阅读说明：本技术 贵金属盐制剂、其生产方法及用于电镀的用途 (Noble metal salt preparation, method for producing same and use thereof for electroplating ) 是由 赖科·埃纳特 弗兰克·科斯特 于 2017-05-23 设计创作，主要内容包括：本发明涉及用于生产贵金属盐制剂的方法,该贵金属盐制剂包括至少一种贵金属磺酸盐和硫脲,以及通过贵金属或金属合金的电镀或化学镀用于表面涂层的用途。(The invention relates to a method for producing a noble metal salt preparation comprising at least one noble metal sulfonate and thiourea, and to the use thereof for surface coating by electroplating or electroless plating of noble metals or metal alloys.)

1. Method for producing a noble metal salt formulation by electromembrane electrolysis, comprising the following steps

a) Providing an electrolytic cell comprising an anode and a cathode, the anode comprising a noble metal, wherein an anode region and a cathode region are separated by a membrane,

b) providing at least one sulfonate solution in the anode region,

c) anodising the noble metal by passing an electric current through the electrolytic cell and forming a noble metal salt formulation comprising a noble metal sulphonate,

wherein thiourea is added in the anode region after step b) or after step c),

wherein the concentration of the thiourea is 0.005g/l to 200 g/l.

2. The method for producing a noble metal salt formulation according to claim 1, wherein at least one noble metal is selected from gold (Au), platinum (Pt), palladium (Pd), rhodium (Rh), iridium (Ir), ruthenium (Ru), or indium (In).

3. The method for producing a noble metal salt formulation according to claim 1 or 2, wherein the membrane is a cation exchange membrane or an anion exchange membrane.

4. The method for producing a noble metal salt formulation according to any one of claims 1 to 3, wherein the sulfonate is an alkyl sulfonate, preferably a C1-to C10-alkyl sulfonate.

5. The method for producing a noble metal salt formulation according to any one of claims 1 to 4, wherein the concentration of the at least one sulfonate salt solution is 0.1% (w/w) to 20% (w/w).

6. The process for producing a noble metal salt formulation according to any one of claims 1 to 5, wherein the process comprises at least one further step selected from precipitation, flocculation, complexation, oxidation and/or reduction.

7. A noble metal salt formulation comprising at least one noble metal sulfonate and thiourea, wherein the molar ratio of noble metal to thiourea is from 10,000:1 to 1: 10.

8. The noble metal salt formulation according to claim 7, wherein the noble metal salt formulation is an aqueous, organic or ionic solution having a noble metal concentration of 0.001 to 5mol, preferably 0.01 to 0.5 mol.

9. The noble metal salt formulation according to claim 7 or 8, wherein the noble metal sulfonate is selected from the group consisting of gold (Au), platinum (Pt), palladium (Pd), rhodium (Rh), iridium (Ir), ruthenium (Ru) or indium (In) sulfonates.

10. The noble metal salt formulation of any one of claims 7 to 9, wherein the pH value is from pH 1 to pH 8.

11. A precious-metal salt formulation according to any one of claims 7 to 10, comprising at least one further complexing agent, preferably selected from chelating agents or organic sulphur compounds, more preferably selected from methylglycinediacetic acid or ethylenediamine-N, N' -disuccinic acid (EDDS) or alkali or alkaline earth metal salts of these acids, methionine or cysteine.

12. The noble metal salt formulation of any one of claims 7 to 11, wherein the aqueous solution of the noble metal salt formulation has a stability of at least several months.

13. Use of the noble metal salt formulation according to any one of claims 7 to 12 for surface coating by electroplating or electroless plating of noble metals or metal alloys.

14. Method for electroplating a noble metal or metal alloy, said method comprising the following steps

a) Providing an electroplating bath comprising an anode, a cathode and a solution of at least one noble metal salt formulation according to any one of claims 7 to 12,

b) applying an electric current to the electroplating bath, thereby forming at least one noble metal on the cathode, and

c) removing the cathode from the electroplating bath.

15. Method for electroless plating of noble metals, comprising the following steps

a) Providing a plating bath comprising a solution of a noble metal salt formulation according to any one of claims 7 to 12,

b) contacting a solid substrate with the plating bath to form a noble metal on the solid substrate, an

c) Removing the solid substrate from the plating bath.

Example 1: preparation of gold (I) methanesulfonate

The catholyte was a solution of 70% methanesulfonic acid and distilled water mixed to 5% methanesulfonic acid. The anolyte comprises an aqueous solution of methanesulfonic acid (5%) and 20g/l thiourea. Titanium platinate was used as the cathode and the anode was pure gold from the walwell process. The membrane between the cathode and anode is a cation selective membrane (Nafion) from DuPont.

The anodization was carried out with a direct current of 1.0A for two hours. Thereafter, the anolyte contained 13.9g of gold in the form of gold (I).