Special-shaped cutting system and method based on position coordinates of galvanometer and AB deflection axis

文档序号:1012631 发布日期:2020-10-27 浏览:12次 中文

阅读说明:本技术 基于振镜与ab偏摆轴位置坐标的异形切割系统及其方法 (Special-shaped cutting system and method based on position coordinates of galvanometer and AB deflection axis ) 是由 赵裕兴 张威 于 2020-08-24 设计创作,主要内容包括:本发明涉及基于振镜与AB偏摆轴位置坐标的异形切割系统及方法,上位机与ACS运动控制器、振镜运动控制卡及激光控制器相连,振镜运动控制卡与振镜运动单元和激光控制器相连;ACS运动控制器与X轴运动单元和Y轴运动单元连接,其上安装的光栅尺读数头与ACS运动控制器相连;ACS运动控制器与A轴驱动器和B轴驱动器连接,两驱动器与其对应的运动单元驱动连接,A轴运动单元的法兰垂直安装于X轴运动单元之上,B轴运动单元的法兰与A轴运动单元的法兰呈垂直安装,两运动单元与ACS运动控制器信号连接;ACS运动控制器与Z轴驱动器连接,Z轴驱动器与Z轴步进电机驱动连接,其上安装的读数头与ACS运动控制器相连。实现异形加工。(The invention relates to a special-shaped cutting system and a method based on the position coordinates of a galvanometer and an AB deflection axis, wherein an upper computer is connected with an ACS motion controller, a galvanometer motion control card and a laser controller, and the galvanometer motion control card is connected with a galvanometer motion unit and the laser controller; the ACS motion controller is connected with the X-axis motion unit and the Y-axis motion unit, and a grating ruler reading head arranged on the ACS motion controller is connected with the ACS motion controller; the ACS motion controller is connected with the A-axis driver and the B-axis driver, the two drivers are in driving connection with the corresponding motion units, the flange of the A-axis motion unit is vertically arranged on the X-axis motion unit, the flange of the B-axis motion unit is vertically arranged with the flange of the A-axis motion unit, and the two motion units are in signal connection with the ACS motion controller; the ACS motion controller is connected with the Z-axis driver, the Z-axis driver is in driving connection with the Z-axis stepping motor, and a reading head arranged on the Z-axis driver is connected with the ACS motion controller. And realizing special-shaped processing.)

1. Dysmorphism cutting system based on mirror that shakes and AB deflection axis position coordinate, its characterized in that: the system comprises an upper computer (1) and an ACS motion controller (2), wherein the upper computer (1) is respectively connected with the ACS motion controller (2), a galvanometer motion control card (3) and a laser controller (4), and the galvanometer motion control card (3) is connected with a galvanometer motion unit (9) and the laser controller (4);

the ACS motion controller (2) is connected with an X-axis motion unit (5) and a Y-axis motion unit (6) of the X-Y axis processing platform, an X-axis grating ruler reading head (7) is installed on the X-axis motion unit (5), a Y-axis grating ruler reading head (8) is installed on the Y-axis motion unit (6), and the X-axis grating ruler reading head (7) and the Y-axis grating ruler reading head (8) are connected with the ACS motion controller (2);

the ACS motion controller (2) is connected with an A-axis driver (10) and a B-axis driver (12), the A-axis driver (10) is in driving connection with an A-axis motion unit (11), the B-axis driver (12) is in driving connection with a B-axis motion unit (13), a flange of the A-axis motion unit (11) is vertically arranged on the X-axis motion unit (5) and can swing back and forth, and a flange of the B-axis motion unit (13) and a flange of the A-axis motion unit (11) are vertically arranged; the A-axis motion unit (11) and the B-axis motion unit (13) are in signal connection with the ACS motion controller (2);

the ACS motion controller (2) is connected with a Z-axis driver (14), the Z-axis driver (14) is in driving connection with a Z-axis stepping motor (15), and a Renyshao reading head is mounted on the Z-axis stepping motor and connected with the ACS motion controller (2).

