Automatic accurate burnt mark cutting system that beats
阅读说明:本技术 一种自动准焦打标切割系统 (Automatic accurate burnt mark cutting system that beats ) 是由 李杏璇 于 2020-06-30 设计创作,主要内容包括:本发明涉及打标设备技术领域,具体是一种自动准焦打标切割系统,包括打标激光器和机架,还包括:调焦组件,设置在所述打标激光器的出射光光路上,用于调节所述打标激光器的出射光的焦距;安装在机架上的移动组件,与所述调焦组件配合,用于调节所述打标激光器的打标位置和焦点;合束镜,所述合束镜用于将所述打标激光器的出射光的光轴与所述激光测距模块的出射光的光轴重合;以及控制模块和激光测距模块,所述激光测距模块用于测量加工面各加工点的位置坐标,所述控制模块控制各部件工作。本发明的有益效果是:所述控制模块控制所述激光测距模块、调焦组件和打标激光器,自动完成对复杂加工面的精密测量、加工,对复杂加工面的加工精度高。(The invention relates to the technical field of marking equipment, in particular to an automatic focusing, marking and cutting system, which comprises a marking laser and a frame, and further comprises: the focusing assembly is arranged on an emergent light path of the marking laser and used for adjusting the focal length of the emergent light of the marking laser; the moving assembly is arranged on the frame, is matched with the focusing assembly and is used for adjusting the marking position and the focus of the marking laser; the beam combining mirror is used for enabling the optical axis of emergent light of the marking laser to coincide with the optical axis of emergent light of the laser ranging module; the laser ranging module is used for measuring the position coordinates of each processing point of the processing surface, and the control module controls each part to work. The invention has the beneficial effects that: the control module controls the laser ranging module, the focusing assembly and the marking laser to automatically complete the precise measurement and processing of the complex processing surface, and the processing precision of the complex processing surface is high.)
1. The utility model provides an automatic accurate burnt mark cutting system, is including beating mark laser instrument and frame, its characterized in that still includes:
the focusing assembly is arranged on an emergent light path of the marking laser and used for adjusting the focal length of the emergent light of the marking laser;
the moving assembly is arranged on the frame, is matched with the focusing assembly and is used for adjusting the marking position and the focus of the marking laser;
the beam combining mirror is used for enabling the optical axis of emergent light of the marking laser to coincide with the optical axis of emergent light of the laser ranging module; and
the device comprises a control module and a laser ranging module, wherein the laser ranging module is used for measuring the position coordinates of each processing point of a processing surface, and the control module controls each part to work.
2. The automatic in-focus marking and cutting system of claim 1, wherein the focusing assembly comprises a focusing lens disposed between the marking laser and the beam combiner.
3. The automatic in-focus marking and cutting system of claim 1, wherein the focusing assembly comprises a beam expander lens disposed at an exit port of the marking laser.
4. The automatic focus aligning marking and cutting system according to claim 1, wherein the moving assembly comprises a scanning galvanometer structure, the scanning galvanometer structure comprises a first galvanometer and a second galvanometer, the second galvanometer is arranged on an emergent light path of the beam combining mirror, and the first galvanometer is arranged on an emergent light path of the second galvanometer.
5. The automatic focusing marking and cutting system according to claim 4, wherein the first galvanometer motor and the second galvanometer motor are respectively arranged on the first galvanometer and the second galvanometer, and the first galvanometer motor and the second galvanometer motor respectively drive the first galvanometer and the second galvanometer to rotate so as to realize the adjustment of the marking position of the marking laser.
6. The automatic in-focus marking and cutting system of claim 1, wherein the moving assembly comprises a first moving mechanism and a second moving mechanism, and the first moving mechanism and the second moving mechanism are combined to control a marking position of the marking laser.
7. The automatic in-focus marking and cutting system of claim 6, wherein the first moving mechanism comprises a first motor, a first guide rail and a first slider, the second moving mechanism comprises a second motor, a second guide rail and a second slider, the first guide rail is mounted on the machine frame, the second guide rail is mounted on the first guide rail through the first slider, the marking laser is mounted on the second guide rail through the second slider, and the first motor and the second motor respectively drive the first slider and the second slider to move.
8. The automatic focusing marking and cutting system according to claim 1, wherein the laser ranging module is arranged on the side of the optical axis of the emergent light of the marking laser, and the included angle between the beam combining mirror and the optical axis of the emergent light of the laser ranging module and the emergent light of the marking laser is 45 degrees.
9. The automatic in-focus marking and cutting system according to claim 1, wherein the beam combiner has a high transmittance for the emergent light of the marking laser, the beam combiner has a high reflectance for the emergent light of the laser ranging module, and the emergent light of the laser ranging module is reflected by the beam combiner and has the same direction as the emergent light of the marking laser.
10. The automatic in-focus marking and cutting system of claim 1, wherein the control module comprises a host computer, and the host computer is connected with the laser ranging module, the marking laser, the focusing assembly and the moving assembly.
Technical Field
The invention relates to the technical field of marking equipment, in particular to an automatic focusing marking and cutting system.
Background
Laser marking or cutting, in principle, is the same, i.e. a laser beam is focused to produce a spot of very small size and very high energy density at the focal point. The light spot can gasify the surface material of the workpiece, thereby marking, carving or cutting. The processing mode does not generate mechanical extrusion or mechanical stress, so that the processed object cannot be damaged; the size of the laser after focusing is small, the heat affected zone is small, and the processing is fine.
However, this type of processing has disadvantages: it is the focal point of the laser focus that is required for the machined surface. Therefore, in the past, most of laser marking or cutting is in a 2D mode, namely, generally, planar marking or cutting can be carried out only in a specified range; when facing workpieces with height differences, especially free curved surfaces, it is difficult to machine.
Disclosure of Invention
The invention aims to provide an automatic focusing marking and cutting system to solve the problems in the background technology.
In order to achieve the purpose, the invention provides the following technical scheme:
an automatic focus-aligning marking and cutting system comprises a marking laser and a machine frame, and further comprises: the focusing assembly is arranged on an emergent light path of the marking laser and used for adjusting emergent light of the marking laser;
the moving assembly is arranged on the frame, is matched with the focusing assembly and is used for adjusting the marking position and the focus of the marking laser;
the beam combining mirror is used for combining emergent light of the marking laser and emergent light of the laser ranging module into one beam; and
the device comprises a control module and a laser ranging module, wherein the laser ranging module is used for measuring the position coordinates of each processing point of a processing surface, and the control module controls each part to work.
As a further scheme of the invention: the focusing assembly comprises a focusing lens, and the focusing lens is arranged between the marking laser and the beam combining mirror.
As a still further scheme of the invention: the focusing assembly comprises a beam expander, and the beam expander is arranged at an exit port of the marking laser.
As a still further scheme of the invention: the movable assembly comprises a scanning galvanometer structure, the scanning galvanometer structure comprises a first galvanometer and a second galvanometer, the second galvanometer is arranged on an emergent light path of the beam combining mirror, and the first galvanometer is arranged on the emergent light path of the second galvanometer.
As a still further scheme of the invention: first mirror and the second of shaking are equipped with first mirror motor and the second mirror motor that shakes respectively that shakes with the second, first mirror motor and the second of shaking drives respectively first mirror and the second of shaking shakes and shakes the mirror rotation, realizes beating the regulation of mark laser marking position.
As a still further scheme of the invention: the moving assembly comprises a first moving mechanism and a second moving mechanism, and the first moving mechanism and the second moving mechanism are combined to control the marking position of the marking laser.
As a still further scheme of the invention: the first moving mechanism comprises a first motor, a first guide rail and a first sliding block, the second moving mechanism comprises a second motor, a second guide rail and a second sliding block, the first guide rail is installed on the rack, the second guide rail is installed on the first guide rail through the first sliding block, the marking laser device is installed on the second guide rail through the second sliding block, and the first motor and the second motor respectively drive the first sliding block and the second sliding block to move.
As a still further scheme of the invention: the laser rangefinder module sets up mark side of laser instrument emergent light optical axis, the beam combining mirror with the optical axis contained angle of the emergent light of laser rangefinder module, the emergent light of marking the laser instrument is 45.
As a still further scheme of the invention: the beam combining mirror has high transmittance for the emergent light of the marking laser, the beam combining mirror has high reflectivity for the emergent light of the laser ranging module, and the emergent light of the laser ranging module is reflected by the beam combining mirror and then has the same direction as the emergent light of the marking laser.
As a still further scheme of the invention: the control module comprises a host, and the host is connected with the laser ranging module, the marking laser, the focusing assembly and the moving assembly.
Compared with the prior art, the invention has the beneficial effects that: the control module controls the laser ranging module, the focusing assembly and the marking laser to automatically complete the precise measurement and processing of the complex processing surface, and the processing precision of the complex processing surface is high.
