阅读说明：本技术 一种激光化学腐蚀加工灰度阶梯结构产品的方法及其系统 (Method and system for processing gray-scale stepped structure product by laser chemical corrosion ) 是由 陶沙 张�杰 秦国双 于 2020-12-31 设计创作，主要内容包括：本发明涉及一种激光化学腐蚀加工灰度阶梯结构产品的方法及其系统,该方法包括利用激光对玻璃表面进行加工,以得到初加工产品；对所述初加工产品采用化学腐蚀,以得到灰度阶梯结构的产品。本发明通过激光在玻璃表面加工出待加工的图案,改变玻璃表面及下层的材料物理化学性质,并利用碱性腐蚀液进行化学腐蚀,由此加工出灰度阶梯结构的产品,实现高效率地制备灰度阶梯结构的光学微型器件。(The invention relates to a method and a system for processing a gray-scale stepped structure product by laser chemical corrosion, wherein the method comprises the steps of processing the surface of glass by laser to obtain a primary processed product; and carrying out chemical corrosion on the primary processed product to obtain a product with a gray-scale stepped structure. The invention processes the pattern to be processed on the glass surface by laser, changes the physical and chemical properties of the material on the glass surface and the lower layer, and utilizes alkaline corrosive liquid to carry out chemical corrosion, thereby processing the product with the gray-scale stepped structure and realizing the high-efficiency preparation of the optical micro device with the gray-scale stepped structure.)

1. A method for processing a gray-scale step structure product by laser chemical etching is characterized by comprising the following steps:

processing the surface of the glass by using laser to obtain a primary processed product;

and carrying out chemical corrosion on the primary processed product to obtain a product with a gray-scale stepped structure.

2. The method of claim 1, wherein the processing the glass surface by laser to obtain a primary processed product comprises:

and processing the required pattern on the surface of the glass by adopting an ultraviolet laser beam to obtain a primary processing product.

3. The method of claim 2, wherein the wavelength of the UV laser beam is 343nm to 355nm, or the wavelength of the UV laser beam is 266mm, or the wavelength of the UV laser beam is 213 mm.

4. The method for processing gray-scale stepped structure product by laser chemical etching as claimed in claim 3, wherein the pulse width of said UV laser beam is 250fs to 950fs, or the pulse width of said UV laser beam is not more than 15ps, or the pulse width of said UV laser beam is not more than 10 ns.

5. The method of claim 1, wherein the chemical etching is applied to the preliminary processed product to obtain a gray-scale step structure product, and the method comprises:

and chemically corroding the pattern of the primary processed product by adopting alkaline corrosive liquid to obtain a product with a gray-scale stepped structure.

6. The method of claim 5, wherein the alkaline etchant is KOH aqueous solution.

7. The method for processing gray-scale stepped structure product by laser chemical etching as claimed in claim 6, wherein the etching temperature of said alkaline etching solution is 97 ℃.

8. A system for processing a gray-scale stepped structure product by laser chemical etching, the system being suitable for the method for processing a gray-scale stepped structure product by laser chemical etching according to any one of claims 1 to 5, the system comprising a chemical etching tank, a laser, a processing assembly and a mobile machine, wherein the processing assembly and the laser are respectively located on the mobile machine, the laser is connected with the processing assembly, and the chemical etching tank is located on one side of the mobile machine.

9. The system of claim 8, wherein the processing assembly comprises a beam expander, a galvanometer, and a field lens, which are connected in sequence, and the processing assembly further comprises a lens, which is connected to the beam expander.

10. The system of claim 9, wherein the processing assembly further comprises a first reflector and a second reflector, the first reflector is connected between the beam expander and the vibrating mirror, and the first reflector is connected to the lens through the second reflector.

Technical Field

The invention relates to a glass processing method, in particular to a method and a system for processing a gray-scale step structure product by laser chemical corrosion.

Background

The glass belongs to an important amorphous brittle transparent material with stable chemical properties, and is widely applied to consumer electronics and biomedical treatment. Also due to its chemical stability and brittleness, glass materials are particularly suitable for laser micromachining. The processing modes mainly comprise two modes, namely a dry-method mode of direct material removal, laser direct writing modes such as cutting, drilling and surface carving, and the like, so that high-quality and high-efficiency processing is realized; the other is wet processing of laser-induced chemical etching, and in view of the high toxicity of HF (aqueous solution of hydrogen fluoride gas) solution, the existing chemical etching solution mainly uses low-toxicity alkaline etching solution. The corrosion rate of the glass after laser treatment is far greater than that of the glass without laser treatment.

