阅读说明：本技术 发光二极管芯片初始结构、图像显示设备与芯片分类系统 (Light emitting diode chip initial structure, image display device and chip classification system ) 是由 廖建硕 于 2020-05-25 设计创作，主要内容包括：本发明公开发光二极管芯片初始结构、图像显示设备与芯片分类系统。图像显示设备包括基板结构、发光二极管芯片群组以及导电连接结构。基板结构包括电路基板。发光二极管芯片群组包括电性连接于电路基板的多个发光二极管芯片结构。每一发光二极管芯片结构包括发光二极管芯片主体、第一导电电极以及第二导电电极。导电连接结构包括多个第一导电层以及多个第二导电层。第一导电层至少由一热熔材料所形成,多个第一导电层的多个热熔材料之中具有至少两种以上不同的熔点。借此,每一第一导电层电性连接于相对应的发光二极管芯片结构的第一导电电极与电路基板之间,且每一第二导电层电性连接于相对应的发光二极管芯片结构的第二导电电极与电路基板之间。(The invention discloses an LED chip initial structure, an image display device and a chip classification system. The image display device comprises a substrate structure, a light emitting diode chip group and a conductive connection structure. The substrate structure includes a circuit substrate. The light emitting diode chip group comprises a plurality of light emitting diode chip structures electrically connected to the circuit substrate. Each light emitting diode chip structure comprises a light emitting diode chip main body, a first conductive electrode and a second conductive electrode. The conductive connection structure includes a plurality of first conductive layers and a plurality of second conductive layers. The first conductive layer is formed by at least one hot melting material, and the multiple hot melting materials of the multiple first conductive layers have at least more than two different melting points. Therefore, each first conducting layer is electrically connected between the first conducting electrode of the corresponding light-emitting diode chip structure and the circuit substrate, and each second conducting layer is electrically connected between the second conducting electrode of the corresponding light-emitting diode chip structure and the circuit substrate.)

1. An led chip initial structure, the led chip initial structure being placed in a liquid substance of a liquid container, the led chip initial structure comprising:

the LED chip body is provided with a temporary electrode-free end and an electrode connecting end; and

the conductive electrode is arranged on the electrode connecting end of the light-emitting diode chip main body and is electrically connected with the light-emitting diode chip main body;

wherein the LED chip initial structure is adhered to a hot melting material through the conductive electrode.

2. The light emitting diode chip initial structure according to claim 1, wherein the light emitting diode chip main body comprises a P-type semiconductor layer, a light emitting layer disposed on the P-type semiconductor layer, and an N-type semiconductor layer disposed on the light emitting layer, the conductive electrode is electrically connected to one of the P-type semiconductor layer and the N-type semiconductor layer, and the electrode terminal is disposed on the other of the P-type semiconductor layer and the N-type semiconductor layer.

3. An image display apparatus characterized by comprising:

a substrate structure, the substrate structure comprising a circuit substrate;

a light emitting diode chip group, wherein the light emitting diode chip group comprises a plurality of light emitting diode chip structures electrically connected to the circuit substrate, and each light emitting diode chip structure comprises a light emitting diode chip main body, a first conductive electrode arranged on one bottom end of the light emitting diode chip main body and a second conductive electrode arranged on one top end of the light emitting diode chip main body; and

a conductive connection structure, the conductive connection structure comprising a plurality of first conductive layers and a plurality of second conductive layers;

each first conductive layer is electrically connected between the first conductive electrode of the corresponding light-emitting diode chip structure and the circuit substrate, and each second conductive layer is electrically connected between the second conductive electrode of the corresponding light-emitting diode chip structure and the circuit substrate;

the first conductive layer is formed by at least one hot melting material, and the multiple hot melting materials of the multiple first conductive layers have at least two different melting points.

4. The image display device according to claim 3, wherein the circuit substrate includes a plurality of first conductive pads and a plurality of second conductive pads respectively corresponding to the first conductive pads, each of the first conductive layers is disposed between the first conductive electrode of the corresponding light emitting diode chip structure and the corresponding first conductive pad, and each of the second conductive layers extends from the second conductive electrode of the corresponding light emitting diode chip structure to the corresponding second conductive pad; the hot melting material at least comprises a first soldering material and a second soldering material which are mixed with each other, and the melting point of the first soldering material is the same as or different from that of the second soldering material.

5. The image display device according to claim 3, wherein the circuit substrate includes a plurality of first conductive pads and a plurality of second conductive pads respectively corresponding to the first conductive pads, each of the first conductive layers is disposed between the first conductive electrode of the corresponding light emitting diode chip structure and the corresponding first conductive pad, and each of the second conductive layers extends from the second conductive electrode of the corresponding light emitting diode chip structure to the corresponding second conductive pad; the conductive connection structure comprises a plurality of electrical barrier layers, and each electrical barrier layer is arranged between the corresponding light-emitting diode chip structure and the corresponding second conductive layer so as to insulate and block the contact between the first conductive layer and the second conductive layer; the hot melting material at least comprises a first soldering material and a second soldering material which are mixed with each other, and the melting point of the first soldering material is the same as or different from that of the second soldering material.

6. A chip classification system, comprising:

the liquid container is internally provided with a liquid substance, and the plurality of LED chip initial structures are randomly distributed in the liquid substance; and

a substrate structure movably disposed in or out of the liquid container, the substrate structure including a circuit substrate;

the LED chip initial structure comprises an LED chip main body and a conductive electrode, wherein the LED chip main body is provided with a temporary electrode-free end and an electrode connecting end which are arranged oppositely, and the conductive electrode is arranged on the electrode connecting end of the LED chip main body so as to be electrically connected with the LED chip main body;

wherein a plurality of hot melt materials are disposed on the circuit substrate;

wherein, when the substrate structure is movably placed in the liquid container, the liquid substance with a predetermined temperature heats a part of the plurality of hot melting materials, so that the plurality of conductive electrodes of the part of the plurality of led chip initial structures are respectively adhered to a part of the plurality of hot melting materials;

wherein, when the substrate structure is movably placed in the liquid container, the liquid substance with another predetermined temperature heats another part of the plurality of hot melting materials, so that the plurality of conductive electrodes of another part of the plurality of LED chip initial structures are respectively adhered to another part of the plurality of hot melting materials;

wherein at least two different melting points are provided in the plurality of hot melt materials.

7. The die sorting system of claim 6, wherein each of the hot melt materials comprises a first solder material disposed on the circuit substrate and a second solder material disposed on the first solder material, and the melting point of the first solder material is the same as or different from the melting point of the second solder material; wherein the conductive electrode of the led chip initial structure is adhered to the second solder material when the second solder material is melted by the liquid substance so that the second solder material is connected between the first solder material and the conductive electrode.

8. The die sorting system of claim 6, wherein the first solder material and the second solder material of each of the hot melt materials are simultaneously heated to form a conductive layer when the substrate structure is movably moved away from the fluid reservoir; the circuit substrate comprises a plurality of conductive welding pads, and each conductive layer is arranged between the corresponding conductive electrode and the corresponding conductive welding pad.

9. The chip classification system according to claim 6, further comprising: and the temperature control equipment is arranged in the liquid container so as to control the two preset temperatures of the liquid substance.

10. The chip sorting system according to claim 6, wherein the melting point of one part of the plurality of hot melt materials is the same as or different from the melting point of the other part of the plurality of hot melt materials.

Technical Field

The present invention relates to a chip initialization structure, an image display device and a chip classification system, and more particularly, to a light emitting diode chip initialization structure, a light emitting diode display device and a light emitting diode chip classification system.

Background

The conventional vertical light emitting diode chip has two oppositely arranged conductive electrodes, and if one layer of conductive electrode is omitted, the vertical light emitting diode chip cannot provide any use. In addition, the smaller the volume of the led chips, the suction nozzle cannot be used for sorting or die bonding, so how to sort or die bond the miniaturized chips is a big problem.

Disclosure of Invention

The present invention provides an led chip initial structure, an image display device and a chip sorting system, which are directed to overcome the disadvantages of the prior art.