2. A galvanometer and AB yaw axis position coordinate based contour cutting system as defined in claim 1, wherein: the upper computer (1) is connected with the ACS motion controller (2) through an Ethercat bus.

3. A galvanometer and AB yaw axis position coordinate based contour cutting system as defined in claim 1, wherein: the galvanometer motion control card (3) is arranged in a PCI (peripheral component interconnect) card slot in the upper computer (1) and carries out data interactive transmission with the upper computer (1) through a PCI bus standard protocol.

4. A galvanometer and AB yaw axis position coordinate based contour cutting system as defined in claim 1, wherein: the galvanometer motion control card (3) is communicated with the galvanometer motion unit (9) through an SL2-100 data transmission protocol.

5. A galvanometer and AB yaw axis position coordinate based contour cutting system as defined in claim 1, wherein: the upper computer (1) is communicated with the laser controller (4) through a TCP/IP protocol.

6. A galvanometer and AB yaw axis position coordinate based contour cutting system as defined in claim 1, wherein: the ACS motion controller (2) is an SPiPlusEC motion controller, the galvanometer motion control card (3) is a digital signal processing controller with the model number of TMS320DM642AZNZ, and the laser controller (4) is a Marble UN-15 laser controller.

7. A galvanometer and AB yaw axis position coordinate based contour cutting system as defined in claim 1, wherein: the X-axis motion unit (5) and the Y-axis motion unit (6) are UL9N linear motors, the galvanometer motion unit (9) is a stepping motor, the X-axis grating scale reading head (7) and the Y-axis grating scale reading head (8) are model numbers Ti0200A25A Renysha reading heads, the A-axis driver (10) and the B-axis driver (12) are provided with STM32 microcontrollers, and the A-axis motion unit (11) and the B-axis motion unit (13) are provided with photoelectric encoders.

8. The special-shaped cutting method based on the position coordinates of the galvanometer and the AB deflection axis is characterized by comprising the following steps of: the method comprises the following steps:

1) the upper computer (1) controls the AB deflection shaft to rotate to the initial machining angle through the ACS motion controller (2);

2) the ACS motion controller (2) controls the Z axis to reach the height of a processing focus, and the upper computer (1) sets galvanometer processing parameters;

3) the upper computer (1) sends out a Laser ON +5V control signal through a control galvanometer motion control card (3), and the control signal reaches a Laser GATE control interface through a BNC connector to control the Laser to emit light;

4) setting the motion position of an AB axis according to the processing requirement of a processing sample, fixing the processing sample on a jig of a B axis, fixing the jig on a flange surface of the B axis, controlling the front and back deflection angle of a processing piece by the A axis, and rotating the B axis based on the deflection position of the A axis to enable a processing focus to completely process the inside of the sample;

5) when the A shaft deflects by an angle, the same plane height in the sample generates a height difference; the height difference of the interior of the sample is measured by using the image when the processing is started, the Z-axis processing stepping height is obtained, the B-axis rotates after the processing is started, the Z-axis stepping motor modifies the processing focus height after the processing of one area is completed, and the platform moves the AB-axis to change the processing area, so that the requirement of processing the special-shaped non-planar processing sample is met.

9. A special-shaped cutting method based on the position coordinates of a galvanometer and an AB deflection axis as claimed in claim 6, characterized in that: the ACS motion controller (2) sends pulses in a P/D pulse and direction control mode, the pulse commands reach the A-axis driver (10), the A-axis driver (10) receives signals through a CN4 interface, and the A-axis motion unit (11) is controlled to move to the position designated by the controller; the A-axis motion unit (11) acquires four groups of sine wave signals A, B, C, D through a photoelectric encoder arranged on the A-axis motion unit and a photoelectric emitter and a receiver of the A-axis motion unit, each sine wave has a 90-degree difference, C, D signals are superposed on A, B two phases in an inverted mode, and a pulse signal of a Z phase is output per revolution to represent a zero reference bit and is fed back to an A-axis driver; the A-axis driver feeds back a A, B, Z phase signal to the ACS motion controller (2) through an output port CN4 according to the position signal fed back by the photoelectric encoder, and the positioning position of the A-axis is controlled.

10. A special-shaped cutting method based on the position coordinates of a galvanometer and an AB deflection axis as claimed in claim 6, characterized in that: the ACS motion controller (2) sends pulses through P/D pulses and a direction control mode, the pulse commands reach the B-axis driver (12), the B-axis driver (12) receives signals through a CN4 interface, and the B-axis motion unit (13) is controlled to move to a position designated by the controller; the B-axis motion unit (13) acquires four groups of sine wave signals A, B, C, D through a photoelectric encoder arranged on the B-axis motion unit, a photoelectric emitter and a photoelectric receiver of the B-axis motion unit, each sine wave has a phase difference of 90 degrees, C, D signals are superposed on A, B two phases in an inverted mode, and a pulse signal of a Z phase is output per revolution to represent a zero reference bit and is fed back to the B-axis driver (12); the B-axis driver (12) feeds back A, B, Z phase signals to the ACS motion controller (2) through an output port CN4 according to the position signals fed back by the photoelectric encoder, and the positioning position of the B axis is controlled.

Technical Field

The invention relates to a special-shaped cutting system and method based on the position coordinates of a galvanometer and an AB deflection axis.

Background

At present, various processing control systems in the field of laser micromachining are various, and accurate laser dotting and special-shaped cutting cannot be effectively carried out when non-planar materials are processed.

The main method of the current mirror vibration special-shaped cutting is the mirror vibration machining and the platform machining formed by a linear motor, when the mirror vibration machining is used for machining a large-area special-shaped size material, effective machining cannot be conducted due to the influences of the flatness of a machined product and the product structure of a special-shaped product, if the machining of the inner ring or the outer ring of a bearing cannot effectively control the machining focus and the machining range, the mode of manual adjustment can be adopted for multiple times of machining, the efficiency of the machining mode is low, the machining time is long, the production cycle of the product can be prolonged, and therefore the manufacturing cost of the product is indirectly increased.

Disclosure of Invention

The invention aims to overcome the defects in the prior art and provides a special-shaped cutting system and method based on the position coordinates of a galvanometer and an AB deflection axis.

The purpose of the invention is realized by the following technical scheme:

dysmorphism cutting system based on galvanometer and AB deflection axis position coordinate, characteristics are: the system comprises an upper computer and an ACS motion controller, wherein the upper computer is respectively connected with the ACS motion controller, a galvanometer motion control card and a laser controller, and the galvanometer motion control card is connected with a galvanometer motion unit and the laser controller;

the ACS motion controller is connected with an X-axis motion unit and a Y-axis motion unit of the X-Y axis processing platform, an X-axis grating ruler reading head is installed on the X-axis motion unit, a Y-axis grating ruler reading head is installed on the Y-axis motion unit, and the X-axis grating ruler reading head and the Y-axis grating ruler reading head are connected with the ACS motion controller;

the ACS motion controller is connected with the A-axis driver and the B-axis driver, the A-axis driver is in driving connection with the A-axis motion unit, the B-axis driver is in driving connection with the B-axis motion unit, a flange of the A-axis motion unit is vertically arranged on the X-axis motion unit and can swing back and forth, and a flange of the B-axis motion unit is vertically arranged with a flange of the A-axis motion unit; the A-axis motion unit and the B-axis motion unit are in signal connection with the ACS motion controller;

the ACS motion controller is connected with the Z-axis driver, the Z-axis driver is in driving connection with the Z-axis stepping motor, and a Renyshao reading head is mounted on the Z-axis stepping motor and connected with the ACS motion controller.

Further, in the special-shaped cutting system based on the position coordinates of the galvanometer and the AB deflection axis, the upper computer is connected with the ACS motion controller through an Ethercat bus.

Further, in the special-shaped cutting system based on the position coordinates of the galvanometer and the AB deflection axis, the galvanometer motion control card is installed in a PCI (peripheral component interconnect) card slot in the upper computer, and data interactive transmission is performed with the upper computer through a PCI bus standard protocol.

Further, in the special-shaped cutting system based on the position coordinates of the galvanometer and the AB deflection axis, the galvanometer motion control card is communicated with the galvanometer motion unit through an SL2-100 data transmission protocol.

Further, in the special-shaped cutting system based on the position coordinates of the galvanometer and the AB deflection axis, the upper computer is communicated with the laser controller through a TCP/IP protocol.

Further, in the special-shaped cutting system based on the position coordinates of the galvanometer and the AB deflection axis, the ACS motion controller is an SPiPlusEC motion controller, the galvanometer motion control card is a digital signal processing controller with the model number of TMS320DM642AZNZ, and the laser controller is a Marble UN-15 laser controller.

Further, in the special-shaped cutting system based on the position coordinates of the galvanometer and the AB deflection axis, the X-axis motion unit and the Y-axis motion unit are UL9N linear motors, the galvanometer motion unit is a stepping motor, the reading head of the X-axis grating ruler and the reading head of the Y-axis grating ruler are model numbers Ti0200A25A Renesha reading heads, the A-axis driver and the B-axis driver are provided with STM32 microcontrollers, and the A-axis motion unit and the B-axis motion unit are provided with photoelectric encoders.

The invention discloses a special-shaped cutting method based on the position coordinates of a galvanometer and an AB deflection axis, which comprises the following steps:

1) the upper computer controls the AB deflection shaft to rotate to the initial machining angle through the ACS motion controller;

2) the ACS motion controller controls the height of the Z axis reaching a processing focus, and the upper computer sets the processing parameters of the galvanometer;

3) the upper computer sends out a Laser ON +5V control signal through a control galvanometer motion control card, and the Laser ON +5V control signal reaches a GATE control interface of the Laser through a BNC connector to control the Laser to emit light;

4) setting the motion position of an AB axis according to the processing requirement of a processing sample, fixing the processing sample on a jig of a B axis, fixing the jig on a flange surface of the B axis, controlling the front and back deflection angle of a processing piece by the A axis, and rotating the B axis based on the deflection position of the A axis to enable a processing focus to completely process the inside of the sample;

5) when the A shaft deflects by an angle, the same plane height in the sample generates a height difference; the height difference of the interior of the sample is measured by using the image when the processing is started, the Z-axis processing stepping height is obtained, the B-axis rotates after the processing is started, the Z-axis stepping motor modifies the processing focus height after the processing of one area is completed, and the platform moves the AB-axis to change the processing area, so that the requirement of processing the special-shaped non-planar processing sample is met.

Furthermore, in the method for cutting the special-shaped workpiece based on the position coordinates of the galvanometer and the AB deflection axis, the ACS motion controller sends pulses in a P/D pulse and direction control mode, the pulse command reaches the A-axis driver, and the A-axis driver receives signals through the CN4 interface and controls the A-axis motion unit to move to the position designated by the controller; the A-axis motion unit obtains four groups of sine wave signals A, B, C, D through a photoelectric encoder arranged on the A-axis motion unit and a photoelectric transmitter and a receiver of the A-axis motion unit, each sine wave has a phase difference of 90 degrees, C, D signals are superposed on A, B two phases in a reversed phase mode, and each rotation outputs a pulse signal of a Z phase to represent a zero reference bit and feed back the pulse signal to an A-axis driver; the A-axis driver feeds back A, B, Z phase signals to the ACS motion controller through an output port CN4 according to the position signals fed back by the photoelectric encoder, and the positioning position of the A-axis is controlled.

Furthermore, in the method for cutting the special-shaped workpiece based on the position coordinates of the galvanometer and the AB deflection axis, the ACS motion controller sends pulses in a P/D pulse and direction control mode, the pulse command reaches the B-axis driver, and the B-axis driver receives signals through a CN4 interface and controls the B-axis motion unit to move to the position specified by the controller; the B-axis motion unit acquires four groups of sine wave signals A, B, C, D through a photoelectric encoder arranged on the B-axis motion unit and a photoelectric transmitter and a receiver of the B-axis motion unit, each sine wave has a phase difference of 90 degrees, C, D signals are superposed on A, B two phases in an inverted mode, and each rotation outputs a pulse signal of a Z phase to represent a zero reference bit and feed back the pulse signal to the B-axis driver; the B-axis driver feeds back A, B, Z phase signals to the ACS motion controller through an output port CN4 according to the position signals fed back by the photoelectric encoder, and the positioning position of the B axis is controlled.

Compared with the prior art, the invention has obvious advantages and beneficial effects, and is embodied in the following aspects:

firstly, the processing of special-shaped workpieces is realized by A, B-axis deflection and laser cutting of a galvanometer, non-planar special-shaped processing can be finished when A, B deflection axes are adopted for processing, such as processing a sample by a cylinder, processing the surface of the sample and processing the inner wall, and the processing can be finished with higher precision by the accurate positioning of a A, B axis;

when a non-planar special-shaped sample is processed, the position of a processing area can be accurately controlled through the movement of the X, Y and A, B axes, the positioning error of the processing area is reduced, and the problem of height change of a processing surface can be solved by moving the Z axis;

the interior surface of machined parts such as cylinder can be processed through laser fast, compares current processing mode, can fix a position the processing region fast, can process more regions and need not carry out the secondary dismouting in certain processing region.

Additional features and advantages of the invention will be set forth in the description which follows, and in part will be obvious from the description, or may be learned by the practice of the invention. The objectives and other advantages of the invention will be realized and attained by the structure particularly pointed out in the written description and claims hereof as well as the appended drawings.

Drawings

In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings needed to be used in the embodiments will be briefly described below, it should be understood that the following drawings only illustrate some embodiments of the present invention and therefore should not be considered as limiting the scope, and for those skilled in the art, other related drawings can be obtained according to the drawings without inventive efforts.

FIG. 1: system block diagram of the present invention.

Detailed Description

The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. The components of embodiments of the present invention generally described and illustrated in the figures herein may be arranged and designed in a wide variety of different configurations. Thus, the following detailed description of the embodiments of the present invention, presented in the figures, is not intended to limit the scope of the invention, as claimed, but is merely representative of selected embodiments of the invention. All other embodiments, which can be derived by a person skilled in the art from the embodiments of the present invention without making any creative effort, shall fall within the protection scope of the present invention.

It should be noted that: like reference numbers and letters refer to like items in the following figures, and thus, once an item is defined in one figure, it need not be further defined and explained in subsequent figures. Meanwhile, in the description of the present invention, the directional terms and the sequence terms, etc. are used only for distinguishing the description, and are not to be construed as indicating or implying relative importance.

As shown in fig. 1, the special-shaped cutting system based on the position coordinates of the galvanometer and the AB deflection axis comprises an upper computer 1 and an ACS motion controller 2, wherein the upper computer 1 is connected with the ACS motion controller 2 through an Ethercat bus, a galvanometer motion control card 3 is arranged in a PCI card slot in the upper computer 1 and is in data interactive transmission with the upper computer 1 through a PCI bus standard protocol, the upper computer 1 is communicated with a laser controller 4 through a TCP/IP protocol, and the galvanometer motion control card 3 is communicated with a galvanometer motion unit 9 through an SL2-100 data transmission protocol; the galvanometer motion control card 3 is connected with the laser controller 4;

the ACS motion controller 2 is connected with an X-axis motion unit 5 and a Y-axis motion unit 6 of the X-Y axis processing platform, an X-axis grating ruler reading head 7 is installed on the X-axis motion unit 5, a Y-axis grating ruler reading head 8 is installed on the Y-axis motion unit 6, and the X-axis grating ruler reading head 7 and the Y-axis grating ruler reading head 8 are connected with the ACS motion controller 2;

the ACS motion controller 2 is connected with an A-axis driver 10 and a B-axis driver 12, the A-axis driver 10 is in driving connection with an A-axis motion unit 11, the B-axis driver 12 is in driving connection with a B-axis motion unit 13, a flange of the A-axis motion unit 11 is vertically arranged on the X-axis motion unit 5 and can swing back and forth, and a flange of the B-axis motion unit 13 is vertically arranged with a flange of the A-axis motion unit 11; the A-axis motion unit 11 and the B-axis motion unit 13 are in signal connection with the ACS motion controller 2;

the ACS motion controller 2 is connected with a Z-axis driver 14, the Z-axis driver 14 is in driving connection with a Z-axis stepping motor 15, a model Ti0200A25A Renyshao reading head is mounted on the Z-axis stepping motor, and the Renyshao reading head is connected with the ACS motion controller 2.

Wherein, the ACS motion controller 2 is a SPiPlusEC motion controller, the galvanometer motion control card 3 is a digital signal processing controller with the model number of TMS320DM642AZNZ, and the laser controller 4 is a Marble UN-15 laser controller.

The X-axis movement unit 5 and the Y-axis movement unit 6 are UL9N linear motors, the galvanometer movement unit 9 is a stepping motor, the X-axis grating scale reading head 7 and the Y-axis grating scale reading head 8 are model Ti0200A25A Renysha reading heads, the A-axis driver 10 and the B-axis driver 12 are provided with STM32 microcontrollers, and the A-axis movement unit 11 and the B-axis movement unit 13 are provided with photoelectric encoders.

The upper computer 1 is connected with the ACS motion controller 2 through an Ethercat bus, the upper computer 1 and the galvanometer motion control card 3 communicate by adopting a PCI bus protocol based on a PC PCI card slot, 5V high-level signals are sent to a GATE interface of the laser controller 4 through PINs PIN2 and PIN10 in DB15 of the galvanometer motion control card 3, and on-off light control during processing is carried out; the upper computer 1 and the laser controller 4 carry out network communication through a TCP/IP protocol and set laser parameters; the ACS motion controller 2 and the X-Y axis processing platform are directly controlled through an ACS integrated built-in driver in a +/-10V analog quantity control mode, the X, Y axis linear motor sends A, B, Z phase pulse signals to the ACS motion controller 2 through a grating ruler reading head (Ti0200A25A) arranged on the rotor to feed back the current accurate coordinate position of the X, Y axis in real time, a complete closed loop is formed, the position coordinates are accurately fed back in real time, and the positioning error is reduced.

The ACS motion controller 2 and the A-axis driver 10 perform accurate axis positioning in a P/D pulse + direction control mode, the A-axis motion unit 11 feeds back the current position coordinate through a built-in photoelectric encoder, sends the current position coordinate to the A-axis motion unit 11 in an A, B, Z-phase pulse feedback mode, and sends a corresponding A, B, Z-phase pulse feedback to the ACS motion controller 2 after being processed by an STM32 chip of the A-axis to form a complete closed loop, so that the position coordinate is accurately fed back in real time, and the positioning error is reduced; the B axis is the same as the A axis, and the same control mode is adopted. The ACS motion controller 2 and the Z-axis driver 14 adopt a P/D pulse + direction control mode, and different from the AB axis, Z-axis feedback is directly fed back to the ACS motion controller 2 by a grating ruler subdivision box of a reading head, and the ACS motion controller 2 controls the positioning precision of the Z axis in real time through the emitted plus pulse number, the motion direction and the feedback data of the reading head.

The special-shaped cutting method based on the position coordinates of the galvanometer and the AB deflection axis specifically comprises the following steps:

1) the upper computer 1 controls the AB deflection shaft to rotate to the initial machining angle through the ACS motion controller 2;

2) the ACS motion controller 2 controls the height of the Z axis reaching a processing focus, and the upper computer 1 sets galvanometer processing parameters;

3) the upper computer 1 sends out a Laser ON +5V control signal through a control galvanometer motion control card 3, and the control signal reaches a GATE control interface of the Laser through a BNC connector to control the Laser to emit light;

4) setting the motion position of an AB axis according to the processing requirement of a processing sample, fixing the processing sample on a jig of a B axis, fixing the jig on a flange surface of the B axis, controlling the front and back deflection angle of a processing piece by the A axis, and rotating the B axis based on the deflection position of the A axis to enable a processing focus to completely process the inside of the sample;

5) when the A shaft deflects by an angle, the same plane height in the sample generates a height difference; the height difference of the interior of the sample is measured by using the image when the processing is started, the Z-axis processing stepping height is obtained, the B-axis rotates after the processing is started, the Z-axis stepping motor modifies the processing focus height after the processing of one area is completed, and the platform moves the AB-axis to change the processing area, so that the requirement of processing the special-shaped non-planar processing sample is met.

The ACS motion controller 2 sends pulses through P/D pulses and a direction control mode, pulse instructions reach the A-axis driver 10, the A-axis driver 10 receives signals through a CN4 interface, and the A-axis motion unit 11 is controlled to move to a position designated by the controller; the axis A motion unit 11 obtains four groups of sine wave signals A, B, C, D through a photoelectric encoder arranged on the axis A motion unit and a photoelectric transmitter and a receiver of the axis A motion unit, each sine wave has a phase difference of 90 degrees, C, D signals are superposed on A, B two phases in an inverted mode, and each rotation outputs a pulse signal of a Z phase to represent a zero reference bit and the pulse signal is fed back to an axis A driver; the A-axis driver feeds back a A, B, Z phase signal to the ACS motion controller 2 through an output port CN4 according to the position signal fed back by the photoelectric encoder, and controls the positioning position of the A-axis.

The ACS motion controller 2 sends pulses in a P/D pulse and direction control mode, the pulse command reaches the B-axis driver 12, the B-axis driver 12 receives signals through a CN4 interface and controls the B-axis motion unit 13 to move to a position designated by the controller; the B-axis motion unit 13 obtains four groups of sine wave signals A, B, C, D through a photoelectric encoder mounted on the B-axis motion unit, a photoelectric emitter and a photoelectric receiver of the B-axis motion unit acquire the four groups of sine wave signals A, B, C, D, each sine wave has a phase difference of 90 degrees, C, D signals are superposed on A, B two phases in opposite phases, and each rotation outputs a pulse signal of a Z phase to represent a zero reference bit and feed back the pulse signal to the B-axis driver 12; the B-axis driver 12 feeds back the A, B, Z phase signal to the ACS motion controller 2 via the output port CN4 according to the position signal fed back by the photoelectric encoder, and controls the positioning position of the B-axis.

In conclusion, the processing of the special-shaped workpiece is realized by A, B-axis deflection and laser cutting of the galvanometer, the A, B deflection axis is adopted for processing, non-planar special-shaped processing can be finished, such as processing a sample by a cylinder, processing the surface of the sample and processing the inner wall can be finished, and the processing can be finished with higher precision by the accurate positioning of the A, B axis;

when a non-planar special-shaped sample is processed, the position of a processing area can be accurately controlled through the movement of the X, Y and A, B axes, the positioning error of the processing area is reduced, and the problem of height change of a processing surface can be solved by moving the Z axis;

can compare current processing mode through the inside surface of machined parts such as laser rapid machining cylinder, can fix a position the processing region fast, can process more regions and need not carry out the secondary dismouting in certain processing region.

The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention, and various modifications and changes may be made by those skilled in the art. Any modification, equivalent replacement, or improvement made within the spirit and principle of the present invention should be included in the protection scope of the present invention. It should be noted that: like reference numbers and letters refer to like items in the following figures, and thus, once an item is defined in one figure, it need not be further defined and explained in subsequent figures.

The above description is only for the specific embodiments of the present invention, but the scope of the present invention is not limited thereto, and any person skilled in the art can easily conceive of the changes or substitutions within the technical scope of the present invention, and shall be covered by the scope of the present invention. Therefore, the protection scope of the present invention shall be subject to the protection scope of the claims.

It is noted that, herein, relational terms such as first and second, and the like may be used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Also, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising an … …" does not exclude the presence of other identical elements in a process, method, article, or apparatus that comprises the element.

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