting different laser marking parameters according to different workpiece surface treatment processes. The workpiece surface treatment process comprises the following steps: aluminum alloy-sand blasting-pretreatment-laser etching or aluminum alloy-sand blasting-anode-laser etching-two-anode; the laser marking parameters include: and (3) high-brightness laser etching parameters and/or sun-breaking parameters.

S3: placing a workpiece: and placing the workpiece on a clamp, wherein the clamp is placed in a horizontal plane.

S4: adsorbing the workpiece: and opening the control switch of the adsorption device. The adsorption device is resistant to at least 250 ℃ of high temperature.

S5: blowing the workpiece: and opening a control switch of the air blowing device. The air pressure of the blowing device is about 0.1-0.4 MPa.

S6: marking a workpiece: and the computer system marks corresponding marking drawing files on corresponding positions of the workpiece by controlling the vibrating mirror and the focusing mirror group.

Further, when the workpiece surface treatment process is aluminum alloy-sand blasting-pretreatment-laser etching, after sand blasting and pretreatment are carried out on the surface of the aluminum alloy workpiece, a continuous light mode laser etching highlight effect is adopted. The pretreatment comprises the following steps: ultrasonic water washing, chemical reagent soaking, ultrasonic water washing, drying, and adopting a pretreatment process after sand blasting of the workpiece to enhance the surface smoothness and smoothness of the workpiece.

Further, when the surface treatment process of the workpiece is aluminum alloy-sand blasting-anode-laser etching-secondary anode, after sand blasting and anode treatment are carried out on the surface of the aluminum alloy workpiece, a surface anode layer is broken by adopting a pulsed light mode, a continuous light mode laser etching highlight light effect is adopted, and a surface protection layer is increased by adopting secondary anode treatment. Under the same other conditions, sunlight is broken by adopting pulsed light, the surface of the workpiece is smooth and fine, and the sample color is white after sunlight is broken, as shown in figure 2; and the continuous light is adopted to break the sun, so that the surface of the workpiece is rough and black, and the effect is poor, as shown in figure 3. The effect of using continuous light highlighting is shown in fig. 4. The common white color is formed by adopting pulsed light highlighting, and the effect of the white color generated after sun breaking is almost the same as that of the white color, so that the pulsed light highlighting cannot be adopted.

Further, the high-brightness laser etching parameters include: the laser power is 60-90%, the marking speed is 1000-2500 mm/s, and the filling density is 0.01-0.03 mm.

Further, the sun damage parameters comprise: the laser pulse width is 50ns to 100ns, the laser power is 50% to 70%, the laser repetition frequency is 80kHz to 150kHz, the marking speed is 1000mm/s to 2500mm/s, and the filling density is 0.01mm to 0.03 mm.

Further, when the laser etching is used for highlighting the light effect, the laser beam deviates from the focus by 1-1.5 mm. As shown in figure 5, the effect contrast graph of the positive-focus laser etching and the defocusing 1mm laser etching shows that the surface of the positive-focus laser etching has more explosion points and poor effect, and the defocusing laser etching has smoother surface and better effect.

When the drawing to be marked is processed, different laser marking parameters are set according to different workpiece surface processing technologies, so that the same production line of the same set of equipment can be adapted to the surfaces of workpieces processed by different technologies, the equipment containment is strong, and the factory cost is low; when the surface of a workpiece is sand-blasting aluminum, a continuous light mode laser etching highlight light effect is adopted, when the surface of the workpiece is anode aluminum, a surface anode layer is broken by adopting pulsed light firstly, and then the highlight light effect is realized by adopting a continuous light laser etching mode, so that the aim of realizing the highlight light effect by setting different laser parameters on the surface of the workpiece treated by different surface treatment processes is fulfilled, the LOGO marking process is simplified, and the yield of the whole process is improved.

Example 2

As shown in fig. 6, the present embodiment provides a laser marking device for highlighting aluminum alloy, which includes a laser 1, a three-dimensional dynamic focusing galvanometer 2, an air blowing device 3, an adsorption device 4, a mechanical device 5, and a control system; the control system is connected with the laser 1 and is used for setting the operating parameters of the laser 1, including focal length, power, pulse width, repetition frequency, marking speed and filling density; the control system is connected with the three-dimensional dynamic focusing galvanometer 2 and is used for focusing laser emitted by the laser 1 and controlling the position of a laser focus on a workpiece; the control system is connected with the air blowing device 3 and is used for blowing air to the workpiece; the control system is connected with the adsorption device 4 and is used for adsorbing the workpiece; the control system is connected to the mechanical device 5 for controlling the movement of the workpiece.

As shown in fig. 7, the three-dimensional dynamic focusing galvanometer 2 includes a beam expander 21, a concave lens 22, a focusing front mirror 23, a focusing rear mirror 24, a first reflecting mirror 25, a second reflecting mirror 26, a first high-speed motor 27, a second high-speed motor 28, and a third high-speed motor 29. The laser at the outlet of the laser 1 passes through the beam expander 21 and then is diffused by the concave lens 22, and the diffused laser is focused by the focusing front mirror 23 and the focusing rear mirror 24 in sequence and then passes through the first reflecting mirror 25 and the second reflecting mirror 26 in sequence and then irradiates on the workbench; a first high-speed motor 27 is arranged on the concave lens 22, and the first high-speed motor 27 controls the concave lens 22 to move back and forth; the first reflector 25 is provided with a second high-speed motor 28, and the second high-speed motor 28 controls the first reflector 25 to rotate; the second reflector 26 is provided with a third high-speed motor 29, and the third high-speed motor 29 controls the second reflector 26 to rotate.

The marking breadth range of the three-dimensional dynamic focusing galvanometer is 0-400 mm.

In this embodiment, the laser emitted by the laser 1 is focused by the three-dimensional dynamic focusing galvanometer 2 and then emitted to the mechanical device 5 to mark the marking object; the control system controls the position of the laser focus in the marking X, Y and the Z-axis direction through the three-dimensional dynamic focusing galvanometer 2.

Finally, it should be noted that: the above examples are only intended to illustrate the technical solution of the present invention, but not to limit it; although the present invention has been described in detail with reference to the foregoing embodiments, it will be understood by those of ordinary skill in the art that: the technical solutions described in the foregoing embodiments may still be modified, or some or all of the technical features may be equivalently replaced; and the modifications or the substitutions do not make the essence of the corresponding technical solutions deviate from the technical solutions of the embodiments of the present invention.