In order to solve the above technical problem, one of the technical solutions of the present invention is to provide an led chip initial structure, where the led chip initial structure is placed in a liquid material of a liquid container, and the led chip initial structure includes: a light emitting diode chip main body and a conductive electrode. The LED chip main body is provided with a temporary electrode-free end and an electrode connecting end. The conductive electrode is arranged on the electrode connecting end of the light-emitting diode chip main body so as to be electrically connected with the light-emitting diode chip main body. Wherein the LED chip initial structure is adhered to a hot melting material through the conductive electrode.

Further, the led chip body includes a P-type semiconductor layer, a light emitting layer disposed on the P-type semiconductor layer, and an N-type semiconductor layer disposed on the light emitting layer, the conductive electrode is electrically connected to one of the P-type semiconductor layer and the N-type semiconductor layer, and the electrode-less end is disposed on the other of the P-type semiconductor layer and the N-type semiconductor layer.

In order to solve the above technical problem, another technical solution adopted by the present invention is to provide an image display apparatus, including: the LED chip comprises a substrate structure, an LED chip group and a conductive connection structure. The substrate structure comprises a circuit substrate. The light emitting diode chip group comprises a plurality of light emitting diode chip structures electrically connected to the circuit substrate, and each light emitting diode chip structure comprises a light emitting diode chip main body, a first conductive electrode arranged on one bottom end of the light emitting diode chip main body and a second conductive electrode arranged on one top end of the light emitting diode chip main body. The conductive connection structure includes a plurality of first conductive layers and a plurality of second conductive layers. Each first conductive layer is electrically connected between the first conductive electrode of the corresponding light-emitting diode chip structure and the circuit substrate, and each second conductive layer is electrically connected between the second conductive electrode of the corresponding light-emitting diode chip structure and the circuit substrate. The first conductive layer is formed by at least one hot melting material, and the multiple hot melting materials of the multiple first conductive layers have at least two different melting points.

Further, the circuit substrate includes a plurality of first conductive pads and a plurality of second conductive pads corresponding to the first conductive pads, respectively, each of the first conductive layers is disposed between the corresponding first conductive electrode of the led chip structure and the corresponding first conductive pad, and each of the second conductive layers extends from the corresponding second conductive electrode of the led chip structure to the corresponding second conductive pad; the hot melting material at least comprises a first soldering material and a second soldering material which are mixed with each other, and the melting point of the first soldering material is the same as or different from that of the second soldering material.

Further, the circuit substrate includes a plurality of first conductive pads and a plurality of second conductive pads corresponding to the first conductive pads, respectively, each of the first conductive layers is disposed between the corresponding first conductive electrode of the led chip structure and the corresponding first conductive pad, and each of the second conductive layers extends from the corresponding second conductive electrode of the led chip structure to the corresponding second conductive pad; the conductive connection structure comprises a plurality of electrical barrier layers, and each electrical barrier layer is arranged between the corresponding light-emitting diode chip structure and the corresponding second conductive layer so as to insulate and block the contact between the first conductive layer and the second conductive layer; the hot melting material at least comprises a first soldering material and a second soldering material which are mixed with each other, and the melting point of the first soldering material is the same as or different from that of the second soldering material.

In order to solve the above technical problem, another technical solution adopted by the present invention is to provide a chip classification system, including: a liquid container and a substrate structure. The liquid container is internally provided with a liquid substance, and the plurality of LED chip initial structures are randomly distributed in the liquid substance. The substrate structure is movably placed in or out of the liquid container, and the substrate structure includes a circuit substrate. The LED chip initial structure comprises an LED chip main body and a conductive electrode, wherein the LED chip main body is provided with a temporary electrode-free end and an electrode connecting end which are arranged oppositely, and the conductive electrode is arranged on the electrode connecting end of the LED chip main body so as to be electrically connected with the LED chip main body. Wherein a plurality of hot melt materials are disposed on the circuit substrate. Wherein, when the substrate structure is movably placed in the liquid container, the liquid substance with a predetermined temperature heats a part of the plurality of hot melting materials, so that the plurality of conductive electrodes of the part of the plurality of led chip initial structures are respectively adhered to a part of the plurality of hot melting materials; wherein, when the substrate structure is movably placed in the liquid container, the liquid substance with another predetermined temperature heats another part of the plurality of hot melting materials, so that the plurality of conductive electrodes of another part of the plurality of LED chip initial structures are respectively adhered to another part of the plurality of hot melting materials; wherein at least two different melting points are provided in the plurality of hot melt materials.