At present, dry laser processing is generally adopted for processing and preparing an optical micro device with a gray scale step structure, such as a surface micro lens array, but for realizing continuous structure change by processing a gradual step structure, the motion control requirement of a laser beam is high, and the efficiency is low.

Therefore, it is necessary to design a new method for efficiently manufacturing an optical micro device having a gray scale step structure.

Disclosure of Invention

The invention aims to overcome the defects of the prior art and provides a method and a system for processing a gray-scale step structure product by laser chemical etching.

In order to achieve the purpose, the invention adopts the following technical scheme: a method of laser chemical etching a gray scale stepped structure product, comprising:

processing the surface of the glass by using laser to obtain a primary processed product;

and carrying out chemical corrosion on the primary processed product to obtain a product with a gray-scale stepped structure.

The further technical scheme is as follows: the processing of the glass surface by laser to obtain a preform product comprises:

and processing the required pattern on the surface of the glass by adopting an ultraviolet laser beam to obtain a primary processing product.

The further technical scheme is as follows: the wavelength of the ultraviolet laser beam is 343nm to 355nm, or the wavelength of the ultraviolet laser beam is 266mm, or the wavelength of the ultraviolet laser beam is 213 mm.

The further technical scheme is as follows: the pulse width of the ultraviolet laser beam is 250fs to 950fs, or the pulse width of the ultraviolet laser beam is not more than 15ps, or the pulse width of the ultraviolet laser beam is not more than 10 ns.

The further technical scheme is as follows: the method for obtaining the gray-scale stepped structure by chemically etching the primary processed product comprises the following steps:

and chemically corroding the pattern of the primary processed product by adopting alkaline corrosive liquid to obtain a product with a gray-scale stepped structure.

The further technical scheme is as follows: the alkaline corrosive liquid is KOH aqueous solution.

The further technical scheme is as follows: the corrosion temperature of the alkaline corrosion liquid is 97 ℃.

The invention also provides a system for processing the gray-scale stepped structure product by laser chemical corrosion, which is suitable for the method for processing the gray-scale stepped structure product by laser chemical corrosion.

The further technical scheme is as follows: the processing assembly comprises a beam expander, a vibrating mirror and a field lens which are connected in sequence, and the processing assembly further comprises a lens, and the lens is connected with the beam expander.

The further technical scheme is as follows: the processing assembly further comprises a first reflecting mirror and a second reflecting mirror, the beam expander and the vibrating mirror are connected with the first reflecting mirror, and the first reflecting mirror is connected with the lens through the second reflecting mirror.

Compared with the prior art, the invention has the beneficial effects that: the invention processes the pattern to be processed on the glass surface by laser, changes the physical and chemical properties of the material on the glass surface and the lower layer, and utilizes alkaline corrosive liquid to carry out chemical corrosion, thereby processing the product with the gray-scale stepped structure and realizing the high-efficiency preparation of the optical micro device with the gray-scale stepped structure.

The invention is further described below with reference to the accompanying drawings and specific embodiments.

Drawings

In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings needed to be used in the description of the embodiments are briefly introduced below, and it is obvious that the drawings in the following description are some embodiments of the present invention, and it is obvious for those skilled in the art to obtain other drawings based on these drawings without creative efforts.

FIG. 1 is a schematic flow chart of a method for processing a gray-scale step structure product by laser chemical etching according to an embodiment of the present invention;

FIG. 2 is a schematic block diagram of a system for laser chemical etching of a gray-scale stair-step structure product according to an embodiment of the present invention;

FIG. 3 is a schematic structural diagram of a method for processing a gray-scale step-structure product by laser chemical etching according to an embodiment of the present invention;

FIG. 4 is a schematic block diagram of a laser for processing a glass surface according to an embodiment of the present invention;

FIG. 5 is a schematic block diagram of a chemical etch provided in accordance with an embodiment of the present invention.

Detailed Description

In order to make the objects, technical solutions and advantages of the present invention more apparent, the present invention will be described in detail with reference to the accompanying drawings and the detailed description.

The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.

In the description of the present invention, it is to be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", and the like, indicate orientations and positional relationships based on those shown in the drawings, and are used only for convenience of description and simplicity of description, and do not indicate or imply that the device or element being referred to must have a particular orientation, be constructed and operated in a particular orientation, and thus, should not be considered as limiting the present invention.

Furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of the present invention, "a plurality" means two or more unless specifically defined otherwise.

In the present invention, unless otherwise expressly stated or limited, the terms "mounted," "connected," "secured," and the like are to be construed broadly and can, for example, be connected or detachably connected or integrated; can be mechanically or electrically connected; either directly or indirectly through intervening media, either internally or in any other relationship. The specific meanings of the above terms in the present invention can be understood by those skilled in the art according to specific situations.