Drawings
Fig. 1 is a schematic structural diagram of an automatic in-focus marking and cutting system in an embodiment of the present invention.
Fig. 2 is an enlarged view of a portion of the structure of fig. 1.
Fig. 3 is a projection model diagram of the laser ranging module shown in fig. 1.
Fig. 4 is a schematic structural diagram of an automatic in-focus marking and cutting system in an alternative embodiment of the present invention.
FIG. 5 is a projection model diagram of the laser ranging module of FIG. 4.
FIG. 6 is a system schematic of the control module of FIG. 1.
FIG. 7 is a system diagram of the control module of FIG. 4.
In the drawings: 101-a first motor, 102-a first guide rail, 103-a first slide block, 201-a second motor, 202-a second guide rail, 203-a second slide block, 3-a focusing lens, 4-a marking laser, 5-a beam combiner, 6-a beam expander, 701-a first galvanometer motor, 702-a first galvanometer, 801-a second galvanometer motor, 802-a second galvanometer and 9-a laser ranging module.
Detailed Description
Reference will now be made in detail to the exemplary embodiments, examples of which are illustrated in the accompanying drawings. When the following description refers to the accompanying drawings, like numbers in different drawings represent the same or similar elements unless otherwise indicated. The implementations described in the exemplary embodiments below are not intended to represent all implementations consistent with the present disclosure. Rather, they are merely examples of apparatus and methods consistent with certain aspects of the present disclosure, as detailed in the appended claims.
Referring to fig. 1-3, in an embodiment of the present invention, an automatic in-focus marking and cutting system includes a marking
Specifically, the control module comprises a host, and the host is connected with the
Referring to fig. 1, in the embodiment of the present invention, the focusing assembly includes a focusing
Specifically, a motor is arranged inside the focusing
Referring to fig. 4, in a preferred embodiment of the present invention, the focusing assembly includes a beam expander 6, and the beam expander 6 is disposed at an exit port of the marking laser; the movable assembly comprises a scanning galvanometer structure, the scanning galvanometer structure comprises a
Specifically, the emergent light of the marking
Referring to fig. 4, in the embodiment of the present invention, the
Specifically, as shown in fig. 7, the host machine drives the
Referring to fig. 1, in an embodiment of the present invention, the moving assembly includes a first moving mechanism and a second moving mechanism, and the first moving mechanism and the second moving mechanism are combined to control a marking position of the marking laser.
Specifically, the first moving mechanism comprises a first motor 101, a first guide rail 102 and a first sliding block 103, the second moving mechanism comprises a second motor 201, a second guide rail 202 and a second sliding block 203, the first guide rail 102 is installed on the rack, the second guide rail 202 is installed on the first guide rail 102 through the first sliding block 103, the marking laser is installed on the second guide rail 202 through the second sliding block 203, and the first motor 101 and the second motor 201 drive the first sliding block 103 and the second sliding block 203 to move respectively. The first motor 101 and the second motor 201 are controlled by the host. The host computer is through control first motor 101, second motor 201 drive mark laser instrument with the laser rangefinder module is in the motion of first, second direction, and the point of marking and the measuring point of laser rangefinder module that realize marking the laser instrument are in the regulation of position on the machined surface, through control the motion of focusing lens is adjusted the focus of the emergent light of marking the laser instrument for marking the point of marking the laser instrument is in on the machined surface, accomplish the range finding, beat mark or cutting.
Referring to fig. 4, in the embodiment of the present invention, the
Specifically, the
The working principle of the invention is as follows: when finding range, will mark the power of marking
It should be noted that the host used in the present invention is an application of the prior art, and those skilled in the art can implement the functions to be achieved according to the related description, or implement the technical features to be achieved through the similar technology, and will not be described in detail here.
Other embodiments of the disclosure will be apparent to those skilled in the art from consideration of the specification and practice of the disclosure herein. This application is intended to cover any variations, uses, or adaptations of the disclosure following, in general, the principles of the disclosure and including such departures from the present disclosure as come within known or customary practice within the art to which the disclosure pertains. It is intended that the specification and examples be considered as exemplary only, with a true scope and spirit of the disclosure being indicated by the following claims.
It will be understood that the present disclosure is not limited to the precise arrangements described above and shown in the drawings and that various modifications and changes may be made without departing from the scope thereof. The scope of the present disclosure is limited only by the appended claims.
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