Furthermore, each hot melting material comprises a first soldering material arranged on the circuit substrate and a second soldering material arranged on the first soldering material, and the melting point of the first soldering material is the same as or different from that of the second soldering material; wherein the conductive electrode of the led chip initial structure is adhered to the second solder material when the second solder material is melted by the liquid substance so that the second solder material is connected between the first solder material and the conductive electrode.

Further, the first solder material and the second solder material of each hot melt material are heated simultaneously to form a conductive layer when the substrate structure is movably moved away from the liquid container; the circuit substrate comprises a plurality of conductive welding pads, and each conductive layer is arranged between the corresponding conductive electrode and the corresponding conductive welding pad.

Further, the chip classification system further includes: and the temperature control equipment is arranged in the liquid container so as to control the two preset temperatures of the liquid substance.

Further, the melting point of one part of the plurality of hot melt materials is the same as or different from that of the other part of the plurality of hot melt materials.

The led chip initial structure provided by the present invention has a temporary electrode-free end and an electrode connecting end through the technical scheme that the led chip main body has the electrode connecting end and the conductive electrode is disposed on the electrode connecting end of the led chip main body so as to be electrically connected to the led chip main body, so that the led chip initial structure can be adhered to a hot melting material through the conductive electrode.

Another advantage of the present invention is that the image display apparatus provided by the present invention can include "the led chip group includes a plurality of led chip structures electrically connected to the circuit substrate, each of the led chip structures includes an led chip body, a first conductive electrode disposed on a bottom end of the led chip body, and a second conductive electrode disposed on a top end of the led chip body", "each of the first conductive layers is electrically connected between the corresponding first conductive electrode of the led chip structure and the circuit substrate", and each of the second conductive layers is electrically connected between the corresponding second conductive electrode of the led chip structure and the circuit substrate ", and" the first conductive layer is formed by at least a hot melting material, the plurality of hot melting materials of the plurality of first conductive layers have at least two different melting points ", so that when the light emitting diode chip structure is arranged on the corresponding hot melting material, the light emitting diode chip structure can be adhered to the corresponding hot melting material through the first conductive electrode.

The chip sorting system provided by the present invention has another beneficial effect in that the chip sorting system can be adhered to a corresponding hot melting material through the technical scheme that "a plurality of led chip initial structures are randomly distributed in the liquid material", "the led chip initial structures include an led chip main body and a conductive electrode", and "a plurality of hot melting materials are disposed on the circuit substrate, and at least two different melting points are provided in the plurality of hot melting materials, and the liquid material heats the hot melting materials".

For a better understanding of the nature and technical content of the present invention, reference should be made to the following detailed description of the invention, taken in conjunction with the accompanying drawings, which are provided for purposes of illustration and description, and not for purposes of limitation.

Drawings

Fig. 1 is a schematic diagram of a plurality of led chip initial structures formed on a substrate material layer according to a first embodiment of the present invention.

Fig. 2 is a schematic view of an initial structure of separating a plurality of led chips after removing a base material layer according to a first embodiment of the invention.

Fig. 3 is a schematic diagram illustrating a plurality of red led chip initial structures respectively attached to a plurality of heat-fusible materials of a portion thereof according to a second embodiment of the present invention.

Fig. 4 is a schematic diagram illustrating a plurality of green led chip initial structures respectively attached to another portion of a plurality of heat-fusible materials according to a second embodiment of the present invention.

Fig. 5 is a schematic diagram illustrating a plurality of blue led chip initial structures respectively attached to another part of a plurality of hot melting materials according to a second embodiment of the present invention.

Fig. 6 is a schematic view of another conductive electrode formed on the main body of the led chip according to the second embodiment of the present invention.

Fig. 7 is a schematic diagram illustrating the conductive electrodes of the initial structure of the led chip adhered to the second solder material when the second solder material is heated and melted by the corresponding liquid substance according to the second embodiment of the present invention.

Fig. 8 is a schematic view of the first solder material and the second solder material being heated simultaneously to form a conductive layer according to the second embodiment of the present invention.

Fig. 9 is a schematic diagram of a first image display apparatus according to a third embodiment of the present invention.

Fig. 10 is a schematic diagram of a second image display apparatus according to a third embodiment of the present invention.

Fig. 11 is a schematic diagram of a third image display apparatus according to a third embodiment of the present invention.

Detailed Description

The following is a description of the embodiments of the present disclosure relating to the led chip initial structure, the image display apparatus and the chip sorting system, by specific embodiments, and those skilled in the art can understand the advantages and effects of the present disclosure from the disclosure of the present disclosure. The invention is capable of other and different embodiments and its several details are capable of modifications and variations in various respects, all without departing from the present invention. The drawings of the present invention are for illustrative purposes only and are not intended to be drawn to scale. The following embodiments will further explain the related art of the present invention in detail, but the disclosure is not intended to limit the scope of the present invention. In addition, the term "or" as used herein should be taken to include any one or combination of more of the associated listed items as the case may be.

First embodiment

Referring to fig. 1 and fig. 2, a light emitting diode chip initial structure 20a and a method for fabricating the same are provided in a first embodiment of the present invention. The method for manufacturing the light emitting diode chip initial structure 20a comprises the following steps: as shown in fig. 1, a plurality of led chip original structures 20a are fabricated on a base material layer B, each led chip original structure 20a includes an led chip body 200 and a conductive electrode 201 a; then, as shown in fig. 1 and fig. 2, the base material layer B is removed to separate the led chip original structures 20a from each other, so that only one side of the led chip original structure 20a has one conductive electrode 201a, and the other side of the led chip original structure 20a does not have any conductive electrode. For example, the base material layer B may be a wafer (wafer) or Sapphire (Sapphire), but the present invention is not limited to the above-mentioned examples.

More specifically, as shown in fig. 2, the led chip original structure 20a includes an led chip body 200 and a conductive electrode 201 a. Further, the led chip body 200 has a top end and a bottom end disposed opposite to each other, one of the top end and the bottom end is a temporary electrode-free end 2001, and the other of the top end and the bottom end is an electrode connecting end 2002. In addition, the conductive electrode 201a is disposed on the electrode connection end 2002 of the led chip body 200 to be electrically connected to the led chip body 200. For example, the bottom of the led chip body 200 is a temporary electrode-free end 2001, and the top of the led chip body 200 is an electrode connection end 2002. It is to be noted that the electrode-less end 2001 has an exposed non-occupied object surface 2001S, so that any electrode is not temporarily formed on the surface of the electrode-less end 2001. In addition, the conductive electrode 201a has a conductive surface opposite to the non-occupant surface 2001S. However, the present invention is not limited to the above-mentioned examples.

For example, as shown in fig. 2, the led chip body 200 includes a P-type semiconductor layer 200P, a light emitting layer 200L disposed on the P-type semiconductor layer 200P, and an N-type semiconductor layer 200N disposed on the light emitting layer 200L. In addition, the conductive electrode 201a is electrically connected to one of the P-type semiconductor layer 200P and the N-type semiconductor layer 200N, and the electrode terminal 2001 is disposed on the other of the P-type semiconductor layer 200P and the N-type semiconductor layer 200N. For example, as shown in fig. 2, the conductive electrode 201a is electrically connected to the N-type semiconductor layer 200N, and the electrode terminal 2001 is disposed on the P-type semiconductor layer 200P. However, the present invention is not limited to the above-mentioned examples.

Second embodiment

Referring to fig. 3 to 6, a second embodiment of the invention provides a chip classification system S, which includes: a liquid container T and a substrate structure 1. As shown in fig. 3, 4 and 5, a liquid substance L (e.g. water or any mixed liquid containing water) is contained in the liquid container T, and the plurality of led chip original structures 20a can be randomly distributed in the liquid substance L. Furthermore, as shown in fig. 5 and fig. 6, the substrate structure 1 is movably disposed in the liquid container T or separated from the liquid container T, and the substrate structure 1 includes a circuit substrate 10.

For example, as shown in fig. 3, 4, 5 and 6, the substrate structure 1 may be a rigid circuit substrate or a flexible circuit substrate. In addition, the led chip original structure 20a includes an led chip body 200 and a conductive electrode 201 a. The led chip body 200 has a temporary electrode terminal 2001 and an electrode connection terminal 2002 which are oppositely disposed, and the conductive electrode 201a is disposed on the electrode connection terminal 2002 of the led chip body 200 to be electrically connected to the led chip body 200. However, the present invention is not limited to the above-mentioned examples.

For example, as shown in fig. 3, fig. 4, fig. 5 and fig. 6, the substrate structure 1 includes a circuit substrate 10, and the circuit substrate 10 includes a plurality of first conductive pads 101 and a plurality of second conductive pads 102 corresponding to the first conductive pads 101, respectively. In addition, a plurality of hot melt materials M are respectively disposed on the plurality of first conductive pads 101 of the circuit substrate 10, and the melting points of a part of the plurality of hot melt materials M and another part of the plurality of hot melt materials M may be the same or different (that is, at least two or more different melting points are included in the plurality of hot melt materials M). Furthermore, when the substrate structure 1 is movably disposed in the liquid container T, the liquid substance L having a predetermined temperature can heat a portion of the plurality of hot melting materials M, so that the plurality of conductive electrodes 201a of a portion of the plurality of led chip original structures 20a are respectively adhered to a portion of the plurality of hot melting materials M. In addition, when the substrate structure 1 is movably disposed in the liquid container T, the liquid substance L having another predetermined temperature can heat another portion of the plurality of hot melting materials M, so that the plurality of conductive electrodes 201a of another portion of the plurality of led chip original structures 20a are respectively adhered to another portion of the plurality of hot melting materials M. It should be noted that the chip sorting system S further includes a temperature control device E (e.g., including a heating rod and a temperature sensor), which can be placed in the liquid container T to control the temperature of the liquid L. However, the present invention is not limited to the above-mentioned examples.

For example, as shown in fig. 3 to 5, the led chip original structures 20a are at least divided into a plurality of red led chip original structures (20a-R), a plurality of green led chip original structures (20a-G), and a plurality of blue led chip original structures (20 a-B). However, the present invention is not limited to the above-mentioned examples.

For example, as shown in fig. 3, when the plurality of red led chip original structures (20a-R) are randomly distributed in the first liquid substance L1 of the first liquid container T1, the first liquid substance L1 can generate a first predetermined temperature by heating the temperature control device E, then the first liquid substance L1 with the first predetermined temperature can heat a portion of the plurality of hot melt materials M (e.g., the plurality of first hot melt materials 1M, assuming a melting point of about 40), and the portion of the plurality of hot melt materials M can simultaneously generate viscosity by heating the first liquid substance L1 with the first predetermined temperature, so that the plurality of red led chip original structures (20a-R) can be respectively attached to the portion of the plurality of hot melt materials M. As shown in fig. 4, when the green led chip initial structures (20a-G) are randomly distributed in the second liquid substance L2 of the second liquid container T2, the second liquid substance L2 can generate a second predetermined temperature by heating the temperature control device E, then the second liquid substance L2 with the second predetermined temperature can heat another part of the hot-melt materials M (e.g., the second hot-melt materials 2M, assuming that the melting point thereof is about 50), and the another part of the hot-melt materials M can simultaneously generate viscosity by heating the second liquid substance L2 with the second predetermined temperature, so that the green led chip initial structures (20a-G) can be respectively attached to the another part of the hot-melt materials M. As shown in fig. 5, when the plurality of blue led chip initial structures (20a-B) are randomly distributed in the third liquid substance L3 of the third liquid container T3, the third liquid substance L3 can generate a third predetermined temperature by heating with the temperature control device E, then the third liquid substance L3 with the third predetermined temperature can heat another part of the plurality of hot melt materials M (e.g., the plurality of third hot melt materials 3M, assuming a melting point of about 60), and another part of the plurality of hot melt materials M can simultaneously generate viscosity by heating with the third liquid substance L3 with the third predetermined temperature, so that the plurality of blue led chip initial structures (20a-B) can be respectively attached to another part of the plurality of hot melt materials M. Therefore, when the first liquid substance L1 with the first predetermined temperature is in, only the plurality of first heat-melting materials 1M are heated by the first liquid substance L1 at the same time, so that only the plurality of red light-emitting diode chip initial structures (20a-R) are respectively adhered by the plurality of first heat-melting materials 1M; when the second liquid substance L2 has the second predetermined temperature, only the plurality of second heat-fusible materials 2M are simultaneously heated by the second liquid substance L2, so that only the plurality of green led chip original structures (20a-G) are respectively adhered by the plurality of second heat-fusible materials 2M; when the third liquid substance L3 is at the third predetermined temperature, only the plurality of third heat-fusible materials 3M are simultaneously heated by the third liquid substance L3, so that only the plurality of blue light-emitting diode chip original structures (20a-B) are respectively adhered by the plurality of third heat-fusible materials 3M. Therefore, a plurality of red LED chip initial structures (20a-R), a plurality of green LED chip initial structures (20a-G) and a plurality of blue LED chip initial structures (20a-B) can be sequentially adhered on the bearing substrate. However, the present invention is not limited to the above-mentioned examples.

For example, as shown in fig. 6 to 8, each of the hot melting materials M includes a first solder material M1 disposed on the circuit substrate 10 and a second solder material M2 disposed on the first solder material M1, and the melting point of the first solder material M1 is the same as or different from the melting point of the second solder material M2. When the melting point of the first solder material M1 is different from the melting point of the second solder material M2, the first solder material M1 may be a relatively high temperature solder (any positive integer above 178 degrees or above 183 degrees or above), and the second solder material M2 may be a low temperature solder or other solder material that melts at a low temperature (the low temperature melting point may be about any positive integer between 10 degrees and 40 degrees, or between 5 degrees and 30 degrees, or between 20 degrees and 50 degrees, or below 178 degrees). In addition, when the second solder material M2 is melted by the liquid substance L, the conductive electrode 201a of the led chip initial structure 20a is adhered to the second solder material M2, so that the second solder material M2 is connected between the first solder material M1 and the conductive electrode 201 a. Further, as shown in fig. 6 to 8, when the substrate structure 1 is moved away from the liquid container T, the first solder material M1 and the second solder material M2 of each hot melt material M are simultaneously heated (e.g., heated by the laser beam C, or by microwave heating, or by baking) to form a conductive layer 31a, and each conductive layer 31a is disposed between the corresponding conductive electrode 201a and the corresponding conductive pad 101. However, the present invention is not limited to the above-mentioned examples.

It is noted that, as shown in fig. 6, another conductive electrode 202a may be additionally formed on the light emitting diode chip body 200 by coating, printing, or semiconductor fabrication. However, the present invention is not limited to the above-mentioned examples.

Third embodiment

Referring to fig. 9 to 11, a third embodiment of the present invention provides an image display device D, including: a substrate structure 1, a LED chip group 2 and a conductive connection structure 3.

As shown in fig. 9 to 11, the substrate structure 1 includes a circuit substrate 10, and the circuit substrate 10 includes a plurality of first conductive pads 101 and a plurality of second conductive pads 102 corresponding to the first conductive pads 101, respectively. In addition, the led chip group 2 includes a plurality of led chip structures 20 electrically connected to the circuit substrate 10, and each led chip structure 20 includes an led chip body 200, a first conductive electrode 201 disposed on a bottom end of the led chip body 200, and a second conductive electrode 202 disposed on a top end of the led chip body 200. In addition, the conductive connection structure 3 includes a plurality of first conductive layers 31 and a plurality of second conductive layers 32. Each first conductive layer 31 is electrically connected between the first conductive electrode 201 of the corresponding led chip structure 20 and the circuit substrate 10, and each second conductive layer 32 is electrically connected between the second conductive electrode 202 of the corresponding led chip structure 20 and the circuit substrate 10.

As shown in fig. 9 to 11, each first conductive layer 31 is disposed between the first conductive electrode 201 of the corresponding led chip structure 20 and the corresponding first conductive pad 101, and each second conductive layer 32 extends from the second conductive electrode 202 of the corresponding led chip structure 20 to the corresponding second conductive pad 102. For example, each second conductive layer 32 can be a conductive line formed by wire bonding (as shown in fig. 9) or a conductive layer formed by coating, printing or semiconductor manufacturing (as shown in fig. 10). It is noted that, as shown in fig. 11, the conductive connection structure 3 includes a plurality of electrical barrier layers 30, and each electrical barrier layer 30 is disposed between the corresponding led chip structure 20 and the corresponding second conductive layer 32 to insulate and block the contact between the first conductive layer 31 and the second conductive layer 32. However, the present invention is not limited to the above-mentioned examples.

For example, referring to fig. 7 and 8, the first conductive layer 31 at least includes a first solder material M1 and a second solder material M2 mixed with each other, and the melting point of the first solder material M1 is the same as or different from the melting point of the second solder material M2. When the melting point of the first solder material M1 is different from the melting point of the second solder material M2, the first solder material M1 may be a relatively high temperature solder (any positive integer above 178 degrees or above 183 degrees or above), and the second solder material M2 may be a low temperature solder or other solder material that melts at a low temperature (the low temperature melting point may be about any positive integer between 10 degrees and 40 degrees, or between 5 degrees and 30 degrees, or between 20 degrees and 50 degrees, or below 178 degrees).

However, the present invention is not limited to the above-mentioned examples.

Advantageous effects of the embodiments

One of the advantages of the present invention is that the led chip original structure 20a provided by the present invention can be electrically connected to the led chip body 200 by the technical solution that "the led chip body 200 has a temporary electrode-free end 2001 and an electrode connecting end 2002" and "the conductive electrode 201a is disposed on the electrode connecting end 2002 of the led chip body 200", so that the led chip original structure 20a can be adhered to a hot melting material M by the conductive electrode 201 a.

Another advantageous effect of the present invention is that the image display apparatus D provided by the present invention can include a plurality of led chip structures 20 electrically connected to the circuit substrate 10 by "the led chip group 2, each led chip structure 20 includes a led chip main body 200, a first conductive electrode 201 disposed on a bottom end of the led chip main body 200, and a second conductive electrode 202 disposed on a top end of the led chip main body 200", "each first conductive layer 31 is electrically connected between the first conductive electrode 201 of the corresponding led chip structure 20 and the circuit substrate 10", and each second conductive layer 32 is electrically connected between the second conductive electrode 202 of the corresponding led chip structure 20 and the circuit substrate 10 ", and" the first conductive layer 31 is formed by at least a hot melting material M, the plurality of heat melting materials M of the plurality of first conductive layers 31 have at least two different melting points ", so that when the led chip structure 20 is disposed on the corresponding heat melting material M, the led chip structure 20 can be adhered to the corresponding heat melting material M through the first conductive electrode 201.

Another advantage of the present invention is that the chip sorting system S provided by the present invention can be configured to randomly distribute the led chip initial structures 20a in the liquid substance L, and the led chip initial structures 20a include an led chip main body 200 and a conductive electrode 201a, and the plurality of hot melting materials M are disposed on the circuit substrate 10, wherein the plurality of hot melting materials M have at least two different melting points, and the liquid substance L heats the hot melting materials M, so that the led chip initial structures 20a can be adhered to the corresponding hot melting materials M through the conductive electrode 201 a.

The disclosure is only a preferred embodiment of the invention, and is not intended to limit the scope of the claims, so that all technical equivalents and modifications using the contents of the specification and drawings are included in the scope of the claims.