In the present invention, unless otherwise expressly stated or limited, "above" or "below" a first feature means that the first and second features are in direct contact, or that the first and second features are not in direct contact but are in contact with each other via another feature therebetween. Also, the first feature being "on," "above" and "over" the second feature includes the first feature being directly on and obliquely above the second feature, or merely indicating that the first feature is at a higher level than the second feature. A first feature being "under," "below," and "beneath" a second feature includes the first feature being directly under and obliquely below the second feature, or simply meaning that the first feature is at a lesser elevation than the second feature.

In the description herein, references to the description of the term "one embodiment," "some embodiments," "an example," "a specific example," or "some examples," etc., mean that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the invention. In this specification, the schematic representations of the terms used above should not be understood to necessarily refer to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples. Furthermore, various embodiments or examples described in this specification can be combined and combined by one skilled in the art.

Referring to fig. 1, fig. 1 is a schematic diagram illustrating a method for processing a gray-scale step structure product by laser chemical etching according to an embodiment of the present invention, which can be applied to process a gray-scale step structure optical micro device, such as a surface micro lens array. The principle of the chemical corrosion processing induced by the laser at present is that the high transmittance of the glass 90 to the laser is utilized, the shaping beam of the ultrafast laser is used for realizing the material damage inside the glass 90 through multi-photon absorption inside the glass 90, and then the chemical corrosion liquid is used for corroding the modified glass 90 to realize the designed structure and device. One of the advantages of laser chemical etching is a controllable gradual process, so that the laser-induced chemical etching of the surface of the glass 90 can efficiently realize the processing of products with gray-scale step structures.

Referring to fig. 1, the method for processing a gray-scale step structure product by laser chemical etching includes the following steps S110 to S120.

And S110, processing the surface of the glass 90 by using laser to obtain a primary processed product.

In the present embodiment, the preliminary processing product refers to processing the glass 90 surface with a pattern to be processed by using a laser to realize the appearance of the pattern to be processed on the glass 90 surface.

As shown in fig. 4, when the surface of the glass 90 is processed by the laser beam, the intensity of both the material-removed region and the material-modified region is diffused outward around the focal point due to the gaussian distribution of the laser beam, and is distributed continuously from strong to weak.

Specifically, a desired pattern is processed on the surface of the glass 90 using an ultraviolet laser beam to obtain a preform product.

In this embodiment, the wavelength of the ultraviolet laser beam is 343nm to 355 nm. Of course, in other embodiments, the wavelength of the ultraviolet laser beam may also be 266nm or 213nm, which may be selected according to the actual situation.

In this embodiment, the pulse width of the ultraviolet laser beam is 250fs to 950 fs. In other embodiments, the pulse width of the uv laser beam may be not greater than 15ps or not greater than 10ns, which may be selected according to practical situations.

The wavelength and pulse width of the uv laser beam are set such that the laser changes the physicochemical properties of the surface and underlying material of the glass 90 to form a layer of precursor material that can be chemically etched.

And S120, carrying out chemical corrosion on the primary processed product to obtain a product with a gray-scale step structure.

In this embodiment, the product with a gray-scale step structure refers to a product with a gradual step, such as a surface microlens array.

Specifically, as shown in fig. 5, the pattern of the preliminary processed product is chemically etched by using an alkaline etchant to obtain a product with a gray-scale step structure.

In this embodiment, the alkaline etchant is an aqueous KOH solution. Specifically, the concentration of the aqueous KOH solution is 90%. Of course, in other embodiments, the concentration of the aqueous KOH solution is in the range of 85% to 95%.

In this embodiment, the etching temperature of the alkaline etching solution is 97 ℃. In other embodiments, the etching temperature of the alkaline etching solution may be 25 ℃ to 100 ℃.

By using the alkaline etching solution with the concentration and the etching temperature, the distribution of the modified layer can be controlled by using the beam intensity distribution of the laser or necessary beam shaping, and finally the designed structure/shape can be realized by controlling the etching process, so that the controllable glass 90 surface micro device prepared in batches is realized, and the controllable glass 90 surface micro device has high controllable degree and efficiency.

As shown in fig. 3, a laser is applied to the glass 90 to change the physicochemical properties of the material on the surface and under layer of the glass 90, thereby forming a precursor material layer that can be chemically etched. The distribution of the modified layer is controlled by utilizing the beam intensity distribution of laser or necessary beam shaping, and finally the designed structure/shape is realized by controlling the corrosion process, so that the controllable degree and the efficiency are high, and the controllable glass 90 surface micro device prepared in batches is realized. Although the laser spot is typically on the micrometer scale, the modified area of the material is much larger than the spot, but the distribution and beam remain consistent.

