阅读说明：本技术 一种高速高密度板上多个深微孔的加工工艺 (Processing technology for multiple deep micropores on high-speed high-density board ) 是由 卢小燕 陶应辉 于 2020-06-19 设计创作，主要内容包括：本发明公开了一种高速高密度板上多个深微孔的加工工艺,S5、待打微孔铜板的工装；S6、将激光打孔设备的激光头朝向铜板,打开激光打孔设备,激光头发生的激光垂向的照射在铜板的顶表面上,激光熔化铜材料以形成微孔(10)；S7、利用铝板紧贴在铜板(9)的顶表面上；随后打开截止阀(7)和真空泵(8),真空泵(8)对锥形筒(1)的内腔和微孔(10)进行抽真空；经3~10min后关闭截止阀(7)和真空泵(8)；S8、成品铜板的拆卸,反向旋转压板(5)使压板(5)向上运动,当压板(5)与铜板(9)分离后,将铜板(9)从锥形筒(1)上取下。本发明的有益效果是：提高微孔加工质量、高效清理掉微孔内残渣。(The invention discloses a processing technology of a plurality of deep micropores on a high-speed high-density board, comprising the following steps of S5, a tool for punching a micropore copper plate; s6, enabling a laser head of the laser drilling equipment to face the copper plate, opening the laser drilling equipment, enabling laser generated by the laser head to vertically irradiate the top surface of the copper plate, and melting the copper material by the laser to form micropores (10); s7, utilizing an aluminum plate to cling to the top surface of the copper plate (9); then opening a stop valve (7) and a vacuum pump (8), and vacuumizing the inner cavity and the micropores (10) of the conical barrel (1) by the vacuum pump (8); closing the stop valve (7) and the vacuum pump (8) after 3-10 min; and S8, disassembling the finished copper plate, reversely rotating the pressing plate (5) to enable the pressing plate (5) to move upwards, and taking down the copper plate (9) from the conical cylinder (1) after the pressing plate (5) is separated from the copper plate (9). The invention has the beneficial effects that: improve the micropore processing quality and efficiently clean the residues in the micropores.)

1. A processing technology of a plurality of deep micropores on a high-speed high-density board is characterized in that: it comprises the following steps:

s1, taking a conical barrel (1) and ensuring that the diameter of a large port of the conical barrel (1) is larger than the width of the copper plate; the large port of the conical cylinder (1) is upwards arranged on the platform (2);

s2, taking two lug plates (3), processing a threaded hole on each of the two lug plates (3), respectively welding the two lug plates (3) on the outer walls of the two sides of the conical cylinder (1), and ensuring that the two lug plates (3) are both in a horizontal state;

s3, taking two threaded rods (4) and ensuring that the nominal diameter of the threaded rods (4) is equal to that of the threaded holes; a pressing plate (5) is welded on the top of each of the two threaded rods (4); connecting the two threaded rods (4) into the threaded holes respectively;

s4, welding a two-way pipe (6) at the lower port of the conical barrel (1), connecting a stop valve (7) at the other port of the two-way pipe (6), connecting a vacuum pump (8) at the other end of the stop valve (7), and in an initial state, closing the stop valve (7) and the vacuum pump (8);

s5, placing the copper plate (9) on the top surface of the conical cylinder (1) horizontally, then respectively rotating the two pressing plates (5) to enable the pressing plates (5) to move downwards, and respectively pressing the two pressing plates (5) on the top of the copper plate (9) under the threaded connection force of the threaded rod (4) and the threaded hole, so that the copper plate is finally fixed by the quick tool;

s6, enabling a laser head of the laser drilling equipment to face the copper plate, opening the laser drilling equipment, enabling laser generated by the laser head to vertically irradiate the top surface of the copper plate, and melting the copper material by the laser to form micropores (10);

s7, utilizing an aluminum plate to cling to the top surface of the copper plate (9); then opening a stop valve (7) and a vacuum pump (8), and vacuumizing the inner cavity and the micropores (10) of the conical barrel (1) by the vacuum pump (8); closing the stop valve (7) and the vacuum pump (8) after 3-10 min;

and S8, disassembling the finished copper plate, reversely rotating the pressing plate (5) to enable the pressing plate (5) to move upwards, and taking down the copper plate (9) from the conical cylinder (1) after the pressing plate (5) is separated from the copper plate (9).

2. The process of claim 1, wherein the deep micro-holes are formed on the high-speed high-density board by the following steps: the diameter of the micropores processed in the step S6 is 0.2-0.4 mm.

3. The process of claim 1, wherein the deep micro-holes are formed on the high-speed high-density board by the following steps: and after the step S8 is finished, the method for manufacturing the high-speed high-density board also comprises the steps of filling resin into the micropores of the copper plate (9), welding a circuit layer on each of the upper surface and the lower surface of the copper plate (9) after filling, and electrically conducting the two circuit layers through the resin, so that the high-speed high-density board is manufactured.