According to the method for processing the gray-scale stepped structure product by laser chemical etching, the patterns to be processed are processed on the surface of the glass 90 by laser, the physical and chemical properties of the materials on the surface and the lower layer of the glass 90 are changed, and chemical etching is performed by using alkaline etching solution, so that the gray-scale stepped structure product is processed, and the optical micro device with the gray-scale stepped structure is efficiently prepared.

In one embodiment, please refer to fig. 2, fig. 2 is a schematic block diagram of a system for processing a gray-scale step structure product by laser chemical etching according to an embodiment of the present invention, the system being suitable for the method described above; the system for processing the gray-scale stepped structure product by laser chemical etching comprises a chemical etching groove (not shown in the figure), a laser 10, a processing assembly and a movable machine table 20, wherein the processing assembly and the laser 10 are respectively positioned on the movable machine table 20, the laser 10 is connected with the processing assembly, and the chemical etching groove is positioned on one side of the movable machine table 20.

The chemical etching tank is internally provided with alkaline etching solution. The glass 90 is placed on the mobile machine platform 20.

After the laser 10 emits laser beams and is transmitted by the processing assembly, the surface of the glass 90 on the movable machine table 20 is subjected to laser processing, after the processing is finished, the movable machine table 20 can drive a primary processed product to move to a specified position, and alkaline corrosive liquid is obtained from a chemical corrosion tank to carry out chemical corrosion, so that a product with a gray step structure is processed, and a controllable glass 90 surface micro device prepared in batches is realized.

In an embodiment, referring to fig. 2, the processing assembly includes a beam expander 30, a galvanometer 50, and a field lens 60, which are connected in sequence, and the processing assembly further includes a lens 80, and the lens 80 is connected to the beam expander 30.

In an embodiment, referring to fig. 2, the processing assembly further includes a first reflector 40 and a second reflector 70, the first reflector 40 is connected between the beam expander 30 and the galvanometer 50, and the first reflector 40 is connected to the lens 80 through the second reflector 70.

After laser beams emitted by the laser 10 are expanded by the beam expander 30, the beam expander is used for expanding the diameter of parallel input beams to larger parallel output beams, the parallel output beams are deflected by the first reflector 40 and then enter the vibrating mirror 50, and then the beams are focused by the field lens 60 and projected to glass 90 arranged on the surface of the moving platform, so that the scanning mode of the vibrating mirror 50 is realized; in addition, the laser beam is reflected by the first reflector 40, reflected for the second time by the second reflector 70, focused by the lens 80 and projected onto the glass 90 disposed on the surface of the movable platform, so as to implement a static focusing processing mode, and the two processing modes combine with the movement of the movable platform to complete the engraving of the pattern to be processed.

In this embodiment, laser 10 is, but is not limited to, an ultraviolet laser 10, and ultraviolet laser 10 removes and modifies material from the surface of glass 90. The ultraviolet laser beam is emitted by a laser.

In the present embodiment, the lens 80 is a short focal length lens 80, and the focal length of the short focal length lens 80 is less than 60 mm.

In the present embodiment, the laser 10, the beam expander 30, the first mirror 40, and the second mirror 70 constitute a static focusing structure.

In the present embodiment, the moving stage 20 is, but not limited to, an XYZ three-axis moving stage 20. The chemical etching tank is an etching tank with controllable temperature within the room temperature of 100 ℃.

According to the system for processing the gray-scale stepped structure product by laser chemical etching, after laser is emitted by the laser 10, the surface of the glass 90 is processed by scanning by the vibrating mirror 50 and static focusing by the processing component, the physical and chemical properties of the material on the surface and the lower layer of the glass 90 are changed, and chemical etching is performed by using alkaline etching liquid in a chemical etching tank, so that the gray-scale stepped structure product is processed, and the optical micro device with the gray-scale stepped structure is efficiently prepared.

It should be noted that, as will be clearly understood by those skilled in the art, the specific implementation process of the system for processing a gray-scale stepped structure product by laser chemical etching may refer to the corresponding description in the foregoing embodiment of the method for processing a gray-scale stepped structure product by laser chemical etching, and for convenience and brevity of description, no further description is provided herein.

The technical contents of the present invention are further illustrated by the examples only for the convenience of the reader, but the embodiments of the present invention are not limited thereto, and any technical extension or re-creation based on the present invention is protected by the present invention. The protection scope of the invention is subject to the claims.