Technical Field

The invention relates to the technical field of processing deep micropores on a high-speed high-density circuit board, in particular to a processing technology of a plurality of deep micropores on a high-speed high-density circuit board.

Background

At present, with the continuous development of electronic products, electronic products are made more and more fine, the important indispensable component in the electronic products is a circuit board, and the circuit board is further divided into a high-speed high-density board, a high-order high-density circuit board, an HID circuit board, an IC circuit board and the like, wherein the high-speed high-density circuit board is widely applied and comprises a copper plate and a circuit layer, the top surface and the bottom surface of the copper plate are both electroplated with the circuit layer, micropores are processed on the copper plate, the structure of the micropores is as shown in fig. 1, the micropores are filled with resin, and the resin electrically connects the two circuit layers. Wherein the diameter of micropore is 0.2~0.4mm, the micropore adopts laser drilling equipment to process and forms, the work step of processing micropore does, the workman will wait that the copper that punches is flat to be placed on the workstation earlier, the laser head of laser drilling equipment faces the copper again, open laser drilling equipment, the vertical shining of laser that the laser head takes place is on the top surface of copper, laser melting copper product is in order to form the micropore, after punching of a period of time, can process out the micropore on the copper, repeat this step after processing a micropore, can process out a plurality of micropores on the copper. However, although this processing method can process a plurality of micropores, after the micropores are processed on the copper plate, a large amount of residues remain on the walls of the micropores, and the accumulated residues block the micropores, so that the resin subsequently filled in the micropores cannot conduct the two circuit layers, and the residues are very difficult to clean, mainly because the pores of the micropores are small and the cleaning difficulty is very large. Therefore, a micro-hole processing technology for improving the micro-hole processing quality and efficiently cleaning the residue in the micro-hole is needed.

Disclosure of Invention

The invention aims to overcome the defects of the prior art and provide a processing technology for a plurality of deep micropores on a high-speed high-density plate, which improves the micropore processing quality and efficiently cleans residues in the micropores.

The purpose of the invention is realized by the following technical scheme: a processing technology for a plurality of deep micropores on a high-speed high-density board comprises the following steps:

s1, taking a conical barrel, and ensuring that the diameter of a large port of the conical barrel is larger than the width of the copper plate; installing a large port of the conical cylinder on the platform upwards;

s2, taking two lug plates, processing a threaded hole on each of the two lug plates, respectively welding the two lug plates on the outer walls of the two sides of the conical cylinder, and ensuring that the two lug plates are both in a horizontal state;

s3, taking two threaded rods, and ensuring that the nominal diameter of each threaded rod is equal to that of each threaded hole; a pressing plate is welded on the top of each of the two threaded rods; connecting two threaded rods into the threaded holes respectively;

s4, welding a two-way pipe at the lower port of the conical barrel, connecting a stop valve at the other port of the two-way pipe, connecting a vacuum pump at the other end of the stop valve, and in the initial state, closing the stop valve and the vacuum pump;

s5, placing the copper plate on the top surface of the conical cylinder horizontally, then respectively rotating the two pressing plates to enable the pressing plates to move downwards, and respectively pressing the two pressing plates on the top of the copper plate under the threaded connection force of the threaded rod and the threaded hole, thereby finally realizing the quick tool fixing of the copper plate;

s6, enabling a laser head of the laser drilling equipment to face the copper plate, opening the laser drilling equipment, enabling laser generated by the laser head to vertically irradiate the top surface of the copper plate, and melting the copper material by the laser to form micropores;

s7, utilizing an aluminum plate to cling to the top surface of the copper plate; then opening a stop valve and a vacuum pump, and vacuumizing the inner cavity and the micropores of the conical cylinder by the vacuum pump; closing the stop valve and the vacuum pump after 3-10 min;

and S8, disassembling the finished copper plate, reversely rotating the pressing plate to enable the pressing plate to move upwards, and taking down the copper plate from the conical cylinder after the pressing plate is separated from the copper plate.

The diameter of the micropores processed in the step S6 is 0.2-0.4 mm.

And after the step S8 is finished, the method for manufacturing the high-speed high-density board comprises the steps of filling resin into the micropores of the copper plate, welding a circuit layer on each of the upper surface and the lower surface of the copper plate after filling, and electrically conducting the two circuit layers through the resin, so that the high-speed high-density board is manufactured.

The invention has the following advantages: the invention improves the micropore processing quality and efficiently cleans residues in micropores.

Drawings

FIG. 1 is a schematic view of a copper plate with micro-holes punched therein;

FIG. 2 is a schematic view of a tooling copper plate;

in the figure, 1-conical cylinder, 2-platform, 3-lug plate, 4-threaded rod, 5-pressure plate, 6-two-way pipe, 7-stop valve, 8-vacuum pump, 9-copper plate and 10-micropore.

Detailed Description

The invention will be further described with reference to the accompanying drawings, without limiting the scope of the invention to the following: